1389results about "Solid electrolytic capacitors" patented technology

A substrate 1 for manufacturing a capacitor element includes: a substrate layer 10 divided into a product region R1 constituting a capacitor element and a region R2 outside product surrounding at least a part of the product region R1; and a sealing layer 20 provided so as to cover at least one major surface of the substrate layer 10. The product region R1 includes an anode plate 11 having a porous part 11B on at least one major surface of the core part 11A, a dielectric layer 13 provided on a surface of the porous part 11B, and a cathode layer 12 provided on a surface of the dielectric layer 13. The region R2 outside product includes the core part 11A of the anode plate 11. A penetration part 30 penetrating the anode plate 11 in a thickness direction is provided in at least a part of a region located at an outer edge of the substrate layer 10 in the region R2 outside product. At least a part of the penetration part 30 is filled with a filling member 40.

An apparatus is disclosed which includes an electrolytic capacitive element with multiple capacitor sections.

An apparatus is disclosed which includes an electrolytic capacitive element with multiple capacitor sections.

To provide a thin film capacitor having a large capacitance. A thin film capacitor includes a metal foil having roughened main surfaces, a dielectric film covering the main surfaces, an electrode layer contacting the metal foil through an opening formed in the dielectric film and having a surface formed as a metal terminal, an electrode layer contacting the dielectric film without contacting the metal foil and having a surface formed as a metal terminal, and an electrode layer contacting the dielectric film without contacting the metal foil. The electrode layers include a conductive polymer layer contacting the dielectric film.

A solid electrolytic capacitor according to one aspect of the present disclosure includes: an anode body made of a valve metal; a dielectric layer formed on the anode body; and a solid electrolyte layer formed on the dielectric layer. The solid electrolyte layer includes: a first conductive polymer layer formed on the dielectric layer and heterogeneously doped with a monomolecular dopant; a block layer formed on the first conductive polymer layer; and a second conductive polymer layer formed on the block layer and composed of a self-doped-type conductive polymer containing a plurality of side chains containing a functional group that can be doped. The block layer blocks a migration of the self-doped-type conductive polymer from the second conductive polymer layer into the first conductive polymer layer and / or a migration of the self-doped-type conductive polymer from the second conductive polymer layer into pores of the porous anode body.

An electrolytic capacitor includes a winding portion, an anode lead member, and a cathode lead member. The winding portion includes an anode foil and a cathode foil that are wound. The anode lead member is connected to the anode foil and extends in a first direction. The cathode lead member is connected to the cathode foil and extends in the first direction. The winding portion has a shape viewed in the first direction, the shape including a first peripheral region and a second peripheral region that are opposed to each other in a second direction intersecting the first direction, and a third peripheral region and a fourth peripheral region that are opposed to each other in a third direction intersecting the first direction and the second direction. The length of the winding portion in the third direction is larger than the length of the winding portion in the second direction. The anode lead member and the cathode lead member are arranged point-symmetrically with respect to a center of the winding portion when viewed in the first direction.

A capacitor that is capable of exhibiting good electrical properties under a wide variety of different conditions is provided. The capacitor contains a capacitor element that includes a sintered porous anode body, a dielectric that overlies the anode body, and a solid electrolyte that overlies the dielectric and includes a conductive polymer. The capacitor also contains multiple exposed anode lead portions that are electrically connected to respective anode terminations and a planar cathode termination that is electrically connected to the solid electrolyte.

A wound capacitor package structure includes a wound assembly, a conductive assembly, a package assembly, a bottom seat plate and a pin protection assembly. The conductive assembly includes a first and a second conductive pin. The package assembly is configured for enclosing the wound assembly. The bottom seat plate is disposed on a bottom side of the package assembly. The pin protection assembly includes a first pin protection layer configured to partially cover the first conductive pin, and a second pin protection layer configured to partially cover the second conductive pin. The first conductive pin includes a first exposed portion exposed outside the package assembly, and the second conductive pin includes a second exposed portion exposed outside the package assembly. The first and the second pin protection layer are disposed on the first and the second exposed portion for protecting the first and the second conductive pin, respectively.

Provided is an electrolytic capacitor including a capacitor element and a liquid component. The capacitor element includes an anode foil having a dielectric layer on a surface of the anode foil, and a conductive polymer component in contact with at least a portion of the dielectric layer. The conductive polymer component contains a self-doped conductive polymer. The liquid component contains at least one solvent selected from the group consisting of alkylene glycols having 4 or more carbon atoms and polyalkylene glycols having a repeating structure of oxyalkylene having 3 or more carbon atoms.

A capacitor element 1 comprises a positive electrode plate 10 that has a porous layer 12 on at least one main surface, a dielectric layer 20 that is provided on the surface of the porous layer 12, a negative electrode layer 30 that is provided on the surface of the dielectric layer 20, and an insulation layer 40 that is provided on the surface of the dielectric layer 20 so as to partially overlap the negative electrode layer 30, the relationship d1≥0.2×d2 being satisfied, where d1 is the layer thickness of a portion 34 of the insulation layer 40 where the negative electrode layer 30 and the insulation layer 40 overlap at an end 40a that overlaps the negative electrode layer 30, and d2 is the layer thickness of the insulation layer.

To provide a thin film capacitor having high adhesion with respect to a circuit substrate. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. An angle θa formed by the other main surface of the metal foil and a side surface thereof is more than 20° and less than 80°. The side surface is thus tapered at an angle of more than 20° and less than 80°, so that it is possible to suppress warpage and to enhance adhesion with respect to a multilayer substrate when the thin film capacitor is embedded in the multilayer substrate.

To provide a thin film capacitor in which warpage is less likely to occur. A thin film capacitor includes: a metal foil having roughened upper and lower surfaces; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a dielectric film covering the lower surface of the metal foil and made of a dielectric material having a thermal expansion coefficient smaller than that of the metal foil; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the first dielectric film without contacting the metal foil. The lower surface of the metal foil is thus covered with the dielectric film having a small thermal expansion coefficient, thereby making it possible to prevent the occurrence of warpage.

The invention discloses a high-adhesion solid-state capacitor carbon foil production process, and relates to the technical field of solid-state capacitor carbon foils. The preparation method comprises the following steps: generating a three-dimensional graphene layer in situ on the surface of an aluminum foil by a chemical vapor reduction method; secondly, the graphene layer is modified by utilizing aluminum nitrate ammonium nitrate, and then the Ni-Al layer with a continuous lamellar structure is prepared on the graphene layer through electrochemical deposition, so that active sites are provided, and the ion diffusion capability of the carbon foil is remarkably improved; finally, mixing ethylene diamine tetraacetic acid dipotassium salt and corn starch to prepare nitrogen-doped carbon aerogel, preparing the nitrogen-doped carbon aerogel into powder, and coating the surface of the Ni-Al layer with the powder to prepare a four-layer composite carbon foil; by doping nitrogen atoms, the surface chemical performance of the carbon aerogel material can be changed, the wettability of an electrode is improved, the diffusion rate of electrolyte ions is increased, and the specific capacity of the material is increased, so that the overall electrochemical performance of the carbon foil is improved. The four-layer composite carbon foil prepared by the invention has the effects of high adhesion and excellent electrochemical performance.

A solid electrolytic capacitor that includes: an anode plate including a core portion, a porous layer having pores on at least one main surface of the core portion, and a dielectric layer on a surface of the porous layer and extending into the pores of the porous layer; and a cathode layer that includes a solid electrolyte layer on a surface of the dielectric layer. The solid electrolyte layer includes a conductive polymer layer inside the pores of the porous layer, the conductive polymer layer comprising a mixture of a conductive polymer and an insulating material. The insulating material is a material which contains an OH group, a COOH group, a CO group, or an NH2 group in a molecule, has hygroscopicity, and does not have a function as a dopant for the above-described conductive polymer.

A capacitor element that includes: a capacitor portion including an anode plate including a porous portion on a core portion, a dielectric layer on the porous portion, and a cathode layer on the dielectric layer; a sealing layer covering the capacitor portion; conductive interconnect layers on the sealing layer; and an outer insulating layer covering the sealing layer and the conductive interconnect layers. In a plan view from a thickness direction of the anode plate, a center-to-center distance between a first anode through conductor and a first cathode through conductor is equivalent to a center-to-center distance between the first anode through conductor and a second cathode through conductor, and a center-to-center distance between a fifth cathode through conductor and the first cathode through conductor is equivalent to a center-to-center distance between the fifth cathode through conductor and the second cathode through conductor.

A capacitor array that includes: a capacitor part including a plurality of capacitor elements disposed in a planar arrangement in an in-plane direction orthogonal to a thickness direction, the plurality of capacitor elements including mutually adjacent capacitor elements that are separated from each other, wherein the plurality of capacitor elements each include a first electrode layer and a second electrode layer that face each other in the thickness direction with a dielectric layer interposed between the first electrode layer and the second electrode layer; a built-in member disposed at an outer periphery of the capacitor part in the in-plane direction; and a sealing layer that seals the capacitor part and the built-in member, wherein the built-in member has a higher melting temperature than the sealing layer.

Provided is a conductive polymer solution capable of providing an electrolytic capacitor having high capacity and exhibiting low ESR characteristics. A conductive polymer solution having a pH of 1.5-5.0 is used, the solution containing 0.01-10% by mass of a polythiophene (A) containing at least one type of structural unit selected from the group consisting of structural units represented by general formula (1) and structural units represented by general formula (2), 0.001-20% by mass of an epoxy compound (B) having at least two or more epoxy groups, and water. In general formulae (1) and (2), R2 represents a hydrogen atom, a methyl group, an ethyl group, a C3-6 linear or branched alkyl group, or a fluorine atom, m represents an integer of 1-10, and n represents 0 or 1. ] # imgabs0 #

A core package includes N cores, N+1 hollow-square-shaped thin plates, a first substrate and a second substrate. The N+1 hollow-square-shaped thin plates and the N cores are stacked alternately to form a semi-finished core package. Anode portions of adjacent two cores are electrically connected, and cathode portions of adjacent two cores are electrically connected. When stacking the N+1 hollow-square-shaped thin plates and the N cores, a space where the N+1 hollow-square-shaped thin plates are not in contact with the N cores is filled with an insulating adhesive. A double-substrate multilayer solid aluminum electrolytic capacitor includes a resin shell, a waterproof coating and the core package. This application also provides a method of preparing the double-substrate multilayer solid aluminum electrolytic capacitor.

Provided is an electrical storage device that is compact and can be manufactured easily, while allowing for use of higher voltages.　In an electrical storage device 1, a winding structure 20 comprises: a central electrode body 21 in which a first extending part 21b and a second extending part 21c extending from either side of a central portion 21a are wound around the central portion in the same direction; a first electrode body 22 electrically connected to a first external terminal 6 and extending toward an outer peripheral side from a vicinity of the central portion; a second electrode body 23 electrically connected to a second external terminal 7 and extending toward the outer peripheral side from a vicinity of the central portion; a first separator 24 disposed between the central electrode body and the first electrode body; and a second separator 25 disposed between the central electrode body and the second electrode body.

The invention discloses a high-voltage solid capacitor positive electrode oxide film repairing electrolyte and a film coating process thereof, and belongs to the technical field of solid capacitors. The electrolyte comprises ammonium azelate, azelaic acid, ammonium dihydrogen phosphate, phosphoric acid, a reducing agent, a functional additive, ethylene glycol, deionized water and other components; the electrolyte can effectively repair the positive electrode foil oxidation film when the positive electrode foil oxidation film has defects, and the film coating process comprises the steps of acid pickling pretreatment, electrolyte repair, silane coupling agent treatment, film forming liquid impregnation and curing and the like, according to the invention, the oxidation film on the surface of the positive electrode foil is repaired through the electrolyte, and the uniform and compact protection film is formed through a film coating process, so that the mechanical strength and corrosion resistance of the oxidation film are enhanced, the leakage current value of the capacitor is effectively reduced, and the service life of the capacitor is prolonged. The performance of the capacitor is improved, and the corrosion of the external environment to the oxidation film is isolated.

A tantalum capacitor includes a tantalum body including a tantalum element including tantalum powder, a conductive polymer layer disposed on the tantalum element, and a tantalum wire penetrating through at least a portion of each of the tantalum element and the conductive polymer layer in a first direction, a molded portion including a fifth surface and a sixth surface facing in the first direction, a third surface and a fourth surface facing in a second direction, and a first surface and a second surface facing in a third direction and surrounding the tantalum body, a first coating layer disposed in at least a portion of an interface between the tantalum body and the molded portion, and a second coating layer disposed on the first coating layer, wherein the second coating layer is thicker than the first coating layer.

A solid electrolytic capacitor that includes an anode body having a porous part on surface thereof and a manufacturing method thereof including a step (i) of forming a first solid electrolyte layer on a dielectric layer and a step (ii) of forming a second solid electrolyte layer on the first solid electrolyte layer. The first and second solid electrolyte layers contain first and second conductive polymers, respectively. The step (i) includes a step (i-a) of supplying a reaction solution containing a monomer and a silane compound to the surface of the dielectric layer, and a step (i-b) of forming the first solid electrolyte layer by polymerizing the monomer in the supplied reaction solution to form the first conductive polymer. The monomer contains a compound represented by the following formula (I) (in the formula (I), R represents an alkyl group whose carbon number is within a range of 1 to 10).

The present invention relates to the technical field of manufacturing solid aluminum electrolytic capacitors, and specifically discloses a moisture-resistant laminated solid aluminum electrolytic capacitor and a manufacturing method, including a shell and a cover, wherein the inner side of the shell is provided with positive contacts and negative contacts that are staggered and distributed at equal intervals, the inner side of the shell is provided with two symmetrically distributed arc strips, the bottom of the arc strip is fixedly connected with two symmetrically distributed conductive strips, the inner side of the conductive strip is fixedly connected with U-shaped card slots that are distributed at equal intervals in a straight line, and the outer side of the positive contact and the outer side of the negative contact are respectively provided with positive conductive sheets and negative conductive sheets. The present invention arranges two conductive sheets on the outer side of the positive contact and the negative contact, and if one group of conductive sheets and the U-shaped card slot appear, the other group of conductive sheets and the U-shaped card slot can still be used normally, so that the entire capacitor can continue to be used, thereby improving the service life of the laminated solid aluminum electrolytic capacitor.

A solid electrolytic capacitor includes: a capacitor element including an anode part and a cathode part; a substrate that supports the capacitor element; a sealing body that seals the capacitor element; a first external electrode electrically connected to the anode part; a second external electrode electrically connected to the cathode part; and an adhesive layer disposed between the capacitor element and a first surface of the substrate. At an interface between the first surface and the adhesive layer, a maximum height Rz1 of surface roughness of the first surface is 5 μm or more, and a maximum height Rz2 of surface roughness of the adhesive layer is 3 μm or more.

A tantalum capacitor includes a tantalum body including a tantalum element including tantalum powder, and a tantalum wire passing through at least a portion of the tantalum element in a first direction, a molded portion having fifth and sixth surfaces opposing each other in the first direction, third and fourth surfaces opposing each other in a second direction, first and second surfaces opposing each other in a third direction, the molded portion formed to surround the tantalum body, an anode lead frame connected to the tantalum wire, a cathode lead frame spaced apart from the anode lead frame, the cathode lead frame connected to the tantalum body, and a frame terminal disposed on the anode lead frame and the cathode lead frame to be spaced apart from the second surface of the molded portion.

A capacitor assembly package structure, capacitor structure and method of manufacturing the same, and electronic device. The capacitor assembly package structure includes a capacitor assembly, an insulating package body and an electrode assembly. The capacitor assembly includes a plurality of capacitor structures that are stacked in sequence and electrically connected to each other. The insulating package body is configured to encapsulate a plurality of the capacitor structures. The electrode assembly includes a first electrode structure and a second electrode structure. Each of the capacitor structures includes a sintered silver layer, and the sintered silver layer includes more than 95% pure silver material. The average thickness of the sintered silver layer can be less than or equal to 1 μm, and the resistivity of the sintered silver layer can be less than the resistivity of a silver glue material formed by mixing epoxy resin and silver powder.

A tantalum capacitor includes a tantalum body including a tantalum element, a conductive polymer layer disposed on the tantalum element, and a tantalum wire penetrating through at least a portion of each of the tantalum element and the conductive polymer layer in a first direction, a molded unit surrounding the tantalum body and, an anode lead frame exposed to one surface of the molded unit and connected to the tantalum wire, a cathode lead frame spaced apart from the anode lead frame and exposed to the one surface of the molded unit, and a first coating layer disposed in at least a portion of a region between the molded unit and the anode lead frame and a region between the molded unit and the cathode lead frame.

The present invention provides a metal foil for an electrolytic capacitor, said metal foil including a valve metal and having two main surface regions. At least one of the main surface regions has a plurality of recesses extending in a line shape, and the depth of the recesses is between 4 μm and 58 μm inclusive, or the projected area ratio of the recesses in the main surface regions is between 8% and 45% inclusive.

The present invention provides a solid electrolytic capacitor in which a conductive polymer and an electrolyte solution are used in combination, an increase in equivalent series resistance in a high-temperature environment is suppressed even if fibrillated fibers are included as a separator, and a decrease in electrostatic capacity is suppressed. This solid electrolytic capacitor is provided with: an anode body that has a dielectric film; a cathode body that faces the anode body; and an inter-electrode layer that is interposed between the anode body and the cathode body. The inter-electrode layer includes a conductive polymer, an electrolyte solution, and a separator. The separator contains fibrillated fibers and has an air permeation resistance of 5.8 (sec / 100 mL) or less. The electric conductivity of the inter-electrode layer is not less than 55 (S) but less than 180 (S).

The invention provides a lightweight flexible composite micro-energy storage module, which comprises a flexible substrate, a composite electrode layer, a solid electrolyte layer and a packaging layer, and is characterized in that the flexible substrate is made of a polyurethane-graphene composite material, the thickness of the flexible substrate is 50-200 [mu] m, and the surface of the flexible substrate is provided with a micro-crack structure; the composite electrode layer is formed by alternately stacking MXene / silicon carbon composite nanosheets and polypyrrole conductive polymers, wherein the mass ratio of MXene to silicon carbon is 3: 1 to 5: 1. According to the invention, through the mechanical interlocking design of the microcrack structure of the flexible substrate and the composite electrode layer, the interlayer binding force is significantly enhanced, and the structural integrity under dynamic bending is improved; the root-shaped ion transmission channel of the solid electrolyte layer and the vertical orientation transition layer realize electron-ion dual-channel cooperative transmission and reduce the interface impedance; the gradient hydrophobic structure of the packaging layer is matched with mechanics through chemical bonding, the sealing performance, the flexibility and the environmental tolerance are balanced, and the service life of the module is prolonged.