457 results about "Temperature resistance" patented technology

The invention relates to the technical field of aluminum alloy materials, in particular to a high-temperature-resistant and high-strength aluminum alloy material and a preparation method thereof. The problems that an existing aluminum alloy material is insufficient in mechanical property and poor in high temperature resistance are solved. A plurality of strengthening elements with synergistic effects, including copper, magnesium, scandium, zirconium, nickel, manganese and titanium, are introduced into an aluminum alloy matrix, meanwhile, multiple layers of graphene nanosheets are added for step-by-step smelting, and under argon protection, hexachloroethane refining and lithium salt complexing agent grain refinement are performed to prepare a smelted alloy; and by combining the multi-stage refined smelting, the staged heat treatment process, the three-stage aging treatment and the surface modification process, the microstructure is optimized, and meanwhile the surface performance is improved. According to the prepared aluminum alloy material, through multi-element cooperation and multi-process optimization, the mechanical property, the high temperature resistance and the surface oxidation resistance of aluminum alloy are remarkably improved, and the aluminum alloy material is suitable for the field of aerospace.

The invention provides a corrosion-resistant and high-temperature-resistant composite quartz crucible and a preparation method thereof. The quartz crucible sequentially comprises the following laminated layers in parts by weight from inside to outside: 50-100 parts of an inner layer, 200-400 parts of a transition layer, 150-250 parts of a reinforcing layer and 40-80 parts of an outer layer, the preparation method comprises the following steps: forming layer by layer: sequentially adding inner-layer slurry, transition-layer powder, a reinforcement-layer prefabricated member and outer-layer slurry into a mold for forming; gradient drying is conducted, specifically, the formed crucible blank is put into a drying box to be subjected to gradient drying; and step-by-step sintering: putting the dried crucible blank into a high-temperature sintering furnace, carrying out step-by-step sintering, and cooling and demolding to obtain a crucible product. A composite protection system is designed and constructed through four layers of functionally graded materials, the prepared composite quartz crucible has excellent high temperature resistance, corrosion resistance and structural stability and can be applied to large-size semiconductor single crystal furnaces, and the engineering advantage of the preparation process is remarkable.

The invention relates to the field of tension and pressure sensors, in particular to a tension and pressure sensor with a compensation function, which comprises an elastic body, a strain gauge, a compensation gauge and a wiring terminal, the strain gauge and the compensation gauge are respectively arranged on the surface of the elastic body, the strain gauge, the compensation gauge and the wiring terminal are electrically connected through a plurality of high-temperature-resistant cables to form a bridge circuit, at least the strain gauge and the compensation gauge are respectively limited in the first heat insulation layer and the protection layer, and the first heat insulation layer is located between the elastic body and the protection layer. At least a first heat insulation layer used for protection, heat insulation, pressure resistance and sealing is used for wrapping a strain gauge and a compensating gauge which are packaged by a polyimide film and can resist the high temperature of 260 DEG C, so that the actual temperature of the strain gauge and the compensating gauge has a remarkable temperature difference with the current environment temperature; the actual temperature of the strain gauge and the compensating gauge is obviously lower than the environment temperature, so that the strain gauge and the compensating gauge are respectively in an ideal temperature range, and the force measurement precision of the pull pressure sensor is ensured.

The invention relates to the technical field of coatings, in particular to a coating suitable for niobium-silicon alloy surface high-temperature protection and a preparation method of the coating. The coating comprises the following raw materials in parts by weight: 100-120 parts of deionized water, 60-80 parts of nickel-chromium-aluminum-yttrium alloy powder, 60-80 parts of enamel glaze, 50-60 parts of filler, 20-40 parts of a binder, 10-20 parts of nano titanium dioxide and 6-10 parts of an additive. According to the invention, during preparation of the coating, through addition of the filler, the negative thermal expansion performance of zirconium tungstate in the filler and volume shrinkage of zirconium tungstate in a high-temperature state, a buffer space is provided for thermal expansion of other materials in the coating, cracks of the coating due to thermal stress are avoided, and the high-temperature resistance of the coating is improved; kH560 enhances the interfacial compatibility of zirconium tungstate, avoids agglomeration of zirconium tungstate, and enables the zirconium tungstate to be more uniformly distributed in a coating system.

The invention aims to provide an ultrasonic transducer capable of continuously and stably working in a high-temperature and high-pressure extreme environment, and belongs to the technical field of ultrasonic nondestructive testing, the ultrasonic transducer comprises a packaging matching layer, a piezoelectric layer, an electrode layer and a backing layer, the packaging matching layer can have the effects of high temperature resistance, high pressure resistance and heat dissipation so as to match acoustic impedance, and the piezoelectric layer is arranged on the backing layer. Therefore, the acoustic performance of the transducer is improved. The piezoelectric layer can keep excellent piezoelectric performance in a high-temperature environment. The electrode layer and the back lining layer can achieve a good heat dissipation effect, and the service life is prolonged. The method has a wide application prospect in the field of ultrasonic nondestructive testing in an extreme environment.

The invention belongs to the technical field of electrical system loops, and relates to a system loop matching design method and device, computer equipment and a storage medium, and the method comprises the steps: obtaining load parameters in a system loop; calculating a load current according to the load parameter; according to a load current, selecting a fuse, defining a temperature resistance grade, and selecting a cable diameter; according to the selected fuse, the defined temperature resistance grade and the selected cable diameter, performing overcurrent matching checking, judging whether the overcurrent matching checking is passed or not, and if yes, performing temperature rise checking; judging whether the temperature rise checking is passed or not, and if so, checking the fuming time; and judging whether the verification of the fuming time is passed or not, and if so, carrying out electrical performance test confirmation. Multiple aspects such as electrical element performance, environmental factors and frequency factors are comprehensively considered, and the accuracy and reliability of the high-voltage system in the design process are ensured; failure risks can be effectively avoided, the safety and stability of the system are improved, and powerful support is provided for electric development of automobiles.

The invention discloses a temperature self-compensation Wheatstone bridge structure, and relates to the field of Wheatstone bridges, at least one group of sub-strain gauges which are separated from adjacent arms, are mutually compatible and are attached to the same area of the same elastic beam exist in a four-arm resistor of the Wheatstone bridge structure; the temperature resistance change trends of the compatible sub strain gauges tend to be the same; wherein each group of compatible two sub-strain gauges are closely attached to each other so that the two sub-strain gauges are located in the same area of the same elastic beam, so that the two closely attached sub-strain gauges generate homodromous temperature resistance variation, resistance temperature drift caused by local temperature difference of different arms is counteracted, and temperature self-compensation is realized. According to the invention, temperature compensation can be carried out on the local temperature difference of the force sensor, so that the measurement accuracy of the six-dimensional force sensor is improved.

The embodiment of the invention discloses a composite shielding plate and a preparation method thereof, and the composite shielding plate comprises a cladding which is provided with an accommodation space, and the accommodation space is in a vacuum state; the shielding material is arranged in the accommodating space; wherein the shielding material comprises a neutron moderation base material, and the cladding is made of a boron-containing metal material; or the shielding material comprises a neutron moderation base material and a neutron absorption base material, the cladding is made of a metal material, the neutron moderation base material comprises rare earth hydride, and the neutron absorption base material comprises boron-containing ceramic. The composite shielding plate provided by the embodiment of the invention not only comprises the neutron moderation base material which is high in hydrogen content and excellent in temperature resistance so as to effectively moderate fast neutrons, but also is combined with the neutron absorption base material containing boron atoms so as to efficiently absorb thermal neutrons, so that the complete neutron moderation-absorption integrated shielding performance of the composite shielding plate is realized; and stable shielding performance can be provided at the temperature of 300-1000 DEG C.

The invention discloses metal material surface treatment equipment and a surface treatment method. The surface treatment method comprises the following steps: performing surface pretreatment on a metal matrix to form an activated matrix with target surface roughness; metal ceramic powder is directionally deposited on the surface of the activated substrate through a spraying system, and a porous substrate layer with uniform micropore channels is generated; depositing a gradient functional coating on the porous substrate layer, and dynamically adjusting the mixing proportion and the spraying angle of spraying powder to sequentially form a bottom layer bonding interface, a transition strengthening layer and a surface layer protection layer; the gradient functional coating is subjected to laser remelting treatment, and a coating interface is scanned through a multi-beam laser array, so that metallurgical bonding is achieved between the surface protection layer and the transition strengthening layer, and between the transition strengthening layer and the bottom bonding interface; in a single treatment process, multiple protection performances of high temperature resistance, corrosion resistance and fatigue resistance are synergistically improved, so that the problem of interface stripping caused by thermal expansion mismatch of a protective coating and a matrix is solved.

The invention provides double-silver coated glass capable of being tempered in different places and a preparation method of the double-silver coated glass, and relates to the technical field of coated glass. The invention provides double-silver coated glass capable of being tempered in different places, which comprises a glass substrate, the bottom dielectric combination layer, the first Ag functional layer, the first metal sacrificial layer, the middle dielectric combination layer, the second metal sacrificial layer, the second Ag functional layer, the third metal sacrificial layer and the top dielectric protection combination layer are sequentially deposited on the surface of one side of the glass substrate from inside to outside. Each of the bottom dielectric combination layer and the middle dielectric combination layer is formed by laminating more than two dielectric layers; the top layer dielectric protection combination layer is formed by laminating more than two dielectric layers and a top layer protection layer, and the top layer protection layer is located at the outermost layer. The double-silver coated glass provided by the invention has excellent high-temperature resistance and supports remote tempering and laminated processing treatment, and the tempered product has excellent performance; and an excellent heat insulation effect is achieved.

The invention discloses a multi-layer heat insulation composite material based on a high-temperature-resistant modified alloy foil and a preparation method thereof, and belongs to the technical field of thermal protection materials.The preparation method comprises the following steps that (1) the alloy foil is subjected to high-temperature pre-oxidation treatment for a period of time in the air atmosphere, and the high-temperature-resistant modified alloy foil with good infrared radiation shielding performance is obtained; (2) alternately laminating the spacer material and the high-temperature-resistant modified alloy foil to obtain a multi-layer heat insulation composite material based on the high-temperature-resistant modified alloy foil; in the multi-layer heat insulation composite material based on the high-temperature-resistant modified alloy foil, the upper surface and the lower surface are both made of spacer materials, and a layer of high-temperature-resistant modified alloy foil reflecting screen is arranged between every two layers of spacer materials. The problem that a traditional reflecting screen system is insufficient in temperature resistance is solved, and the use environment of the multi-layer heat insulation composite material based on the metal reflecting screen is effectively widened.

The invention discloses a high-temperature-resistant titanium alloy and a preparation method thereof. The high-temperature-resistant titanium alloy comprises, by mass, 5.5%-6% of aluminum, 3.5%-4.2% of tin, 3.8%-4.5% of zirconium, 0.2%-0.4% of molybdenum, 0.8%-1.2% of tungsten, 0.2%-0.4% of niobium, 0.25%-0.4% of silicon, 0.4%-0.55% of manganese, 0.2%-0.5% of silicon carbide, 0.03%-0.06% of carbon and the balance titanium and inevitable impurities. The titanium alloy disclosed by the invention is excellent in room-temperature and high-temperature strength, relatively high in thermal stability, creep resistance and oxidation resistance and relatively high in high-temperature resistance, the room-temperature tensile strength is greater than 1100MPa, the high-temperature tensile strength at the temperature of 650 DEG C is greater than 650MPa, and the high-temperature tensile strength at the temperature of 750 DEG C is greater than 450MPa.

The invention discloses a release film for semiconductor packaging based on PET and ETFE compounding and a preparation method of the release film, and belongs to the technical field of film materials, the release film structurally comprises a PET base material layer, an adhesive layer and an ETFE layer which are sequentially arranged, and the adhesive layer is prepared from the following raw materials in parts by mass: 40-60 parts of fluorine-containing acrylate compound; 20 to 30 parts of epoxy modified organic silicon resin; 5 to 10 parts of nano silicon dioxide; 1 to 2 parts of a photoinitiator; wherein the surface of the contact side of the PET base material layer and the adhesive layer is subjected to plasma treatment or corona treatment, and the dyne value is larger than or equal to 50 mN / m; the surface of the side, making contact with the adhesive layer, of the ETFE layer is subjected to fluoridation treatment, and the surface roughness Ra is smaller than or equal to 1 micrometer. The release film has the advantages of controllable release force in a range of 0.1-5N / 25mm, good stability, temperature resistance of 175 DEG C, good organic solvent resistance, and wide application prospect in the field of semiconductor packaging.

The invention relates to a design and manufacturing method of a composite insulation electronic connecting wire in the field of intelligent manufacturing. The method comprises the steps of obtaining design parameters of the composite insulation connecting wire, extracting material formulas corresponding to wear resistance, high temperature resistance and flame retardance from a material database, determining initial material combinations of an inner layer, an outer layer and a middle layer in a three-layer structure, and outputting parameters of the material formulas; according to the material formula parameters, finite element analysis is adopted to simulate the flow characteristics of the melt in the die head runner, the runner geometric parameters are calculated, the runner curvature and the flow dividing angle are optimized, and a die head runner design scheme is obtained; and the extrusion speed and temperature distribution of the middle layer material are obtained from the optimized runner parameters, the rotating speed of an extruder and the temperature of a heating area are adjusted through a closed-loop control algorithm, and extrusion process parameters with the thickness uniformity of the middle layer reaching a preset threshold value are determined.

A TPE novel thermoplastic rubber flexible cable disclosed by the present invention comprises a tensile conductor, an insulation shielding sleeve and an outer sleeve, the outer sleeve is internally provided with a buffer filling layer and a tear-resistant belt, a high temperature resistant layer is arranged between the outer sleeve and the insulation shielding sleeve, and the high temperature resistant layer is composed of a polyimide nanofiber woven belt and an outer sleeve layer. The polyimide nanofiber woven belt and the outer sleeve layer successively sleeve the outer layer of the tensile conductor, so that instantaneous high temperature can be blocked, and the temperature resistance of the tensile conductor is enhanced. The hBN / TPE composite material is adopted, the temperature resistance limit is broken through, the cable can resist the temperature from 130 DEG C to 150 DEG C, the heat resistance limit of the cable is improved, and thermal aging is relieved; high tear resistance is achieved through dynamic crosslinking of SEBS / TPU, the tear strength is larger than or equal to 25 kN / m, and the mechanical performance is improved through cooperation of the tear-resistant layer of the bionic three-dimensional woven structure and the gradient buffer filling layer; and the bending life, the tensile strength and the temperature resistance of the cable are superior to those of a traditional TPE cable, and international standards such as IEC, UL and ISO are met.

The present application relates to a kind of high-temperature-resistant inductive angle sensor, belong to angle sensor technical field.The sensor includes: gradient composite ceramic substrate Al2O3-ZrO2-Al2O3, realize thermal expansion coefficient gradient matching by intermediate layer zirconium oxide doped yttrium oxide, reduce thermal stress cracking risk;Substrate surface is formed with micro-arc oxidation porous layer in turn titanium nitride nanocrystalline layer, improve surface bonding force;Atomic layer deposition process is used to prepare TiN or TiN / Ag composite film coil, improve temperature resistance;Through electron beam welding and transient liquid phase bonding composite process coil and circuit;Insulating encapsulation layer is made of boron nitride nanosheet and high-temperature-resistant resin, improve thermal conductivity and breakdown field strength.The present application is through gradient substrate design, thin film coil integration and composite process optimization, solves the thermal stress failure of traditional inductive sensor under high temperature, coil oxidation and insulation aging problem, suitable for angle measurement under extreme environment.

The composite material is mainly applied to protection and improvement of electronic devices in a high-temperature environment. (1) a polyimide film layer; because the polyimide film has excellent ductility, high and low temperature resistance, electrical insulation, cohesiveness, radiation resistance and medium resistance, the polyimide film can be used for a long time in a temperature range of-269 DEG C to 280 DEG C, and can reach a high temperature of 400 DEG C in a short time. The polyimide film has excellent high-voltage-resistant insulativity, and the highest withstand voltage of the film with the thickness of 0.1 mm is larger than or equal to 12 kv. The polyimide film can be bent and extended in various ways according to use scenes, and has no influence on material performance (2) the lowest density of the polyimide foam can reach 5.4 kg per cubic meter, and the density is far lower than that of other common materials. The high-toughness high-temperature-resistant steel not only can bear the long-term working temperature as high as 350 DEG C, but also can keep excellent toughness in an environment as low as-269 DEG C. Zero VOC and flame retardance are achieved, and good environment friendliness and chemical stability are achieved. After the two materials are compounded and combined, better heat insulation and temperature resistance can be achieved in the using process, meanwhile, due to the low density of the polyimide foam, better shaping can be achieved after the insulating paint is combined and cured, and better heat conduction and heat dissipation can be achieved on the surface.

The invention discloses a high and low temperature resistant organosilicon gel and a preparation method thereof, the organosilicon gel comprises a component A and a component B, the component A is prepared by mixing 100 parts of vinyl-terminated silicone oil and 0.05-0.2 part of a platinum catalyst, and the component B is prepared by mixing 50-70 parts of vinyl-terminated silicone oil, 20-40 parts of a chain extender, 5-15 parts of a cross-linking agent, 0.05-0.2 part of an inhibitor and 0.05-0.3 part of a heat-resistant additive. The organic silicon gel disclosed by the invention is low in viscosity, good in fluidity, colorless and transparent, good in flexibility and low stress after being cured, good in adhesion effect on various base materials, excellent in electric insulativity and high and low temperature resistance, capable of tolerating a high temperature of 240 DEG C for a long time, and free of chain segment crystallization behavior at a low temperature of-77 DEG C. The organic silicon gel is used for packaging protection of various different substrates and electronic components, the reliability and the service life of the components, high-power semiconductor modules and the like at high temperature can be remarkably improved, and the reliability of electronic equipment is guaranteed.

The application relates to a 3D printing-based abnormal cooling channel heat transfer evaluation method of a regenerative cooling engine, which comprises the following steps: determining an overheating area of a thrust chamber, obtaining node overheating temperature of an overheating position; carrying out heat transfer calculation of a normal cooling channel of the thrust chamber and obtaining a gas side theoretical normal wall temperature of the overheating position; assuming an initial coolant flow value of the overheating position, carrying out abnormal cooling channel heat transfer calculation to obtain a theoretical node overheating temperature; judging whether the theoretical node overheating temperature and the node overheating temperature meet a condition; if yes, taking the initial coolant flow value as a final coolant flow value; obtaining a coolant flow variation ratio alpha based on the final coolant flow value, obtaining a rated working condition flow of the abnormal cooling channel, carrying out abnormal cooling channel heat transfer calculation and evaluation, and outputting a rated abnormal cooling channel gas side wall temperature; and if the rated abnormal cooling channel gas side wall temperature is lower than a material temperature resistance limit of the thrust chamber, the rated working condition of a hot test is safe, and the test can be carried out.

The invention relates to the field of metal surface treatment, in particular to a surface treatment method of a copper-aluminum composite foil and the surface-treated copper-aluminum composite foil. According to the surface treatment method for the copper-aluminum composite foil, the production process is continuous and efficient, and belongs to a new process route; technological parameters of each functional tank belong to a new technological formula; according to the continuous production electroplating line for degreasing cleaning, copper plating thickening and copper plating surface coarsening and passivation of the copper-aluminum composite foil in the electroplating process, the surface binding force of the copper-aluminum composite foil, the appearance of a copper layer and the performance of folding resistance, peel strength resistance, high temperature resistance and normal-temperature storage can be improved, and the requirement of downstream customers for higher performance of the copper-aluminum composite foil is met. Tests show that the copper-aluminum composite foil subjected to surface treatment through the surface treatment method has the advantages that the surface dyne value is larger than or equal to 40, the good binding force is achieved, the peel strength is larger than or equal to 0.8 N / mm, and the high-temperature-resistant and oxidation-resistant performance that the copper-aluminum composite foil can be stored at the normal temperature for more than or equal to 6 months and can resist the high temperature of 180 DEG C for 1 hour is achieved.

The utility model belongs to the field of single crystal furnace manufacturing, particularly relates to a high-strength cold forming composite end socket for a single crystal furnace, and aims to solve the problems that the conventional end socket for the single crystal furnace is difficult to simultaneously meet the requirements of high temperature resistance, high pressure resistance and mechanical strength, a furnace body and the end socket are inconvenient to align when the end socket is mounted, and the cost is high. In order to solve the problem that the welding position of the end socket is not accurate due to the fact that the welding position of the end socket is not accurate, the utility model provides the following scheme that the end socket comprises an end socket body, a plurality of connecting lugs which are uniformly distributed are welded on the circumference of the end socket body, and chamfers are arranged on the sides, close to the end socket body, of the connecting lugs. The sealing head body is made of various materials and used for installing and positioning the sealing head body, so that the sealing head body is more convenient and faster to install, the sealing head body not only has excellent high-temperature resistance and corrosion resistance, but also has the characteristics of high strength, high toughness, wear resistance and oxidation resistance, the service life of the sealing head is greatly prolonged, and the safety of the sealing head is greatly improved.

The invention relates to a high-temperature-resistant Si3N4-based wave-absorbing material based on FSS and a preparation method thereof. The high-temperature-resistant Si3N4-based wave-absorbing material based on the FSS comprises a frequency selective surface layer, a porous silicon nitride dielectric layer and a metal substrate which are sequentially stacked from top to bottom, the frequency selective surface layer is composed of M * N FSS units which are periodically arranged in a two-dimensional plane and are in a Jerusalem cross pattern, M is larger than or equal to 8, and N is larger than or equal to 8. The high-temperature-resistant Si3N4-based wave-absorbing material based on the FSS provided by the invention can realize effective absorption of C-Ku wave band electromagnetic waves, has the characteristics of thin thickness, low reflectivity, high strength, high temperature resistance, light weight and wide frequency band, and can realize the purpose that the high-temperature-resistant Si3N4-based wave-absorbing material can be used for absorbing high-temperature-resistant Si3N4-based wave-absorbing material in a complex and severe physical environment with relatively small physical burden. And efficient, reliable and lasting absorption of broadband electromagnetic waves is realized.

This invention relates to a heat-resistant, multifunctional bacterial strain and its application, belonging to the field of microbial technology and aquatic ecological restoration. This invention solves the technical problems of low high-temperature activity and limited functionality of existing bacterial strains. The heat-resistant, multifunctional bacterial strain of this invention is *Bacillus zanthoxyli* MH-168, with accession number CGMCC No. 37674. The application of this strain in the treatment of eutrophication in water bodies is also discussed. The MH-168 strain was obtained by screening from sediment in urban landscape water bodies. This strain exhibits vigorous growth at 40-50℃ and weak growth at 55℃, while also possessing siderophore production, protein degradation, organophosphate degradation, and salt tolerance. It can stably perform nutrient degradation and iron chelation functions at high temperatures, solving the technical problems of low high-temperature activity and limited functionality of existing bacterial agents.

The application provides a base glass, a preparation method of the base glass, a glass powder, a granulation powder, a glass insulator and a temperature sensor glass sealing workpiece. 3 The base glass comprises BaO 50-80 parts, B2O3 5-30 parts, SrO 1-10 parts, SiO2 1-25 parts, Al2O3 1-15 parts, CaF2 0.1-10 parts, TiO2 0.1-5 parts, rare earth oxide 0.7-3.1 parts and Nb2O5 0.1-3 parts; the rare earth oxide comprises La2O3 and Y2O3. The glass raw material of the application is lead-free, has high strength and air tightness, the lead-free microcrystalline glass system meets the insulation requirement of high-temperature sensors under long-time high-temperature environment, is resistant to repeated temperature impact and will not crack, the electric property does not attenuate, the problem of high-temperature resistance of metal sealing parts is solved, and the performance requirements of high-temperature resistance and high insulation are met.

The application discloses Cu-Si3N4-FeCoCrNiMn nanolayer composite material and a preparation method thereof, characterized by comprising a plurality of groups of sequentially compounded and stacked layer composite units, each group of layer composite units being sequentially compounded and stacked by a Cu film, a Si3N4 film and a FeCoCrNiMn film, and the thickness of the Cu film is 30-100 nm, the thickness of the Si3N4 film is 5-15 nm, and the thickness of the FeCoCrNiMn film is 20-60 nm; the Cu-Si3N4-FeCoCrNiMn nanolayer composite material combines the high thermal conductivity and electrical conductivity of Cu, the high hardness and high-temperature resistance of Si3N4 ceramic, and the excellent mechanical properties of FeCoCrNiMn high-entropy alloy, and realizes multi-scale synergistic reinforcement. The Cu layer serves as a plastic buffer phase, passivates crack propagation and relieves interface stress concentration, the Si3N4 layer can effectively pin dislocation motion and inhibit high-temperature grain boundary sliding, and the high-temperature stability and wear resistance of the material are significantly improved. Moreover, the nanolayer structure can control the average free path of dislocation, fully utilizes the thickness size effect, and improves the strength while maintaining good toughness.

The utility model relates to the technical field of cables, and discloses a high-strength copper-core silver-plated special high-temperature cable, which comprises a conductor and further comprises a conductor shielding layer arranged on the outer side of the conductor, an insulating layer arranged on the outer side of the conductor shielding layer, and an insulating shielding layer arranged on the outer side of the insulating layer. The inner protection layer is arranged on the outer side of the insulation shielding layer, and an outer protection layer is arranged on the outer side of the inner protection layer; according to the utility model, fluoroplastic (such as PTFE and FEP) is used as the insulating layer, the long-term tolerable temperature can reach more than 200 DEG C, the chemical corrosion resistance is strong, the high-temperature resistance of the cable is improved, the high-temperature-resistant metal braid layer (such as tinned copper) is used as the outer layer to reinforce mechanical protection, the flexible silica gel is used as the inner layer to improve the bending resistance, and the service life of the cable is prolonged. Corrugated grooves are designed in the inner wall of the protective sleeve, so that the heat dissipation area can be increased; the heat conduction filling material boron nitride filling material is embedded in the protection sleeve so that internal heat conduction efficiency can be enhanced and heat radiation efficiency in the cable can be enhanced.

The application discloses a novel martensitic stainless steel plate for key equipment of nuclear power unit, and relates to the material and metallurgical technology field, which comprises the following components in percentage by mass: C: 0.07%-0.15%, Mn: 0.6%-1.50%, Ni: 0.5%-1.5%, Cr: 12%-19%, Mo: 1.00%-2.00%, Cu: 0.01%-0.2%, TiO2: 0.0001%-0.0010%, V: 0.03%-0.30%, Ti: 0.01%-0.20%, Ca: 0.0001%-0.0011%, and the balance is Fe and inevitable impurities. The stainless steel plate produced by combining smelting, casting blank heating, rolling and heat treatment with reasonable component design has the advantages of large thickness, high strength, low hardness, high-temperature resistance and low-temperature resistance, and meets the high-end use requirements.

This utility model relates to the field of circuit board performance testing technology, and proposes a circuit board chip temperature resistance testing device, including: a frame, an isolation shell located in the center, and a base located below the frame. The inner wall of the isolation shell of the frame is fixedly connected to a test shell. A fan draws external gas into the heating shell through an air supply pipe, guides the gas flow through a guide plate, and heats the gas inside the heating shell through a heating wire. Then, the hot gas enters from the top of the test shell through a second delivery pipe, and simultaneously enters the chamber where the circuit board chip is placed in the test shell through an airflow port on the surface of the partition. In addition, a semiconductor cooler lowers the temperature of the gas in the cooling shell, and then the low-temperature gas enters from the top of the test shell through a first delivery pipe, and simultaneously enters the chamber where the circuit board chip is placed in the test shell through an airflow port on the surface of the partition. In summary, this application provides a method for testing the performance of circuit board chips in both high-temperature and low-temperature environments.

The invention provides a device for assisting packaging and column planting of a ceramic column grid array and a manufacturing method of the device, and relates to the field of microelectronic packaging manufacturing and assembling. The problems that according to an existing column planting device, a resin piece is prone to deformation at high temperature, a metal piece and ceramic thermal expansion are not matched, stress warping is prone to being generated, welding column positioning precision and perpendicularity are insufficient, multi-specification chips are poor in universality, and high-temperature stability and micron-level positioning are difficult to consider at the same time are solved. According to the invention, the rigid-flexible coupling structure of the AlSi10Mg aluminum alloy shell and the resin plug board with the temperature resistance of not less than 210 DEG C is adopted, and the double-layer boss and the through hole array are matched, so that the precise positioning of the welding column is realized, chips of multiple specifications are adapted, and high-temperature stability and micron-sized alignment are both considered.

The invention provides heat-conducting silicone grease for spaceflight electronic equipment and a preparation method of the heat-conducting silicone grease. The heat-conducting silicone grease is prepared from the following components in parts by weight: 3-8 parts of ethyl silicone oil with the viscosity of 50-1000 mPa.s, 3-8 parts of phenyl silicone oil with the viscosity of 50-1000 mPa.s, 1-5 parts of modified silicone oil, 60-80 parts of zinc oxide with the particle size of 2-7 microns and 15-25 parts of zinc oxide with the particle size of 0.1-1 micron. The invention aims to provide the heat-conducting silicone grease which has high heat-conducting property, good low-temperature resistance and cosmic ray resistance and is stable and reliable, so that the heat dissipation requirement of spaceflight electronic equipment in an extreme space environment is met, and the effective thermal design of the prepared heat-conducting silicone grease can greatly prolong the service life of a spacecraft and improve the working reliability of the spacecraft.