597 results about "INSULATION FAILURE" patented technology

A stacked electronic component comprises a first electronic component adhered on a substrate via a first adhesive layer, and a second electronic component adhered by using a second adhesive layer thereon. The second adhesive layer has a two-layer structure formed by a same material and having different modulus of elasticity. The second adhesive layer of the two-layer structure has a first layer disposed at the first electronic component side and a second layer disposed at the second electronic component side. The first layer softens or melts at an adhesive temperature. The second layer maintains a layered shape at the adhesive temperature. According to the stacked electronic component, occurrences of an insulation failure and a short circuiting are prevented, and in addition, a peeling failure between the electronic components, an increase of a manufacturing cost, and so on, can be suppressed.

Material is removed from a body of material, e.g. to create a bore hole, by plasma channel drilling. High voltage, high energy, rapid rise time electrical pulses are delivered many times per second to an electrode assembly in contact with the material body to generate therein elongate plasma channels which expand rapidly following electrical breakdown of the material causing the material to fracture and fragment.

Electrodynamic on funnels confine, guide, or focus ions in gases using the Dehmelt potential of oscillatory electric field. New funnel designs operating at or close to atmospheric gas pressure are described. Effective on focusing at such pressures is enabled by fields of extreme amplitude and frequency, allowed in microscopic gaps that have much higher electrical breakdown thresholds in any gas than the macroscopic gaps of present funnels. The new microscopic-gap funnels are useful for interfacing atmospheric-pressure ionization sources to mass spectrometry (MS) and on mobility separation (IMS) stages including differential IMS or FAIMS, as well as IMS and MS stages in various configurations. In particular, “wedge” funnels comprising two planar surfaces positioned at an angle and wedge funnel traps derived therefrom can compress on beams in one dimension, producing narrow belt-shaped beams and laterally elongated cuboid packets. This beam profile reduces the ion density and thus space-charge effects, mitigating the adverse impact thereof on the resolving power, measurement accuracy, and dynamic range of MS and IMS analyzers, while a greater overlap with coplanar light or particle beams can benefit spectroscopic methods.

Devices and systems comprising high current/high voltage GaN semiconductor devices are disclosed. A GaN die, comprising a lateral GaN transistor, is sandwiched between an overlying header and an underlying composite thermal dielectric layer. Fabrication comprises providing a conventional GaN device structure fabricated on a low cost silicon substrate (GaN-on-Si die), mechanically and electrically attaching source, drain and gate contact pads of the GaN-on-Si die to corresponding contact areas of conductive tracks of the header, then entirely removing the silicon substrate. The exposed substrate-surface of the epi-layer stack is coated with the composite dielectric thermal layer. Preferably, the header comprises a ceramic dielectric support layer having a CTE matched to the GaN epi-layer stack. The thermal dielectric layer comprises a high dielectric strength thermoplastic polymer and a dielectric filler having a high thermal conductivity. This structure offers improved electrical breakdown resistance and effective thermal dissipation compared to conventional GaN-on-Si device structures.

A stacked electronic part comprises a first electronic part which is adhered onto a circuit board via a first adhesive layer and a second electronic part which is adhered onto the first electronic part via a second adhesive layer. An insulating resin having a filling viscosity of 1 Pa·s or more and less than 1000 Pa·s or a photo-setting insulating resin is filled in the spaces below first bonding wires which are connected to the first electronic part. Thus, the occurrence of bubbles resulting from the resin non-filled portions below the wires can be prevented. Besides, the first electronic part and the second electronic part are adhered via an insulating resin layer having an adhering viscosity of 1 kPa·s or more and 100 kPa·s or less. Therefore, the occurrence of an insulation failure, a short circuit or the like resulting from a contact between the bonding wires of the lower electronic part and the upper electronic part can be prevented.

A flexible wiring board is obtained as follows. A copper foil pattern is formed on the both surfaces of a base polymer film made of polyimide, etc. The copper foil pattern of the both sides, except for an end portion of the copper foil pattern of one surface, is covered entirely with an insulative protecting film made of polyimide, etc., for protecting the copper foil pattern, and the insulative protecting film and the copper foil pattern are bonded with each other by an insulative protecting film adhesive layer. On the exposed end portion of the copper foil pattern on one surface is formed a plated layer to be connected to an electrical component. The thickness of the insulative protecting film which is bonded with the surface on which the plated layer is formed is set to be thinner than the base polymer film. As a result, it is ensured that insulation failure of the insulative protecting film is prevented, and wire breakage of wiring when bent can easily be prevented.

The invention discloses a halogen-free fire-retardant high heat conducting insulating resin composition and a heat dissipation metal-base copper clad plate (CCL). The composition comprises the following components in parts by weight: 10-45 parts of halogen-free epoxy resin, 0-15 parts of thermoplastic resin and/or synthetic rubber, 0.1-5 parts of curing agent, 0.02-1 parts of accelerator, 0.5-1 parts of antioxidant and 25-80 parts of heat conducting filler. The halogen-free fire-retardant high heat conducting insulating resin composition of the invention adopts high heat conducting filler, and the cured composition shows good thermal conductivity, electric insulativity and welding heat resistance as well as high adhesive force. The invention also discloses a heat dissipation metal-base CCL prepared by using the above halogen-free fire-retardant high heat conducting insulating resin composition, which has high thermal conductivity and high peel strength, does not have the problems of peel-off and deterioration even being subjected to thermal cycle of quick heating and quick cooling, and also has high electrical breakdown resistance, good heat resistance and soldering resistance and the like, and the flame retardant rating of the heat dissipation metal-base CCL reaches UL-94V0.

The invention discloses a device and a method for detecting a turn-to-turn insulation failure of a rotor winding of a generator. The detection device comprises a signal generator and a digital oscilloscope which are connected to two ends of the rotor winding respectively. Excitation signals are applied to one end of the rotor winding by using the signal generator, and response signals are outputted at the other end of the rotor winding. The response signals are received and displayed by using the digital oscilloscope, and the excitation signals and the response signals are recorded and stored by using the digital oscilloscope at the same time. Determining whether a rotor winding insulation failure exists by comparing the response signals outputted from the two ends of the rotor winding which are recorded and stored by using the digital oscilloscope. According to the invention, generator rotor insulation failure detection can be performed at project site, problems in the rotor turn-to-turn short circuit failure detection in generator maintenance at the project site are solved, and the device and the method can also be applied to rotor winding insulation detection in motor manufacturing phase at the same time.

This invention provides a photovoltaic module for preventing insulation failure between an outer frame and connection leads. The photovoltaic module comprises: a photovoltaic submodule including a plurality of solar cells interposed between two light-transmitting substrates through the intermediary of an encapsulant and the connection leads extending from an edge between light-transmitting substrates and outputting generated electric currents; a terminal box attached near an edge of the photovoltaic submodule and housing connected parts between the connection leads and cables for outputting the electric currents to the outside; and an outer frame fitting over peripheral edges of the photovoltaic submodule. A side, of the light-receiving side light-transmitting substrate, from which the connection leads are pulled out, is made large so as to extend outward further than the other light-transmitting substrate. The connection leads are led out from the edge between the two light-transmitting substrates to be guided into the terminal box.

A gas-insulated apparatus is equipped inside with multiple sensors for sensing a partial discharge signal caused by a foreign substance, and a frequency analyzing section for analyzing the frequency of the sensed partial discharge signal. A defect type judging section estimates the defect type of the foreign substance from the signal obtained through the frequency analysis or from the voltage phase distribution of partial discharge synchronized with the frequency of the voltage applied to the gas-insulated apparatus, and a location determining section estimates the defect location and signal intensity from the multiple partial discharge signals. A defect size calculating section estimates the defect size for each defect type from the signal intensity and field distribution at the defect location. Dielectric breakdown risk evaluation is performed based on the defect size and type, and the insulation failure risk is diagnosed from the partial discharge.

Methods and devices are provided for avalanche breakdown in a thin-film solar cell. In one embodiment, a method of breakdown protection assembly comprises providing a single reel of material which is pre-cut in a pattern so that a first portion of the material can be overlapped to a second portion of material to sandwich a breakdown protection device therebetween

Proposed is a method for providing uniform distribution of plasma density in a CCP plasma processing apparatus. According to the method the through gas holes of the showerhead of used in the plasma processing chamber of the apparatus are provided with conical nozzles formed on the side of the gas holes that face the gas reservoir of the cooler plate. The cone angle θ of the nozzles decreases in the direction from the peripheral portion to the central area of the showerhead in the range from 120° to 0°. Since the conical nozzles increase the gas gap between the showerhead and the cooler plate, more favorable conditions are created for electric breakdown. In order to protect the surfaces of the conical nozzles and gas holes from deterioration by hollow cathode discharge, these surface are coated by a protective coating resistant to electrical breakdown and chemical corrosion.

An object is to detect an insulation failure of a DC circuit with high sensitivity and in safety by means of a simple detection circuit. An insulation resistance measurement device of this invention is a device for measuring an insulation resistance to ground of a DC source circuit and is provided with connection terminals for connections to a positive electrode and a negative electrode of a series power supply, switch elements connected between the connection terminals and the ground potential and configured to switch connections between the connection terminals and the ground potential, resistive elements connected through the switch elements between the connection terminals, respectively, and the ground potential, and a voltage detection unit for detecting voltage drops in the resistive elements.

In an electric charging system, a charging cable of an electric charger is connected to an electric vehicle, and a supply voltage at the electric charger is temporarily raised and dropped. A receiving voltage at the electric vehicle rises and falls in conjunction with to the supply voltage. Accordingly, a feature point is assigned to each of electric charger data obtained by applying a filtering process to the supply voltage and vehicle data obtained by applying a filtering process to the receiving voltage. Then a time lag between the electric charger data and the vehicle data due to filtering processing is calculated based on the feature points. Upon determining an insulation failure and the like between the electric charger and the electric vehicle, the electric charger data and the vehicle data are synchronized based on the time lag and then compared.

Proposed is a showerhead-cooler system of a semiconductor-processing chamber with uniform distribution of plasma density. The showerhead has a plurality of through gas holes that are coaxial with respective channels of the gas-feeding cooler plate. On the gas inlet side, the though passages of the showerhead are provided with unequal conical nozzles characterized by a central angle that decreases from the peripheral part of the showerhead to the showerhead center. Such design provides uniformity of plasma density. Furthermore, in order to protect the walls of the nozzle and the walls of the gas holes from erosion that may be caused by the hollow-cathode phenomenon, these areas are coated with a thin protective coating that is resistant to electrical breakdown and chemical corrosion.

A brushless DC motor minimizes a chance of dislocation of or damage to an insulator used in the brushless DC motor. Slant portions are provided at end portions of the insulator; therefore, even if a nozzle of a machine for installing a winding should hit the insulator while moving between teeth, the insulator moves in a direction for coming in close contact with a slot aperture, i.e., in a direction substantially at right angles to a direction in which the nozzle moves. This arrangement prevents the insulator from moving by being pushed by the nozzle, making it possible to minimize a chance of occurrence of an insulation failure caused by a damaged or dislocated insulator.

The invention discloses an online monitoring system for the insulation state of a substation DC system. The system comprises multiple sets of DC leakage current detection devices and a signal merger and diagnosis unit. The DC leakage current detection devices are respectively used for detecting DC leakage current of all branches; each set of DC leakage current detection devices is provided with at least two DC leakage current detection devices which are used for detecting DC leakage current at different positions on the same branch respectively. The signal merger and diagnosis unit is used for detecting the voltage to earth of positive and negative buses and further wirelessly connected with all the DC leakage current detection devices to receive DC leakage current data transmitted by all the DC leakage current detection devices. The signal merger and diagnosis unit judges whether an insulation failure occurs or not and determines the position where the insulation failure occurs according to the detected voltage to earth of the positive and negative buses and the received DC leakage current data. The invention further discloses an online diagnosis method for the insulation state of the substation DC system.

Scientific and medical system circuitry for diagnosis of implantable cardioverter defibrillator (ICD) lead conductor anomalies, in particular conductor migration and externalization within an ICD implantable cardiac lead. The system determines an “imaginary” component of the high frequency transmission line impedance having certain spectral changes that correspond to radially outward movements or local externalization of a conductor within a lead body allowing for the detection of conductor migration and small insulation failures.

An electronic drive system applies a drive signal to an electrostatically actuated device such that a resulting electric field has a constant force. In various exemplary embodiments, the electronic drive system applies a drive signal to an electrostatically actuated fluid ejector that has a piston and a faceplate including a nozzle hole. A dielectric fluid to be ejected is supplied between the piston and the faceplate. The drive signal is applied to one of the piston and the faceplate. The drive signal generates an electric field across the fluid between the piston and the faceplate. The electric field causes the piston to be electrostatically attracted towards the faceplate so that a jet or drop of fluid is ejected through the nozzle hole of the faceplate. According to exemplary embodiments, the drive signal is from a constant current source or is reduced over the course of its lifetime. Further, according to various exemplary embodiments, the drive signal is of a suitable high frequency to reduce the potential of electrochemical reactions or electrical breakdown, or both. The drive signal may also be a bi-polar drive signal to reduce the possibility of electrochemical reactions.

A detection device includes a light-receiving element array and a read-out integrated circuit (CMOS), bumps of the light-receiving element array being bonded to bumps of the read-out integrated circuit, and at least one of the light-receiving element array and the read-out integrated circuit having a concaved surface which faces the other. The bonded bumps positioned in a region near the periphery of the arrangement region of the bonded bumps have a larger diameter and a lower height than those of the bumps positioned in a central region. Therefore, it is possible to prevent bonding failure and insulation failure in the bumps from occurring due to a difference in coefficient of thermal expansion, while securing a small size and low cost.