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6551results about "Duplicating/marking methods" patented technology

Jettable compositions

ActiveUS20050171237A1Prevent long-term corrosionAdditive manufacturing apparatusLiquid surface applicatorsMeth-Oligomer
A fully curable jettable composition having a viscosity less than 30 cps at a temperature within the range of 15-180° C., more preferably at a temperature of 15-100° C., e.g. 60-80° C. the composition comprising: (A) at least one low viscosity reactive resin selected from the group consisting of compounds containing an oxetane ring, cycloaliphatic epoxy resins, tetrahydrofurans, hexahydropyrans and mono-functional (meth)acrylates, said resin having a molecular weight of not greater than 300 Daltons, e.g. 250 Daltons or less, and a viscosity at a temperature in the said range of less than 30 cps, e.g. 5 to 15 cps; (B) at least one higher viscosity resin selected from the group consisting of epoxy resins, compounds containing an oxetane ring and acrylates, which resin acts to thicken the low viscosity resin and strengthen a jetted deposit of the composition, the higher viscosity resin having: a viscosity greater than twice that of the low viscosity resin at the said temperature in the range stated above, and a functionality of greater than or equal to 2; (C) at least one curable toughener, preferably having a functionality of at least 2, such as hydroxy, epoxy, acrylic or other reactive functionalised polymer/oligomer (e.g. derived by functionalising poly(tetrahydrofuran), polycaprolactone, polycarbonate diol, or a dendrimeric polyol; (D) at least one initiator for the polymerisation of the resins, and (E) at least one stabiliser for delaying the curing of the resins of the composition; wherein the low viscosity resin is slower to react than the higher viscosity resin and acts to solvate the higher viscosity resin prior to curing and at least partly during curing and wherein at least 30% of the components A and B are cationically curable resins. The composition can be jetted from piezo electric printing heads under the control of a computer program to form a multi-layered article, e.g. a three dimensional article, in which the adjacent droplets merge and are cured homogeneously together.
Owner:3D SYST INC +1

Fabrication of sub-50 nm solid-state nanostructures based on nanolithography

Combination of nanolithography and wet chemical etching including the fabrication of nanoarrays of sub-50 nm gold dots and line structures with deliberately designed approximately 12-100 nm gaps. These structures were made by initially using direct write nanolithography to pattern the etch resist, 16-mercaptohexadecanoic acid (MHA), on Au/Ti/SiOx/Si substrates and then wet chemical etching to remove the exposed gold. These are the smallest Au structures prepared by a wet chemical etching strategy. Also, Dip-Pen Nanolithography (DPN) has been used to generate resist layers on Au, Ag, and Pd that when combined with wet chemical etching can lead to nanostructures with deliberately designed shapes and sizes. Monolayers of mercaptohexadecanoic acid (MHA) or octadecanethiol (ODT), patterned by DPN, were explored as etch resists. They work comparably well on Au and Ag, but ODT is the superior material for Pd. MHA seems to attract the FeCl3 etchant and results in nonuniform etching of the underlying Pd substrate. Dots, lines, triangles and circles, ranging in size from sub-100 to several hundred nm have been fabricated on these substrates. These results show how one can use DPN as an alternative to more complex and costly procedures like electron beam lithography to generate nanostructures from inorganic materials.
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