88 results about "Cycloaliphatic epoxy" patented technology

The invention discloses a flame-retardant epoxy resin adhesive with a low dielectric constant and a low dielectric loss factor as well as a preparation method and application of the flame-retardant epoxy resin adhesive, and belongs to the technical field of electrical insulating materials. The method comprises the following steps: uniformly mixing and stirring epoxy resin and alicyclic epoxy resin to obtain an epoxy resin mixture; uniformly stirring liquid acid anhydride, a flame retardant, an epoxy active toughening agent and an accelerant to obtain an epoxy resin curing agent; and vacuumizing and uniformly stirring the epoxy resin mixture and the epoxy resin curing agent to obtain the flame-retardant epoxy resin adhesive with low dielectric constant and low dielectric loss factor. Dielectric loss of the epoxy resin mixture is reduced through polarity complementation, and molecular chain segment polarization is reduced through an alicyclic epoxy resin ring structure. And the flame retardant is dispersed into a uniform flame-retardant phase in liquid anhydride, so that the mechanical property is prevented from being reduced. A flexibilizer and anhydride are grafted to introduce a flexible chain segment, vacuum mixing is performed to eliminate an air gap, and after gradient curing, a low dielectric constant, a low dielectric loss factor and flame retardance are obtained.

This application provides a glass fiber surface treatment agent, its preparation method, glass fiber, fabric, and their applications. The glass fiber surface treatment agent comprises an effective component and water, with a solid content of 5.8–10.5%. The effective component, by weight percentage, includes: a coupling agent of 7.3–17.3%, a penetrant of 0.3–2.8%, a lubricant of 7.7–13.2%, a film-forming agent of 58.3–81.9%, a toughening agent of 0.4–1.8%, and additives of 2.4–6.6%. The film-forming agent comprises film-forming agent A and film-forming agent B. Film-forming agent A is a composition of phenolic epoxy emulsion and bisphenol A type epoxy emulsion, and film-forming agent B is an alicyclic epoxy resin emulsion. Glass fibers produced using this glass fiber surface treatment agent exhibit excellent bundle properties, wear resistance, and weaving performance. The glass fiber fabric undergoes rapid and complete static impregnation in epoxy resin, resulting in high mechanical strength and meeting the performance requirements of new energy vehicle battery casings.

The invention discloses a high-refractive-index photo-thermal dual-curing optical adhesive and a preparation method thereof, and belongs to the technical field of high polymer materials, and the preparation method comprises the following steps: S1, preparation of high-refractive-index resin: placing biphenyl-4, 4 '-dithiol in a nitrogen atmosphere reaction kettle, adding a free radical thermal initiator, heating to 180-200 DEG C, reacting for 1-2 hours, and cooling to room temperature to obtain the high-refractive-index resin; dropwise adding alkenyl resin under the protection of nitrogen, stirring, reacting for 1-2 hours after dropwise adding, and cooling to room temperature to obtain high-refractive-index resin; s2, preparation of the optical adhesive: mixing the alicyclic epoxy resin, the high-refractive-index resin, the toughened resin, the liquid epoxy resin, the cationic photoinitiator and the cationic thermal initiator, and uniformly stirring in a dark place to obtain the adhesive. The problems that a traditional optical adhesive is poor in optical performance stability and unbalanced in mechanical and optical performance are solved. The application potential of preparing the high-performance optical adhesive is realized.

A manufacturing method of a liquid ejecting head, in which a ejection port forming member that forms an ejection port for ejecting a liquid and a flow path of the liquid that communicates with the ejection port are formed on a substrate, the manufacturing method includes: forming a mold for the flow path of the liquid on the substrate; applying a photosensitive resin composition for forming the ejection port forming member on the substrate on which the mold has been formed so as to form a cationically polymerizable resin layer; and performing exposure and development on the cationically polymerizable resin layer so as to form the ejection port forming member, wherein the photosensitive resin composition includes at least one epoxy resin selected from an alicyclic epoxy resin and a glycidyl epoxy resin and a cationic photopolymerization initiator having a specific structure and a molar absorption coefficient.

A refrigerator oil composition which is used together with a refrigerant that contains an unsaturated fluorinated compound having a carbon-carbon unsaturated bond represented by general formula (I): C2FpR4-p (I) [in general formula (I), R each independently represents a hydrogen atom, a chlorine atom, a bromine atom or an iodine atom, and p is an integer of 1-3], in which R represents a hydrogen atom, a chlorine atom, a bromine atom or an iodine atom, and p represents an integer of 1-3], R represents a hydrogen atom, a chlorine atom, a bromine atom or an iodine atom, and p represents a hydrogen atom, a chlorine atom, a bromine atom or an iodine atom. A refrigerator oil composition containing a base oil (A), an epoxy compound (B), and a terpene compound (C), the epoxy compound (B) being an aliphatic epoxy compound (B1) or an alicyclic epoxy compound (B2), the total content of the epoxy compound (B) and the terpene compound (C) being 4.0 mass% or more based on the total amount of the refrigerator oil composition.

The invention discloses a quaternary ammonium salt latent curing agent, a single-component epoxy resin composition as well as a preparation method and application of the single-component epoxy resin composition. The compound has a specific general formula (I) structure, and R is Si, O or S and is matched with a specific weak nucleophilic anion (such as PF). The curing agent can be pre-mixed with an alicyclic epoxy resin (such as a compound of a formula II / III) to form a single-component system which can be stably stored for at least 3 months at the temperature of less than or equal to 40 DEG C. When heated to 90-130 DEG C, the system can rapidly initiate polymerization of epoxy groups, and the curing efficiency is high. The invention successfully solves the industrial problem that the single-component storage stability and the medium-temperature curing activity of the cycloaliphatic epoxy resin in the prior art are difficult to consider at the same time, and has extremely high industrial application value.

The application discloses a UV and moisture dual-cured high-temperature-resistant hot-melt acrylate pressure-sensitive adhesive tape and a preparation process thereof, and belongs to the technical field of high polymer materials. The pressure-sensitive adhesive tape comprises a base material and an adhesive layer. Raw materials of the adhesive layer comprise acrylate prepolymer containing a side chain containing a vinyl ether group, modified terpene resin containing a phenolic hydroxyl group, alicyclic epoxy functional silane, a cationic photoinitiator and an antioxidant. By controlling the molar ratio of the phenolic hydroxyl group and the vinyl ether, the tackifying resin is chemically grafted into the polymer network by using the cationic chain transfer reaction, and the double mechanism of the light-induced cationic polymerization and the acid-catalyzed moisture curing is combined, so that the problems of poor temperature resistance and oxygen inhibition of the traditional hot-melt adhesive are solved. The tape has excellent high-temperature shear resistance, high initial adhesion and deep curing characteristics, and the preparation process has good hot-melt processing stability.

The invention relates to the technical field of high polymer material modification, and discloses high-uniformity and high-stability epoxy modified resin and a preparation method thereof.The epoxy modified resin comprises 3, 4-epoxy cyclohexylmethyl-3 ', 4'-epoxy cyclohexane carboxylate, a synergistic modified cycloaliphatic epoxy resin matrix, an antioxidant, a light stabilizer, a flatting agent and a defoaming agent; according to the synergistic modified cycloaliphatic epoxy resin matrix, trimethyl (2, 3-epoxypropyl) ammonium chloride, 1, 3, 6, 8-tetra (4-aminophenyl) pyrene and sodium tetraphenylborate are constructed to form an embedded synergistic modified structure; the preparation method comprises the steps of matrix construction, resin pretreatment, synergistic dispersion and assistant introduction. By constructing a synergistic effect structure, the components in the system form a stable effect network on the molecular scale, microphase separation is effectively inhibited, the dispersion uniformity is improved, the thermal stability, mechanical properties and aging resistance of the material are remarkably improved, and the preparation method is suitable for the field of high-performance coatings and structural materials.

The invention discloses thermosetting type white coating with the solid content of 100% for metal printing and a preparation method of the thermosetting type white coating, and belongs to the technical field of primer for metal printing packaging. Comprising the following raw materials in parts by weight: 50-70 parts of thermosetting alicyclic epoxy resin, 5-15 parts of acrylic resin, 1-3 parts of blocked isocyanate, 3-5 parts of an alicyclic epoxy curing agent, 25-35 parts of a pigment, 1-5 parts of sulfydryl resin and 0.6-2.5 parts of an auxiliary agent. Meanwhile, the flexibility and the impact resistance of the paint film can be improved.

This invention provides a high-reliability UV adhesive for polarizing films, composed of the following raw materials by weight percentage: 25-55% alicyclic epoxy resin, 3-15% dicyclopentadiene acrylate monomer, 10-30% acrylic acid-modified castor oil epoxy resin, 10-30% glycidyl ether type epoxy compound, 1-10% adhesion promoter, 0.3-3% sensitizer, and 0.5-8% photoacid generator. The UV adhesive of this invention exhibits high adhesion strength to COP films, maintains adhesion over time, and is resistant to yellowing, overcoming the shortcomings of conventional UV adhesives, such as low adhesion and degradation over time.

A curable composition contains an alicyclic epoxy resin; and an active hydrogen compound having a pKa of 10 or less.

The application provides a UV adhesive with controllable curing time, which comprises the following raw materials in parts by weight: 50-100 parts of alicyclic epoxy resin and 0.11-4 parts of a photoinitiator; wherein the photoinitiator comprises a cationic photoinitiator and an imidazole type accelerator; the mass of the imidazole type accelerator accounts for 0.95%-90% of the mass of the photoinitiator. The formula of the adhesive is reasonably set, the UV curing rate of the cationic photoinitiator is delayed by introducing the imidazole type accelerator, the collocation of the two can achieve the effect that the resin can be relatively slowly cured after preliminary curing under light irradiation even without light irradiation, and the curing time is prolonged; moreover, the UV curing time of the adhesive can be further regulated by controlling the content of the imidazole type accelerator, and the delayed curing of different time is realized, so that the operation time can be accurately controlled in the production and application process.

The present application relates to the technical field of epoxy adhesive, especially to the field of IPC C09J163, more particularly to a yellowing-resistant flame-retardant epoxy resin electronic potting adhesive and a preparation method thereof. The components include: component A and component B, the component A includes: 80-130 parts of epoxy resin, 10-20 parts of active diluent, 10-20 parts of filler, 5-10 parts of toughening agent, and 5-15 parts of flame retardant; the component B includes: 50-80 parts of curing agent and 5-15 parts of accelerator. 3. The epoxy resin includes bisphenol A epoxy resin, bisphenol F epoxy resin and alicyclic epoxy resin, and when the weight ratio of the bisphenol A epoxy resin, the bisphenol F epoxy resin and the alicyclic epoxy resin is 1:(1-2):(5-8), the hardness and yellowing resistance of the prepared potting adhesive can be improved.

The application discloses a kind of photovoltaic 0BB technology with thermosetting epoxy glue, including the following mass fraction group: castor oil structure oxabutane 10-20 parts, alicyclic epoxy 30-70 parts, polyester polyol 1-10 parts, hydrogenated rosin resin 1-5 parts, thermal initiator 0.6-3 parts, coupling agent 0.5-1.5 parts, anti-aging agent 0.2-1.0 parts, thixotropic agent 1-7 parts;Photovoltaic 0BB technology with thermosetting epoxy glue prepared by the application has good yellowing resistance, high temperature low volatile fraction, and good high-low temperature impact performance.

The invention provides a packaging material, a preparation method thereof and an LED display module. The packaging material comprises 75%-99% of an epoxy resin mixture, 0.5%-15% of a reinforcing agent and 0.5%-10% of a light diffusion agent. Wherein the epoxy resin mixture comprises the following components in percentage by mass: 1%-10% of bisphenol A epoxy resin, 15%-25% of alicyclic epoxy resin and 65%-84% of organic silicon modified epoxy resin; the reinforcing agent comprises at least one of polycarbonate and silica powder, and the light diffusion agent comprises at least one of barium sulfate, calcium carbonate and siloxane. Compared with the prior art, the packaging material disclosed by the invention has better impact resistance, cracking resistance and uniform light transmission capability, so that the mechanical property and optical function of the packaging layer are enhanced, the display effect of the LED display module is improved, and meanwhile, the packaging material also has relatively high impact resistance, so that the packaging material is effectively suitable for diversified application scenes such as outdoor and the like.

The invention discloses low-VOC (volatile organic compound) high-adhesion epoxy finish paint and a preparation method thereof, and relates to the technical field of epoxy paint. The low-VOC high-adhesion epoxy finish paint comprises the following raw materials in parts by weight: 50-70 parts of cationic epoxy resin, 3-8 parts of an adhesion promoter, 0-15 parts of a function enhancing component, 2-5 parts of a photoinitiator, 15-25 parts of a pigment filler and 3-8 parts of a solvent, and the function enhancing component is at least one of polysiloxane micropowder and a reactive fluorocarbon polymer. According to the low-VOC high-adhesion epoxy finish paint and the preparation method thereof, the alicyclic epoxy resin suitable for cation UV curing is selected as a basis, and the adhesion promoter is combined, so that the adhesion of a coating to a base material is remarkably improved on the premise of ensuring the low VOC content; by introducing the polysiloxane micropowder with rich active groups on the surface and the reactive fluorocarbon polymer, the weather resistance, hardness, hydrophobicity and stain resistance of the coating are respectively improved.

In order to improve the interface bonding force and stability of a packaging adhesive film and realize rapid packaging under mild conditions, the invention provides a glue composition which comprises the following components in parts by mass: 21-56 parts of alicyclic epoxy resin, 5-40 parts of hydrogenated epoxy resin, 5-45 parts of aromatic epoxy resin, 0.51-10.5 parts of a photoinitiator, 2.01-12 parts of a free radical initiator and 10-40 parts of an auxiliary agent.

The invention discloses a high-toughness high-temperature-resistant epoxy resin composition suitable for an RTM (Resin Transfer Molding) process and a preparation method thereof, and relates to the technical field of epoxy resin. The composition comprises a component A and a component B, wherein the component A comprises an epoxy resin mixture, core-shell structure toughening particles and a stabilizer; and the component B is a composite amine curing agent consisting of aromatic amine, alicyclic amine and polyether amine. The epoxy resin mixture is compounded by trifunctional epoxy resin, bisphenol A epoxy resin and alicyclic epoxy resin according to a specific proportion. Through collaborative design of a core-shell particle toughening technology and a composite curing agent system, a cured resin matrix has high toughness and high heat resistance while a super-long process window is maintained, and the technical problem that high toughness, high heat resistance and long operation period are difficult to consider in an RTM process is solved.

The application discloses a kind of concrete anticorrosive coating with antibacterial and self-repairing and preparation method thereof, the anticorrosive coating includes the following weight parts of raw materials: 20-50 parts alicyclic epoxy resin, 100-150 parts vinyl resin, 30-50 parts multifunctional curing agent, 5-15 parts polyvinylamine resin, 10-25 parts silicone resin, 1-3 parts silane coupling agent, 0.5-2 parts initiator, 3-8 parts epoxy resin curing agent and 30-50 parts filler;The multifunctional curing agent includes the following weight parts of raw materials: 10-15 parts vinyl epoxy, 15-20 parts allyl thiocyanate and 5-15 parts allyl methyl disulfide.The concrete anticorrosive coating of the application contains multifunctional curing agent, which has thiocyanate group and disulfide group, the thiocyanate group can effectively inhibit the activity of escherichia coli and staphylococcus aureus, prevent escherichia coli and staphylococcus aureus from corroding the coating, and improve the service life of the anticorrosive coating;Disulfide group can undergo reversible rupture and recombination, with self-repairing ability.

The invention provides a resin composition and application thereof, and the resin composition comprises the following components in parts by weight: resin which comprises 20-100 parts by weight of alicyclic epoxy resin; the curing agent comprises 15-55 parts by weight of an alicyclic anhydride curing agent; 30 to 200 parts by weight of filler; the alicyclic epoxy resin is selected from at least one of a compound as shown in a structural formula (1), a compound as shown in a structural formula (2), a compound as shown in a structural formula (3) and a compound as shown in a structural formula (4); in the structural formula (1), n is an integer of 1-10; structural formula (2); structural formula (3); in the structural formula (4), m is an integer from 1 to 10; the finally obtained cured product integrates excellent heat resistance, high voltage resistance and reliable insulation performance, and is suitable for high-voltage and high-reliability application scenes.

A photosensitive composition and film prepared from the same are provided. The photosensitive composition includes 100 parts by weight of a cycloaliphatic epoxy resin, 2.5-20 parts by weight of a polyhedral oligomeric silsesquioxane with epoxy groups and 1.5-10 parts by weight of an oxetane compound, wherein the weight of the polyhedral oligomeric silsesquioxane with epoxy groups is greater than or equal to the weight of the oxetane compound.

The application discloses a preparation method of wind power blade repair resin and a wind power blade repair method. The wind power blade repair resin comprises bisphenol A type epoxy resin, a diluent and an initiator. The diluent is an alicyclic epoxy type diluent. The initiator is one or a combination of cationic initiator and free radical initiator. After mixing and proportioning, the mixed monomers are impregnated with a fabric and coated on a damaged part of the wind power blade. The polymerization reaction of the local coating area is started by using a heat source, a light source or a laser beam. After the polymerization reaction is started, the monomers continuously release heat to maintain the reaction until the mixed monomers in all coating areas are converted into polymers, and the system is completely cured. Compared with the traditional epoxy thermal curing resin, the polymerization process of the resin completely relies on the heat release of the monomers, and the energy consumption is extremely low without external heating. The curing reaction speed is fast, the performance of the cured plate is good, and the efficiency of the wind power blade repair work can be improved.

The invention relates to the technical field of optical protection, and particularly discloses a high-wear-resistance and stain-resistance optical coating based on a photocuring technology. The coating composition comprises an alicyclic epoxy resin, an oxetane reactive diluent, a six-functionality polyurethane acrylate oligomer, an environment-friendly short-chain perfluoropolyether modified diaryl iodonium photoinitiator, a photosensitizer, a free radical photoinitiator, a hindered amine proton scavenger and the like. The preparation method comprises the following steps: dispersing raw materials in a mixed solvent; pretreating the base material; a base material is coated with the coating liquid; thermally induced self-assembly is carried out; carrying out long-wave photosensitization dual curing; and performing post-curing treatment. According to the application, a composite initiation system of environment-friendly short-chain perfluoropolyether modified diaryl iodonium matched with a long-wave photosensitizer is adopted, and iodonium salt is driven to be enriched towards the surface due to the low surface energy characteristic of a perfluoropolyether chain segment, so that the effects of the surface crosslinking density and pencil hardness of the coating are realized in an air atmosphere; meanwhile, the flexibility of an internal free radical curing system is reserved.

The invention discloses a fast-curing dual-system anisotropic conductive adhesive and a preparation method thereof, and belongs to the technical field of electronic tag encapsulating materials. The rapidly-cured dual-system anisotropic conductive adhesive is prepared from the following raw materials in parts by mass: 25 to 30 parts of alicyclic epoxy resin, 1 to 1.5 parts of a cationic initiator, 11 to 22 parts of bisphenol A epoxy resin, 25 to 30 parts of pentaerythritol glycidyl ether, 10 to 20 parts of acrylic resin, 0.4 to 0.6 part of a curing agent, 6 to 8 parts of gold-plated polymer particles, 3 to 5 parts of liquid metal solder balls, 1 to 3 parts of cross-linking agent resin and 0.1 to 0.3 part of a silane coupling agent. The dual-system anisotropic conductive adhesive disclosed by the invention can be cured for 2 seconds, meanwhile, the shearing force reaches 13N or above, curing is completed in 2 seconds when the dual-system anisotropic conductive adhesive is used at a client, the production efficiency is greatly improved, the hardness performance is excellent, and the dual-system anisotropic conductive adhesive can be more widely applied to electronic tag packaging.

The invention relates to the field of mobile phone materials, in particular to a glass fiber plate mobile phone rear cover and a preparation method thereof. The glass fiber plate mobile phone rear cover is formed by compounding and curing a glass fiber reinforced framework and a special epoxy resin composition; the special epoxy resin composition comprises the following components in parts by weight: 60-85 parts of an epoxy resin matrix, 5-15 parts of an alicyclic epoxy resin intermediate, 8-20 parts of a toughening agent, 20-35 parts of a composite curing agent, 0.1-0.5 part of a defoaming agent and 0.5-1 part of a flatting agent. According to the preparation method, a sectional process of prepreg-preforming-compression molding is adopted, the resin flowability can be controlled in the pre-curing step, resin loss in the subsequent molding process is avoided, air between laminates can be fully discharged in the pre-pressing step, the material can be fully cured in a sectional temperature and pressure control mode of compression molding, and the product quality is improved. And the density and the size precision of the product are improved, the product percent of pass is remarkably improved, and large-scale industrial production is facilitated.

The invention relates to the technical field of high-voltage insulating materials, particularly provides an epoxy resin composition for an insulator, and further provides a forming method of the epoxy resin composition and an electronic gun insulator based on the epoxy resin composition. The invention provides an epoxy resin composition for an insulator. The epoxy resin composition comprises the following components in percentage by mass: 25%-32% of alicyclic epoxy resin, 8%-10% of bisphenol A epoxy resin, 24%-27% of an anhydride curing agent, 32%-41% of modified silica powder, 2%-5% of heat-conducting filler and 0%-1% of an accelerant. By optimizing the proportion of the alicyclic epoxy resin, the bisphenol A epoxy resin, the modified silica powder and the heat-conducting filler, on the premise of ensuring the high dielectric strength and the pressure resistance of the material, the curing molding yield and the toughness of the material are remarkably improved, the binding force between the material and a metal insert is enhanced, and the machining applicability is improved.

The application discloses a preparation method of an alicyclic epoxy resin. The method comprises the following steps: performing two-stage etherification reactions of bisphenol A and epichlorohydrin under the action of a quaternary ammonium salt catalyst at low temperature and high temperature to obtain chlorohydrin ether; and sequentially performing catalytic hydrogenation reaction and ring closure reaction on the chlorohydrin ether. The method is simple and safe, the hydrogenation rate of benzene rings is high, and the prepared alicyclic epoxy resin has the characteristics of low epoxy equivalent weight and low total chlorine content.

The invention relates to the technical field of adhesives, in particular to low-stress glue for underfilling of a chip-level PCB and a preparation method of the low-stress glue. The low-stress glue for filling the bottom of the chip-level PCB is prepared from the following raw materials in parts by weight: 50-70 parts of alicyclic epoxy resin, 15-25 parts of modified epoxy resin, 15-30 parts of butadiene styrene rubber, 20-30 parts of a curing agent and 2-3 parts of 2-(3, 4-difluorophenyl)-1, 2, 4-trimethyl-1, 3-pentanediol monoisobutyrate. The coating is prepared from the following components in parts by weight: 0.5 to 1.2 parts of 1, 4-epoxy cyclohexyl) ethane trimethoxy silane, 0.5 to 1.2 parts of nano titanium dioxide, 2 to 5 parts of silicon microspheres, 0.6 to 3 parts of carbon black, 0.6 to 1.2 parts of a defoaming agent, 0.8 to 1.5 parts of a flatting agent and 0.8 to 1.5 parts of a dispersing agent. The prepared glue has excellent bonding strength, anti-falling performance and flowing performance, gaps of BGA solder balls can be rapidly filled, and bubble residues are avoided; and moreover, the composite material also has excellent damp-heat resistance and aging resistance, has no performance attenuation after high and low temperature circulation, and is suitable for electronic equipment in long-term outdoor or severe environments.

This invention relates to the field of polymer composite materials, specifically to a lightweight bicycle frame material and its preparation method, which is made from the following raw materials in parts by weight: 80-100 parts nylon, 5-15 parts alicyclic epoxy resin, 30-40 parts hyperbranched polyamine-modified carbon fiber, and 1-3 parts additives. The material provided by this invention has excellent mechanical properties and can be used to make bicycle frames, solving the drawbacks of existing bicycle frames such as heavy weight and easy corrosion, and meeting the needs of consumers.