195 results about "Cycloaliphatic epoxy" patented technology

The invention discloses a toughened epoxy resin and a curing method thereof, and relates to the technical field of epoxy resins, the toughened epoxy resin comprises the following components: 100 parts of an epoxy resin matrix, specifically a mixture of bisphenol A epoxy resin and alicyclic epoxy resin, 5-35 parts of a composite amine curing agent, and 5-20 parts of a nano toughening agent, in particular to core-shell rubber particles grafted with epoxy groups on the surfaces, the core layer of each core-shell rubber particle is cross-linked polybutadiene, the shell layer of each core-shell rubber particle is polymethyl methacrylate, 0.5-3 parts of an accelerant comprising a bi-component synergistic accelerant, 1-5 parts of an interface enhancer, and a mixture of gamma-glycidyl ether oxypropyl trimethoxy silane and a titanate coupling agent, a bisphenol A type epoxy resin and a specific proportion of alicyclic epoxy resin are combined to construct an epoxy resin matrix according to a mass ratio of 2: 1, the epoxy resin matrix is matched with a composite amine curing agent prepared by carrying out a special three-step reaction on long-chain polyether diamine, aromatic diamine and anhydride, and key parameters such as molecular weight, functionality and molar ratio of the components are accurately regulated and controlled.

The invention discloses a preparation method of an anti-bird cover device with an ultra-large umbrella diameter and the anti-bird cover device, and relates to the technology of electrical tools and insulators, the preparation method of the anti-bird cover device with the ultra-large umbrella diameter comprises the steps that a hard insulating material is added into a reaction kettle to be stirred to obtain a castable, and the hard insulating material takes alicyclic epoxy resin as a matrix; and the hardware fitting is installed in a mold, the castable is injected into the mold through pressure, primary curing, demolding and secondary curing are carried out, and the anti-bird cover device with the ultra-large umbrella diameter is obtained. According to the anti-bird cover device with the ultra-large umbrella diameter and the manufacturing process of the anti-bird cover device, the diameter of the manufactured umbrella skirt is designed to reach 600 mm or above, the anti-bird cover device is suitable for special environments such as bird damage, icing and rainfall, and the operation reliability of a power transmission line can be effectively improved.

The invention discloses an LED (light-emitting diode) pouring sealant which is prepared from the following components: alicyclic epoxy resin, a glycidyl ether toughening agent, a thermal initiation cation curing agent, an anhydride curing agent and the like. A rigid ring structure of the alicyclic epoxy resin and a flexible chain segment of the anhydride curing agent are subjected to ring-opening reaction to form a three-dimensional cross-linked network; the alicyclic epoxy resin and the anhydride curing agent are combined to form an interpenetrating polymer network, the anhydride curing agent is further crosslinked through an esterification reaction in a high-temperature stage to form a high-density interpenetrating network, and the structure not only retains the weather resistance of the alicyclic epoxy resin, but also relieves internal stress through a flexible chain segment of anhydride, so that the volume shrinkage rate after curing is reduced to 0.5% or below; meanwhile, a glycidyl ether toughening agent is inserted into double networks through long-chain ether bonds to form tough nodes, crack propagation is inhibited, and the comprehensive performance of the colloid is remarkably improved by combining an anhydride curing agent vacuum dehydration and staged curing process.

The invention relates to the technical field of polymer composite materials, in particular to an explosion-proof and impact-resistant polymer coating material for an aircraft shell. The coating is prepared from aliphatic polyurethane acrylate, cycloaliphatic epoxy resin, nano silicon dioxide, polyethylene glycol, polyurea microcapsules, dicyclopentadiene resin, a Grubb catalyst, graphene oxide, polysulfide rubber and the balance of auxiliary materials. According to the invention, aliphatic polyurethane acrylate is used as a flexible matrix, so that the risk of hydrolysis of aromatic isocyanate is avoided. The dicyclopentadiene resin is subjected to in-situ ring opening polymerization in the presence of a Grubbs catalyst and cooperates with the hydrophobic nano silicon dioxide to block water. The polyurea microcapsules are broken by impact to release silicone oil, and cracks are filled immediately to reduce friction. And a water molecule permeation path is prolonged by the mica powder sheet layer. And the epoxy-polyurethane network realizes micro-crack self-repairing through dynamic ester bond exchange, so that the anti-explosion and anti-impact functions of the coating and the structural stability of an aircraft shell in an extreme environment are guaranteed.

The invention discloses epoxy vinyl ultraviolet curing resin and a preparation method thereof, and belongs to the technical field of epoxy resin materials.The preparation method comprises the following steps that fluorine-containing alicyclic epoxy resin, thiol-alkene functionalized vinyl acid, coumarin modified styrene, a prepolymer, an active prepolymer and nanoscale dispersion liquid are sequentially prepared; and carrying out nano synergistic modification, thermal activation component introduction, gradient photo-thermal synergistic curing and super-hydrophobic surface optimization to obtain the epoxy vinyl ultraviolet curing resin. According to the invention, through ternary compounding of coumarin modified styrene, thiol-alkene functionalized vinyl acid and fluorine-containing alicyclic epoxy resin and synergistic effect of the three components and a gradient photo-thermal curing process, the problems of excessive cross-linking brittleness of a surface layer, insufficient curing and weak bonding of an inner layer, permeation of a medium along defects and the like are synchronously solved; systematic improvement of strength, cohesive force and corrosion resistance is achieved.

The invention discloses a flame-retardant epoxy resin adhesive with a low dielectric constant and a low dielectric loss factor as well as a preparation method and application of the flame-retardant epoxy resin adhesive, and belongs to the technical field of electrical insulating materials. The method comprises the following steps: uniformly mixing and stirring epoxy resin and alicyclic epoxy resin to obtain an epoxy resin mixture; uniformly stirring liquid acid anhydride, a flame retardant, an epoxy active toughening agent and an accelerant to obtain an epoxy resin curing agent; and vacuumizing and uniformly stirring the epoxy resin mixture and the epoxy resin curing agent to obtain the flame-retardant epoxy resin adhesive with low dielectric constant and low dielectric loss factor. Dielectric loss of the epoxy resin mixture is reduced through polarity complementation, and molecular chain segment polarization is reduced through an alicyclic epoxy resin ring structure. And the flame retardant is dispersed into a uniform flame-retardant phase in liquid anhydride, so that the mechanical property is prevented from being reduced. A flexibilizer and anhydride are grafted to introduce a flexible chain segment, vacuum mixing is performed to eliminate an air gap, and after gradient curing, a low dielectric constant, a low dielectric loss factor and flame retardance are obtained.

The invention discloses a high-Tg low-expansion-coefficient underfill adhesive and a preparation method thereof. The high-Tg low-expansion-coefficient underfill adhesive comprises the following raw material components in percentage by weight: 10-15% of alicyclic epoxy resin; 15-18% of organic acid anhydride; 0.5%-1.0% of a curing accelerator; 0.1%-0.3% of a defoaming agent; 1-3% of a silane coupling agent; 1.5%-1.8% of carbon powder; and 60-75% of spherical silicon dioxide. By adopting various raw materials with specific proportions and types, the obtained filling adhesive can be quickly cured at low temperature, and element damage caused by high temperature in the packaging process of a heat-sensitive element becomes possible.

According to the single-component low-temperature curing silver paste stored at normal temperature and the preparation method, polyhedral silver-coated copper powder and nano silver powder are compounded, the contact area between the powder is increased, the resistance is reduced, meanwhile, the characteristic that the nano silver powder can be molten at 180 DEG C is utilized, gaps between the powder are filled, part of colloid is driven away, and the resistivity is further reduced. A closed antimony salt cationic initiator is adopted to cure alicyclic epoxy resin, lower-temperature rapid curing is achieved, oxidation of silver-coated copper powder in the heating curing process is avoided, meanwhile, it is guaranteed that slurry has low viscosity, construction performance is ensured, and in addition, in order to avoid hindering of high metal powder filling on slurry curing, the construction efficiency is improved. The enclosed antimony salt is dissolved by alcohol and is uniformly dispersed in the whole slurry, so that the carrier resin is completely cured, and the problem of grid line pulverization is avoided. The method can be used for printing heterojunction (HJT) photovoltaic cells, laminated cells and flexible circuit boards, and can be industrially produced.

The invention discloses a composite resin material for packaging a fuel cell and a preparation method of the composite resin material. The composite resin comprises bisphenol F type epoxy resin, alicyclic epoxy resin, acrylate resin, a toughening agent, nano silicon dioxide particles, a long-chain aliphatic amine curing agent, an imidazole accelerant and graphene coating carbon fibers. Bisphenol F and alicyclic epoxy resin are compounded, acrylate resin is combined to form a rigid-flexible three-dimensional network matrix, nano-silica treated by a silane coupling agent is introduced to improve moisture resistance, and graphene coating carbon fibers with oxygen-containing groups on the surface are utilized to enhance interface bonding force. And a cross-linked network is regulated and controlled through the coordination of the long-chain fatty amine curing agent and the imidazole accelerant. The obtained composite resin has excellent temperature resistance, moisture resistance, mechanical properties and interface bonding strength, effectively solves the problem of performance degradation of a traditional packaging material in high-temperature, high-humidity and corrosive environments, and meets the strict use requirements of fuel cells.

The invention provides a UV delayed curing adhesive and a preparation method thereof. The UV delayed curing adhesive is prepared from the following raw materials in parts by weight: alicyclic epoxy resin, modified alicyclic epoxy resin, polycaprolactone polyol, a reactive diluent, a photoinitiator, a silane coupling agent and gaseous silicon. According to the prepared UV delayed curing adhesive, the formula is optimized, the defects of performance of traditional curing adhesives can be overcome, the performance of the adhesive is improved, the post-curing time is shortened, the bonding performance is improved, application in many scenes can be met, and the important research value is achieved.

The invention relates to the technical field of composite structure protection stickers, and particularly discloses a composite layered protection sticker for a folding screen and a production process of the composite layered protection sticker. The invention discloses a composite layered protection paste for a folding screen. The composite layered protection paste sequentially comprises a polymeric membrane layer, ultra-thin flexible glass, a polymeric membrane layer and a functional coating from bottom to top, the polymeric membrane layer is prepared from the following components in parts by mass: 40 to 50 parts of alicyclic epoxy resin, 20 to 30 parts of hydroxyl-terminated polyisobutene, 5 to 10 parts of hydroxyl-terminated polybutadiene, 8 to 10 parts of modified vinyl alkoxy silane, 5 to 7 parts of modified nano silicon dioxide, 30 to 40 parts of curing agent, 0.4 to 0.6 part of catalyst and 30 to 50 parts of solvent; the composite layered protective paste prepared by the invention has excellent advantages in bending resistance and impact resistance.

The invention belongs to the technical field of epoxy resin, and provides degradable epoxy resin containing a cyclic acetal structure and a preparation method and application thereof.The epoxy resin is based on alicyclic epoxy resin, the cyclic acetal structure is introduced into the alicyclic epoxy resin structure, the cyclic acetal structure has degradability under the acidic condition, and therefore the cyclic acetal structure can be degraded under the acidic condition; the rigidity of the annular structure is favorable for improving the mechanical property of the epoxy resin, and the finally obtained epoxy resin has the characteristics of good mechanical property, ultraviolet radiation resistance and suitability for the field of photocuring. According to the preparation method provided by the invention, 3-cyclohexene-1-formaldehyde and tetrahydric alcohol are taken as raw materials, and the epoxy resin is obtained through nucleophilic addition reaction and epoxidation reaction.

The invention relates to the technical field of LED packaging adhesives, in particular to a packaging adhesive for a Mini-LED display module and a preparation method of the packaging adhesive. The packaging adhesive comprises a component A and a component B, wherein the weight ratio of the component A to the component B is 1: (0.8-1); wherein every 100 parts of the component A comprises 35-50 parts of alicyclic epoxy resin, 5-20 parts of hydrogenated bisphenol A type epoxy resin, 25-40 parts of modified silica powder and 1-10 parts of a reactive diluent; the modified silica powder is silica powder modified by a silane coupling agent; every 100 parts of the component B comprises 85-95 parts of anhydride, 1-10 parts of a toughening agent and 0.5-5 parts of a curing accelerator. The packaging adhesive provided by the invention has the advantages of low viscosity and curing stress, and can effectively reduce the probability of occurrence of defects such as inconsistent ink colors and hard spots generated in the packaging process. And a packaging adhesive layer obtained by curing the packaging adhesive has the advantages of high transparency, heat resistance, moisture resistance and ultraviolet resistance.

The invention relates to the technical field of semiconductor packaging adhesive films, and provides a resin composition, an adhesive film and application thereof. The resin composition disclosed by the invention is prepared from the following components in parts by weight: 5 to 20 parts of maleimide, 5 to 20 parts of alicyclic epoxy resin, 25 to 40 parts of thermoplastic high-molecular compound, 10 to 20 parts of bisphenol epoxy resin, 10 to 30 parts of benzoxazine resin and 30 to 300 parts of inorganic filler, wherein the degree of functionality of the alicyclic epoxy resin is not less than 3. The packaging adhesive film prepared from the resin composition provided by the invention has low thermal expansion coefficient and excellent heat resistance, can still keep stable adhesive force in a high-temperature and high-humidity environment, and is suitable for packaging semiconductors.

This application provides a glass fiber surface treatment agent, its preparation method, glass fiber, fabric, and their applications. The glass fiber surface treatment agent comprises an effective component and water, with a solid content of 5.8–10.5%. The effective component, by weight percentage, includes: a coupling agent of 7.3–17.3%, a penetrant of 0.3–2.8%, a lubricant of 7.7–13.2%, a film-forming agent of 58.3–81.9%, a toughening agent of 0.4–1.8%, and additives of 2.4–6.6%. The film-forming agent comprises film-forming agent A and film-forming agent B. Film-forming agent A is a composition of phenolic epoxy emulsion and bisphenol A type epoxy emulsion, and film-forming agent B is an alicyclic epoxy resin emulsion. Glass fibers produced using this glass fiber surface treatment agent exhibit excellent bundle properties, wear resistance, and weaving performance. The glass fiber fabric undergoes rapid and complete static impregnation in epoxy resin, resulting in high mechanical strength and meeting the performance requirements of new energy vehicle battery casings.

The invention discloses a high-refractive-index photo-thermal dual-curing optical adhesive and a preparation method thereof, and belongs to the technical field of high polymer materials, and the preparation method comprises the following steps: S1, preparation of high-refractive-index resin: placing biphenyl-4, 4 '-dithiol in a nitrogen atmosphere reaction kettle, adding a free radical thermal initiator, heating to 180-200 DEG C, reacting for 1-2 hours, and cooling to room temperature to obtain the high-refractive-index resin; dropwise adding alkenyl resin under the protection of nitrogen, stirring, reacting for 1-2 hours after dropwise adding, and cooling to room temperature to obtain high-refractive-index resin; s2, preparation of the optical adhesive: mixing the alicyclic epoxy resin, the high-refractive-index resin, the toughened resin, the liquid epoxy resin, the cationic photoinitiator and the cationic thermal initiator, and uniformly stirring in a dark place to obtain the adhesive. The problems that a traditional optical adhesive is poor in optical performance stability and unbalanced in mechanical and optical performance are solved. The application potential of preparing the high-performance optical adhesive is realized.

The invention discloses high-heat-resistance low-dielectric-loss resin as well as a preparation method and application thereof, and relates to the technical field of resin materials. The high-heat-resistance and low-dielectric-loss resin is prepared through the curing reaction of the alicyclic epoxy resin and the active ester; the core of the method is that alicyclic epoxy resin is subjected to curing reaction with active ester by utilizing the characteristics of small molecular weight, high crosslinking density and no glyceryl ether structure, so that the defects of large molecular weight, low crosslinking density, low Tg, low cost and the like of resin formed by bisphenol A type epoxy resin, phenolic aldehyde type epoxy resin and the active ester in the prior art are effectively overcome. And electrical defects caused by a glyceryl ether-containing structure of part of resin are overcome. The prepared high-heat-resistance low-dielectric-loss resin has high heat resistance and excellent electrical performance, the manufacturing process is simple and easy to operate, and the high-heat-resistance low-dielectric-loss resin can be applied to the electronic field of copper-clad plates and the like and has wide application prospects.

[Task] To provide a cationically curable composition that cures in both the exposed area and the unexposed area in a mold with a complex geometry and is suitable for application as an optical element or adhesive. [Solution] Providing a cationically curable composition comprising a fluorene skeleton-containing epoxy compound (A) containing naphthalenediyl groups which may have a substituent, a mono- or bifunctional alicyclic epoxy compound (B), a photoacid generator (C) and an acid multiplying agent (D) and curing even in the unexposed area in a mold having a complex geometry.

The present invention relates to a photosensitive resin composition comprising: (A) 10-60 wt% of a polyacrylic resin; (B) 10-60 wt% of an epoxy resin; (C) 8-30 wt% of a photopolymerizable monomer; (D) 1-20 wt% of a photoinitiator; (E) 1-15 wt% of a curing agent; (G) 1-15 wt% of a thermal initiator; (H) 1-10 wt% of other additives; the content of each component is calculated based on 100 wt% of the total solid content of the composition; the weight average molecular weight Mw of the polyacrylic resin is 4,000 to 80,000; the acid value is 80 to 200 mgKOH / g; the epoxy resin is selected from bisphenol A type epoxy acrylic resin and alicyclic epoxy acrylic resin. The invention also relates to an OLED display using the photosensitive resin composition.

The invention discloses a high-adhesion bottom filling adhesive, a preparation method thereof and a chip packaging structure, and relates to the technical field of chip packaging, the bottom filling adhesive is composed of the following components by mass: 28-54% of epoxy resin, 38-67% of an anhydride curing agent, 2-5% of an accelerator, and 1-4% of an additive; wherein the epoxy resin is formed by compounding bisphenol F type epoxy resin and alicyclic epoxy resin, and the additive comprises liquid bismaleimide. The anhydride curing agent is adopted to accelerate the cross-linking curing reaction of the underfill adhesive and shorten the surface drying time, so that the underfill adhesive can be suitable for a tunnel type oven, and the chip packaging efficiency is improved; meanwhile, bismaleimide is introduced into the system, so that the surface energy difference between the underfill adhesive and a PI substrate is reduced, the adhesive force between the underfill adhesive and the PI substrate as well as between the underfill adhesive and a chip is improved, and the packaging yield of the chip is improved.

This application relates to the technical field of composite structure protective films, and specifically discloses a composite laminated protective film for a folding screen and its production process. A composite laminated protective film for a folding screen comprises, from bottom to top in sequence, a polymer film layer, an ultra-thin flexible glass, a polymer film layer, and a functional coating; the preparation raw materials of the polymer film layer include the following components: 40 to 50 parts by mass of alicyclic epoxy resin, 20 to 30 parts by mass of hydroxyl-terminated polyisobutylene, 5 to 10 parts by mass of hydroxyl-terminated polybutadiene, 8 to 10 parts by mass of modified vinyl alkoxysilane, 5 to 7 parts by mass of modified nano-silica, 30 to 40 parts by mass of a curing agent, 0.4 to 0.6 parts by mass of a catalyst, and 30 to 50 parts by mass of a solvent; the composite laminated protective film prepared in this application shows excellent advantages in anti-bending performance and impact resistance.

The application relates to a conductive silver glue and a preparation method and application thereof, and belongs to the technical field of bonding materials.The conductive silver glue comprises an epoxy resin, an active diluent, a curing agent, an accelerator and silver powder; the epoxy resin comprises a main body resin and an auxiliary resin; the main body resin comprises a glycidyl amine type epoxy resin; and the auxiliary resin comprises a combination of a phenolic epoxy resin, a triphenylmethane type epoxy resin and an alicyclic epoxy resin.The conductive silver glue provided by the application is a high-reliability conductive silver glue of an epoxy resin system, has the characteristics of high moisture and heat resistance, high high-temperature bonding force, high residual glue rate and low resin overflow, effectively solves the problem that the existing conductive silver glue has low reliability under high-temperature and high-humidity conditions, is suitable for complex scenes, and has a simple preparation method and controllable cost.

A manufacturing method of a liquid ejecting head, in which a ejection port forming member that forms an ejection port for ejecting a liquid and a flow path of the liquid that communicates with the ejection port are formed on a substrate, the manufacturing method includes: forming a mold for the flow path of the liquid on the substrate; applying a photosensitive resin composition for forming the ejection port forming member on the substrate on which the mold has been formed so as to form a cationically polymerizable resin layer; and performing exposure and development on the cationically polymerizable resin layer so as to form the ejection port forming member, wherein the photosensitive resin composition includes at least one epoxy resin selected from an alicyclic epoxy resin and a glycidyl epoxy resin and a cationic photopolymerization initiator having a specific structure and a molar absorption coefficient.

The high-reliability UV adhesive for the polaroid is prepared from the following raw materials in percentage by weight: 25 to 55 percent of alicyclic epoxy resin, 3 to 15 percent of dicyclopentadiene acrylate monomer, 10 to 30 percent of acrylic acid modified castor oil epoxy resin, 10 to 30 percent of glycidyl ether type epoxy compound, 1 to 10 percent of adhesion promoter, 0.3 to 3 percent of sensitizer and 0.5 to 8 percent of photoacid generator. The UV adhesive disclosed by the invention has relatively high bonding strength to a COP film, the adhesion is not attenuated over time, the UV adhesive has the advantage of yellowing resistance, and the defects that the conventional UV adhesive is low in adhesion and is reduced over time are overcome.

The invention relates to a photocuring continuous carbon fiber composite material formula and a 3D printing head device, and the photocuring continuous carbon fiber composite material formula comprises the following components in parts by weight: 50-90 parts of carbon fiber and epoxy resin, 1-5 parts of a photoinitiator, 0-3 parts of a photosensitizer, 5-20 parts of an alicyclic epoxy compound, and 5-20 parts of an oxygen heterocyclic compound. 0-5 parts by weight of a thixotropic agent and 0-20 parts by weight of an active diluent. The 3D printing head comprises a resin injection part, a fiber feeding part, an in-situ impregnation tank, a point light source bracket part, an anti-overflow part and a preimpregnated continuous carbon fiber discharging part; according to the photocuring continuous carbon fiber composite material formula and the 3D printing head device, protonic acid and gelation can be rapidly initiated on the surface through illumination, protonic acid is diffused into fibers by means of the heat effect to achieve deep curing, and therefore 3D printing of the photocuring continuous carbon fiber reinforced epoxy resin composite material is achieved.

The invention discloses a water-resistant PSA adhesive for an antifogging tablet and a preparation method thereof, and relates to the technical field of acrylate pressure-sensitive adhesives, and the preparation method comprises the following steps: mixing an acrylate monomer and a solvent, heating to 80-85 DEG C, sequentially adding a chain transfer agent, an internal crosslinking agent and an initiator, stirring, carrying out a heat preservation reaction for 60-90 min, heating to 84-88 DEG C, and continuing the reaction for 150-200 min to obtain a polyacrylate solution; according to the invention, the tackifying resin, the external cross-linking agent and the photoinitiator are added to obtain the PSA adhesive, the acrylate monomer contains epoxy acrylate prepared from alicyclic epoxy resin, and compared with traditional epoxy resin, the PSA adhesive has the advantages of active dilution effect, fluidity, lubricity and processability; and the crosslinking density of an adhesive film is improved, the initial adhesion and the peel strength are improved, and the water resistance and the heat resistance are improved.

The invention provides a polarizing plate, a barrier layer composition and a display device. The polarizing plate includes a polarizer and a barrier layer formed on one surface of the polarizer. The barrier layer comprises curable compounds including an epoxy compound and a (meth) acrylate compound; a photoinitiator; and a diol compound, wherein the epoxy compound includes a cycloaliphatic epoxy compound and a bisphenol-type epoxy compound. The bisphenol-type epoxy compound is present in an amount of 20 parts by weight to 70 parts by weight with respect to 100 parts by weight of the curable compound, and the diol compound is present in an amount of 1 part by weight to 15 parts by weight with respect to 100 parts by weight of the curable compound.

A refrigerator oil composition which is used together with a refrigerant that contains an unsaturated fluorinated compound having a carbon-carbon unsaturated bond represented by general formula (I): C2FpR4-p (I) [in general formula (I), R each independently represents a hydrogen atom, a chlorine atom, a bromine atom or an iodine atom, and p is an integer of 1-3], in which R represents a hydrogen atom, a chlorine atom, a bromine atom or an iodine atom, and p represents an integer of 1-3], R represents a hydrogen atom, a chlorine atom, a bromine atom or an iodine atom, and p represents a hydrogen atom, a chlorine atom, a bromine atom or an iodine atom. A refrigerator oil composition containing a base oil (A), an epoxy compound (B), and a terpene compound (C), the epoxy compound (B) being an aliphatic epoxy compound (B1) or an alicyclic epoxy compound (B2), the total content of the epoxy compound (B) and the terpene compound (C) being 4.0 mass% or more based on the total amount of the refrigerator oil composition.

The invention discloses a quaternary ammonium salt latent curing agent, a single-component epoxy resin composition as well as a preparation method and application of the single-component epoxy resin composition. The compound has a specific general formula (I) structure, and R is Si, O or S and is matched with a specific weak nucleophilic anion (such as PF). The curing agent can be pre-mixed with an alicyclic epoxy resin (such as a compound of a formula II / III) to form a single-component system which can be stably stored for at least 3 months at the temperature of less than or equal to 40 DEG C. When heated to 90-130 DEG C, the system can rapidly initiate polymerization of epoxy groups, and the curing efficiency is high. The invention successfully solves the industrial problem that the single-component storage stability and the medium-temperature curing activity of the cycloaliphatic epoxy resin in the prior art are difficult to consider at the same time, and has extremely high industrial application value.

The invention provides an alicyclic epoxy resin-based anti-yellowing solder resist ink and a preparation method thereof, the alicyclic epoxy resin-based anti-yellowing solder resist ink comprises a component A and a component B. The component A comprises the following components: an acrylic resin emulsion, a modified acrylic resin, an active monomer, a photoinitiator, an amino-modified filler, a pigment, an auxiliary agent and a solvent; the component B comprises the following components in parts by mass: alicyclic epoxy resin, an auxiliary agent and a solvent; wherein the modified acrylic resin is obtained by reaction of polyfunctional epoxy resin, acrylic acid and acrylate. According to the present invention, the anti-yellowing effect is good, the advantages of the alicyclic and aromatic ring structures are combined, the stability, the adhesion, the toughness and other capabilities of the ink are improved, the defects in the prior art are overcome, and the new idea is provided for the development of the solder resist ink.