568results about "Epoxynovolac adhesives" patented technology

The invention relates to a two-component epoxy resin adhesive, including the following components: novolac epoxy resin, lipid ring type epoxy resin and terminal carboxylic acrylonitrile butadiene rubber in component A, and 1, 4-di-benzene (2, 4-diaminobenzene oxygen) in component B, wherein, the mass percentage of the lipid ring type epoxy resin is 20-35 percent of the novolac epoxy resin, the mass percentage of the terminal carboxylic acrylonitrile butadiene rubber CTBN is 12 percent of the novolac epoxy resin and the mass percentage of the 1, 4-di-benzene (2, 4-diaminobenzene oxygen) is 15-20 percent of the novolac epoxy resin; and the preparation of the two-component epoxy resin adhesive includes the step of evenly mixing the component A and the component B for use. The two-component epoxy resin adhesive used for conductive adhesive has good heat resistance, average stretching and shearing strength of 21.28MPa, simple preparation process and operation without solvent, and plays the role of protecting environment.

The invention relates to a high impact-resistant epoxy resin filling adhesive and a preparation method thereof. The high impact-resistant epoxy resin filling adhesive consists of a component A and a curing agent in a weight ratio of 100:6.5-100:7.5, wherein the component A consists of the following raw materials in percentage by weight: 20 to 60 percent of epoxy resin, 5 to 15 percent of toughening agent, 0.1 to 0.5 percent of thixotropic agent, 2 to 10 percent of diluent, 30 to 70 percent of filler and 0.1 to 0.5 percent of aid; and the curing agent is one or a mixture of more of straight chain aliphatic amine, aliphatic cyclic amine, polyether amine and low molecular weight polyamide. The preparation method for the high impact-resistant epoxy resin filling adhesive comprises the following steps of: mixing the component A and the curing agent in a proper weight ratio, and curing at the temperature of between 10 and 35DEG C for 16 hours.

The invention relates to a 4,4'-bis[4-(2,4-diamidophenoxy)phenyl]biphenyl high-temperature-resistant epoxy adhesive and a preparation method thereof. The 4,4'-bis(2,4-diamidophenoxy)biphenyl high-temperature-resistant epoxy adhesive is composed of a component A and a component B, wherein the component A is a copolymer prepared by reacting 4,4'-bis(2,4-diamidophenoxy)biphenyl and epoxy resin; and the component B is a homogeneous transparent solution with the solid content of 15-30%, which is prepared by reacting 4,4'-bis(2,4-diamidophenoxy)biphenyl and aromatic dibasic acid anhydride in a strong-polarity non-proton organic solvent and toluene. The preparation method comprises the following step: evenly mixing the component A and the component B in a mass ratio of 1:(1-2) at room temperature. The preparation technique is simple; and the adhesive has excellent comprehensive properties, can be widely used for bonding steel, copper, aluminum or any other metal with ceramic, glass, resin-base composite material or any other substrate, and has favorable industrialization prospects.

The invention relates to a preparation method of repairing adhesive, in particular to a binder for repairing blade of a wind driven generator, belonging to the high polymer material field. The preparation method of double-component epoxy resin binder used for repairing blade is simple in operation and low in cost. The double-component epoxy resin binder for repairing blade which is made by the method of the invention has high tenacity, high shear strength, low heat and low shrink, thus being suitable for repairing and binding of large structural part; solidification is rapid, the binder can be rapidly solidified in 10-30 minutes at 5-25 DEG C and reach certain strength; and the binder is used for repairing defect of blade of wind driven generator.

The invention relates to the field of semiconductor electronic materials, and in particular relates to a silver nanowire doped conductive silver colloid and a preparation method thereof. The raw materials of the silver nanowire doped conductive silver colloid provided by the invention comprise the following components in percentage by weight: 25-60% of micrometer silver powder, 5-30% of silver nanowires, 20-50% of epoxy resin, 1.6-4% of curing agent, 5.8-9.2% of dissolvent, 0.4-1.6% of accelerant, 0.04-0.16% of toughening agent and 0.8-2.4% of additive. The conductive silver colloid is prepared by mixing and doping single-crystal silver nanowires and silver granules, thus, the total silver doping amount is reduced to 35-45%, and the conductive silver colloid has a favorable conductive effect, high shear strength, low working temperature and good ageing-resistant performance, and the cost of the conductive silver colloid is reduced. The silver nanowire doped conductive silver colloid can be widely applied to the fields of solar cell (film, crystal silicon) conductive colloids, conductive colloid LED (Light-Emitting Diode) package and the like.

The invention relates to a 2,2-bis[4-(2,4-diamidophenoxy)phenyl]hexafluoropropane high-temperature-resistant epoxy adhesive and a preparation method thereof. The 2,2-bis[4-(2,4-diamidophenoxy)phenyl]hexafluoropropane high-temperature-resistant epoxy adhesive is composed of a component A and a component B, wherein the component A is a copolymer prepared by reacting 2,2-bis[4-(2,4-diamidophenoxy)phenyl]hexafluoropropane and epoxy resin; and the component B is a homogeneous transparent solution with the solid content of 15-30%, which is prepared by reacting 2,2-bis[4-(2,4-diamidophenoxy)phenyl]hexafluoropropane and aromatic dibasic acid anhydride in a strong-polarity non-proton organic solvent and toluene. The preparation method comprises the following step: evenly mixing the component A and the component B in a mass ratio of 1:(1-2) at room temperature. The preparation technique is simple; and the adhesive has excellent comprehensive properties, can be widely used for bonding steel, copper, aluminum or any other metal with ceramic, glass, resin-base composite material or any other substrate, and has favorable industrialization prospects.

The invention discloses a photocuring and thermocuring conductive adhesive, which is prepared by mixing photosensitive high polymer, diluent monomer, conducting particles, photoinitiator, polymerization inhibitor, epoxy resin, epoxy active diluting agent, latent curing agent and latent promoting agent, grinding the mixture, and stirring and dispersing in a planetary manner. The curing temperature of the product is low, and deep curing can be realized; after being cured, the adhesive has high adhesiveness and high solvent resistance; and the adhering strength is high, the resistivity is low, and the requirements of microelectronic packaging technique for LED chips, liquid crystal materials, glass substrates, thin film circuits, PCB circuit boards and the like can be met.

The invention relates to a low-viscosity and high-heat conduction epoxy resin electronic potting adhesive which is formed by mixing a component A with an amine curing agent according to the weight ratio of 100:5-12, wherein the component A comprises the following raw materials in weight ratio: 70-85 parts of spherical alumina powder, 10-20 parts of epoxy resin, 2-4 parts of active thinner, 2.5-5 parts of toughening agent and 0.1-0.5 parts of coupling agent. The invention has the advantages that the spherical alumina of the potting adhesive has higher filling amount compared with non-spherical alumina, the viscosity is less affected, the fluidity is favorable and the construction is convenient; the potting adhesive has good dispersibility and is difficult to sedimentate; a condensate has high heat conductivity and can quickly dissipate accumulated heat of heating parts and components; a high-filling filler can reduce a thermal expansion coefficient and a volumetric shrinkage rate and is very suitable for potting parts and components; and the price is cheaper compared with boron nitride and aluminum nitride, and the cost is low.

The invention discloses a double-solidification system fast-flowing underfill and a preparation method thereof. The underfill comprises the following raw materials in parts by weight: 30-80% of epoxy resin, 10-50% of epoxy acrylate, 5-30% of acrylate, 2-20% of polyol, 1-20% of silane coupling agent, 0.3-4% of cationic initiator, 0.1-3% of radical initiator and 0.1-0.5% of carbon black; and the preparation method comprises the following steps of: weighing the epoxy resin and the cationic initiator in the proportion, putting in a reaction kettle and stirring into a uniform solution; weighing the epoxy acrylate, the acrylate, the polyol, the silane coupling agent, the radical initiator and the carbon black in the proportion, putting in the reaction kettle in sequence, mixing and stirring to obtain the finished product of the double-solidification system fast-flowing underfill.

The invention relates to high-temperature resistant flame-retardant epoxy glue and a preparation method of the high-temperature resistant flame-retardant epoxy glue. The epoxy glue is a double-component epoxy glue; when the epoxy glue is used, a first component and a second component are mixed in a weight ratio of 4:(2-3); the first component is prepared from the following raw materials in parts by weight: 30-50 parts of polyfunctional epoxy resin, 5-15 parts of low-viscosity epoxy resin, 3-10 parts of an active toughening agent, 10-30 parts of temperature-resistant reinforcing fillers, 10-15 parts of flame retardant and 0.3-3 parts of antioxidant; the second component is prepared from the following raw materials in parts by weight: 70-95 parts of a temperature-resistant curing agent, 10-30 parts of temperature-resistant reinforcing fillers and 0.3-1 part of a coupling agent. Compared with the prior art, the high-temperature resistant flame-retardant epoxy glue has the advantages of high high-temperature toughness, high adhesion strength, high flame retardant performance and the like.

The invention provides a photocurable adhesive composition and a polarizing plate which attaches a protecting membrance to a polarizing sheet by means of the adhesive. The photocurable adhesive composition is able to be adhered on the polarizing sheet in a short period with a complete adhesive strength even though a resin membrance selected from polyester resin, polycarbonate resin and acrylic acid resin with low humidity transmissivity is taken as the protecting membrance. When the polarizing sheet made of polyethylene alcoholic resin membrance which is unidirectionally stretched and attracted with orientioned dichromatic pigments is adhered to the protecting membrance made of the resin membrance with low humidity transmissivity, the photocurable adhesive composition includes (A) an epoxy compound having at least two epoxy groups in the molecule, (B) an oxetane compound including at least an oxetanyl group in the molecule and (C) an optical cation polymerization initiator, wherein A/C (wt.%) is 90/10 to 10/90 and the C is 0.5-20 wt.% in the composition.

The invention relates to an inorganic/organic nano particle compound modification epoxy resin adhesive and a preparation method thereof, aiming at solving the problem that the existing toughened epoxy resin adhesive has low bonding strength at high temperature and poor high temperature aging performance. The preparation method comprises the following steps of: firstly preparing an epoxy resin component, and then preparing a curing agent component, thereby obtaining the inorganic/organic nano particle compound modification epoxy resin adhesive. When the adhesive is used, the epoxy resin component and the curing agent component are mixed uniformly at normal temperature, tensile shear strength of the adhesive at 150 DEG C can reach 10MPa-15MPa, the tensile shear strength of the adhesive at 250 DEG C still can reach 4MPa-5MPa, the bonding strength at high temperature is high, after ageing for 1000 hours at 150 DEG C, the retention rate of the tensile shear strength of the adhesive still can be above 80%, the high temperature ageing property of the adhesive is good, the preparation method of the adhesive is simple and is applicable to the fields of aviation, aerospace, mechanical automation, automobile and the like.

The invention relates to an environment-friendly heat conduction insulating glue used by high-power LEDs, which is characterized by being prepared from the following raw materials in percentage by weight: 50-68 percent of micro-grade high-thermal conductive powder, 18-30 percent of epoxy resin, 4-10 percent of curing agent, 7-15 percent of solvent, 0.6-1.5 percent of accelerator and 1-2 percent of additive; and the micro-grade high-thermal conductive powder is selected from a mixture formed by one or more of micro-grade aluminum powder, palladium powder, platinum powder, gold powder, C powder, AlN powder and SiC powder. The invention also relates to a preparation method of the heat conduction insulating glue. The environment-friendly heat conduction insulating glue used by high-power LEDsis obtained by optimizing the matching ratio and the modification of the raw materials and improving and simplifying the preparation process. Besides high resistivity, the heat conduction insulating glue also has high thermal conductivity, higher working temperature, strong viscosity, high cutting strength and fine performance index.

The invention relates to flame retardant high-heat-conductivity epoxy resin electronic adhesive glue, which is formed by mixing ingredients A with amine curing agents according to the weight ratio of 100:(5-12), wherein the ingredients A comprises the following ingredients in parts by weight: 50 to 60 parts of spherical alumina powder, 20 to 30 parts of flame retardant fillings, 10 to 20 parts of epoxy resin, 1.5 to 2.5 parts of reactive diluents, 2 to 3 parts of halogen-free liquid flame retardants, 2 to 3 parts of toughening agents, 0.2 to 0.8 parts of thixotropic agents and 0.1 to 0.5 parts of coupling agents. According to the adhesive glue provided by the invention, the adhesive glue filled by the spherical alumina has higher condensate heat conductivity when being compared with the adhesive glue filled by the non-spherical alumina, and the heat accumulation of heating devices can be fast dispersed.

The invention relates to an epoxy-organic silicon polyimide adhesive comprising the following components: organic silicon polyimide (SPI) resin, multifunctional epoxy resin, a curing agent, an accelerating agent and an organic solvent. The preparation method of the epoxy-organic silicon polyimide adhesive comprises the following steps of: adding the SPI resin to a reactor for reacting for 0.5 hours at 130 DEG C, then cooling, adding the organic solvent, and stirring for dissolution to obtain a component A; stirring the curing agent, the accelerating agent and the organic solvent for dissolution to obtain a component solution B; and when in use, uniformly mixing and stirring the components A, B to obtain the epoxy-organic silicon polyimide adhesive. The tensile sheering strength of the epoxy-organic silicon polyimide adhesive reaches 25.4 MPa at the room temperature, and the epoxy-organic silicon polyimide adhesive also has the advantages of excellent heat resistance, strong hydrophobicity, simple preparation process and low cost, is beneficial to realizing industrial production and has extensive application prospects in the fields of electronics, microelectronics, flexible copper--clad laminates, flexible printed circuit boards, hard copper-clad laminates, motors, aerospace and the like.

The invention relates to a high-performance conductive silver paste, which is characterized by comprising the following raw materials in percentage by weight: 65-80% of micron-sized metal silver powder, 10-20% of epoxy resin, 1.4-3.5% of curing agent, 6-9% of solvent, 0.5-1.2% of accelerator, 0.05-0.1% of flexibilizer and 1-2% of additive. The invention also discloses a preparation method of the high-performance conductive silver paste. The conductive silver paste of the invention has high conductivity, very high thermal conductivity, high working temperature, strong viscosity and very high shear strength, and the performance indexes are apparently higher than the working performance of the conductive silver paste in the prior art, thereby solving the technical problems of poor shear performance, low working temperature, poorer thermal conductivity, long curing time, high curing temperature, poor viscosity, easy pollution of environment and the like in the field of the conductive silver paste in the prior art.

The invention provides a halogen-free resin composition, a bonding sheet and a copper-clad laminate. The halogen-free resin composition comprises the following components of: by weight, 10-90 parts of polybenzoxazine resin, 10-90 parts of polyepoxides, 1-50 parts of a curing agent, 0.01-1 part of a curing accelerator, 10-100 parts of a filling material, and 0-80 parts of a fire retardant. The bonding sheet prepared from the halogen-free resin composition has high glass-transition temperature, excellent heat resistance and low water absorption. The copper-clad laminate prepared from the bonding sheet has high glass-transition temperature, excellent heat resistance, good flame retardation effect and low water absorption. In addition, the technology for making the copper-clad laminate is simple to operate and requires low cost.

The invention relates to a halogen-free and phosphorous-free flame-retardant synthetic resin adhesive used for a flexible copper clad laminate, in particular to the adhesive used for producing the flexible copper clad laminate. The adhesive comprises the following components: biphenyl epoxy resin, elastomer modified epoxy resin, a flexibilizer, a curing agent, a curing accelerator, an inorganic filler and an organic solvent. The halogen-free and phosphorous-free flame-retardant synthetic resin adhesive is halogen-free and phosphorous-free, is environmental-friendly and achieves fire retardance up to level UL94V-0; and the flexible copper clad laminate produced by using the adhesive has the characteristics of high folding endurance, high fire retardance, dip-soldering resistance, high peel strength, low water absorption and high dimensional stability.

The invention relates to an epoxy resin conductive adhesive and a preparation method thereof. The epoxy resin conductive adhesive comprises 3-10% of epoxy resin, 1-8% of toughening agent, 5-10% of latent curing agent, 1-5% of latent accelerating agent, 5-10% of solvents and 60-85% of conductive filler. The adhesive lengthens the retention time on the basis of maintaining lower volume resistivity and increases the glass transition temperature (TG) of the material so as to expand the application range of the adhesive and simplify the processing process of the adhesive.

The invention discloses a single-component thread locking epoxy precoated adhesive which is characterized by being prepared from the following components in proportion by weight: 40-70 parts of epoxyresin, 10-80 parts of activated thinner, 20-60 parts of epoxy hardener, 8-20 parts of urea, 30-60 parts of formaldehyde solution, 10-30 parts of hydroxyphenol, 0.5-5 parts of stuffing, 5-15 parts of surfactant, 80-200 parts of distilled water, 0.5-2 parts of membrane material, 0.1-1 part of hydrolysis inhibitor and 5-10 parts of solvent; and a preparation method comprises the steps: firstly, respectively microencapsulating the epoxy resin and the epoxy hardener are and then uniformly mixing with other components in proportion. The single-component thread locking epoxy precoated adhesive has the characteristics of convenient construction, applicable workpiece material diversification, less curing condition restriction, good moisture resistance and high destabilizing moment and average disassembly moment, ensures the locking performance and better guarantees the safe reliability of products.

The invention discloses a lead-free high heat-resisting copper-clad board, and the lead-free high heat-resisting copper-clad board is prepared from a resin adhesive, glass fiber cloth and copper foil, the resin adhesive is composed of the following components by weight percent: 50-90% of solid matter and the balance of organic solvent; the solid matter is prepared from phenolic epoxy resin, isocyanate modified brominated epoxy resin, high-bromine epoxy resin, a phenolic resin curing agent, an epoxy resin curing accelerant, a heat stabilizer and an inorganic filler. The invention further discloses a preparation method of the lead-free high heat-resisting copper-clad board. The lead-free high heat-resisting copper-clad board suitable for lead-free process has a glass transition temperature not less than 170 DEG C, good heat resistance, good toughness and peel strength and excellent PCB (printed circuit board) processing property, can be manufactured as various lead-free printed circuit boards with excellent property, and is completely suitable for the demands of PCB lead-free process and high multilayer board production.