733 results about "Cycloaliphatic epoxy" patented technology

A fully curable jettable composition having a viscosity less than 30 cps at a temperature within the range of 15-180° C., more preferably at a temperature of 15-100° C., e.g. 60-80° C. the composition comprising: (A) at least one low viscosity reactive resin selected from the group consisting of compounds containing an oxetane ring, cycloaliphatic epoxy resins, tetrahydrofurans, hexahydropyrans and mono-functional (meth)acrylates, said resin having a molecular weight of not greater than 300 Daltons, e.g. 250 Daltons or less, and a viscosity at a temperature in the said range of less than 30 cps, e.g. 5 to 15 cps; (B) at least one higher viscosity resin selected from the group consisting of epoxy resins, compounds containing an oxetane ring and acrylates, which resin acts to thicken the low viscosity resin and strengthen a jetted deposit of the composition, the higher viscosity resin having: a viscosity greater than twice that of the low viscosity resin at the said temperature in the range stated above, and a functionality of greater than or equal to 2; (C) at least one curable toughener, preferably having a functionality of at least 2, such as hydroxy, epoxy, acrylic or other reactive functionalised polymer / oligomer (e.g. derived by functionalising poly(tetrahydrofuran), polycaprolactone, polycarbonate diol, or a dendrimeric polyol; (D) at least one initiator for the polymerisation of the resins, and (E) at least one stabiliser for delaying the curing of the resins of the composition; wherein the low viscosity resin is slower to react than the higher viscosity resin and acts to solvate the higher viscosity resin prior to curing and at least partly during curing and wherein at least 30% of the components A and B are cationically curable resins. The composition can be jetted from piezo electric printing heads under the control of a computer program to form a multi-layered article, e.g. a three dimensional article, in which the adjacent droplets merge and are cured homogeneously together.

A packaged solid state device having a package, a chip, and an encapsulate having an epoxy resin, a boron containing catalyst that is essentially free of halogen. A LED device having a package, a LED chip, a encapsulate having a cycloaliphatic epoxy resin and a boroxine catalyst essentially free of halogen. A method of encapsulating a solid state device whereby a solid state device is placed into a package, and an encapsulant comprising an epoxy resin, and a boron containing catalyst that is essentially free of halogen, are provided.

The present invention relates to a siloxane hard resin including alicyclic epoxy siloxane alone or a reactive monomer, which is prepared by condensation reaction of alkoxysilanes, and has a weight average molecular weight in the range of 1000 to 4000 and a molecular weight distribution of PDI 1.05 to 1.4. A siloxane hard cured article produced by photo- or thermal polymerization has high hardness by compact crosslinking of siloxane molecules having different molecular weights.

A composition for use as underfill material is provided. The underfill material includes a first curable transparent resin composition and a second curable fluxing resin composition. The first curable resin composition includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds and combinations and mixtures thereof, thereby forming a solvent-modified resin. The second curable fluxing composition includes at least one epoxy resin. The combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.

A liquid radiation-curable composition that comprises(A) at least one polymerizing organic substance comprising a mixture of(1) at least one alicyclic epoxide having at least two epoxy groups; and(2) at least one difunctional or higher functional glycidylether of a polyhydric compound;(B) at least one free-radical polymerizing organic substance comprising a mixture of(1) optionally, at least one trifunctional or higher functional (meth)acrylate compound; and(2) at least one aromatic di(meth)acrylate compound;(C) at least one cationic polymerization initiator;(D) at least one free-radical polymerization initiator;(E) optionally, at least one hydroxyl-functional aliphatic compound; and(F) at least one hydroxyl-functional aromatic compound;wherein the concentration of hydroxyl groups in the radiation-curable composition is at least about 1.1 equivalent OH groups per kilogram;wherein the concentration of epoxy groups in the radiation-curable composition is at least about 5.5 equivalent epoxy groups per kilogram; andwherein the amount of trifunctional or higher functional (meth)acrylate compound (B)(1) is from 0% to about 3% of the composition and the amount of aromatic di(meth)acrylate compound (B)(2) is at least 10% of the composition.

Liquid radiation curable resin compositions for additive manufacturing comprising: from about 5 to about 30 wt % of an oxetane; a (meth)acrylate component; a cationic photoinitiator; a free-radical photoinitiator; and from about 50 to about 80 wt % of an epoxy, which further comprises a cycloaliphatic epoxy component, and an epoxy component having an aromatic glycidyl ether group, wherein the majority of the epoxy is the cycloaliphatic epoxy component are described and claimed. Also described and claimed is a process for using the liquid radiation curable resins for additive manufacturing to create molds for dental aligners, and the three-dimensional molds made from the liquid radiation curable resins for additive manufacturing.

The invention I provides a method of producing an alicyclic epoxy compound having a specific structure, which comprises epoxidizing an alicyclic olefin compound having a specific structure by using an aliphatic percarboxylic acid having low water content. The alicyclic epoxy compound is useful for use in coatings, inks, adhesives, sealants, encapsulants, stabilizers or the like. The invention II provides an epoxy resin composition containing the alicyclic epoxy compound as a main component, and a photosemiconductor device comprising a photosemiconductor element encapsulated with the epoxy resin composition. The epoxy resin composition can be cured by heating, thereby obtaining a cured product having excellent moisture and heat resistance and transparency. The invention III provides: an ultraviolet rays-curable can-coating composition containing the alicyclic epoxy compound as a main component, which can be cured by ultraviolet irradiation, and can form a coating film having excellent film performances such as processability, adhesion, hardness and scratch resistance, particularly film appearance and retort resistance; and a process of producing a coated metal can using the composition.

A composition comprises a first curable resin composition that includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds, combinations thereof, and mixtures thereof. The composition can include a separate second curable fluxing composition that comprises at least one epoxy resin. The first curable resin or the combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.

This invention relates to an epoxy resin composition for a fiber-reinforced composite material, which contains the following constituent components (A), (B) and (C). (A) alicyclic epoxy resin (B) polyamine (C) latent acid catalyst which can dissolve in constituent component (A) or in constituent component (B) This epoxy resin composition is of low viscosity and is suitable for use in the molding of fiber-reinforced composite materials by RTM or the like. More particularly, it is possible to offer an epoxy resin composition for a fiber-reinforced composite material where the cured material obtained by heating has high level heat resistance and strength properties, and which is suitable for use as aircraft components, spacecraft components, artificial satellite components and the like

Provided is a photosensitive composition for volume hologram recording capable of forming a volume hologram recording medium that less shrinks upon curing in hologram recording (in hologram formation) and resists cracking. The photosensitive composition for volume hologram recording contains an alicyclic epoxy compound (A) represented by Formula (I); a thermal acid generator (B); a radically polymerizable compound (C); a radical polymerization initiator (D); and at least one epoxy compound (E) selected from the group consisting of compounds represented by Formula (1), epoxidized fatty acid esters, and epoxidized conjugated diene polymers.

A composition for use as underfill material is provided. The underfill material includes a first curable transparent resin composition and a second curable fluxing resin composition. The first curable resin composition includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds and combinations and mixtures thereof, thereby forming a solvent-modified resin. The second curable fluxing composition includes at least one epoxy resin. The combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.

A process for producing an epoxy silane oligomer including a reaction glycidoxy silane and / or cycloaliphatic epoxy silane having 2 or 3 alkoxy groups and, optionally, a copolymerizable silane other than glycidoxy and cycloaliphatic epoxy silane, with less than 1.5 equivalents of water in the presence of a catalyst, wherein said water is continuously fed during the reaction.

The invention relates to a liquid radiation curable resin capable of curing into a solid upon irradiation comprising: (A) from about 0 to about 12 wt % of a cycloaliphatic epoxide having a linking ester group; (B) from about 30 to about 65 wt % of one or more epoxy functional components other than A; (C) from about 10 to about 30 wt % of one or more oxetanes; (D) from, about 1 to about 10 wt % of one or more polyols; (E) from about 2 to about 20 wt % of one or more radically curable (meth) acrylate components; (F) from about 2 to about 12 wt % of one or more impact modifiers; (G) from about 0.1 to about 8 wt % of one or more free radical photoinitiators; and (H) from about 0.1 to about 8 wt % of one or more cationic photoinitiators; wherein the liquid radiation curable resin has a viscosity at 30° C. of from about 600 cps to about 1300 cps.

The invention discloses a high-performance liquid epoxy resin composition for packaging LEDs. The liquid epoxy resin composition is characterized by comprising the following components in percentage by weight: 48-52 percent of glue A and 48-52 percent of glue B, wherein the glue A comprises the following components in parts by weight: 95-99 parts of epoxy resin mixture, 0.01-0.5 part of color paste and 0.1-4.9 parts of defoaming agent, and the epoxy resin mixture is prepared by mixing cycloaliphatic epoxy resin and bisphenol epoxy resin according to arbitrary proportion; and the glue B comprises the following components in parts by weight: 92-99 parts of anhydride curing agent, 0.5-3 parts of curing accelerator, 0.1-3 parts of curing improver and 0.5-2 parts of antioxidant. The liquid epoxy resin composition has the advantages of low viscosity, high heat resistance, high light transmittance and good mechanical property.

The invention provides a high temperature-resistant epoxy resin composition for pultrusion and a preparation method. The high temperature-resistant epoxy resin composition for pultrusion comprises A and B components, wherein the A component comprises glycidyl ether epoxy resin, cycloaliphatic epoxy resin and an epoxy resin active diluents, the B component comprises cycloaliphatic anhydride, aromatic hydrocarbon polyanhydride, a thermoplastic phenolic resin curing agent, a maleic anhydride grafted rubber toughening agent, a polysiloxane toughening modifier, and an epoxy resin curing accelerator, and the ratio of the A component to the B component, by weight of the components, is 100:50-250. The composition of the invention has excellent high temperature resistance, and also maintains balance between processing properties, impact toughness and comprehensive performance. The prepared products can be used for a long time in rigorous wild high temperature environment.

The invention discloses a photocuring adhesive used for adhering optic glass lenses, which consists of the following components in percentages by weight: 50-80% of main resin, 10-40% of auxiliary resin, 5-20% of active monomer, 4-4.5% of photo initiator and 0.5-1% of auxiliary. The main resin is alicyclic epoxy resin. The auxiliary resin is modified epoxy acrylate resin. The active monomer is oneor a mixture of vinyl ether monomers and acrylate monomers. The photo initiator is a radical photo initiator and a cation photo initiator. The auxiliary is a coupling agent. The photocuring optic adhesive has the characteristics of high curing speed, high refraction rate, high light transmittance, low curing shrinkage rate, small thermal deformation, strong adhesion force, small smell, yellowing resistance and the like.

The invention discloses a flame-retardant high temperature-resistant epoxy resin composition capable of being used for pultrusion and a preparation method thereof. The flame-retardant high temperature-resistant epoxy resin composition capable of being used for pultrusion comprises three components of A, B, and C, and is characterized in that the A component comprises diglycidyl ether epoxy resin, cycloaliphatic epoxy resin and an epoxy resin active diluents; the B component comprises cycloaliphatic acid anhydride, arene poly(acid anhydride), a thermoplastic phenolic resin curing agent, a maleic anhydride-grafted rubber flexibilizer, a polysiloxane toughening modifier, and an epoxy resin curing accelerator; the C component comprises an inorganic fire retardant which has an ultrafine particle size and is subjected to surface modification by a silane coupling agent and a hydrophobic modifier; the weight ratio of the A, B, and C components is that A:B:C=100:50-250:20-150.

The invention discloses a preparation method of a high temperature and yellowing resistant alkali-soluble epoxy acrylate UV resin. The preparation method comprises the following steps: carrying out free radical polymerization on an alicyclic epoxy acrylate monomer, glycidyl methacrylate, and hydroxyethyl methacrylate or hydroxypropyl methacrylate to prepare an alicyclic epoxy acrylate copolymer; reacting acrylic acid with an epoxy group in the above epoxy acrylate resin, and introducing a double bond to make the resin have photosensitive activity; and reacting acid anhydride with a hydroxy group, and introducing a carboxyl group to make the resin alkali-soluble in order to prepare the high temperature and yellowing resistant alkali-soluble epoxy acrylate UV resin with a carboxyl group. The glass transition temperature of the resin finally obtained in the invention is 65-100DEG C, and the finally obtained resin has the characteristics of good high temperature resistance, yellowing resistance, acid and alkali resistance of a curable film, solvent resistance, excellent mechanical performances and the like, and can be widely applied in yellowing resistant optical imaging solder resistant inks, photoresist, yellowing resistant UV inks and coatings, adhesion promoters, ink crosslinking agents and the like.

The invention relates to a double-component transparent epoxy resin LED (light emitting diode) patch packing adhesive. The double-component transparent epoxy resin LED patch packing adhesive is characterized by consisting of two components, namely an A component and a B component, wherein the A component and the B component are mixed to be applied to construction according to the proportion of 1:(0.9-1.0), the A component consists of cycloaliphatic epoxy resin, silicone resin intermediate, reactive diluent, transparent blue and purple dye color paste, a defoaming agent and a flexibility agent, and the B component consists of a curing agent, an accelerating agent, an ultraviolet absorbent, polyalcohol and an antioxidant. The invention provides transparent cycloaliphatic epoxy resin patch adhesive with small viscosity, strong cohesive force, difficulty in cracking, high temperature resistance, high corrosion resistance and low temperature resistance, overcomes the defects that the current epoxy resin patch adhesive has brittleness, high hygroscopicity, low light transmittance, poor ultraviolet resistance and the like, is more suitable for outside LED and high-power LED packing adhesive, has the advantages of being simple in manufacturing process, lower in production cost and advanced technique in country, and is suitable for industrial large-scale production.

The invention discloses a method for improving the performance of a large-power high-light-transmittance LED packaging epoxy resin composition. The composition is composed of a component A and a component B. The composition has excellent UV resistance and yellowing resistance. The composition is advantaged in good manufacturability, good light transmittance, and low light failure. The composition can be used in white-light and blue-light LED packaging. Compared with organosilicon, the composition is advantaged in low price. Innovatively, the component A of the composition is composed of liquid cycloaliphatic epoxy resin, solid cycloaliphatic epoxy resin, and hydrogenated bisphenol A epoxy resin. An anti-forming agent, a color complementary agent, and a dispensing agent are adopted in auxiliary. The system does not contain benzene ring, and yellowing is not easy to occur. The component B is prepared through the steps that: methyl hexahydrophthalic anhydride and hexahydrophthalic anhydride are subjected to a polymerization reaction with promoting agents or cationic initiators such as quaternary phosphonium salt, quaternary ammonium salts, DBU salt, and imidazole; with added phosphate antioxidant, a thermal yellowing capacity is improved. With the applications of an ultraviolet absorber and a light stabilizer, a UV yellowing resisting effect is further improved.

The invention discloses an epoxy adhesive for OLED frame encapsulation and a preparation method of the epoxy adhesive. The epoxy adhesive is prepared from the following components in parts by weight:50-80 parts of epoxy resin, 5-10 parts of epoxy diluents, 5-10 parts of flexibilizer, 20-40 parts of filler, 1-5 parts of photoinitiator, 0.1-1 part of antioxidant and 0.3-3 parts of additive. The epoxy resin is one or a mixture of more of cycloaliphatic epoxy resin and bisphenol F epoxy resin. The epoxy diluent is one or a mixture of more of oxetane and aliphatic glycidyl ether. The photoinitiator is a cationic photoinitiator which comprises an iron-arene photoinitiator and a hexafluorophosphate photoinitiator. The epoxy adhesive adopts a curing way that ultraviolet exposure and heating are conducted in sequence, has the advantages of less curing agent residue, less volatile component residue, low curing temperature, strong bonding force, boiling resistance, water vapor resistance, oxygenbarrier performance and the like, and reaches the halogen-free standard.

The invention provides a resin filling material for repairing steel bridge deck pavement and method for preparing the same, the material is composed of two following components in weight ratio: adhesive component:curing component= 1:0.3-1; wherein, the adhesive component is prepared by following raw materials in weight parts proportion: bisphenol A epoxy resin 1-100 parts, alicyclic epoxy resin mixture 1-100 parts, toughening, softing components bifunctional epoxy resin 1-50 parts, softing components trifunctional epoxy resin 1-50 parts; the curing component is prepared by following raw materials in weight parts proportion: polyether amine curing agent 20-50 parts, alicyclic amine curing agent 2-50 parts, aromatic amine curing agent 2-50 parts, long-chain aliphatic amine curing agent 1-50 parts, polyamide curing agent 1-50 parts, organic amine curing accelerator 1-4 parts. The invention provided resin filling materials for repairing steel bridge deck pavement has characteristics of good flexibility, high adhesive strength, good water resistance and good temperature resistance, which meets the service requirments in filling repair of steel bridge deck pavement.

A liquid thermosetting epoxy resin composition contains a base resin in combination with a curing agent and a curing accelerator or with a curing catalyst. The base resin includes a cycloaliphatic epoxy compound having at least one alicyclic skeleton and two or more epoxy groups per molecule, and a polyol oligomer having two or more terminal hydroxyl groups. An optical semiconductor device includes an optical semiconductor element sealed by using the liquid thermosetting epoxy resin composition. The composition yields a cured resinous product which is free from curing failure, is optically homogenous, has a low elastic modulus in bending, a high bending strength, a high glass transition temperature, a high optical transparency and is useful for optical semiconductors.

The invention discloses a modified cycloaliphatic epoxy polyurethane acrylate ultraviolet-curable coating. The coating comprises the following chemical components in percentage by weight: 40-85% of modified cycloaliphatic epoxy polyurethane acrylate prepolymer, 10-55% of activated monomer diluent, 0.5-5% of photoinitiator, 0.1-2% of leveling agent, and 0.1-5% of adhesion promoter, wherein the sum of weight percentage of the raw materials is 100%. The invention also discloses a preparation method of the modified cycloaliphatic epoxy polyurethane acrylate ultraviolet-curable coating. The coating disclosed by the invention has the characteristics of strong impact resistance, high adhesion and the like, shrinkage of the curing system is small and the flexibility of the cured film is good. The coating can be used as coating materials of various metal sheets.

The invention belongs to the technical field of adhesives, and particularly relates to an ultraviolet-heat dual curing optical adhesive containing epoxidized polybutadiene resin. The ultraviolet-heat dual curing optical adhesive comprises the following components in percentage by weight: 14.5%-45% of epoxidized polybutadiene resin, 10%-40% of alicyclic epoxy modified resin, 5%-15% of polyolefin liquid rubber, 25.5%-35% of an acrylic ester reactive diluent, 2.4%-3.4% of a free radical photoinitiator, 0.1%-0.2% of a cationic photoinitiator and 2%-2.5% of a peroxide initiating curing agent. The optical adhesive disclosed by the invention is relatively completely solidified at a shaded part, a dark adhesive layer part or a thick adhesive layer part, has excellent optical properties such as high refractive index and high transmittance after being solidified, has the advantages of shock resistance, low yellowing coefficient, low haze, low shrinking percentage, easiness in repairing and good flexibility, meets the requirements of optical, physical and chemical properties of display devices, and is suitable for fast-tempo and high-efficiency production processes.

The invention discloses a high-reliability and low-viscosity underfill for packaging a semiconductor device and a substrate, which comprises the following raw materials by weight percent: 0-12.8% of bisphenol-type epoxy resin, 11.4-62.5% of alicyclic epoxy resin, 0.44-13% of multi-functional epoxy resin, 11.4-62.5% of curing agent, 0.86-5.7% of curing accelerator, 11.6-51.1% of inorganic filler, 00.4-4.2% of silane coupling agent and 0-4.2% of carbon black. The invention uses the bisphenol type epoxy resin, the inorganic filler material and the silane coupling agent with molecular weight of more than 400 as necessary components, and has good mobility and thermal cycling stability and high reliability.

The invention discloses a preparation method of a high-performance epoxy resin composition for LED (light-emitting diode) packaging, which comprises the steps of raw material preparation, proportional mixing, vacuum degassing and curing. In the raw material preparation step, the epoxy resin composition is composed of a component A and a component B, wherein the component A comprises an epoxy resin mixture, a defoaming agent and a color complementing agent; the epoxy resin is composed of an alicyclic epoxy resin, a hydrogenated bisphenol A epoxy resin, a bisphenol A epoxy resin and a polyurethane modified epoxy resin; the component B comprises a curing agent mixture, a modifier, an antioxidant, an ultraviolet absorbent, a light stabilizer, an accelerator and a mold release agent; and the curing agent mixture is composed of methyl hexahydrophthalic anhydride and hexahydrophthalic anhydride. The method improves the brittleness of the epoxy resin, lowers the internal stress of the material, enhances the low-temperature resistance of the finished product, and improves the aging resistance, yellowing resistance and ultraviolet resistance of the LED product.

Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) at least one anhydride curing agent, (C) at least one a boron containing catalyst that is essentially free of halogen, (D) at least one cure modifier, and, optionally (E) at least one ancillary curing catalyst. The encapsulant may also optionally comprise at least one of thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip, and an encapsulant comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.