47 results about "Electro polishing" patented technology

An electro-polishing fixture for polishing stents which incorporates multiple anodes in contact with the stent and a center cathode disposed coaxially within the interior of the stent and a curved exterior cathode disposed about the perimeter of the stent. The invention further includes an electrolyte solution adapted for polishing stents composed of nickel-titanium alloy and a method of using the electrolyte in combination with the electro-polishing fixture.

A method and apparatus for the removal of a deposited conductive layer along an edge of a substrate using an electrode configured to electro polish a substrate edge are disclosed. The electro polishing of the substrate edge may occur simultaneously during electrochemical mechanical processing (Ecmp) of a substrate face. In one embodiment, a power source applies a bias between the substrate and at least two electrodes. The electrodes form a first electrode zone proximate the substrate edge at a sufficient potential to electro polish the substrate edge, thereby removing the conductive layer from the substrate edge. A second electrode zone with a lower potential than the first electrode zone is aligned proximate the substrate face during processing to enable Ecmp of the substrate face.

The invention discloses a Cu-Ni alloy electro-polishing method used for an EBSD (electron back scatter diffraction) test, and relates to researches on microstructure, the texture and the like of a Cu-Ni alloy used for discovering high-temperature superconductive coat conductors through adopting an EBSD technology in the cold rolling and heat treatment processes. The electro-polishing method can be used for the sample processing before the EBSD test of the microstructure and the texture of the surface of the Cu-Ni alloy. The electro-polishing method can effectively remove the stress layer on the surface of a sample, is in favor of the generation of strong diffraction patterns during the EBSD test, and is convenient for the researches on the microstructure and the texture of the Cu-Ni alloy. The method is characterized in that the Cu-Ni alloy sample which undergoes mechanical polishing and ultrasonic cleaning is electro-polished, a cathode material is a metal platinum sheet, a Cu-Ni alloy electro-polishing liquid is stirred in a magnetic stirrer in a low speed (0.5-1r/s) mode, the alternating current voltage during the electro-polishing is 5-15V, the electro-polishing temperature is 10-25DEG C, and the electro-polishing time is 5-20s.

The invention relates to a method used mixed acid electrolyte to manufacture high ordered multi-hole anodic alumina die plate. In order to further reduce oxidation voltage, barrier layer thickness, and increase nanometer hole array orderliness, the alumina die plate is manufactured as follows: using the mixed acid of sulfuric acid and oxalic acid as electrolyte; their content are 100-200g/L and 50-150g/L; de-oiling; oxide layer removing; electro polishing; double steps anodic oxidation manufacturing multi-hole anodic alumina die plate. The invention reduces reduce oxidation voltage and barrier layer thickness to make nanometer hole diameter rise from 20nm to 45-55nm. This is good for the further application of multi-hole alumina die plate.

Disclosed is a method of forming a copper wiring in a semiconductor device. A copper barrier metal layer and a copper seed layer are sequentially formed along the surface of an interlayer insulating film including damascene patterns. In a state that a wafer is then loaded onto an electrical plating apparatus in which a copper plating solution is filled and a negative (-) power supply is also applied to the wafer, copper is plated so that the damascene patterns are sufficiently filled, thereby forming a copper layer. Next, the copper layer is polished in the plating solution by means of the electro-polishing process by changing the negative (-) power supply to the positive (+) power supply. Due to this, the surface of the copper layer is flat over the entire wafer. Thereafter, a chemical mechanical polishing process is performed until the surface of the interlayer insulating film is exposed, thereby forming copper wirings within the damascene patterns. As such, an uneven surface of the copper layer plated by the electroplating method is etched in the plating solution, thus making flat the surface of the copper layer and thin the thickness of the copper layer. It is thus possible to prevent a dishing phenomenon or an erosion phenomenon in a subsequent chemical mechanical polishing process. Therefore, the process margin of the chemical mechanical polishing process could be increased and process characteristics could be improved.

A system and method for preparation of nano-porous membrane using anodized aluminium oxide and the membrane/film/thin lamina produced thereof. The system comprises a template forming device that comprises of two rolls provided with one or plurality of projections wherein the Al sheet is passed through the said rolls that are rotatable in opposite direction with respect to each other wherein in operation as the Al sheet is passed through the said rolls, the said projections of the rolls punch depressions to the predetermined depth in the said sheet wherein the depth of the depression is governed by the height of the projections. A method for preparation of anodized aluminum oxide nano-porous membrane comprising electro polishing of Al substrate; first step anodization; chemical etching of alumina; second stage anodization; etching Al for separation of alumina and barrier layer removal or voltage pulse detachment for barrier layer removal and detachment of membrane from Al substrate.

Compositions and methods are disclosed for preventing the oxidative corrosion of metal surfaces by exposing a metal surface to an anti-corrosion agent characterized as a lower alkyl carboxylic acid or salts and/or other derivatives that conserve or embody the lower alkyl carboxylic acid moiety present in their molecular structures as an active anti-corrosion agent. The anti-corrosion agent may be used in combination with a material capable of forming a moisture retentive barrier over the metal surface. The compositions and methods of the invention provide a practical, non-toxic way of ensuring anti-corrosion protection for metals, or devices containing exposed metals, stored or operated in water or in the presence of water vapor. Exemplary, non-exhaustive uses of the invention include employing the composition as lubricant for the surface of a metal or as a pump oil or brake fluid; using the composition as an undercoating for painting, electro-plating or electro-polishing procedures; and providing a protective coating for any metal or metal-containing machine or device, form automotive assembly plant metal press machines to electronic circuit boards.

The present invention discloses an artery medicament elution bracket, which is a net-shaped hollow tubular body made by processing a cobalt-chromium alloy with laser engraving and electro-polishing cochrome. The bracket comprises more than one annular-wave-shaped supporting bar and connecting rods which are alternately and spirally connected between the supporting bars. The shape of the connecting rod is an array of waves formed by more than one connected sinusoidal waveform unit, and curve-shaped connected bend angles with different radiuses are positioned at the fold positions of wave crests and the wave troughs of the sinusoidal waveform unit. The shape of the connecting rod is an S-shaped sinusoid section connected with a straight line section. The surface of the bracket is covered by a medicament coating. The fold positioned at the wave crests and the wave troughs of the sinusoidal waveform unit adopt curve-shaped bend angles with unequal radiuses so that the blend pressure of the support bars is reduced, the rebound degree is reduced, and the bracket abscission incidence rate due to the insufficient retentivity is reduced. After being pressed and held, the bracket has a passing outer diameter of between 1 and 1.08mm. The possibility and the operability of the bracket are apparently improved.

The invention discloses a three-level polyaluminium chloride coagulation treatment process for stainless steel electro-polishing wastewater. By multilevel coagulation treatment, sewage enters an advanced treatment system or is discharged with standards. The test results show that when the three-level polyaluminium chloride coagulation treatment method is adopted for treating high-concentration phosphor-containing electro-polishing wastewater, the concentrations of total phosphorous (TP), chemical oxygen demand (COD) and total chromium (total Cr) in the effluent can respectively reach 0.46, 120 and 0.15 mg/L, and the removal rates are respectively 99.94%, 88.5% and 99.6%. The three-level polyaluminium chloride coagulation treatment method has the characteristics that the operation is simple, various heavy metal ions, COD and TP can be efficiently removed at the same time, and the like; and the three-level polyaluminium chloride coagulation treatment method is also applicable to treating other like high-concentration phosphor-containing wastewater.

The object of the invention is to provide a method of manufacturing a semiconductor device and a processing apparatus for planarization wherein to form copper wiring in multiple layers. The removal of a residue of polishing by local electro polishing, the enhancement of the performance of planarization by using a grindstone and the reduction by small frictional force in electro polishing of damage, are enabled. To achieve the object, the following measures are taken. A residue of polishing of copper is removed by combining the detection of a local area including the residue of polishing of copper and local processing for electro polishing. As small-load processing for planarization is enabled by using electro polishing, multilayer interconnection structure using low-k material as a dielectric interlayer is also enabled. Plural pairs of small unit electrodes in a pair of which minus electrodes surround a plus electrode are provided to a tool for electro polishing, each electrode is connected to a power supply, pulse voltage is applied to each electrode and copper is electrolytically polished.

The invention provides a welding process of a movable cover plate and a fixed cover plate of a vacuum arc-extinguishing chamber. The welding process comprises the steps of A, carrying out deoiling treatment on the movable cover plate and the fixed cover plate; B, placing the movable cover plate and the fixed cover plate in an electropolishing solution for being subjected to surface treatment for 10-15 minutes, and then cleaning; C, placing welding flux at the welding seams and the welding surface of the movable cover plate and the fixed cover plate; D, loading the movable cover plate and the fixed cover plate into a vacuum brazing furnace for brazing; E, afterwards, dropping the temperature to 350-400 DEG C for pure nitrogen cooling or pure argon cooling, and tapping off until the temperature in the furnace is higher than the outside temperature for 15-25 DEG C. The welding process has the advantages that due to the adoption of a chemical electropolishing technology, quality fluctuation points are avoided, so that the cost of burning nickel is reduced, the sewage disposal is relieved, and the production progress is effectively improved.

The invention discloses a method for preparing a composite film photoelectrode, and the method comprises the following steps of: preparing an electrode matrix: taking platinum-plated titanium conductive glass as an electrode substrate, soaking the electrode substrate in a hydrogen peroxide solution, washing the electrode substrate with water, and performing ultrasonic treatment to form a film electrode layer; then, putting the film electrode layer into a sodium hydroxide solution for ultrasonic treatment, repeatedly carrying out ultrasonic cleaning by using deionized water, and then, drying; finally, electropolishing and ultrasonically washing with water in a sodium hypochlorite electrolytic cell to prepare the electrode matrix, and drying the electrode matrix; and pretreating the electrode matrix: adding graphene into a mixed solution of sodium carboxymethylcellulose and styrene to obtain a coating solution; performing coating solution spin-coating on the electrode matrix, and performing annealing treatment to obtain an electrode preform; and preparing a composite film photoelectrode: preparing an LDH electrode from the electrode preform by using an electro-deposition method, placing the prepared LDH electrode in a muffle furnace, and calcining and air-cooling to prepare an MMO electrode; and preparing an MMO photoelectrode covered by a lead dioxide film by using an electrodeposition method, washing with water, and drying.

The invention relates to preparation of a porous aluminium oxide bionic multilayer dewatering surface, belonging to the field of thin films. The invention aims to solve the technical problems that the current process for preparing a porous aluminium oxide dewatering thin film is relatively complex; the cost is high; and the range of a thin film substrate is limited by the preparation method of chemical etching, so that a preparation method for the porous aluminium oxide bionic multilayer dewatering surface is provided. According to the method, a degreased and processed aluminium sheet is subjected to electropolishing, and then is subjected to oxidation for twice; a prepared aluminium oxide film is soaked; a reducing agent is added; an aired aluminium/argentum oxide multilayer film is soaked in an ethanol solution of perfluorodecanethiol; and then the film is taken out and blow-dried by nitrogen so as to obtain the porous aluminium oxide bionic multilayer dewatering surface. The method is simple in process and low in cost; the prepared porous aluminium oxide dewatering thin film has good heat resistance, chemical stability and high mechanical strength and dimensional stability, and can be widely promoted for use.

Compositions and methods are disclosed for preventing the oxidative corrosion of metal surfaces by exposing a metal surface to an anti-corrosion agent characterized as 2,4-trans, trans-hexadienoic acid (2,4-HDA), its alkali salt identified as potassium sorbate (KHDA), or other derivatives that conserve or embody the 2,4-trans, trans-hexadiene-type moiety present in their molecular structures as an active anti-corrosion agent (ACA), in combination with a material capable of forming a moisture retentive barrier over the metal surface. The compositions and methods of the invention provide a practical, non-toxic way of ensuring anti-corrosion protection for metals, or devices containing exposed metals, stored or operated in water or in the presence of water vapor. Exemplary, non-exhaustive uses of the invention include employing the composition as a lubricant for the surface of a metal or as a pump oil or brake fluid; using the composition as an undercoating for painting, electro-plating or electro-polishing procedures; and providing a protective coating for any metal or metal-containing machine or device, from automotive assembly plant metal press machines to electronic circuit boards.

The invention discloses a welding process and a welding device for a vacuum furnace. The welding process comprises the following steps: step 1, deoiling a movable cover plate and a static cover plate; secondly, the treated movable and static cover plates are put into an electropolishing solution to be subjected to surface treatment for 10-15 minutes, and then the movable and static cover plates are cleaned up. When a worker places the treated movable and static cover plates on a placing plate in the furnace body, a motor is started to enable the placing plate to rotate under the action of a rotating shaft; meanwhile, a heating pipe and an air suction cylinder are started, the interior of the furnace body can be in a vacuum state through starting of the air suction cylinder, high temperature can be generated in the furnace body through starting of the heating pipe, and therefore the purpose of welding the welding flux between the movable cover plate and the static cover plate is achieved; in this state, compared with a traditional static state, the movable cover plate and the static cover plate can be heated evenly, and therefore the welding effect of the device can be enhanced.