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Conductive adhesive compositions with electrical stability and good impact resistance for use in electronics devices

A composition and conductive technology, applied in the field of interconnected compositions, can solve the problems of poor impact resistance of conductive adhesives

Inactive Publication Date: 2006-06-14
NAT STARCH & CHEM INVESTMENT HLDG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The impact resistance of conductive adhesives becomes worse when containing high loadings of conductive fillers

Method used

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  • Conductive adhesive compositions with electrical stability and good impact resistance for use in electronics devices
  • Conductive adhesive compositions with electrical stability and good impact resistance for use in electronics devices
  • Conductive adhesive compositions with electrical stability and good impact resistance for use in electronics devices

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Example 1. Preparation of samples of prepolymers and samples of epoxy-amine system physical mixtures. A physical mixture of epoxy resin and amine (component A) was prepared by adding 55.56% by weight of a diglycidyl ether of bisphenol-A and a diglycidyl ether of bisphenol-F (from Tohto Kasei Co. .A mixture of commercially available ZS1059) and 44.44% by weight of poly(oxy(methyl-1,2-ethanediyl), α-(2-aminomethylethyl)ω-2(2-amino Methylethoxy) (commercially available as Jeffamine® D-2000 from Huntsman Petrochemical Co.). The prepolymer (component B) was obtained by heating the physical mixture in a conventional oven at 120° C. for 6 hours .Components A and B were detected with IR spectroscopy and component B was at a wavelength of 3439em -1 Absorption peaks are shown at , which indicates the presence of hydroxyl functional groups in the sample. Component A does not have a wavelength of 3439cm -1 shows an absorption peak at , which indicates the absence of hydroxyl fun...

Embodiment 2

[0041] Example 2. Examination of the initial contact resistance of conductive adhesives by five different adhesive formulations catalyzed by imidazole and containing epoxy-aliphatic amine prepolymer. Formulation The formulation was prepared by first dissolving Novolac 1166 in gamma-butyrolactone at 120°C. The solution was cooled to room temperature and the remaining ingredients were added and mixed thoroughly with a mechanical stirrer. The composition of the formulation is shown in Table 2.

[0042] components

Formula A

Formula B

Formula C

Formula D

Formula E

Novolac 1166

0.72

0.72

0.61

0.61

0.72

γ-butyrolactone

5.62

5.62

4.75

4.75

5.62

Component B

14.06

14.06

11.78

11.88

14.06

4-Methyl-2-phenylimidazole

0.72

0.72

0.60

0.60

0.72

8-Hydroxyquinoline

1.30

1.30

1.10

1.10

...

Embodiment 3

[0048] Embodiment 3. Prepare two other samples according to the same method as the sample of Example 2, and their formulations are shown in Table 5.

[0049] components

[0050] After the coupons were formulated and placed on the plate, the initial contact resistance was measured. The panels were then placed in a humid chamber maintained at 85°C and 85% relative humidity, and the contact resistance was measured periodically with a Keithley 2010 multimeter. As shown in Figure 1, the change in resistance value of the sample without any corrosion inhibitor is more obvious. Also, when imidazole was used as a catalyst and a corrosion inhibitor was added to the formulation, the resistance was much more stable in conditions of high temperature and high humidity.

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PUM

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Abstract

A composition that comprises a) an admixing of at least one epoxy resin and aliphatic amine wherein the ratio of epoxy function group / amine is greater than 1; b) a conductive filler; c) one or more corrosion inhibitors, oxygen scavengers or both; d) imidazole as a curing agent / catalyst; and e) optionally other additives such as organic solvents, flow additives, adhesion promoters and rheology modifiers. The reaction of epoxy and aliphatic amine with excess epoxy functionality results in a flexible resin with remaining active epoxy groups. The compositions exhibit improved electrical stability and impact resistance over other conductive adhesive compositions that do not comprise the admixture.

Description

field of invention [0001] The present invention relates to compositions suitable for use as conductive materials in microelectronic devices or semiconductor components to provide electrically stable interconnections. Background of the invention [0002] In the manufacture and assembly of semiconductor components and microelectronic devices, electrically conductive compositions are used for various purposes. For example, conductive adhesives are used to bond integrated circuit chips to substrates (die attach adhesives) or to bond circuit assemblies to printed circuit boards (surface mount conductive adhesives). [0003] Throughout the electronics industry, the dominant technique for soldering parts to substrates uses a metallic solder paste alloy, also known as eutectic solder paste, which contains 63% tin and 37% lead by weight. It is applied as a solder paste on a circuit board, and heating the paste above its melting temperature (183°C) causes the paste to melt and form a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C08G59/18C08G59/68C08K3/08C09J163/04H01L21/60H05K3/32
CPCC08G59/184C08G59/686C08K3/08C09J163/00H01L24/83H01L2224/83851H05K3/321H05K2203/122H05K2203/124H01L2924/01079H01L2924/01087H01L2924/01322H01L2224/29324H01L2224/29447H01L2224/2929H01L2224/29311H01L2224/29313H01L2224/29339H01L2224/29344H01L2224/29347H01L2224/29364H01L2224/29369H01L2224/29393H01L2224/29424H01L2924/14H01L2924/3512H01L2924/00H01L2924/0665H01L2924/00014C09J163/04
Inventor 肖越S·H·莱曼郑志明G·德里津
Owner NAT STARCH & CHEM INVESTMENT HLDG CORP
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