144 results about "Cycloaliphatic epoxy" patented technology

The invention discloses a flame-retardant epoxy resin adhesive with a low dielectric constant and a low dielectric loss factor as well as a preparation method and application of the flame-retardant epoxy resin adhesive, and belongs to the technical field of electrical insulating materials. The method comprises the following steps: uniformly mixing and stirring epoxy resin and alicyclic epoxy resin to obtain an epoxy resin mixture; uniformly stirring liquid acid anhydride, a flame retardant, an epoxy active toughening agent and an accelerant to obtain an epoxy resin curing agent; and vacuumizing and uniformly stirring the epoxy resin mixture and the epoxy resin curing agent to obtain the flame-retardant epoxy resin adhesive with low dielectric constant and low dielectric loss factor. Dielectric loss of the epoxy resin mixture is reduced through polarity complementation, and molecular chain segment polarization is reduced through an alicyclic epoxy resin ring structure. And the flame retardant is dispersed into a uniform flame-retardant phase in liquid anhydride, so that the mechanical property is prevented from being reduced. A flexibilizer and anhydride are grafted to introduce a flexible chain segment, vacuum mixing is performed to eliminate an air gap, and after gradient curing, a low dielectric constant, a low dielectric loss factor and flame retardance are obtained.

The invention relates to the technical field of semiconductor packaging adhesive films, and provides a resin composition, an adhesive film and application thereof. The resin composition disclosed by the invention is prepared from the following components in parts by weight: 5 to 20 parts of maleimide, 5 to 20 parts of alicyclic epoxy resin, 25 to 40 parts of thermoplastic high-molecular compound, 10 to 20 parts of bisphenol epoxy resin, 10 to 30 parts of benzoxazine resin and 30 to 300 parts of inorganic filler, wherein the degree of functionality of the alicyclic epoxy resin is not less than 3. The packaging adhesive film prepared from the resin composition provided by the invention has low thermal expansion coefficient and excellent heat resistance, can still keep stable adhesive force in a high-temperature and high-humidity environment, and is suitable for packaging semiconductors.

This application provides a glass fiber surface treatment agent, its preparation method, glass fiber, fabric, and their applications. The glass fiber surface treatment agent comprises an effective component and water, with a solid content of 5.8–10.5%. The effective component, by weight percentage, includes: a coupling agent of 7.3–17.3%, a penetrant of 0.3–2.8%, a lubricant of 7.7–13.2%, a film-forming agent of 58.3–81.9%, a toughening agent of 0.4–1.8%, and additives of 2.4–6.6%. The film-forming agent comprises film-forming agent A and film-forming agent B. Film-forming agent A is a composition of phenolic epoxy emulsion and bisphenol A type epoxy emulsion, and film-forming agent B is an alicyclic epoxy resin emulsion. Glass fibers produced using this glass fiber surface treatment agent exhibit excellent bundle properties, wear resistance, and weaving performance. The glass fiber fabric undergoes rapid and complete static impregnation in epoxy resin, resulting in high mechanical strength and meeting the performance requirements of new energy vehicle battery casings.

The invention discloses a high-refractive-index photo-thermal dual-curing optical adhesive and a preparation method thereof, and belongs to the technical field of high polymer materials, and the preparation method comprises the following steps: S1, preparation of high-refractive-index resin: placing biphenyl-4, 4 '-dithiol in a nitrogen atmosphere reaction kettle, adding a free radical thermal initiator, heating to 180-200 DEG C, reacting for 1-2 hours, and cooling to room temperature to obtain the high-refractive-index resin; dropwise adding alkenyl resin under the protection of nitrogen, stirring, reacting for 1-2 hours after dropwise adding, and cooling to room temperature to obtain high-refractive-index resin; s2, preparation of the optical adhesive: mixing the alicyclic epoxy resin, the high-refractive-index resin, the toughened resin, the liquid epoxy resin, the cationic photoinitiator and the cationic thermal initiator, and uniformly stirring in a dark place to obtain the adhesive. The problems that a traditional optical adhesive is poor in optical performance stability and unbalanced in mechanical and optical performance are solved. The application potential of preparing the high-performance optical adhesive is realized.

The invention discloses high-heat-resistance low-dielectric-loss resin as well as a preparation method and application thereof, and relates to the technical field of resin materials. The high-heat-resistance and low-dielectric-loss resin is prepared through the curing reaction of the alicyclic epoxy resin and the active ester; the core of the method is that alicyclic epoxy resin is subjected to curing reaction with active ester by utilizing the characteristics of small molecular weight, high crosslinking density and no glyceryl ether structure, so that the defects of large molecular weight, low crosslinking density, low Tg, low cost and the like of resin formed by bisphenol A type epoxy resin, phenolic aldehyde type epoxy resin and the active ester in the prior art are effectively overcome. And electrical defects caused by a glyceryl ether-containing structure of part of resin are overcome. The prepared high-heat-resistance low-dielectric-loss resin has high heat resistance and excellent electrical performance, the manufacturing process is simple and easy to operate, and the high-heat-resistance low-dielectric-loss resin can be applied to the electronic field of copper-clad plates and the like and has wide application prospects.

The invention discloses a high-adhesion bottom filling adhesive, a preparation method thereof and a chip packaging structure, and relates to the technical field of chip packaging, the bottom filling adhesive is composed of the following components by mass: 28-54% of epoxy resin, 38-67% of an anhydride curing agent, 2-5% of an accelerator, and 1-4% of an additive; wherein the epoxy resin is formed by compounding bisphenol F type epoxy resin and alicyclic epoxy resin, and the additive comprises liquid bismaleimide. The anhydride curing agent is adopted to accelerate the cross-linking curing reaction of the underfill adhesive and shorten the surface drying time, so that the underfill adhesive can be suitable for a tunnel type oven, and the chip packaging efficiency is improved; meanwhile, bismaleimide is introduced into the system, so that the surface energy difference between the underfill adhesive and a PI substrate is reduced, the adhesive force between the underfill adhesive and the PI substrate as well as between the underfill adhesive and a chip is improved, and the packaging yield of the chip is improved.

The application relates to a conductive silver glue and a preparation method and application thereof, and belongs to the technical field of bonding materials.The conductive silver glue comprises an epoxy resin, an active diluent, a curing agent, an accelerator and silver powder; the epoxy resin comprises a main body resin and an auxiliary resin; the main body resin comprises a glycidyl amine type epoxy resin; and the auxiliary resin comprises a combination of a phenolic epoxy resin, a triphenylmethane type epoxy resin and an alicyclic epoxy resin.The conductive silver glue provided by the application is a high-reliability conductive silver glue of an epoxy resin system, has the characteristics of high moisture and heat resistance, high high-temperature bonding force, high residual glue rate and low resin overflow, effectively solves the problem that the existing conductive silver glue has low reliability under high-temperature and high-humidity conditions, is suitable for complex scenes, and has a simple preparation method and controllable cost.

A manufacturing method of a liquid ejecting head, in which a ejection port forming member that forms an ejection port for ejecting a liquid and a flow path of the liquid that communicates with the ejection port are formed on a substrate, the manufacturing method includes: forming a mold for the flow path of the liquid on the substrate; applying a photosensitive resin composition for forming the ejection port forming member on the substrate on which the mold has been formed so as to form a cationically polymerizable resin layer; and performing exposure and development on the cationically polymerizable resin layer so as to form the ejection port forming member, wherein the photosensitive resin composition includes at least one epoxy resin selected from an alicyclic epoxy resin and a glycidyl epoxy resin and a cationic photopolymerization initiator having a specific structure and a molar absorption coefficient.

The invention relates to a photocuring continuous carbon fiber composite material formula and a 3D printing head device, and the photocuring continuous carbon fiber composite material formula comprises the following components in parts by weight: 50-90 parts of carbon fiber and epoxy resin, 1-5 parts of a photoinitiator, 0-3 parts of a photosensitizer, 5-20 parts of an alicyclic epoxy compound, and 5-20 parts of an oxygen heterocyclic compound. 0-5 parts by weight of a thixotropic agent and 0-20 parts by weight of an active diluent. The 3D printing head comprises a resin injection part, a fiber feeding part, an in-situ impregnation tank, a point light source bracket part, an anti-overflow part and a preimpregnated continuous carbon fiber discharging part; according to the photocuring continuous carbon fiber composite material formula and the 3D printing head device, protonic acid and gelation can be rapidly initiated on the surface through illumination, protonic acid is diffused into fibers by means of the heat effect to achieve deep curing, and therefore 3D printing of the photocuring continuous carbon fiber reinforced epoxy resin composite material is achieved.

The invention provides a polarizing plate, a barrier layer composition and a display device. The polarizing plate includes a polarizer and a barrier layer formed on one surface of the polarizer. The barrier layer comprises curable compounds including an epoxy compound and a (meth) acrylate compound; a photoinitiator; and a diol compound, wherein the epoxy compound includes a cycloaliphatic epoxy compound and a bisphenol-type epoxy compound. The bisphenol-type epoxy compound is present in an amount of 20 parts by weight to 70 parts by weight with respect to 100 parts by weight of the curable compound, and the diol compound is present in an amount of 1 part by weight to 15 parts by weight with respect to 100 parts by weight of the curable compound.

A refrigerator oil composition which is used together with a refrigerant that contains an unsaturated fluorinated compound having a carbon-carbon unsaturated bond represented by general formula (I): C2FpR4-p (I) [in general formula (I), R each independently represents a hydrogen atom, a chlorine atom, a bromine atom or an iodine atom, and p is an integer of 1-3], in which R represents a hydrogen atom, a chlorine atom, a bromine atom or an iodine atom, and p represents an integer of 1-3], R represents a hydrogen atom, a chlorine atom, a bromine atom or an iodine atom, and p represents a hydrogen atom, a chlorine atom, a bromine atom or an iodine atom. A refrigerator oil composition containing a base oil (A), an epoxy compound (B), and a terpene compound (C), the epoxy compound (B) being an aliphatic epoxy compound (B1) or an alicyclic epoxy compound (B2), the total content of the epoxy compound (B) and the terpene compound (C) being 4.0 mass% or more based on the total amount of the refrigerator oil composition.

The invention discloses a quaternary ammonium salt latent curing agent, a single-component epoxy resin composition as well as a preparation method and application of the single-component epoxy resin composition. The compound has a specific general formula (I) structure, and R is Si, O or S and is matched with a specific weak nucleophilic anion (such as PF). The curing agent can be pre-mixed with an alicyclic epoxy resin (such as a compound of a formula II / III) to form a single-component system which can be stably stored for at least 3 months at the temperature of less than or equal to 40 DEG C. When heated to 90-130 DEG C, the system can rapidly initiate polymerization of epoxy groups, and the curing efficiency is high. The invention successfully solves the industrial problem that the single-component storage stability and the medium-temperature curing activity of the cycloaliphatic epoxy resin in the prior art are difficult to consider at the same time, and has extremely high industrial application value.

The invention provides a cationic epoxy adhesive for electronic three-proofing and a preparation method thereof, and belongs to the technical field of adhesives. According to the invention, alicyclic epoxy resin is fluorinated and modified with silane, so that moisture resistance, corrosion resistance and mechanical properties are enhanced; 3-mercaptopropyltrimethoxysilane is grafted to polydimethylsiloxane through ultraviolet, so that the compatibility of the polydimethylsiloxane is improved, and the toughness of the polydimethylsiloxane is improved; hyperbranched polyester reacts with trimethyl phosphate to endow the material with flame retardance and metal adhesion; the microencapsulated slow-release curing agent solves the problem of insufficient ultraviolet curing deep layer, and realizes uniform curing of the surface layer and the deep layer; according to the invention, ultraviolet and natural curing are combined, rapid shaping and deep curing are considered, the processing efficiency, mechanical properties and chemical stability of the material are obviously optimized, and various requirements of electronic three-proofing and high-performance materials are met.

The present invention provides a yellowing-resistant solder mask ink based on an alicyclic epoxy resin and a preparation method thereof. The ink comprises component A and component B. Component A comprises the following ingredients: an acrylic resin emulsion, a modified acrylic resin, a reactive monomer, a photoinitiator, an amino-modified filler, a pigment, an additive, and a solvent; and component B comprises the following ingredients in parts by weight: an alicyclic epoxy resin, an additive, and a solvent. The modified acrylic resin is obtained by reacting a multifunctional epoxy resin, acrylic acid, and an acrylate. This invention not only exhibits excellent yellowing resistance but also combines the advantages of alicyclic and aromatic ring structures to improve ink stability, adhesion, toughness, and other properties. This overcomes the shortcomings of existing technologies and provides new insights for the development of solder mask inks.

The invention relates to the technical field of epoxy structural adhesives, in particular to a low-temperature-curable, high-temperature-resistant and corrosion-resistant epoxy structural adhesive as well as a preparation method and application of the low-temperature-curable, high-temperature-resistant and corrosion-resistant epoxy structural adhesive. The component A is prepared by mixing the following components in parts by weight: 30-40 parts of alicyclic epoxy resin, 20-30 parts of biphenyl epoxy resin, 10-15 parts of a CTBN epoxy pre-reactant, 5-8 parts of a core-shell rubber toughening agent and 2-5 parts of fumed silica; and the component B is prepared by mixing 25-30 parts by weight of a modified DETDA curing agent, 10-15 parts by weight of microencapsulated anhydride, 25-35 parts by weight of a corrosion-resistant filler, 2-3 parts by weight of a coupling agent and 1-2 parts by weight of polyamide wax. According to the invention, the contradiction between the curing temperature and the heat resistance in semiconductor packaging is solved, and the excellent performance of low-temperature curing and high-temperature / corrosion resistance is realized.

The invention discloses a coating material for an optical fiber, a preparation method of the coating material, an optical fiber insulator and a preparation method of the optical fiber insulator. The coating material is prepared from the following raw material components in parts by weight: 40-60 parts of tetrahydrofuran acrylate, 30-50 parts of carboxyl modified polyurethane acrylate oligomer, 5-15 parts of organic silicon modified epoxy acrylate bifunctional coupling agent, 2-5 parts of vinyl silane surface modified SiO2 nano-particles, 1-5 parts of organic silicon modified epoxy acrylate, 1-5 parts of organic silicon modified epoxy acrylate, 1-5 parts of organic silicon modified epoxy acrylate, 1-5 parts of organic silicon modified epoxy acrylate and 1-5 parts of organic silicon modified epoxy acrylate. 0.1 to 1 part by weight of a triaryl sulfonium hexafluoroantimonate cationic initiator and 0.5 to 4 parts by weight of a TPO free radical photoinitiator. According to the embodiment of the invention, active chemical bonding of the optical fiber coating layer and the alicyclic epoxy resin sheath is realized through the organic silicon modified epoxy acrylate bifunctional coupling agent in the coating layer, and mismatch of physical gaps and thermal stress of a multi-material interface is reduced; therefore, the interface strength, the internal insulation performance and the long-term reliability of the optical fiber insulator can be fundamentally improved.

The application discloses a UV and moisture dual-cured high-temperature-resistant hot-melt acrylate pressure-sensitive adhesive tape and a preparation process thereof, and belongs to the technical field of high polymer materials. The pressure-sensitive adhesive tape comprises a base material and an adhesive layer. Raw materials of the adhesive layer comprise acrylate prepolymer containing a side chain containing a vinyl ether group, modified terpene resin containing a phenolic hydroxyl group, alicyclic epoxy functional silane, a cationic photoinitiator and an antioxidant. By controlling the molar ratio of the phenolic hydroxyl group and the vinyl ether, the tackifying resin is chemically grafted into the polymer network by using the cationic chain transfer reaction, and the double mechanism of the light-induced cationic polymerization and the acid-catalyzed moisture curing is combined, so that the problems of poor temperature resistance and oxygen inhibition of the traditional hot-melt adhesive are solved. The tape has excellent high-temperature shear resistance, high initial adhesion and deep curing characteristics, and the preparation process has good hot-melt processing stability.

The present invention discloses a multifunctional alicyclic epoxy monomer, a preparation method and application thereof. The structure of the multifunctional alicyclic epoxy monomer is shown in formula (I): #imgabs0##imgabs1# The multifunctional alicyclic epoxy monomer prepared by the present invention has good light transmittance. At the same time, the monomer can initiate free radical polymerization under ultraviolet light irradiation to prepare a multifunctional alicyclic epoxy polymer. The obtained multifunctional alicyclic epoxy polymer has good light transmittance, light color, good flexibility and high thermal decomposition temperature, which solves the problem of poor flexibility of bisphenol A epoxy resin. The polymer has great application prospects in the fields of solder mask ink, light and heat dual curing system, electronic manufacturing, coating protection, etc., and has very good application value.

The invention relates to the technical field of high polymer material modification, and discloses high-uniformity and high-stability epoxy modified resin and a preparation method thereof.The epoxy modified resin comprises 3, 4-epoxy cyclohexylmethyl-3 ', 4'-epoxy cyclohexane carboxylate, a synergistic modified cycloaliphatic epoxy resin matrix, an antioxidant, a light stabilizer, a flatting agent and a defoaming agent; according to the synergistic modified cycloaliphatic epoxy resin matrix, trimethyl (2, 3-epoxypropyl) ammonium chloride, 1, 3, 6, 8-tetra (4-aminophenyl) pyrene and sodium tetraphenylborate are constructed to form an embedded synergistic modified structure; the preparation method comprises the steps of matrix construction, resin pretreatment, synergistic dispersion and assistant introduction. By constructing a synergistic effect structure, the components in the system form a stable effect network on the molecular scale, microphase separation is effectively inhibited, the dispersion uniformity is improved, the thermal stability, mechanical properties and aging resistance of the material are remarkably improved, and the preparation method is suitable for the field of high-performance coatings and structural materials.

The invention discloses thermosetting type white coating with the solid content of 100% for metal printing and a preparation method of the thermosetting type white coating, and belongs to the technical field of primer for metal printing packaging. Comprising the following raw materials in parts by weight: 50-70 parts of thermosetting alicyclic epoxy resin, 5-15 parts of acrylic resin, 1-3 parts of blocked isocyanate, 3-5 parts of an alicyclic epoxy curing agent, 25-35 parts of a pigment, 1-5 parts of sulfydryl resin and 0.6-2.5 parts of an auxiliary agent. Meanwhile, the flexibility and the impact resistance of the paint film can be improved.

This invention provides a high-reliability UV adhesive for polarizing films, composed of the following raw materials by weight percentage: 25-55% alicyclic epoxy resin, 3-15% dicyclopentadiene acrylate monomer, 10-30% acrylic acid-modified castor oil epoxy resin, 10-30% glycidyl ether type epoxy compound, 1-10% adhesion promoter, 0.3-3% sensitizer, and 0.5-8% photoacid generator. The UV adhesive of this invention exhibits high adhesion strength to COP films, maintains adhesion over time, and is resistant to yellowing, overcoming the shortcomings of conventional UV adhesives, such as low adhesion and degradation over time.

A curable composition contains an alicyclic epoxy resin; and an active hydrogen compound having a pKa of 10 or less.

The application provides a UV adhesive with controllable curing time, which comprises the following raw materials in parts by weight: 50-100 parts of alicyclic epoxy resin and 0.11-4 parts of a photoinitiator; wherein the photoinitiator comprises a cationic photoinitiator and an imidazole type accelerator; the mass of the imidazole type accelerator accounts for 0.95%-90% of the mass of the photoinitiator. The formula of the adhesive is reasonably set, the UV curing rate of the cationic photoinitiator is delayed by introducing the imidazole type accelerator, the collocation of the two can achieve the effect that the resin can be relatively slowly cured after preliminary curing under light irradiation even without light irradiation, and the curing time is prolonged; moreover, the UV curing time of the adhesive can be further regulated by controlling the content of the imidazole type accelerator, and the delayed curing of different time is realized, so that the operation time can be accurately controlled in the production and application process.

The invention relates to the technical field of battery cell membranes, in particular to a battery cell insulating membrane and a preparation method thereof. The battery cell insulating film comprises the following components in parts by weight: 30-50 parts of alicyclic epoxy resin; 20 to 30 parts of bis (7-oxabicyclo [4.1. 0] 3-heptyl methyl) adipate; 15 to 25 parts of cyclohexane-1, 2-dicarboxylic acid diglycidyl ester; 10 to 15 parts of 2, 4, 5-epoxy tetrahydrophthalic acid diglycidyl ester; 5 to 10 parts of 3-ethyl-3-(hydroxymethyl) oxetane; 10 to 30 parts of bisphenol F diglycidyl ether; and 1-6 parts of a cationic curing agent. According to the invention, the alicyclic epoxy resin is matched with the epoxy resin and the photo-cation curing agent, and the formula and the curing mode are innovated, so that the problems of low automation degree, low curing speed, high energy consumption and the like in the traditional battery cell blue film production process are solved, and the method has a wide application prospect.

The invention discloses a preparation method of an insulating straining ring, which comprises the following steps: mixing 100 parts of epoxy resin with the phosphorus content of 2.8-3.5%, 20-40 parts of alicyclic epoxy resin, 15-25 parts of core-shell toughening agent and 30-40 parts of curing agent, heating to 115-125 DEG C, and reacting for 1-2 hours; cooling to below 50 DEG C, sequentially adding 20 parts of a solvent, 1.0-3.0 parts of a catalyst and 50-70 parts of superfine aluminum hydroxide, and stirring at a high speed to obtain an epoxy resin composition; adjusting the temperature of a drying oven to 160 + / -10 DEG C, penetrating glass fibers, driving the composition into a glue tank, and preparing a prepreg at a linear speed of 5-8m / min; and winding the prepreg on a mold, carrying out vacuum hot pressing in an oil press, cooling, demolding, slitting and the like to obtain the product. According to the method, through composite resin and glass fiber reinforcement, ultimate tension is improved to bear scene loads such as high-voltage power transmission; the core-shell toughening agent improves the brittleness; phosphorus-containing epoxy resin and aluminum hydroxide cooperate to achieve FV0-level flame retardance; the volume resistivity is stabilized to be more than 1014 omega.cm through process optimization, and the insulation requirement of a complex environment is met.

A polarizing plate and an optical display apparatus are disclosed. The polarizing plate includes: a polarizer; and a first bonding layer and a first retardation layer sequentially stacked on a lower surface of the polarizer. The first retardation layer has a light transmittance of 1.0% or less in the UVA wavelength range. The first bonding layer includes a cured product of a non-(meth)acrylic composition including a curable compound and a photoinitiator, and the curable compound includes an epoxy compound, the epoxy compound including a mixture of a bifunctional alicyclic epoxy compound, a bifunctional aromatic epoxy compound, and a bifunctional aliphatic epoxy compound. The photoinitiator includes a mixture of an iodonium-based photo-acid generator and an anthracene-based photosensitizer, the anthracene-based photosensitizer being present in an amount of 0.5 parts by weight or more relative to 100 parts by weight of the curable compound.

Provided is a curable epoxy composition capable of forming a cured product having excellent heat resistance even in a high temperature environment. A first curable epoxy composition includes an alicyclic epoxy compound (A) having an alicyclic structure and an epoxy group in a molecule, an acid anhydride-based curing agent (B), and an imidazole-based curing accelerator (C), and is liquid at 25° C. and to be used for a rotary electric machine. A second curable epoxy composition includes an alicyclic epoxy compound (A) having an alicyclic structure and an epoxy group in a molecule, an acid anhydride-based curing agent (B), an imidazole-based curing accelerator (C), and a polyester polyol (D), and is to be used for a rotary electric machine.

The present application relates to the technical field of epoxy adhesive, especially to the field of IPC C09J163, more particularly to a yellowing-resistant flame-retardant epoxy resin electronic potting adhesive and a preparation method thereof. The components include: component A and component B, the component A includes: 80-130 parts of epoxy resin, 10-20 parts of active diluent, 10-20 parts of filler, 5-10 parts of toughening agent, and 5-15 parts of flame retardant; the component B includes: 50-80 parts of curing agent and 5-15 parts of accelerator. 3. The epoxy resin includes bisphenol A epoxy resin, bisphenol F epoxy resin and alicyclic epoxy resin, and when the weight ratio of the bisphenol A epoxy resin, the bisphenol F epoxy resin and the alicyclic epoxy resin is 1:(1-2):(5-8), the hardness and yellowing resistance of the prepared potting adhesive can be improved.

The application discloses a kind of photovoltaic 0BB technology with thermosetting epoxy glue, including the following mass fraction group: castor oil structure oxabutane 10-20 parts, alicyclic epoxy 30-70 parts, polyester polyol 1-10 parts, hydrogenated rosin resin 1-5 parts, thermal initiator 0.6-3 parts, coupling agent 0.5-1.5 parts, anti-aging agent 0.2-1.0 parts, thixotropic agent 1-7 parts;Photovoltaic 0BB technology with thermosetting epoxy glue prepared by the application has good yellowing resistance, high temperature low volatile fraction, and good high-low temperature impact performance.

The invention provides a packaging material, a preparation method thereof and an LED display module. The packaging material comprises 75%-99% of an epoxy resin mixture, 0.5%-15% of a reinforcing agent and 0.5%-10% of a light diffusion agent. Wherein the epoxy resin mixture comprises the following components in percentage by mass: 1%-10% of bisphenol A epoxy resin, 15%-25% of alicyclic epoxy resin and 65%-84% of organic silicon modified epoxy resin; the reinforcing agent comprises at least one of polycarbonate and silica powder, and the light diffusion agent comprises at least one of barium sulfate, calcium carbonate and siloxane. Compared with the prior art, the packaging material disclosed by the invention has better impact resistance, cracking resistance and uniform light transmission capability, so that the mechanical property and optical function of the packaging layer are enhanced, the display effect of the LED display module is improved, and meanwhile, the packaging material also has relatively high impact resistance, so that the packaging material is effectively suitable for diversified application scenes such as outdoor and the like.