125results about How to "Low ESR" patented technology

Electrolytic capacitors having low equivalent series resistance and low leakage current are described. The electrolytic capacitors include a solid electrolyte layer of a conductive material in particular a conductive polymer, and an outer layer that includes binders, polymeric anions and conductive polymers (e.g., polythiophenes). Also described is a method of preparing electrolytic capacitors that involves forming the conductive polymer of the solid electrolyte layer in situ by means of chemical oxidative polymerization or electrochemical polymerization. Electronic circuits that include the electrolytic capacitors are also described.

The present invention provides an electrode made of carbon nanotubes or carbon nanofibers and a process for preparing the same. The electrode comprising a current collector, sulfur or metal nanoparticles as a binder, and carbon nanotubes or carbon nanofibers is characterized in that the sulfur or metal nanoparticles are bonded, deposited, or fused on the surfaces of the carbon nanotubes or carbon nanofibers so that the carbon nanotubes or carbon nanofibers are bonded to each other and also bonded to the current collector. The electrode prepared according to the present invention exhibits low internal resistance, strong durability and low equivalent series resistance, and therefore the electrode can be effectively used for secondary batteries, supercapacitors or fuel cells.

A miniature solid electrolytic capacitor is provided, which is suitable for being disposed within an electrically insulating layer, and is connected to other component using an electrically conductive adhesive with a connection resistance at an anode low and with connection reliability improved. Specifically, the electrolytic capacitor includes a valve metal element for an anode 10 having a capacitor forming part 10A and an electrode lead part 10B, a dielectric oxide film 11 formed on the valve element, a solid electrolyte layer 12 formed on the dielectric oxide film 11 and a charge collecting element for a cathode 13 formed on the solid electrolyte layer 12, wherein at least one through hole 15 is formed in the electrode lead part 10B so as to expose a core 10C of the valve metal element, and an exposed portion 10D of the core is used for connecting portion.

Low inductance capacitors include electrodes that are arranged among dielectric layers and oriented such that the electrodes are substantially perpendicular to a mounting surface. Vertical electrodes are exposed along a device periphery to determine where termination lands are formed, defining a narrow and controlled spacing between the lands that is intended to reduce the current loop area, thus reducing the component inductance. Further reduction in current loop area and thus component equivalent series inductance (ESL) may be provided by interdigitated terminations. Terminations may be formed by various electroless plating techniques, and may be directly soldered to circuit board pads. Terminations may also be located on “ends” of the capacitors to enable electrical testing or to control solder fillet size and shape. Two-terminal devices may be formed as well as devices with multiple terminations on a given bottom (mounting) surface of the device. Terminations may also be formed on the top surface (opposite a designated mounting surface) and may be a mirror image, reverse-mirror image, or different shape relative to the bottom surface.

A method for maintaining quality of monomer during a coating process for intrinsically conductive polymer which suppresses unwanted by-products. A neutralization process using a base or anion exchange resin is used batch-wise or continuous.

Low inductance capacitors include electrodes that are arranged among dielectric layers and oriented such that the electrodes are substantially perpendicular to a mounting surface. Vertical electrodes are exposed along a device periphery to determine where termination lands are formed, defining a narrow and controlled spacing between the lands that is intended to reduce the current loop area, thus reducing the component inductance. Further reduction in current loop area and thus component equivalent series inductance (ESL) may be provided by interdigitated terminations. Terminations may be formed by various electroless plating techniques, and may be directly soldered to circuit board pads. Terminations may also be located on “ends” of the capacitors to enable electrical testing or to control solder fillet size and shape. Two-terminal devices may be formed as well as devices with multiple terminations on a given bottom (mounting) surface of the device. Terminations may also be formed on the top surface (opposite a designated mounting surface) and may be a mirror image, reverse-mirror image, or different shape relative to the bottom surface.

A miniature solid electrolytic capacitor is provided, which is suitable for being disposed within an electrically insulating layer, and is connected to other component using an electrically conductive adhesive with a connection resistance at an anode low and with connection reliability improved. Specifically, the electrolytic capacitor includes a valve metal element for an anode 10 having a capacitor forming part 10A and an electrode lead part 10B, a dielectric oxide film 11 formed on the valve element, a solid electrolyte layer 12 formed on the dielectric oxide film 11 and a charge collecting element for a cathode 13 formed on the solid electrolyte layer 12, wherein at least one through hole 15 is formed in the electrode lead part 10B so as to expose a core 10C of the valve metal element, and an exposed portion 10D of the core is used for connecting portion.

The present invention relates to a solid electrolytic capacitor provided with a anode made of a metal or an alloy having valve action, a dielectric layer formed on the anode, and an electrolyte layer consisting of a conductive polymer layer formed so as to have contact with a portion of the region on the dielectric layer surface and a manganese dioxide layer formed so as to have contact with the other portion of the region on the dielectric layer surface.