High-reliability and low-viscosity underfill

An underfill and reliability technology, used in non-polymer adhesive additives, adhesives, epoxy resins, etc., can solve the problems of reducing inorganic fillers, increasing linear expansion coefficient, reducing reliability, etc., to enhance flow performance, inhibiting precipitation, and improving reliability

Inactive Publication Date: 2010-11-10
深圳市库泰克电子材料技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to achieve low viscosity of the underfill, it is necessary to reduce the content of inorganic fillers, which will increase the coefficient of linear expansion and reduce part of the reliability

Method used

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  • High-reliability and low-viscosity underfill

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] The present embodiment is configured by the following raw materials in weight percentage:

[0038] Bisphenol F type epoxy resin: 12.8%

[0039] Cycloaliphatic epoxy resin: 11.4%

[0040] Dicyclopentadiene type epoxy resin: 13%

[0041] Methyltetrahydrophthalic anhydride: 40%

[0042] PN-23 amine curing accelerator: 0.86%

[0043] Spherical silica powder: 21.9%

[0044] 3-Aminopropyltriethoxysilane: 0.04%

[0045] Carbon black: 0%

Embodiment 2

[0047] The present embodiment is configured by the following raw materials in weight percentage:

[0048] Bisphenol F type epoxy resin: 0%

[0049] Cycloaliphatic epoxy resin: 62.5%

[0050] Dicyclopentadiene type epoxy resin: 0.44%

[0051] Methylhexahydrophthalic anhydride: 11.4%

[0052] HX-3788 amine curing accelerator: 0.86%

[0053] Spherical silica powder: 16.4%

[0054] 3-Aminopropyltriethoxysilane: 4.2%

[0055] Carbon black: 4.2%

Embodiment 3

[0057] The present embodiment is configured by the following raw materials in weight percentage:

[0058] 828 epoxy resin: 2.5%

[0059] Cycloaliphatic epoxy resin: 30%

[0060] Dicyclopentadiene type epoxy resin: 1%

[0061] Methylhexahydrophthalic anhydride: 13%

[0062] PN-23 amine curing accelerator: 1%

[0063] Spherical silica powder: 51.1%

[0064] 3-Aminopropyltriethoxysilane: 0.9%

[0065] Carbon black: 0.5%

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Abstract

The invention discloses a high-reliability and low-viscosity underfill for packaging a semiconductor device and a substrate, which comprises the following raw materials by weight percent: 0-12.8% of bisphenol-type epoxy resin, 11.4-62.5% of alicyclic epoxy resin, 0.44-13% of multi-functional epoxy resin, 11.4-62.5% of curing agent, 0.86-5.7% of curing accelerator, 11.6-51.1% of inorganic filler, 00.4-4.2% of silane coupling agent and 0-4.2% of carbon black. The invention uses the bisphenol type epoxy resin, the inorganic filler material and the silane coupling agent with molecular weight of more than 400 as necessary components, and has good mobility and thermal cycling stability and high reliability.

Description

technical field [0001] The invention relates to a bottom filling glue for chip packaging, in particular to a high-reliability, low-viscosity bottom filling glue for flip chip-on-substrate (FCOB) packaging flip-chip-in-package (FCiP) packaging. Background technique [0002] In the 21st century, due to the demand for wireless communications, portable computers, broadband Internet products and car navigation electronic products, the integration of electronic devices is getting higher and higher, the chip area is expanding, and the number of integrated circuit pins is increasing. At the same time, chip packaging is required The size is further miniaturized and miniaturized, and integrated circuits are developing in a lighter, thinner, and smaller direction. Therefore, many new packaging technologies and packaging forms have emerged in the development trend. Flip-chip interconnection technology is one of the most important packaging technologies. The specific content of flip-chi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/02C09J163/04C09J11/04C09J11/06H01L23/29
Inventor 黄伟进叶婷
Owner 深圳市库泰克电子材料技术有限公司
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