The invention belongs to the technical field of
copper-clad plates, and relates to a low-
dielectric high-heat-resistance
copper-clad plate and a preparation method thereof. By introducing the POSS resin, the
dielectric constant of the
copper-clad plate is effectively reduced, which is crucial for reducing
signal delay and improving
signal transmission efficiency. The introduction of the POSS resin not only improves the
dielectric properties of the material, but also improves the
glass transition temperature (Tg) of the material, which means that the physical and chemical properties of the material can be kept unchanged at a higher temperature, and the material is suitable for wider environmental conditions. By using the resin and the
inorganic filler in a specific ratio, the copper-clad plate shows excellent
copper foil peel strength, and ensures that the bonding force between the
copper foil and the base material is not easily weakened under long-term use or severe conditions. Meanwhile, the material also has excellent CAF (conductive
anode wire) resistance, can effectively prevent internal
short circuit caused by
moisture, and prolongs the service life of an electronic product.