1019results about How to "Polished evenly" patented technology

An electro-polishing fixture for polishing stents which incorporates multiple anodes in contact with the stent and a center cathode disposed coaxially within the interior of the stent and a curved exterior cathode disposed about the perimeter of the stent. The invention further includes an electrolyte solution adapted for polishing stents composed of nickel-titanium alloy and a method of using the electrolyte in combination with the electro-polishing fixture.

An apparatus for polishing a substrate is provided. The apparatus includes: a rotatable polishing table supporting a polishing pad; a substrate holder configured to hold a substrate and press the substrate against a polishing surface of the polishing pad on the rotating polishing table so as to polish the substrate; a pad-temperature detector configured to measure a temperature of the polishing surface of the polishing pad; a pad-temperature regulator configured to contact the polishing surface to regulate the temperature of the polishing surface; and a temperature controller configured to control the temperature of the polishing surface by controlling the pad-temperature regulator based on information on the temperature of the polishing surface detected by the pad-temperature detector.

A CMP polish pad used to chemically and mechanically polish a work to be polished. The CMP polish pad has polishing portions of two or more types, that have different conditions of contact with the work, provided on the pad surface. For example, polishing portions of a plurality of types having different coefficients of elasticity with respect to compression in the direction of pressing against the work may be provided on the pad surface. Also polishing portions of a plurality of types having different areas of contact with the work may be provided on the pad surface. Further, polishing portions of a plurality of types having different heights above the pad surface may be provided on the pad surface.

A substrate processing apparatus has a polishing tape and a polishing head for pressing the polishing tape against a peripheral portion of a semiconductor wafer. The substrate processing apparatus polishes the wafer due to sliding contact of the polishing tape and the wafer. The polishing head has an elastic body for supporting the polishing tape. The substrate processing apparatus has an air cylinder for pressing the polishing head so that the elastic body of the polishing head presses the polishing tape against the predetermined portion of the wafer under a constant force.

A wafer carrier for controlling downward force and edge effect during chemical mechanical planarization. A retaining ring actuator is disposed within the retaining ring to control the height of the retaining ring relative to the bottom surface of the wafer carrier. An inflatable membrane is disposed across the bottom surface of the wafer carrier such that pressure in the bladder is independently regulated to control the downward force acting on the wafer during CMP. In addition, an edge control bladder may also be disposed within the carrier such that if the pressure in the bladder is also regulated, the amount of force on the edge of the wafer changes. By regulating retaining ring actuator pressure, inflatable membrane pressure, and edge control bladder pressure, non-uniformities in the wafer surface and edge effect may be addressed during CMP.

A rotary abrasive flow polishing device for integral impeller type parts comprises a feeding system, a spindle system, a device body, a clamp cover, a guide structure and a cleaning system, wherein the feeding system is used for regular bidirectional feeding and controlling abrasive flow, the spindle system is capable of rotating positively and reversely and adjustable in rotation speed, the clamp cover clamps an impeller to form a closed cavity and protects non-polishing sides and upper and lower edges, the guide structure is used for guiding abrasives, and the cleaning system is used for realizing cleanness in ingoing and outgoing. The rotary abrasive flow polishing device solves the problems of easiness in interference, over-polishing of blades, chamfering, dead angles and nonuniform polishing in polishing of integral impeller type parts, the abrasives can bidirectioally cyclically flow to be recovered easily, machining efficiency is improved, and cleanness in ingoing and outgoing during machining can be realized by means of the cleaning system used after polishing is completed.

The invention discloses a polishing method for rotating an abrasive stream of an entire impeller part. The polishing method is characterized by comprising the following steps of: firstly, protecting non-polished faces, such as upper and lower end faces of an impeller and outer edges of blades, by virtue of a special shape clamp cover, and integrally fixing with a workpiece; secondly, properly buffering and adjusting before the workpiece is polished by abrasive through an abrasive stream drainage device, so that a pressure field in a sealing cavity is uniformly distributed; thirdly, driving an equipment spindle and the workpiece to rotate by using a power system consisting of a motor and a speed reducer; and finally, converting to a high-pressure water cleaning system to wash the workpiece and an equipment pipeline after polishing. According to the polishing method provided by the invention, the problems in a polishing process of the entire impeller part of easiness of interference, excessive polished blades, chamfering, dead angle and uniform polishing can be solved; the abrasive circularly flows in double directions so as to be easy to recycle; the machining efficiency is improved; and clean-in and clean-out in a machining process can be realized through the water washing system after the polishing process.

A chemical mechanical polishing apparatus has a substrate holder, a polishing belt, and a backing member positioned on a side of the polishing belt opposite the substrate holder. The polishing belt has a polishing surface to contact at least a portion of the substrate held by the substrate holder. The polishing belt is movable in a first direction in a generally linear path relative to the substrate. The polishing belt has a plurality of grooves formed therein.

A method capable of quickly polishing an angular portion formed by a grinded back surface and a circumferential surface of a substrate without causing damages on the thin substrate is provided. The method includes rotating the substrate about its center, and pressing a polishing tape against the angular portion formed by the back surface and the circumferential surface of the substrate to polish the angular portion.

The invention relates to a chemical mechanical polishing composite of stainless steel surface polishing; the polishing composite is composed of grinding material, oxidizer, polishing accelerant, metalchelator, penetrant, and surfactant; the invention is characterized in that: aluminum oxide sol, namely hydrated alumina dispersed in acidic aqueous solution in sol state, is added, the hydrated alumina can be boehmite, fake boehmite, diaspore or gibbsite.

A wafer polishing apparatus for polishing a semiconductor wafer. The polisher comprises a base (23), a turntable (27), a polishing pad (29) and a drive mechanism (45) for driven rotation of a polishing head (63). The polishing head is adapted to hold at least one wafer (35) for engaging a front surface of the wafer with a work surface of the polishing pad. A spherical bearing assembly (75) mounts the polishing head (63) on the drive mechanism for pivoting of the polishing head about a gimbal point (p) lying no higher than the work surface when the polishing head holds the wafer in engagement with the polishing pad. This pivoting allowing the plane of the front surface of the wafer to continuously align itself to equalize polishing pressure over the front surface of the wafer, while rotation of the polishing head is driven by the driving mechanism. This maintains the front surface and work surface in a continuously parallel relationship for more uniform polishing of a semiconductor wafer, particularly near the lateral edge of the wafer. A cassette of wafers and method of polishing are also disclosed.

The present invention comprises a turntable which holds a turbine part at a predetermined position, the turn table being rotatably supported by a support member, and rotated and driven by a driving motor, an abrasive feeding unit which feeds an abrasive particle having an elastic material as a core to a predetermined position as an abrasive, and a polishing head including an impeller which is rotated and driven by an impeller driving motor at high speed and applies rotary energy to the abrasive particle to be supplied from the abrasive feeding unit, the polishing head injecting the abrasive particle flying from the tangential direction of the impeller at a predetermined speed toward a surface to be polished of the turbine part held on the turntable, and an abrasive recovery unit which recovers the abrasive particle provided for polishing of the turbine part from the polishing head, and feeding into the abrasive feeding unit.

The invention discloses a building construction pipeline end surface processing device capable of conveniently fixing different sizes. The building construction pipeline end surface processing devicecapable of conveniently fixing the different sizes comprises a bottom plate, a first telescopic rod is fixedly mounted on the upper surface of the left end of the bottom plate, a supporting plate is fixedly connected to the top end of the first telescopic rod, a first toothed disc is fixedly mounted at the right end of a handle, a rotary rod is movably connected into the upper end of the supporting plate, a movable barrel is connected to the middle of the rotary rod through bolts, a motor is fixedly connected to the upper end of a second telescopic rod, a second polishing block is fixedly mounted on the outer surface of a first polishing block, and third telescopic rods are connected to the outer surface of the right end of the rotary rod in an equal angle mode. According to the building construction pipeline end surface processing device capable of conveniently fixing the different sizes, polishing is comprehensive and uniform, the polishing degree and effect of an annular end surfacecan be controlled manually, a round supporting structure is arranged in a pipeline, the height and a clamping range of a pipeline clamping structure are convenient to adjust, and a device for integrally connecting sweeps is arranged.

The invention discloses a magneto-rheological polishing method and device. The magneto-rheological polishing method comprises the steps that surface type information of a workpiece is known; the position and polishing interval of the polishing tool are determined; the polishing interval is filled with magneto-rheological fluid; according to surface shape information of a polishing area and linear velocity distribution of all points in the polishing area, polishing pressure distribution is calculated when the removal rate is even; magnetic field distribution is obtained according to the pressure distribution through inverse solution; according to the obtained magnetic field distribution model, coil voltages of three layers of concentric circular electromagnets are changed respectively, so that magnetic field distribution in the radius direction meets the requirement; polishing is carried out. According to the magneto-rheological polishing method, the concentric circular electromagnets are of a nested structure and supply power to a collecting ring respectively, and therefore the purposes that magnetic fields at the same radius are the same in intensity and intensity of magnetic fields at different radii can be controlled separately are achieved.

The invention discloses a cup body polisher for polishing the outer surface of a cup, and aims at providing the cup body polisher capable of effectively reducing the labor intensity of an operator, improving the working efficiency, and realizing the uniform polishing. The key points of the technical scheme are as follows: the cup body polisher comprises a stander, wherein a polishing assembly and a polishing driving assembly for driving the polishing assembly to work are arranged on the stander, the polishing assembly comprises a polishing member, a polishing face is arranged on the polishing member, and the polishing member is in linkage connection with the polishing driving assembly; and a clamping assembly for clamping the cup body is arranged on the stander, the clamping assembly and the polishing face of the polishing member are arranged in parallel, and the clamping assembly comprises a clamping member for holding the cup body and abutting the cup body with the polishing face of the polishing member.

A polishing pad is formed with a non-foamed member shaped as a plate having a flat surface and abrading particles affixed inside and on the surfaces of this non-foamed member. Its average surface roughness is in the range of 0.5 μm-10 μm, and its Shore D hardness is within the range of 50-85. Grooves are formed on the surface of the polishing pad for collecting debris generated during the polishing operation and serving also as flow routes of a polishing liquid for distributing it uniformly over the surface of the polishing pad.

A method of production of a multilayer circuit board comprised of a multilayer structure circuit formed by a plurality of interconnect layers and insulation layers stacked together and a semiconductor chip included therein, including the steps of placing a semiconductor chip having a polished back surface, with its active surface facing downward, on an already formed lower interconnect layer and forming an insulation layer over the layer on which the semiconductor chip has been placed, the method further including the step of treating the polished back surface of the semiconductor chip to improve its bondability with the insulation layer before the step for formation of the insulation layer.

The invention discloses continuous production equipment. The continuous production equipment is used for machining metal plates and at least comprises a machining table, guide tracks, a machining plate, a driving mechanism, a clamping portion and a machining portion. The guide tracks are horizontally mounted on the machining table, the machining plate is mounted on the guide tracks in a sliding mode, and the driving mechanism is used for driving the machining plate to move in the length direction of the guide tracks. The clamping portion comprises a plurality of clamping mechanisms and first gear racks, and the multiple clamping mechanisms are arranged in sequence in the length direction of the guide tracks. Each clamping mechanism comprises a supporting shaft, a bottom plate, a first gear, supporting plates, screw rods and pressing plates, wherein the supporting shaft is vertically mounted on the machining plate; the bottom plate is horizontally and rotationally mounted on the supporting shaft; the first gear is mounted on the bottom plate, and the center line of the first gear coincides with the center line of the supporting shaft; the supporting plates are arranged horizontally and connected with the bottom plate; threaded holes are formed in the supporting plates; and the screw rods are disposed in the threaded holes and matched with the threaded holes.