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574results about "Epoxynovolac adhesives" patented technology
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Bi-component epoxide-resin adhesive and preparation method thereof
InactiveCN101397486AImprove heat resistanceImproved tensile shear strengthEpoxynovolac adhesivesEpoxyBenzene
The invention relates to a two-component epoxy resin adhesive, including the following components: novolac epoxy resin, lipid ring type epoxy resin and terminal carboxylic acrylonitrile butadiene rubber in component A, and 1, 4-di-benzene (2, 4-diaminobenzene oxygen) in component B, wherein, the mass percentage of the lipid ring type epoxy resin is 20-35 percent of the novolac epoxy resin, the mass percentage of the terminal carboxylic acrylonitrile butadiene rubber CTBN is 12 percent of the novolac epoxy resin and the mass percentage of the 1, 4-di-benzene (2, 4-diaminobenzene oxygen) is 15-20 percent of the novolac epoxy resin; and the preparation of the two-component epoxy resin adhesive includes the step of evenly mixing the component A and the component B for use. The two-component epoxy resin adhesive used for conductive adhesive has good heat resistance, average stretching and shearing strength of 21.28MPa, simple preparation process and operation without solvent, and plays the role of protecting environment.
Owner:DONGHUA UNIV +1
High impact-resistant epoxy resin filling adhesive and preparation method thereof
InactiveCN102093832AImprove toughnessImprove the modulus of compressionEpoxynovolac adhesivesEpoxyAdhesive
The invention relates to a high impact-resistant epoxy resin filling adhesive and a preparation method thereof. The high impact-resistant epoxy resin filling adhesive consists of a component A and a curing agent in a weight ratio of 100:6.5-100:7.5, wherein the component A consists of the following raw materials in percentage by weight: 20 to 60 percent of epoxy resin, 5 to 15 percent of toughening agent, 0.1 to 0.5 percent of thixotropic agent, 2 to 10 percent of diluent, 30 to 70 percent of filler and 0.1 to 0.5 percent of aid; and the curing agent is one or a mixture of more of straight chain aliphatic amine, aliphatic cyclic amine, polyether amine and low molecular weight polyamide. The preparation method for the high impact-resistant epoxy resin filling adhesive comprises the following steps of: mixing the component A and the curing agent in a proper weight ratio, and curing at the temperature of between 10 and 35DEG C for 16 hours.
Owner:YANTAI DARBOND TECH
4,4'-bis(2,4-diamidophenoxy)biphenyl high-temperature-resistant epoxy adhesive and preparation method thereof
InactiveCN103146331AGood adhesionGood viscosity controllabilityMacromolecular adhesive additivesEpoxynovolac adhesivesTolueneDibasic acid
The invention relates to a 4,4'-bis[4-(2,4-diamidophenoxy)phenyl]biphenyl high-temperature-resistant epoxy adhesive and a preparation method thereof. The 4,4'-bis(2,4-diamidophenoxy)biphenyl high-temperature-resistant epoxy adhesive is composed of a component A and a component B, wherein the component A is a copolymer prepared by reacting 4,4'-bis(2,4-diamidophenoxy)biphenyl and epoxy resin; and the component B is a homogeneous transparent solution with the solid content of 15-30%, which is prepared by reacting 4,4'-bis(2,4-diamidophenoxy)biphenyl and aromatic dibasic acid anhydride in a strong-polarity non-proton organic solvent and toluene. The preparation method comprises the following step: evenly mixing the component A and the component B in a mass ratio of 1:(1-2) at room temperature. The preparation technique is simple; and the adhesive has excellent comprehensive properties, can be widely used for bonding steel, copper, aluminum or any other metal with ceramic, glass, resin-base composite material or any other substrate, and has favorable industrialization prospects.
Owner:DONGHUA UNIV +1
Epoxy resin binder used for repairing blade and preparation method thereof
ActiveCN101698787AFast curingLower the activation energy of the reactionNon-macromolecular adhesive additivesMacromolecular adhesive additivesEpoxyWind driven
The invention relates to a preparation method of repairing adhesive, in particular to a binder for repairing blade of a wind driven generator, belonging to the high polymer material field. The preparation method of double-component epoxy resin binder used for repairing blade is simple in operation and low in cost. The double-component epoxy resin binder for repairing blade which is made by the method of the invention has high tenacity, high shear strength, low heat and low shrink, thus being suitable for repairing and binding of large structural part; solidification is rapid, the binder can be rapidly solidified in 10-30 minutes at 5-25 DEG C and reach certain strength; and the binder is used for repairing defect of blade of wind driven generator.
Owner:镇江市电子化工材料工程研究中心有限公司
Conductive silver paste for microelectronic packaging and preparation method thereof
InactiveCN102086364AIncrease contactReduce bulk resistivityNon-macromolecular adhesive additivesSemiconductor/solid-state device detailsEpoxySilver paste
The invention discloses a conductive silver paste for microelectronic packaging, which contains the following components in parts by mass: 10-12 parts of liquid epoxy resins, 9-10 parts of diluents, 10-13 parts of spherical silver powder, 50-57 parts of platy silver powder, 0.5-1.5 parts of latent curing agents, 0.2-0.8 part of curing promoter, 1-2 parts of coupling agents, 0.5-1 part of conductive promoters, 0.5-1 part of aging resister and 1.5-2.3 parts of toughening agents. The body resistivity of the conductive silver paste prepared by the invention reaches 10-5 omega.cm, the shear strength is greater than 9MPa, and the conductive silver paste has stable contact resistance; and after low-temperature circulation, high-temperature humidity aging tests and other aging tests, the shear strength, the impact-resistant toughness and the contact resistance change are all less than 18%. The prepared conductive silver paste is suitable for microelectronic packaging and has the advantages of stable contact resistance and strong impact resistance.
Owner:GUANGDONG FENGHUA ADVANCED TECH HLDG
Two-part epoxy-based structural adhesives
A two-part epoxy-based structural adhesive composition comprising a curable epoxy resin, an amine curing agent, a toughening agent, and an oil-displacing agent. The structural adhesive may optionally include reactive liquid modifiers, fillers, secondary curatives, reactive diluents, surfactants, metal salts, pigments and combinations thereof. The structural adhesive may be used to form bonded joints between adherends having clean surfaces, as well as those having surfaces contaminated with hydrocarbon-containing materials, such as oils, processing aids and lubricating agents.
Owner:3M INNOVATIVE PROPERTIES CO
Silver nanowire doped conductive silver colloid and preparation method thereof
InactiveCN102676102AImprove electrical performanceReduce silver contentNon-macromolecular adhesive additivesEpoxynovolac adhesivesEpoxyWorking temperature
The invention relates to the field of semiconductor electronic materials, and in particular relates to a silver nanowire doped conductive silver colloid and a preparation method thereof. The raw materials of the silver nanowire doped conductive silver colloid provided by the invention comprise the following components in percentage by weight: 25-60% of micrometer silver powder, 5-30% of silver nanowires, 20-50% of epoxy resin, 1.6-4% of curing agent, 5.8-9.2% of dissolvent, 0.4-1.6% of accelerant, 0.04-0.16% of toughening agent and 0.8-2.4% of additive. The conductive silver colloid is prepared by mixing and doping single-crystal silver nanowires and silver granules, thus, the total silver doping amount is reduced to 35-45%, and the conductive silver colloid has a favorable conductive effect, high shear strength, low working temperature and good ageing-resistant performance, and the cost of the conductive silver colloid is reduced. The silver nanowire doped conductive silver colloid can be widely applied to the fields of solar cell (film, crystal silicon) conductive colloids, conductive colloid LED (Light-Emitting Diode) package and the like.
Owner:SHANGHAI FUXIN NEW ENERGY TECH
2,2-bis[4-(2,4-diamidophenoxy)phenyl]hexafluoropropane high-temperature-resistant epoxy adhesive and preparation method thereof
InactiveCN103146330AGood adhesionGood viscosity controllabilityMacromolecular adhesive additivesEpoxynovolac adhesivesResin-Based CompositePhenyl group
The invention relates to a 2,2-bis[4-(2,4-diamidophenoxy)phenyl]hexafluoropropane high-temperature-resistant epoxy adhesive and a preparation method thereof. The 2,2-bis[4-(2,4-diamidophenoxy)phenyl]hexafluoropropane high-temperature-resistant epoxy adhesive is composed of a component A and a component B, wherein the component A is a copolymer prepared by reacting 2,2-bis[4-(2,4-diamidophenoxy)phenyl]hexafluoropropane and epoxy resin; and the component B is a homogeneous transparent solution with the solid content of 15-30%, which is prepared by reacting 2,2-bis[4-(2,4-diamidophenoxy)phenyl]hexafluoropropane and aromatic dibasic acid anhydride in a strong-polarity non-proton organic solvent and toluene. The preparation method comprises the following step: evenly mixing the component A and the component B in a mass ratio of 1:(1-2) at room temperature. The preparation technique is simple; and the adhesive has excellent comprehensive properties, can be widely used for bonding steel, copper, aluminum or any other metal with ceramic, glass, resin-base composite material or any other substrate, and has favorable industrialization prospects.
![2,2-bis[4-(2,4-diamidophenoxy)phenyl]hexafluoropropane high-temperature-resistant epoxy adhesive and preparation method thereof](https://images-eureka.patsnap.com/patent_img/c3dc5c5a-1b77-468c-bc0c-b8ed519f1fb6/BDA00002903323100091.PNG "2,2-bis[4-(2,4-diamidophenoxy)phenyl]hexafluoropropane high-temperature-resistant epoxy adhesive and preparation method thereof")
Owner:DONGHUA UNIV +1
4,4'-bis(2,4-diamidophenoxy)diphenylsulphone high-temperature-resistant epoxy adhesive and preparation method thereof
InactiveCN103131369AGood adhesionGood viscosity controllabilityMacromolecular adhesive additivesEpoxynovolac adhesivesOrganic solventRoom temperature
The invention relates to a 4,4'-bis(2,4-diamidophenoxy)diphenylsulphone high-temperature-resistant epoxy adhesive and a preparation method thereof. The 4,4'-bis(2,4-diamidophenoxy)diphenylsulphone high-temperature-resistant epoxy adhesive is composed of a component A and a component B in a mass ratio of 1:(1-2), wherein the component A is a copolymer prepared by reacting 4,4'-bis(2,4-diamido phenoxy)diphenylsulphone and epoxy resin; and the component B is a homogeneous-phase transparent solution with the solid content of 15-30%, which is prepared by reacting 4,4'-bis(2,4-diamidophenoxy)diphenylsulphone and aromatic dibasic acid anhydride in a strong-polarity non-proton organic solvent and diphenylsulphone. The preparation method comprises the following step: evenly mixing the component A and the component B in a mass ratio of 1:(1-2) at room temperature. The preparation technique is simple; and the adhesive has excellent comprehensive properties, can be widely used for bonding steel, copper, aluminum or any other metal with ceramic, glass, resin-base composite material or any other substrate, and has favorable industrialization prospects.
Owner:DONGHUA UNIV +1
Photocuring and thermocuring conductive adhesive and preparation method
ActiveCN102127386ALiquidConnectivityNon-macromolecular adhesive additivesPolyureas/polyurethane adhesivesEpoxyAdhesive
The invention discloses a photocuring and thermocuring conductive adhesive, which is prepared by mixing photosensitive high polymer, diluent monomer, conducting particles, photoinitiator, polymerization inhibitor, epoxy resin, epoxy active diluting agent, latent curing agent and latent promoting agent, grinding the mixture, and stirring and dispersing in a planetary manner. The curing temperature of the product is low, and deep curing can be realized; after being cured, the adhesive has high adhesiveness and high solvent resistance; and the adhering strength is high, the resistivity is low, and the requirements of microelectronic packaging technique for LED chips, liquid crystal materials, glass substrates, thin film circuits, PCB circuit boards and the like can be met.
Owner:东莞市新懿电子材料技术有限公司
Low-viscosity and high-heat conduction epoxy resin electronic potting adhesive
InactiveCN101974302AImprove thermal conductivityRapid heat buildupNon-macromolecular adhesive additivesOther chemical processesEpoxyAdhesive
The invention relates to a low-viscosity and high-heat conduction epoxy resin electronic potting adhesive which is formed by mixing a component A with an amine curing agent according to the weight ratio of 100:5-12, wherein the component A comprises the following raw materials in weight ratio: 70-85 parts of spherical alumina powder, 10-20 parts of epoxy resin, 2-4 parts of active thinner, 2.5-5 parts of toughening agent and 0.1-0.5 parts of coupling agent. The invention has the advantages that the spherical alumina of the potting adhesive has higher filling amount compared with non-spherical alumina, the viscosity is less affected, the fluidity is favorable and the construction is convenient; the potting adhesive has good dispersibility and is difficult to sedimentate; a condensate has high heat conductivity and can quickly dissipate accumulated heat of heating parts and components; a high-filling filler can reduce a thermal expansion coefficient and a volumetric shrinkage rate and is very suitable for potting parts and components; and the price is cheaper compared with boron nitride and aluminum nitride, and the cost is low.
Owner:YANTAI DARBOND TECH
Double-solidification system fast-flowing underfill and preparation method thereof
InactiveCN102010686AGuaranteed reliabilityFast flowOther chemical processesEpoxynovolac adhesivesEpoxyPolyol
The invention discloses a double-solidification system fast-flowing underfill and a preparation method thereof. The underfill comprises the following raw materials in parts by weight: 30-80% of epoxy resin, 10-50% of epoxy acrylate, 5-30% of acrylate, 2-20% of polyol, 1-20% of silane coupling agent, 0.3-4% of cationic initiator, 0.1-3% of radical initiator and 0.1-0.5% of carbon black; and the preparation method comprises the following steps of: weighing the epoxy resin and the cationic initiator in the proportion, putting in a reaction kettle and stirring into a uniform solution; weighing the epoxy acrylate, the acrylate, the polyol, the silane coupling agent, the radical initiator and the carbon black in the proportion, putting in the reaction kettle in sequence, mixing and stirring to obtain the finished product of the double-solidification system fast-flowing underfill.
Owner:YANTAI DARBOND TECH
High-temperature resistant flame-retardant epoxy glue and preparation method thereof
ActiveCN104726045AReduce usageHigh heat distortion temperatureNon-macromolecular adhesive additivesCarboxyl rubber adhesivesEpoxyFire retardant
The invention relates to high-temperature resistant flame-retardant epoxy glue and a preparation method of the high-temperature resistant flame-retardant epoxy glue. The epoxy glue is a double-component epoxy glue; when the epoxy glue is used, a first component and a second component are mixed in a weight ratio of 4:(2-3); the first component is prepared from the following raw materials in parts by weight: 30-50 parts of polyfunctional epoxy resin, 5-15 parts of low-viscosity epoxy resin, 3-10 parts of an active toughening agent, 10-30 parts of temperature-resistant reinforcing fillers, 10-15 parts of flame retardant and 0.3-3 parts of antioxidant; the second component is prepared from the following raw materials in parts by weight: 70-95 parts of a temperature-resistant curing agent, 10-30 parts of temperature-resistant reinforcing fillers and 0.3-1 part of a coupling agent. Compared with the prior art, the high-temperature resistant flame-retardant epoxy glue has the advantages of high high-temperature toughness, high adhesion strength, high flame retardant performance and the like.
Owner:上海海鹰粘接科技有限公司
Conductive adhesive compositions with electrical stability and good impact resistance for use in electronics devices
InactiveCN1788062AStable shelf lifePrinted circuit assemblingSolid-state devicesPolymer sciencePtru catalyst
A composition that comprises a) an admixing of at least one epoxy resin and aliphatic amine wherein the ratio of epoxy function group / amine is greater than 1; b) a conductive filler; c) one or more corrosion inhibitors, oxygen scavengers or both; d) imidazole as a curing agent / catalyst; and e) optionally other additives such as organic solvents, flow additives, adhesion promoters and rheology modifiers. The reaction of epoxy and aliphatic amine with excess epoxy functionality results in a flexible resin with remaining active epoxy groups. The compositions exhibit improved electrical stability and impact resistance over other conductive adhesive compositions that do not comprise the admixture.
Owner:NAT STARCH & CHEM INVESTMENT HLDG CORP
Photocurable adhesive composition, polarizing plate and a process for producing the same, optical member and liquid crystal display device
ActiveCN101845286AGood adhesionEfficient preparationFilm/foil adhesivesSynthetic resin layered productsTectorial membraneAdhesive
The invention provides a photocurable adhesive composition and a polarizing plate which attaches a protecting membrance to a polarizing sheet by means of the adhesive. The photocurable adhesive composition is able to be adhered on the polarizing sheet in a short period with a complete adhesive strength even though a resin membrance selected from polyester resin, polycarbonate resin and acrylic acid resin with low humidity transmissivity is taken as the protecting membrance. When the polarizing sheet made of polyethylene alcoholic resin membrance which is unidirectionally stretched and attracted with orientioned dichromatic pigments is adhered to the protecting membrance made of the resin membrance with low humidity transmissivity, the photocurable adhesive composition includes (A) an epoxy compound having at least two epoxy groups in the molecule, (B) an oxetane compound including at least an oxetanyl group in the molecule and (C) an optical cation polymerization initiator, wherein A / C (wt.%) is 90 / 10 to 10 / 90 and the C is 0.5-20 wt.% in the composition.
Owner:SUMITOMO CHEM CO LTD +1
Inorganic/organic nano particle compound modification epoxy resin adhesive and preparation method thereof
InactiveCN103131374AImprove high temperature performanceEasy to prepareNon-macromolecular adhesive additivesMacromolecular adhesive additivesEpoxyResin adhesive
The invention relates to an inorganic / organic nano particle compound modification epoxy resin adhesive and a preparation method thereof, aiming at solving the problem that the existing toughened epoxy resin adhesive has low bonding strength at high temperature and poor high temperature aging performance. The preparation method comprises the following steps of: firstly preparing an epoxy resin component, and then preparing a curing agent component, thereby obtaining the inorganic / organic nano particle compound modification epoxy resin adhesive. When the adhesive is used, the epoxy resin component and the curing agent component are mixed uniformly at normal temperature, tensile shear strength of the adhesive at 150 DEG C can reach 10MPa-15MPa, the tensile shear strength of the adhesive at 250 DEG C still can reach 4MPa-5MPa, the bonding strength at high temperature is high, after ageing for 1000 hours at 150 DEG C, the retention rate of the tensile shear strength of the adhesive still can be above 80%, the high temperature ageing property of the adhesive is good, the preparation method of the adhesive is simple and is applicable to the fields of aviation, aerospace, mechanical automation, automobile and the like.
Owner:INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
Environment-friendly heat conduction insulating glue used by high-power LEDs and preparation method
ActiveCN101812280AImprove cooling effectImprove work efficiencyNon-macromolecular adhesive additivesEpoxynovolac adhesivesEpoxyWorking temperature
The invention relates to an environment-friendly heat conduction insulating glue used by high-power LEDs, which is characterized by being prepared from the following raw materials in percentage by weight: 50-68 percent of micro-grade high-thermal conductive powder, 18-30 percent of epoxy resin, 4-10 percent of curing agent, 7-15 percent of solvent, 0.6-1.5 percent of accelerator and 1-2 percent of additive; and the micro-grade high-thermal conductive powder is selected from a mixture formed by one or more of micro-grade aluminum powder, palladium powder, platinum powder, gold powder, C powder, AlN powder and SiC powder. The invention also relates to a preparation method of the heat conduction insulating glue. The environment-friendly heat conduction insulating glue used by high-power LEDsis obtained by optimizing the matching ratio and the modification of the raw materials and improving and simplifying the preparation process. Besides high resistivity, the heat conduction insulating glue also has high thermal conductivity, higher working temperature, strong viscosity, high cutting strength and fine performance index.
Owner:连云港市昭华光电科技有限公司
Flame retardant high-heat-conductivity epoxy resin electronic adhesive glue
InactiveCN102533192AImprove thermal conductivityDisperse quicklyNon-macromolecular adhesive additivesEpoxynovolac adhesivesHalogenAdhesive glue
The invention relates to flame retardant high-heat-conductivity epoxy resin electronic adhesive glue, which is formed by mixing ingredients A with amine curing agents according to the weight ratio of 100:(5-12), wherein the ingredients A comprises the following ingredients in parts by weight: 50 to 60 parts of spherical alumina powder, 20 to 30 parts of flame retardant fillings, 10 to 20 parts of epoxy resin, 1.5 to 2.5 parts of reactive diluents, 2 to 3 parts of halogen-free liquid flame retardants, 2 to 3 parts of toughening agents, 0.2 to 0.8 parts of thixotropic agents and 0.1 to 0.5 parts of coupling agents. According to the adhesive glue provided by the invention, the adhesive glue filled by the spherical alumina has higher condensate heat conductivity when being compared with the adhesive glue filled by the non-spherical alumina, and the heat accumulation of heating devices can be fast dispersed.
Owner:YANTAI DARBOND TECH
Epoxy-organic silicon polyimide adhesive and preparation method thereof
InactiveCN101914357AGood viscosity controllabilityGood workmanshipEpoxynovolac adhesivesEpoxyAdhesive
Owner:DONGHUA UNIV +1
White adhesive for flexible printed circuit and preparation method thereof
ActiveCN101575489AHigh whitenessGood shading effectNon-macromolecular adhesive additivesEpoxynovolac adhesivesOrganic solventAdhesive
The invention discloses a white adhesive for a flexible printed circuit and a preparation method thereof. The white adhesive comprises the following raw material compositions: thermosetting resin, filler, thermoplastic resin, rubber, a curing agent and a curing accelerator, wherein the weight ratio in portion of the various raw material compositions is as follows: 20 to 80 portions of the thermosetting resin, 45 to 150 portions of the filler, 0 to 60 portions of the thermoplastic resin, 0 to 40 portions of the rubber, 2 to 9 portions of the curing agent, 0.5 to 2 portions of the curing accelerator and 40 to 120 portions of organic solvent. The white adhesive has good opacity and reflection performance. The invention simultaneously discloses the method for preparing the white adhesive.
Owner:ALLSTAE TECH ZHONGSHAN
High-performance conductive silver paste and preparation method thereof
ActiveCN101805575AEvenly dispersedUniform size distributionNon-macromolecular adhesive additivesEpoxynovolac adhesivesEpoxyWorking temperature
The invention relates to a high-performance conductive silver paste, which is characterized by comprising the following raw materials in percentage by weight: 65-80% of micron-sized metal silver powder, 10-20% of epoxy resin, 1.4-3.5% of curing agent, 6-9% of solvent, 0.5-1.2% of accelerator, 0.05-0.1% of flexibilizer and 1-2% of additive. The invention also discloses a preparation method of the high-performance conductive silver paste. The conductive silver paste of the invention has high conductivity, very high thermal conductivity, high working temperature, strong viscosity and very high shear strength, and the performance indexes are apparently higher than the working performance of the conductive silver paste in the prior art, thereby solving the technical problems of poor shear performance, low working temperature, poorer thermal conductivity, long curing time, high curing temperature, poor viscosity, easy pollution of environment and the like in the field of the conductive silver paste in the prior art.
Owner:连云港市昭华光电科技有限公司
High-humidity and high-temperature resisting single component epoxy adhesive and its preparation method
InactiveCN102191002ASolve the high temperature and high humidity performance requirementsHigh bonding reliabilitySemiconductor/solid-state device detailsSolid-state devicesHigh humidityFilling materials
The invention relates to a high-humidity and high-temperature resisting single component epoxy adhesive and its preparation method. The epoxy adhesive comprises the following raw materials by weight: 40% to 60% of epoxy resin, 1% to 5% of reactive diluent, 30% to 50% of filling material, 0.5% to 1% of coupling agent, 0 to 1% of cross-linking agent, 1% to 10% of flexibilizer, 3% to 8% of latent curing agent and 3% to 5% of curing accelerator. According to the invention, the requirement of high temperature and high humidity resisting performance after the electronic packaging can be satisfied by the high-humidity and high-temperature resisting single component epoxy adhesive, the application scope of the electronic and electric appliances can be greatly extended, and the solidified system has the advantages of high adhesion reliability and wide application range.
Owner:YANTAI DARBOND TECH
Halogen-free resin composition, bonding sheet and copper-clad laminate
ActiveCN102732029AHigh glass transition temperatureImprove heat resistanceFilm/foil adhesivesSynthetic resin layered productsHeat resistanceGlass transition
The invention provides a halogen-free resin composition, a bonding sheet and a copper-clad laminate. The halogen-free resin composition comprises the following components of: by weight, 10-90 parts of polybenzoxazine resin, 10-90 parts of polyepoxides, 1-50 parts of a curing agent, 0.01-1 part of a curing accelerator, 10-100 parts of a filling material, and 0-80 parts of a fire retardant. The bonding sheet prepared from the halogen-free resin composition has high glass-transition temperature, excellent heat resistance and low water absorption. The copper-clad laminate prepared from the bonding sheet has high glass-transition temperature, excellent heat resistance, good flame retardation effect and low water absorption. In addition, the technology for making the copper-clad laminate is simple to operate and requires low cost.
Owner:GUANGDONG SHENGYI SCI TECH
Halogen-free and phosphorous-free flame-retardant synthetic resin adhesive used for flexible copper clad laminate
InactiveCN101851480ANon-macromolecular adhesive additivesMacromolecular adhesive additivesElastomerEpoxy
The invention relates to a halogen-free and phosphorous-free flame-retardant synthetic resin adhesive used for a flexible copper clad laminate, in particular to the adhesive used for producing the flexible copper clad laminate. The adhesive comprises the following components: biphenyl epoxy resin, elastomer modified epoxy resin, a flexibilizer, a curing agent, a curing accelerator, an inorganic filler and an organic solvent. The halogen-free and phosphorous-free flame-retardant synthetic resin adhesive is halogen-free and phosphorous-free, is environmental-friendly and achieves fire retardance up to level UL94V-0; and the flexible copper clad laminate produced by using the adhesive has the characteristics of high folding endurance, high fire retardance, dip-soldering resistance, high peel strength, low water absorption and high dimensional stability.
Owner:HAISO TECH
Single-component epoxy resin conductive adhesive
The invention relates to an epoxy resin conductive adhesive and a preparation method thereof. The epoxy resin conductive adhesive comprises 3-10% of epoxy resin, 1-8% of toughening agent, 5-10% of latent curing agent, 1-5% of latent accelerating agent, 5-10% of solvents and 60-85% of conductive filler. The adhesive lengthens the retention time on the basis of maintaining lower volume resistivity and increases the glass transition temperature (TG) of the material so as to expand the application range of the adhesive and simplify the processing process of the adhesive.
Owner:浙江英特沃斯科技有限公司
Single-component thread locking epoxy precoated adhesive and preparation method thereof
InactiveCN101665674AStable storageNo chemical reactionNon-macromolecular adhesive additivesOther chemical processesEpoxyAdhesive
The invention discloses a single-component thread locking epoxy precoated adhesive which is characterized by being prepared from the following components in proportion by weight: 40-70 parts of epoxyresin, 10-80 parts of activated thinner, 20-60 parts of epoxy hardener, 8-20 parts of urea, 30-60 parts of formaldehyde solution, 10-30 parts of hydroxyphenol, 0.5-5 parts of stuffing, 5-15 parts of surfactant, 80-200 parts of distilled water, 0.5-2 parts of membrane material, 0.1-1 part of hydrolysis inhibitor and 5-10 parts of solvent; and a preparation method comprises the steps: firstly, respectively microencapsulating the epoxy resin and the epoxy hardener are and then uniformly mixing with other components in proportion. The single-component thread locking epoxy precoated adhesive has the characteristics of convenient construction, applicable workpiece material diversification, less curing condition restriction, good moisture resistance and high destabilizing moment and average disassembly moment, ensures the locking performance and better guarantees the safe reliability of products.
Owner:YANTAI DARBOND TECH
Lead-free high heat-resisting copper-clad board and preparation method thereof
InactiveCN103642446AImprove heat resistanceGood toughness strengthNon-macromolecular adhesive additivesSynthetic resin layered productsEpoxyCopper foil
The invention discloses a lead-free high heat-resisting copper-clad board, and the lead-free high heat-resisting copper-clad board is prepared from a resin adhesive, glass fiber cloth and copper foil, the resin adhesive is composed of the following components by weight percent: 50-90% of solid matter and the balance of organic solvent; the solid matter is prepared from phenolic epoxy resin, isocyanate modified brominated epoxy resin, high-bromine epoxy resin, a phenolic resin curing agent, an epoxy resin curing accelerant, a heat stabilizer and an inorganic filler. The invention further discloses a preparation method of the lead-free high heat-resisting copper-clad board. The lead-free high heat-resisting copper-clad board suitable for lead-free process has a glass transition temperature not less than 170 DEG C, good heat resistance, good toughness and peel strength and excellent PCB (printed circuit board) processing property, can be manufactured as various lead-free printed circuit boards with excellent property, and is completely suitable for the demands of PCB lead-free process and high multilayer board production.
Owner:NANYA NEW MATERIAL TECH CO LTD
Structural adhesive for steel bonding
InactiveCN101921566AImprove adhesionIncreased mechanical toughnessNon-macromolecular adhesive additivesEpoxynovolac adhesivesEpoxyStress distribution
The invention discloses a structural adhesive for steel bonding, which comprises a component A and a component B of which the quality ratio is 100:(15-65), wherein the component A comprises epoxy resin, diluter, plasticizer, toughener and couplant; and the component B comprises modified polyamide resin, modified fatty amine and amino terminated polyether. The structural adhesive has the advantages of favorable bonding property, uniform stress distribution, high shearing strength and good mechanical toughness, has the characteristics of no flow after plate bonding, large anchorage withdrawal resistance and limit of harmful substances far below the national technical index, has the characteristics of high durability, convenient construction and stable strength, and can well soak the concrete and well bond the concrete and steel plates. The invention has high application and popularization values.
Owner:RES INST OF HIGHWAY MINIST OF TRANSPORT +1
Modified epoxy resin composite material of prereacted material of epoxy-terminated silicone oil and preparation method and application thereof
InactiveCN101792574AIncrease polarityGood compatibilityOther chemical processesEpoxynovolac adhesivesEpoxyAdhesive
The invention discloses a modified epoxy resin composite material of a prereacted material of epoxy-terminated silicone oil and a preparation method and application thereof. The modified epoxy resin composite material of the prereacted material of the epoxy-terminated silicone oil contains 0.1-100 parts of prereacted material of the epoxy-terminated silicone oil, 100 parts of epoxy resin, 0-50 parts of silica and 5-70 parts of curing agent, wherein the structural formula of the prereacted material of the epoxy-terminated silicone oil is shown as the formula (1). Since the prereacted material of the epoxy-terminated silicone oil has a functional group capable of reacting with the epoxy resin, the polarity of the epoxy resin is enlarged and the compatibility becomes good, and thereby, the epoxy resin is better modified, which more evenly distributes the epoxy-terminated silicone oil in the epoxy resin, achieves smaller the dimensions of phase regions, and improves and the toughness and the heat stability of the epoxy resin, and thereby, the obtained modified epoxy resin composite material of the prereacted material of the epoxy-terminated silicone oil has wide application range and can be used as high-performance materials of dopes, structural adhesives, electronic package materials and the like.
Owner:GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
High-heat-conductivity epoxy resin electronic binding glue
InactiveCN102127382AImprove thermal conductivityRapid heat buildupNon-macromolecular adhesive additivesEpoxynovolac adhesivesReactive diluentThermal expansion
The invention relates to a high-heat-conductivity epoxy resin electronic binding glue. The invention is characterized in that the high-heat-conductivity epoxy resin electronic binding glue is prepared by mixing 100 parts by weight of a component A and 5-12 parts by weight of an amine curing agent; and the component A is prepared from the following raw materials in parts by weight: 70-85 parts of spherical aluminum oxide powder, 10-20 parts of epoxy resin, 2-3.5 parts of reactive diluent, 2.5-5 parts of toughener, 0.2-1 part of thixotropic agent and 0.1-0.5 part of coupling agent. The spherical aluminum oxide of the binding glue provided by the invention has higher filling volume than non-spherical aluminum oxide, and high heat conductivity for solids, and can quickly dissipate heat accumulated in the heating components; the filler with high filling volume can lower the thermal expansion coefficient and volume shrinkage, and thus, the binding glue is very suitable for binding electronic components; and the price of the spherical aluminum oxide is lower than that of boron nitride (BN) or aluminium nitride (ALN), and thus, the binding glue provided by the invention has the advantage of low cost.
Owner:YANTAI DARBOND TECH
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