1095 results about "Silanol" patented technology

Methods for forming silicon dioxide thin films on hydrophobic surfaces are provided. For example, in some embodiments, silicon dioxide films are deposited on porous, low-k materials. The silicon dioxide films can be deposited using a catalyst and a silanol. In some embodiments, an undersaturated dose of one or more of the reactants can be used in forming a pore-sealing layer over a porous material.

This invention relates to materials and processes for thin film deposition on solid substrates. Silica/alumina nanolaminates were deposited on heated substrates by the reaction of an aluminum-containing compound with a silanol. The nanolaminates have very uniform thickness and excellent step coverage in holes with aspect ratios over 40:1. The films are transparent and good electrical insulators. This invention also relates to materials and processes for producing improved porous dielectric materials used in the insulation of electrical conductors in microelectronic devices, particularly through materials and processes for producing semi-porous dielectric materials wherein surface porosity is significantly reduced or removed while internal porosity is preserved to maintain a desired low-k value for the overall dielectric material. The invention can also be used to selectively fill narrow trenches with low-k dielectric material while at the same time avoiding deposition of any dielectric on the surface area outside of the trenches.

Often used to reduce the RC delay in integrated circuits are dielectric films of porous organosilicates which have a silica like backbone with alkyl or aryl groups (to add hydrophobicity to the materials and create free volume) attached directly to the Si atoms in the network. Si—R bonds rarely survive an exposure to plasmas or chemical treatments commonly used in processing; this is especially the case in materials with an open cell pore structure. When Si—R bonds are broken, the materials lose hydrophobicity, due to formation of hydrophilic silanols and low dielectric constant is compromised. A method by which the hydrophobicity of the materials is recovered using a novel class of silylation agents which may have the general formula (R₂N)_XSiR′_Y where X and Y are integers from 1 to 3 and 3 to 1 respectively, and where R and R′ are selected from the group of hydrogen, alkyl, aryl, allyl and a vinyl moiety. Mechanical strength of porous organosilicates is also improved as a result of the silylation treatment.

Methods for preparing polyurethane flexible foam are described, wherein an organic polyisocyanate is reacted with an active hydrogen-containing component such as an organic polyol, in the presence of a urethane catalyst, a blowing agent, optionally a cell opener, and a siloxane-based surfactant composition as a stabilizer for the foam. The siloxane-based surfactant composition comprises a silanol-functionalized organosiloxane having general formula (I),

wherein:

the R groups are independently a C₁-C₃ alkyl, phenyl, or —OSi(R)₃; provided that at least one R group is a hydroxyl (—OH) bonded directly to any silicon atom and X is an integer from 0-200.

Methods of preparing a low-k dielectric material on a substrate are provided. The methods involve using plasma techniques to remove porogen from a precursor layer comprising porogen and a dielectric matrix and to protect the dielectric matrix with a silanol capping agent, resulting in a low-k dielectric matrix. Porogen removal and silanol capping can occur concurrently or sequentially. If performed sequentially, silanol capping is performed without first exposing the dielectric matrix to moisture or ambient conditions.

Diene rubber compositions are described containing a diene elastomer, a reinforcing inorganic filler, and a coupling agent wherein the inorganic filler includes a silica having the following characteristics:

• • (a) a BET specific surface area between 45 and 400 m²/g;
  • (b) a CTAB specific surface area between 40 and 380 m²/g;
  • (c) an average particle size (by mass), d_w, of 20 to 300 nm; and at least one of the following characteristics, preferably two and more preferably all three: (d) a particle size distribution such that dw≧/CTAB)−30; (e) a porosity which meets the criterion L/FI≧−0.0025 CTAB+0.85;
  • (f) an amount of silanols per unit of surface area, N_SiOH/nm²; N_SiOH/nm²≦−0.027 CTAB+10.5. These diene rubber compositions can be used for the manufacture of tires or of semi-finished products intended for tires.

A semiconductor light-emitting device member excellent in transparency, light resistance, and heat resistance and capable of sealing a semiconductor light-emitting device without causing cracks and peeling even after a long-time use is provided. Therefore, a semiconductor light-emitting device member that comprises (1) in a solid Si-nuclear magnetic resonance spectrum, at least one peak selected from a group consisting of (i) peaks whose peak top position is in an area of a chemical shift of −40 ppm to 0 ppm inclusive, and whose full width at half maximum is 0.3 ppm to 3.0 ppm inclusive, and (ii) peaks whose peak top position is in an area of the chemical shift of −80 ppm or more and less than −40 ppm, and whose full width at half maximum is 0.3 ppm to 5.0 ppm inclusive, wherein (2) silicon content is 20 weight % or more and (3) silanol content is 0.1 weight % to 10 weight % inclusive is used.

The invention belongs to the technical field of a new chemical material, and in particular relates to a high-durability super-hydrophobic self-cleaning coating material and a preparation method thereof. The coating material of the invention is prepared by curing and drying nanoparticles with photo-catalytic activity, a low-surface-free-energy polymer and a cross-linking agent at the room temperature, wherein the low-surface-free-energy polymer consists of one or more of polysiloxane fluoride, dimethyl silicone polymer and polyphenylene methyl siloxane, which contain active groups, such as hydroxyl alkoxy group, carbon-carbon double bond, silanol group, siloxy group, and the like; the cross-linking agent is hydrogen-containing silicone oil or aminosilane; and the mass content of the photo-catalytic nanoparticles in the coating ranges from 10 to 60 percent. The coating is formed into a micro-nanostructure by nanoparticle self-organization; a super-hydrophobic self-cleaning coating with lotus effect is prepared from the coating and a cross-linked filming matrix with low surface energy; the persistence of a lotus-shaped super-hydrophobic characteristic of the coating is realized by using the photo-catalytic decomposition characteristic of an organic pollutant for the nanoparticles; and thus the material is suitable for large-area construction and has high weathering resistance andprominent self-cleaning characteristic.

Metal silicates or phosphates are deposited on a heated substrate by the reaction of vapors of alkoxysilanols or alkylphosphates along with reactive metal amides, alkyls or alkoxides. For example, vapors of tris-(ter-butoxy)silanol react with vapors of tetrakis(ethylmethylamido)hafnium to deposit hafnium silicate on surfaces heated to 300° C. The product film has a very uniform stoichiometry throughout the reactor. Similarly, vapors of diisopropylphosphate react with vapors of lithium bis(ethyldimethylsilyl)amide to deposit lithium phosphate films on substrates heated to 250° C. supplying the vapors in alternating pulse produces these same compositions with a very uniform distribution of thickness and excellent step coverage.

Leakage, capacitance and reliability degradation of interconnects fabricated in low-k dielectric materials, particularly porous low-k dielectric material, due to penetration by a barrier metal and/or barrier metal precursor during damascene processing is prevented by depositing a conformal, heat stable dielectric sealant layer on sidewalls of the low-k dielectric material defining the damascene opening. Embodiments include forming a dual damascene opening in a porous, low-k organosilicate layer, the organosilicate having a pendant silanol functional group, depositing a siloxane polymer having a silylating functional group which bonds with the pendant silanol group to form the sealant layer, depositing a Ta and/or TaN barrier metal layer by CVD or ALD and filling the opening with Cu or a Cu alloy.

Fast-curing modified siloxane compositions comprise; (1) an alkoxy- or silanol-functional silicone intermediate, (2) at least one amine reactive ingredient selected from the group consisting of acetoacetate-functional ingredients, acrylate-functional ingredients, and mixtures thereof, (3) an epoxy-functional ingredient, (4) a curing agent selected from the group consisting of amines, aminosilanes, ketimines, aldimines and mixtures thereof, and (5) water. Other ingredients useful in forming fast-curing modified siloxane compositions of this invention include silanes, organometallic catalysts, solvents, pigments, fillers and modifying agents. The above-identified ingredients are combined and reacted to form a fully cured protective film comprising a cross-linked enamine polysiloxane and/or acrylate polysiloxane chemical structure in a reduced amount of time when compared to conventional epoxy siloxane compositions.

The invention generally is related to preventing or inhibiting microbial infections on live tissues or in relation to the use of medical articles. In one embodiment, the invention is directed to a method for forming an antimicrobial coating on live tissue or a medical article, such as, for example, a catheter. The method includes applying to a live tissue or a surface of a medical article an aqueous or non-aqueous composition that includes at least one silane of the general formula R¹_nSi(OR²)_4-n wherein, n is an interger of 1 or 2, R¹ generally is a lower alkyl group, a C₆-C₈ aryl group, or a functional group, such as vinyl, acrylic, amino, mercapto, or vinyl chloride functional group, and R² generally is a lower alkyl group. A partial condensate of a silanol of the formula R¹Si(OH)₃ also can be used. The composition includes one or more additional ingredients. The method also includes reacting and/or curing the silane, in the presence of the one or more ingredients, thereby forming the antimicrobial coating.

The present invention provides a curable polysiloxane composition which is excellent in light resistance (particularly ultraviolet resistance) and adhesion and has a sufficient heat resistance/hydrothermal resistance and film-forming property and which generates little foaming at curing and does not generate cracks, peeling, coloring, and foaming even when used for a long period of time. A curable polysiloxane composition which comprises a specific hydrosilyl group-containing polysiloxane compound, a specific polysiloxane compound comprising two or more silanol groups in one molecule, and a dehydrogenative condensation reaction catalyst.

The invention relates to silicon dioxide which bears partially or fully silylated polysilicic acid chains on its surface, wherein the sum of silanol groups of the silicon dioxide surface (SiOH) and grafted-on silylating agent radicals (SiRa) is greater than the number of silanol groups on the surface of untreated silicon dioxide, where a can be 1, 2 or 3 and R can be identical or different and are each a substituted or unsubstituted hydrocarbon radical.

The antifouling composition of the present invention includes a glassy matrix formed by crosslinking a mixture of a silanol-terminated silicone and an alkoxy-functionalized siloxane to provide an interpenetrating polymer network of glass and silicone and at least two materials capable of microphase separation, at least one of which is graftable to the glassy matrix. A primer composition is also provided and is a mixture of an epoxy, an alkoxy-functionalized siloxane and a silane capable of compatabilizing the epoxy and the alkoxy-functionalized siloxane; a glassy matrix formed by crosslinking a mixture of a silanol-terminated silicone and an alkoxy-functionalized siloxane.

The antifouling composition of the present invention includes a glassy matrix formed by crosslinking a mixture of a silanol-terminated silicone and an alkoxy functionalized siloxane to provide an interpenetrating polymer network of glass and silicone and at least two materials capable of microphase separation, at least one of which is graftable to the glassy matrix.

The invention discloses a preparation method for organosilicon, in particular relates to a preparation method of methyl-phenyl-vinyl silicone resin with high refractive index and high light transmission rate for packaging LED. The preparation method adopts the steps that the mixture of chlorosilane and toluene is added into the solvent which is composed of water and the toluene, the hydrolysis reaction is performed, then an amount of catalyzer is added into the silanol-toluene solution as hysrolysis product, the polycondensation reaction is performed, end capping reagent is finally added to perform the reaction, thus the objective product is obtained. The methyl-phenyl-vinyl silicone resin prepared by utilizing the method has the advantages of high refractive index, transparent clarification, radiation resistance, and high and low temperature resistance and weather resistance, thereby being especially suitable for the high modular basic glue in the packaging material for LED and expected to be applied in organosilicon material such as elastomeric sealant, pouring sealant, elastomoric adhesive and the like.

A method of manufacturing a semiconductor device having a low-k dielectric layer is provided. An embodiment comprises forming a dielectric layer on a substrate, wherein the layer comprises a pore generating material dispersed in an uncured matrix. A second step comprises forming pores in the uncured matrix by irradiating the layer with radiation having a first wavelength. After pore forming, a third step comprises cross-linking the dielectric by irradiating it at a second wavelength, the second being less than the first. In an embodiment, the irradiating wavelengths comprise ultra-violet radiation. Embodiments may further include repairing processing damage wherein the damage includes dangling bonds or silanol formation. The repairing includes annealing in a carbon-containing ambient such as C₂H₄, C₃H₆, or hexamethyldisilazane (HMDS).

Processes have been developed for the manufacture of polyhedral oligomeric silsesquioxanes (POSS), polysilsesquioxanes, polyhedral oligomeric silicates (POS), and siloxane molecules bearing reactive ring-strained cyclic olefins (e.g. norbornenyl, cyclopentenyl, etc. functionalities). The preferred manufacturing processes employ the silation of siloxides (Si—OA, where A=H, alkaline or alkaline earth metals) with silane reagents that contain at least one reactive ring-strained cyclic olefin functionality [e.g., X_3-ySi(CH₃)_y(CH₂)₂ where y=1-2 and X=OH, Cl, Br, I, alkoxide OR, acetate OOCR, peroxide OOR, amine NR₂, isocyanate NCO, and R]. Alternatively, similar products can be prepared through hydrosilation reactions between silanes containing at least one silicon-hydrogen bond (Si—H) with ring-strained cyclic olefin reagents [e.g., 5-vinyl, 2 norbornene CH₂═CH, cyclopentadiene]. The two processes can be effectively practiced using polymeric silsesquioxanes [RSiO_1.5]_∞ where ∞=1-1,000,000 or higher and which contain unreacted silanol or silane groups at chain terminus or branch points, on POSS nanostructures of formulas [(RSiO_1.5)_n]_Σ#, homoleptic, [(RSiO_1.5)_m(R′SiO_1.5)_n]_Σ#, heteroleptic, and {(RSiO_1.5)_m(RXSiO_1.0)_n}_Σ#, functionalized heteroleptic nanostructures, on silanes RSiX₃, linear, cyclic, oligomeric and polymeric siloxanes (polymeric formula RX₂Si—(OSiRX)_m—OSiRX₂ where m=0-1000, X=OH, Cl, Br, I, alkoxide OR, acetate OOCR, peroxide OOR, amine NR₂, isocyanate NCO, and R). Each of the processes result in new chemical species bearing one or more ring strained olefins that can undergo polymerization, grafting, or other desirable chemical reactions to form polymeric products. These polymeric systems are most desirably utilized in polymerizations for the modification of properties of thermoplastic or thermoset resin systems or for the preparation of polymers with utility in electronics, medical devices, sporting goods, and aerospace as coatings and structural components.

A silicone resin-containing emulsion composition is prepared by emulsion polymerizing a solution containing a water-insoluble silanol group-bearing silicone resin and a radical polymerizable vinyl monomer and substantially free of an organic solvent. The emulsion may further contain a film-forming assistant having a boiling point of at least 100 DEG C. and soluble or uniformly dispersible in water. The emulsion can be coated and cured into a film having mar resistance, weather resistance, and chemical resistance.