1668 results about "Wire breakage" patented technology

There are provided a conductive pattern material and a pattern-forming method by which a fine pattern having a high resolution and no wire breakage is obtained. The conductive pattern material is such that on a support surface a pattern-forming layer is formed which allows the formation of a hydrophilic/hydrophobic region directly bonded to the support surface due to energy imparted. Energy is imparted to the pattern-forming material in an imagewise manner to form the conductive material layer.

A flexible substrate inserted in a hinge electrically connects circuit substrates, which are housed in a first casing and a second casing, respectively, to each other. The substrate has a power supply line and signal lines which are formed from a wiring conductor. Slits are opened in border portions of the power supply line in a cranked portion. The slits opened in the border portions of the power supply line make the rigidity of the border portions lower than in prior art. This means that a base is prevented from squashing the wiring conductor (power supply line) when the substrate is bent and that stress concentration on the border portions can accordingly be avoided. As a result, cracks in the border portions are prevented and the power supply line (wiring conductor) is protected against wire breakage.

A flexible wiring board is obtained as follows. A copper foil pattern is formed on the both surfaces of a base polymer film made of polyimide, etc. The copper foil pattern of the both sides, except for an end portion of the copper foil pattern of one surface, is covered entirely with an insulative protecting film made of polyimide, etc., for protecting the copper foil pattern, and the insulative protecting film and the copper foil pattern are bonded with each other by an insulative protecting film adhesive layer. On the exposed end portion of the copper foil pattern on one surface is formed a plated layer to be connected to an electrical component. The thickness of the insulative protecting film which is bonded with the surface on which the plated layer is formed is set to be thinner than the base polymer film. As a result, it is ensured that insulation failure of the insulative protecting film is prevented, and wire breakage of wiring when bent can easily be prevented.

There is provided a layout structure of a semiconductor integrated circuit capable of preventing the thinning of a metal wiring line close to a cell boundary and wire breakage therein without involving increases in the amount of data for OPC correction and OPC process time. In a region interposed between a power supply line and a ground line each placed to extend in a first direction, first and second cells each having a transistor and an intra-cell line each for implementing a circuit function are placed to be adjacent to each other in the first direction. In a boundary portion between the first and second cells, a metal wiring line extending in a second direction orthogonal to the first direction is placed so as not to short-circuit the power supply line and the ground line.

The invention belongs to the metallurgy field and relates to a production process of a steel wire rod, particularly the steel wire rod for an annealing-free solder wire and a production process of the steel wire rod, wherein the steel wire rod comprises elements in weight percentage as follows: 0.07-0.1% of C, 1.25-1.4% of Mn, 0.4-0.6% of Si, less than or equal to 0.02% of P, less than or equal to 0.02% of S, 0.2-0.55% of Mo, 0.5-1.0% of Ni, less than or equal to 0.2% of Cu, less than or equal to 0.2% of Ti and less than or equal to 0.1% of Al with the balance of Fe. The process comprises steps of detecting a blank, heating the steel blank, descaling by high-pressure water, roughly and intermediately rolling, pre-finishing rolling, cooling in a first section by water, finishing rolling bya unit, cooling in a second section by water, diameter reducing and sizing rolling, cooling in a third section by water, spinning, cooling by wind, finishing and delivering to a warehouse. The methodof the invention employs a rolling-controlled and cooling-controlled process to execute process control of the steel wire rod of the solder wire to obtain an F+P tissue appropriate to draw, and has advantages as follows: good comprehensive mechanical property is realized, a solder wire factory can avoid annealing and perform multi-pass drawing without wire breakage, the production efficiency is greatly increased and the production cost is reduced at the same time.

A magnetic head actuator provided with a finely movable tracking device having a piezoelectric element is provided for easy wiring to the piezoelectric element and reducing problems such as wire breakage and continuity defects. In the magnetic head actuator, a portion of an FPC board resin base is removed to expose a portion of the feeding line that extends onto a voltage impressing electrode. An electrical and mechanical connection is made between the electrode and the exposed portion of the feeding line by ultrasonic bonding, Au ball bonding, or stud bumping.

The invention discloses a hot rolled wire rod for high-strength cut steel wires and a production method of the hot rolled wire rod. The production method of the hot rolled wire rod comprises the work procedures of converter smelting, LF refining, continuous casting and steel rolling. The hot rolled wire rod comprises, by weight percentage, 0.79-0.85% of C, 0.15-0.30% of Si, 0.40-0.60% of Mn, smaller than or equal to 0.015% of P, smaller than or equal to 0.010% of S, smaller than or equal to 0.05% of Cr, smaller than or equal to 0.05% of Ni, smaller than or equal to 0.05% of Cu, smaller than or equal to 0.0015% of Alt, smaller than or equal to 0.0008% of Als, smaller than or equal to 0.0010% of Ti, smaller than or equal to 0.0020% of T.O, smaller than or equal to 0.0030% of N, and the balance Fe and inevitable impurity elements. The center segregation of the wire rod obtained through the method is smaller than or equal to the level 2, the grain size is smaller than the level 7, the sorbitizing rate is larger than or equal to 85%, the tensile strength ranges from 1050 MPa to 1250 MPa, the reduction of area is larger than or equal to 38%, and good drawing machining performance is achieved; inclusion has good deformation performance or fragility, the length-width ratio average value of the inclusion is larger than or equal to 6, and the maximum inclusion size is smaller than or equal to 15 microns; and the wire rod is used for a user to produce the 0.11-0.12 mm cut steel wires, and reaches the level that wire breakage is avoided when the length is 10000 km or above.

The invention relates to a cutting method of crystalline silicon blocks, a crystalline silicon block to be cut is placed on a section cutter platform, a plurality of line-shaped saws are horizontally distributed and spray mortar so as to cut the crystalline silicon block; and the method is characterized in that: the two end surfaces of the crystalline silicon block are polished to be level before being cut, and the line-shaped saws are parallelly distributed at equal intervals, with the width of shorter than the length of the crystalline silicon block to be cut. The technical proposal improves the 'climbing' phenomenon in the cutting process of the crystalline silicon block, and well solves the problems of wire-break and line-skipping caused by that silicon fragments generated in the cutting process of the crystalline silicon block drop to the line-shaped saw net or an idler pulley.

The invention discloses an electroplated diamond wire saw sand-applying device. The device sequentially comprises the components, from top to bottom: a vertical tubular sand-applying sub tank, a liquid-returning box, and a plating solution master tank. A guide wheel is fixed in the liquid-returning box. A core wire is sequentially wound on a wire-feeding conductive wheel on the bottom of the vertical tubular sand-applying sub tank and the guide wheel. The core wire then penetrates the vertical tubular sand-applying sub tank, and is finally wound on a wire-discharging conductive wheel on the top of the vertical tubular sand-applying sub tank. The wire-feeding conductive wheel and the wire-discharging conductive wheel are connected in parallel, and are then connected to the negative electrode of an electroplating power supply. Metal anodes are arranged around the core wire in the vertical tubular sand-applying sub tank. The metal anodes are connected with positive electrodes of the electroplating power supply. Through a water pump above the plating solution, the plating solution is lifted from the plating solution master tank into the vertical tubular sand-applying sub tank. With the device provided by the invention, sand-application of produced diamond wire is uniform and good. During the production process, current density is high, efficiency is high, internal stresses of the plating and the substrate are small, plating solution application amount is low, and wire breakage probability is low.

The present invention provides a temperature sensor with a reduced number of parts. In a temperature sensor (10), an entire opening portion (14) of a holder (12) is covered by a cap portion (44A) of a sensor cover (44), so that water drops etc. are prevented from entering between the holder (12) and a filled resin portion (42). Further, wire breakage in a harness pair (34A, 34B) caused by excessive bending is restricted by a neck portion (44B) of the sensor cover (44). The cap portion (44A) and the neck portion (44B) are both part of the sensor cover (44) and are integrated together. In the temperature sensor (10) with such a sensor cover (44), the number of parts is less than that of a temperature sensor (50) where a cap and a lead-wire lead-out member are separate bodies.

The invention discloses a flexible high-resolution infrared chalcogenide glass optical fiber image transmission bundle and a manufacturing method. The optical fiber image transmission bundle is formed by closely stacking optical fiber multifilaments, the optical fiber multifilaments are formed by drawing optical fiber monofilament bundles, the optical fiber monofilament bundles are formed by closely stacking optical fiber monofilaments, the optical fiber monofilaments sequentially comprise chalcogenide glass fiber cores, chalcogenide glass inner coating layers and thermoplastics polymer outer coating layers from inside to outside, and the relation among the refractive index n1 of the chalcogenide glass fiber cores, the refractive index n2 of the chalcogenide glass inner coating layers and the refractive index n3 of the thermoplastics polymer outer coating layers is n1>n2>n3. The manufacturing process is simple and easy to control, the wire breakage rate of the optical fiber bundles is low, and the large-section high-resolution flexible infrared optical fiber image transmission bundle can be manufactured easily.

The invention discloses a constant-tension wire moving mechanism with an automatic wire feeding function, which comprises a wire release and retract device, a tension regulation device and an automatic wire feeding device. The constant-tension wire moving mechanism is characterized in that: a first-stage tension regulation device and a second-stage tension regulation device are arranged between the wire release and retract device and the automatic wire feeding device; automatic wire breakage and wire feed are realized by setting the automatic wire feed mechanism, automatic retrieving of broken wires and waste wires can be realized, the operation is convenient, time and labor force are saved, the wire feeding efficiency and production efficiency are improved, and the wire feeding quality is increase; two stages of tension control are realized by setting the first-stage tension regulation device and the second-stage tension regulation device, changes of preceding stage wire coil tension are effectively controlled, the constant tension of the metal wire is ensured, and the processing accuracy of parts is improved.

Electric current supplied to light source rows of a vehicular lamp is controlled appropriately. The vehicular lamp includes: a plurality of semiconductor light emitting devices connected in parallel; a wire breakage detecting unit detecting wire breakage of each of the plurality of semiconductor light emitting devices; and an electric current supplying unit supplying a predetermined electric current to the plurality of semiconductor light emitting devices. The electric current supplying unit decreases the electric current to be supplied to the plurality of semiconductor light emitting devices when the wire breakage detecting unit detects wire breakage of at least one of the plurality of semiconductor light emitting devices.

A forward and reverse wiring tension balance control device and method for high-speed reciprocating wiring wire cutting are characterized in that the device comprises a stand column (18), wherein an upper wire arm (3) and a lower wire arm (13) are installed on the stand column, the upper wire arm (3) can move up and down on the stand column to adapt to the cutting requirements of workpieces of different thicknesses, an upper fixing wheel (6), a tension wheel (5), a wire breakage protection block (8), an upper current input block (9) and an upper positioning guide wheel (10) are installed on the upper wire arm (3), the wire breakage protection block (8) is controlled by a push rod motor (7), and the tension wheel (5) is connected with a tension sensor (4); a lower positioning wheel (11), a lower current input block (12) and a lower fixing wheel (14) are installed on the lower wire arm (13), and the lower control wheel (15) is controlled by a lead screw sliding table (16) and a stepping motor (17). The forward and reverse wiring tension balance control device and method obviously improve the high-thickness cutting stability and the consistency of workpieces cut in multiple times and can effectively reduce the wire breakage probability.