2626 results about "Wire cutting" patented technology

A cutting tool to be utilized in the resection or removal of bone tissue from patients includes a handle that tensions a wire or cable-like cutting member with a small diameter between at least two features on the handle to present a thin cutting profile. The design of the cutting tool includes features that protect against soft tissue damage and minimize the incision size necessary to utilize the tool. Some embodiments feature details of the cutting tool that interface with a surgical cutting guide system. Other embodiments describe a cutting tool with a selectively changeable length of the cutting profile of the wire cutting member. In one embodiment, the wire cutting member of the cutting tool is energized by mechanical energy in the form of a unidirectional rotation of the cutting member, a mechanical vibration of the cutting member, or an oscillating movement of the wire cutting member.

A foam core cushion mattress assembly provides semi-independent foam pillars on the upper surface of the mattress. The mattress may be unitary, or comprise multiple cushioning components, possibly base, body support and foot cushions. The body support cushion is constructed from a flat, rectangular solid, foam element whose upper surface is cut into an array of rectangular solid pillars, preferably by a hot wire cutting method. The array of rectangular solid pillars is grouped into a central array comprising pillars with generally square top surfaces and edge rows of rectangular solid pillars having rectangular top surfaces. The depth of the hot wire cuts into the surface of the body support cushion is preferably approximately one-half the overall thickness of the body support cushion or approximately three fourths of the length of the shortest face of the pillar. A zippered fabric cover removeably envelops the assembled cushioning components. The resultant structure defines a plurality of semi-independently compressible pillars that support a reclining, or supine patient. The pillars may also be cut into the top and bottom surfaces of the cushion for enhanced pressure relieving effects. Methods of manufacture, and treatment and alleviation of decubitus ulcer formation are also presented.

A device is disclosed for joining a first layer of material to a second layer of material, the device comprising a handle, a first jaw and a second jaw mounted on the handle, at least one of the first jaw and the second jaw being moveable relative to the other; the first jaw defining therein: a first channel for retaining a wire guide; a second channel extending from the first channel for supporting a suture wire extending from the wire guide; and a passageway for retaining a cutting bar; the second channel being curved to impart a looping configuration to portions of the suture wire passed therethrough; a wire advancing actuator mounted on the handle for moving the suture wire through the second channel and through the first and second layers of material in the looping configuration; and a wire cutting actuator mounted on the handle for moving the cutting bar into cutting engagement with the suture wire, wherein the suture wire in the looping configuration joins the first layer of material to the second layer of material.

The invention discloses a touch control display panel and a touch control display device. The panel comprises a substrate, an organic luminescent device, at least one baffles, wherein the width of the at least one baffle is 30-200 micrometers, a thin film encapsulation layer, wherein the thin film encapsulation layer covers the at least one baffle, and difference between the baffle 30 and baffle 40 of the thin film encapsulation layer between the first baffle 41 and a display area A is 0-3 micrometers, electrode wires which are located at least at the non-display area of the substrate, and at least part of the electrode wires are located at the side away from the baffle, of the thin film encapsulation layer, and are arranged in the extension direction of the baffle. The projection of the electrode wires on the substrate is located in the range of the projection of the baffle on the substrate. According to the touch control display panel, at least part of electrode wires are located at the side away from the baffle, of the thin film encapsulation layer, and arranged in the extension direction of the baffle, therefore the side frame area of the baffle location is fully utilized to achieve narrow side frames and the lowering of wire cutting-off risk.

The invention relates to the field of silicon wafer wire-electrode cutting and discloses a method for recycling carborundum and cutting polyethyleneglycol in waste mortar by silicon wafer wire-electrode cutting. In monocrystalline silicon piece processing technique, a viscosity reduction agent is firstly added before waste mortar linear cutting, and then a suspending liquid part and a solid particles part are obtained by the solid-liquid separation; The suspending liquid part is added with a filter aid, then filter pressing with a plate frame, micro porous filtration, hyper filtration with hollow fiber and ion exchange are carried out sequentially, and finally, the suspending liquid is distillated in vacuum and polyethyleneglycol is recycled. Alkali reaction cleaning, water scrubber washing, centrifugalization, acid reaction cleaning, the second water scrubber washing, the second centrifugalization, the second acid reaction cleaning, drying and drying classification are carried out on the solid particles in sequence, and finally, recyclable silicon carbide particles are obtained.

Rapid, efficient, and systematic processes and apparatuses for making repeatable imprints on multiple, individual sweet dough pieces are provided. An advantage of the process is the ease of making uniform imprints that are aligned with the individual dough pieces as formed and deposited. Such provides the ability to create a three-dimensional pattern on the surface of a sweet dough piece, particularly a soft cookie dough piece. The methods can be accomplished by high-speed wire cutting production methods as well as other dough piece depositing apparatuses, such as roller-type depositors.

A method and apparatus for diamond wire cutting of metal structures, such as nuclear reactor vessels, is provided. A diamond wire saw having a plurality of diamond beads with beveled or chamfered edges is provided for sawing into the walls of the metal structure. The diamond wire is guided by a plurality of support structures allowing for a multitude of different cuts. The diamond wire is cleaned and cooled by CO₂ during the cutting process to prevent breakage of the wire and provide efficient cutting. Concrete can be provided within the metal structure to enhance cutting efficiency and reduce airborne contaminants. The invention can be remotely controlled to reduce exposure of workers to radioactivity and other hazards.

The invention discloses a method for preparing high temperature titanium alloy by adopting a selective laser melting rapid formation technique. The method comprises the following steps: (1), preparing powder of elements in nominal chemical components of titanium alloy according to the mass proportion of all the elements, then carrying out vacuum induction melting; (2), milling titanium alloy formed by melting by adopting a gas atomization milling method; (3), establishing a part three-dimensional model, and importing the part three-dimensional model into selective laser melting rapid formation equipment; (4), placing powder into the selective laser melting rapid formation equipment, and carrying out part forming on a substrate; (5), separating the formed part from the substrate by adopting a wire cutting process, annealing the part, so as to improve the plasticity and the toughness of titanium alloy; (6), performing a high temperature oxidation test on the part, so as to determine the high temperature oxidation resistance of the novel titanium alloy. According to the method for preparing high temperature titanium alloy by adopting the selective laser melting rapid formation technique, provided by the invention, a high temperature titanium alloy part with a complex structural shape is quickly formed, and the characteristics of rapid manufacturing, accurate manufacturing and reduction of manufacturing cost and the like are achieved.

Disclosed is a horizontal diamond wire cutting machine tool. The horizontal diamond wire cutting machine tool comprises a tool body (1), the tool body (1) is provided with a rotary worktable (2) for fixing workpieces, a portal frame (15), and a guide wheel group on the portal frame (15), wherein the portal frame (15) can be driven by an X-direction transmission mechanism on the tool body to move in an X direction. The horizontal diamond wire cutting machine tool is characterized in that the beam (10) of the portal frame (15) is provided with a pay-off drum (8) and a take-up drum (9), the stand columns on both sides of the portal frame (15) are respectively provided with an extending plate, and the cantilever end of each extending plate is provided with a cantilever end guide wheel; the extending plates on both sides are driven by the same or a separated Z-direction transmission mechanism to move up and down along the stand columns to control the height and accordingly to maintain a horizontal state so that a diamond wire on the cantilever end guide wheels on the cantilever ends can maintain a horizontal state and participate in cutting of the workpieces. The horizontal diamond wire cutting machine tool is convenient to fixe and high in machining efficiency and yield rate.

A vanishing mould digital control linear cutting processing forming machine belongs to automatic machining device, and overcomes the problems of low forming speed and singular function of prior vanishing mould digital control linear cutting processing forming machine. The vanishing mould digital control linear cutting processing forming machine is composed of a mechanical part and a control part. The mechanical part comprises a frame, a tray, an X-axis motor, a Y-axis motor, a Z-axis motor, a X-axis left cylinder slide way, a X-axis right cylinder slide way, a Y-axis cylinder slide way, a Z-axis cylinder slide way, a main shaft motor and the main shaft. The right side of frame is fixed with a bracket. Two ends of Z-direction vertical girder are fixed with an upper cantilever and a lower cantilever. A baiting cutting line is connected between the end of upper cantilever and the end of lower cantilever. An installation plate is installed on the end of main shaft. The installation plate is fixed with a left supporting arm and a right supporting arm. A processing cutting line is connected between the end of left supporting arm and the end of right supporting arm. The vanishing mould digital control linear cutting processing forming machine of the invention has the advantages of compact structure, complete function, excellent economy and excellent practicality. The vanishing mould digital control linear cutting processing forming machine integrates the functions of baiting, blocking, etc. The manufacturing of vanishing moulds with middle or small quantity is quickly, economically and automatically/semi-automatically completed. The vanishing mould digital control linear cutting processing forming machine can also be used for manufacturing foam pad with middle or small quantity.

The invention provides a multi-wire cutting device applied to block forming of a silicon ingot. The multi-wire cutting device comprises a base, a bearing table arranged on the base for bearing the silicon ingot to be cut and a cutting mechanism. The bearing table is provided with a plurality of bearing assemblies which are arranged in parallel, and a cutting clearance is reserved between every two adjacent bearing assemblies. Each bearing assembly comprises a pair of bearing supports, a traction roller, a traction belt arranged on the traction roller in a sleeving manner, and a first drive motor. The cutting mechanism comprises a cutting support arranged on the base, at least one pair of cutting rollers erected on the cutting support, cutting wires and a second drive motor. The cutting wires are correspondingly wound on at least one pair of cutting rollers to form a cutting net. The cutting wires on the cutting rollers are used for cutting the silicon ingot to be cut on the bearing table under the drive of the second drive motor, and the cutting wires are located in the cutting clearances when cutting the silicon ingot. According to the multi-wire cutting device, a workpiece can be cut into blocks, the workpiece to be cut is controlled by a microcontroller to rotate, automatic control is achieved in the whole process, and the cutting effect is good.

The invention discloses a high strength and high conductivity dispersion strengthened copper alloy. 0.10 to 0.30wtpercent Al is added into an alloy-based material. The technology of the invention cosists of (1)Melting of alloy; (2) Hot rolling or cold rolling (wire cutting)of alloy for preparing thin sheets; (3)Internal oxidation of alloy sheet; (4)Heat pressing and hot extrusion of alloy sheet with internal oxidation; (5)Processing of alloy. Wherein, the thickness of the alloy thin sheet is 0.3 to 2.0mm; and the method for internal oxidation is embedding with the standard of (850DEG C -950DEG C) * (3-15) h; and the temperature of heat pressing and hot extrusion is 900DEG C-950DEG C. The invention adopts a Cu-Al alloy internal oxidation thin sheet, and the micro-hardness and the conductivity of the alloy with the process of heat pressing reaches 120 HV and 78percent IACS respectively; and the tensile strength reaches 260MPa. The micro-hardness and the conductivity of the alloy with the process of hot extrusion reach 135 HV and 85percent IACS respectively; and the tensile strength reaches 450MPa. The softening temperature of the alloy reaches above 900DEG C.

A gate valve having a body, a chamber housed in the body, a passage through the body that intersects the chamber, a gate for selectively opening and closing the valve, and a cutting edge on the gate. The cutting edge can sever any lines that may be in the valve and still seal after closing. The gate includes a recess formed to collect cuttings formed while severing the line.

The present invention relates to a LED lamp pin welding equipment. It includes machine frame, transmission mechanism positioned under the machine frame, conveying chain positioned on the machine frame, vibration plate, LED-placing device, clamping device, stripping and wire-cutting device and welding device. It is characterized by that on the above-mentioned machine frame it has two vibration plates, two LED-placing devices, two clamping devices, two stripping and wire-cutting devices and two welding devices which are respectively positioned at two sides of conveying chain. Besides, said invention also provides the welding method matched with said LED lamp pin welding equipment.

An aqueous slurry composition for lapping, saw wire cutting, and finishing operations which contains about 0.1 to 70% by weight of abrasive particles, 0.1 to 20% by weight of suspending particles that have a density of less than or similar to the aqueous or semi-aqueous carrier medium, and the method for creating the suspension.

The invention discloses a photoelectric control system for an industrial sewing machine, and relates to the technical field of photoelectric control, in particular to an infrared control system capable of detecting fabric edge length of materials sewn and whether sewing materials exist by an industrial sewing machine. The control system comprises two infrared emitters (1) independently forming a relative included angle (phi), an infrared receiver tube (2) and an infrared receiver tube (3) positioned in a front circular hole and a back circular hole of a needle plate holder, a cutter assembly (5), a fabric edge signal processor (10), an air suction pipe (11) and a sewing machine electric cabinet (17), and comprises steps of a to d. Two groups of signals about having or no fabric edges are provided to the fabric edge signal processor to be processed through judging whether the fabric edges are existed on a sewing machine needle plate; and starting, stopping, accounting, speed raising, speed reducing, wire cutting and air sucking and the like of the sewing machine are controlled automatically according to positions of the fabric edges supplied to a system controller. The control system has the characteristics of accurate output signals, good anti-interference property, easy processing and high performance cost ratio, is suitable for various industrial sewing machines, and the like.

The invention provides multi-wire cutting equipment and a tension adjusting mechanism thereof. The tension adjusting mechanism comprises two tension assemblies and a traction assembly positioned between the two tension assemblies, wherein the two tension assemblies are respectively arranged between the traction assembly and a winding reel, as well as between the traction assembly and a cutting area, can respectively sense the tension of a diamond wire between the traction assembly and the winding reel and the tension of a diamond wire between the traction assembly and the cutting area in real time, and can respectively adjust the tension of the diamond wire on the winding reel and the tension of the diamond wire on the cutting area according to the sensed tension values. The condition that the tension of the diamond wire on the winding reel meets the preset condition all the time is ensured, the tension of the winding reel and the tension of the cutting area are separated, the condition that the tension of the cutting area is greater than the tension of the winding reel all the time is ensured, mutual abrasion of the diamond wire on the winding reel due to overlarge tension is avoided, tension cutting process and normal operation of a diamond wire squarer are ensured, and the service life of the diamond wire is effectively improved.

The invention provides a micro-computer control multi-wire cutting machine, comprising a frame, a worktable, a metal wire, and a grinding lubricant supply mechanism; the control part of the micro-computer control multi-wire cutting machine adopts the programming of a main substrate to control a CPU module; the parameters of the CPU module are set by a touch display; furthermore, a servo amplifier is controlled by optical fibres; the servo amplifier controls a servo motor; a frame is internally provided with at least six servo amplifiers and six servo motors which respectively control the lifting of the worktable; the micro-computer control multi-wire cutting machine also comprises three rotation rollers, a wiring wheel, a wiring tensioning sensor, a stranding wheel, and a stranding tensioning sensor; the grinding lubricant supply mechanism leads out an emery liquid injection pipe; the outlet of the emery liquid injection pipe is in the middle of an isosceles triangle which is presented by three rotation rollers; the metal wire extends from wiring wheel passing through the wiring tensioning sensor and winding parallel hundreds of rounds on three rotation rollers to form a cut surface, the main substrate programming controls the CPU module so as to control the rotation/direction of the servo motors, thus leading the rotation rollers, stranding wheel and wiring wheel to reciprocate to rotate. The micro-computer multi-wire cutting machine has high cutting precision and working efficiency.

The invention relates to a method for producing thin monocrystalline silicon polished wafer. The method comprises the following steps: Step 1, monocrystalline silicon is sliced up by adopting wire cutting; Step 2, a slotting double-face grinder which adopts a stainless steel planetary sheet with an internal circle inlaid with a soft rubber ring is adopted to carry out double-surface grinding on the sliced monocrystalline silicon; Step 3, a technique of acid corrosion thinning is adopted, wherein, the removal amount resulted from acid corrosion is 10 micrometers to 60 micrometers; Step 4, a nanometer grinding technique is adopted, wherein, the removal amount resulted from nanometer grinding is 1 micrometer to 25 micrometers; and Step 5, a wax polishing technique is adopted, wherein, the removal amount resulted from wax polishing is 5 micrometers to 30 micrometers. By adopting a new technical route and a new technical procedure for producing new thin monocrystalline silicon polished wafer, the invention effectively improves TTV level, WARP level, TIR level, STIR level and other levels as well as the finished product rate of the thin monocrystalline silicon polished wafer.

The invention relates to an optical fiber winding device used for processing an optical fiber. The device adopts the mechanical and electrical integration design, optical fiber paying off, wire cutting and winding processes are carried out in a linkage mode, the production efficiency is improved, and the manual cost is saved. The optical fiber winding device comprises a control unit, a speed regulation motor, a paying off mechanism, a first stepping motor, a wire cutting mechanism, a second stepping motor and a winding mechanism, wherein the control unit is used for controlling the speed regulation motor to drive the paying off mechanism to pay off the optical fiber; the control unit is used for controlling the first stepping motor to drive the wire cutting mechanism to cut the optical fiber; the control unit is used for controlling the second stepping motor to drive the winding mechanism to coil the optical fiber. The traditional low-efficiency manual operation is directly improved to high-efficiency automated equipment to finish optical fiber coiling, the production efficiency is improved, the optical fiber coiling quality is improved, and the labor intensity of production personnel is lightened. The product quality is further improved, the operations from cutting optical fiber to coiling the optical fiber are finished in one time, the efficiency is improved, and the quality is improved.

The invention discloses an environment-friendly cooling liquid for diamond wire cutting and a preparation method thereof, and aims to solve the technical problem in preparing a cooling liquid for diamond wire cutting which is better in cooling and anti-rusting properties and environment-friendly. The cooling liquid comprises the following components by weight percentage: 4-10% of stabilizer, 0.5-2% of water soluble lubricant, 1-4% of extreme pressure agent, 12-16% of anti-rusting agent, 3-8% of preservative, 1-4% of wetting agent, 0.01-0.04% of defoamer and the balance of deionized water. The environment-friendly cooling liquid for diamond wire cutting provided by the invention has excellent cooling, lubricating, anti-rusting and cleaning properties, and is not easy to rot and deteriorate, long in service life, convenient for recovery and reuse, free of pollution or low in pollution on the environment, and harmless to the body health of the working personnel. Besides, the preparation method of the environment-friendly cooling liquid for diamond wire cutting provided by the invention is safe and reliable, low in composite cost, and suitable for large-scale production.

The invention provides a one-step preparation method of a metal material surface with a super-hydrophobic micro-nano structure, belongs to the technical field of material surfaces and aims at solving the problems that a preparation process in the prior art is complicated, high in cost, long in preparation period and small in preparation area. The one-step preparation method comprises the following steps of using an organic solvent to perform supersonic vibration washing to a metal sample to remove oil stains on the surface of the sample; performing linear cutting treatment to the metal sample subjected to the supersonic vibration washing, using the organic solvent to perform supersonic vibration washing to the metal sample subjected to the linear cutting treatment so as to remove oil stains and reactants on the surface of the metal sample; placing the metal sample into a calorstat to be dried and obtaining the metal material surface with the super-hydrophobic micro-nano structure. The processing can be finished through the linear cutting step, process procedures are simple, and a preparation period is short. The micro-nano structure is directly generated on the metal surface through discharging between a wire electrode and metal, the cost is reduced, the wire electrode is adjustable in length, and processing of a large-area super-hydrophobic structure of the metal surface is facilitated.

The invention discloses a micro-electrolytic electric spark cutting processing device and method for a rotating ultrasonic electrode. The device includes a pulse power supply, a three-dimensional motion mechanism, an ultrasonic-assisted vibration rotating spindle, a measurement and control unit, and an electrolyte tank. The three-dimensional motion mechanism clamps the ultrasonic-assisted vibration rotation The main shaft enables it to move along the X, Y or Z axis. The end of the ultrasonic-assisted vibration rotating main shaft is equipped with a tool electrode. The electrolyte tank is placed at the lower end of the tool electrode, and an auxiliary anode is arranged inside it; the pulse power supply is the auxiliary anode and the tool electrode. Pulse square wave voltage signal is provided, and the invention reduces the electrolysis current and discharge current through the cooperation of ultrasonic vibration-assisted processing and rotating electrodes, and controls the formation of a thinner and more uniform gas film during the processing process, increasing the discharge time and making the discharge easier to occur. The discharge process is more stable, so as to ensure the high surface quality of the processed workpiece edge, and improve the processing stability and precision; at the same time, the use of spiral cylindrical electrodes instead of wire cutting can cut closed graphics.

The invention discloses a system and method for recycling and supplying mortar to multi-wire cutting machines. The system comprises a finished product mortar storage tank, a main supply pipeline, an auxiliary reflowing pipeline, a branch supply pipeline, a waste liquid back-pumping main pipeline, a waste liquid back-pumping branch pipeline, a waste liquid recycling tank, a mortar separation and purification device, a silicon carbide dense mortar storage tank, a recycled liquid storage tank, a silicon carbide dense mortar pumping pipeline, a recycled liquid pumping pipeline, a cutting liquid supplementing pipeline and a silicon carbide micropowder supplementing pipeline. The method comprises the following steps of: firstly, supplying finished product mortar: reflowing the finished product cutting mortar before the mortar is supplied to the multi-wire cutting machines, supplying the finished product cutting mortar, completing the supplying of the mortar, and then continuously reflowing the finished product cutting mortar; secondly, recycling waste mortar; and thirdly, starting a stirrer of a mortar recycling device, separating and purifying the waste mortar, compounding and recycling the finished product cutting mortar. The system is reasonably designed, simply and conveniently operated, can simultaneously supply the mortar to a plurality of cutting machines without retaining the mortar in each pipeline.

The invention discloses a method for cutting 170 μm silicon wafers, which comprises the following steps: (1) bonding silicon ingots: using glue to bond silicon ingots and glass plates into one; (3) Set the groove distance of the guide wheel of the wire cutting machine into three sections, respectively 320±2μm, 317±2μm and 313±2μm, and use a steel wire with a diameter of 115μm to drive; step (2) The mortar prepared in step (1) carries out wire cutting to the silicon ingot and the glass plate which are bonded together in step (1); (4) degumming: use the degumming machine to separate the silicon wafer from the glass plate; (5) cleaning: remove the residue after degumming Clean metal ions and organic impurities on the surface of the silicon wafer. Compared with the prior art, the present invention has the following advantages: it realizes the cutting of 170 μm silicon wafers, reduces the thickness of the silicon wafers, improves the yield and production efficiency, and greatly reduces the production cost; the degumming and cleaning of the silicon wafers High yield and excellent quality.

A tail wire cutting method and bonding apparatus executing the same, in which a capillary raised to a predetermined height and a clamper disposed above the capillary and gripping a wire are caused to make reciprocating oscillation movement on, for instance, a circular arc that has an apex at the above-described predetermined height, thus forming (minute) cracks in a portion between the tail wire and a bonding end of a bonding point, and then cutting of a tail wire sticking out of the tip end of the capillary is executed by way of raising the capillary and clamper.

The invention provides a wire cutting and winding device which comprises a wire releasing device, a wire storing device, a counting and wire-cutting device and a wire winding device, wherein the wire releasing device is used for placing wire coils; wire cables pass through the wire storing device and enter the counting and wire-cutting device, and are wound around the wire winding device after the counting and wire-cutting device counts the wire cables; the counting and wire-cutting device carries out the counting on the wire cables passing through the counting and wire-cutting device; and when the lengths of the wire cables passing through the counting and wire-cutting device reaches the preset length, the counting and wire-cutting device cuts off the wire cables. The wire cutting and winding device organically combines a counting device, a wire cutting device and the wire winding device together, thereby reducing the occupied area, achieving the automatic production, reducing the labor intensity; and furthermore, the wire cutting and winding device has a simple structure, is easy to operate, and effectively improves the production efficiency.

The invention belongs to the field of technologies for processing advanced materials, and particularly provides a method and equipment for efficiently cutting large-diameter single crystals by the aid of diamond wires. The method and the equipment have the advantages that the equipment is convenient to operate and is provided with a multi-wire cutting machine and the diamond cutting wires, the diameters of the diamond cutting wires range from 120 micrometers to 400 micrometers, diamond particles are plated on outer layers of the diamond cutting wires, multiple pieces of large-diameter SiC crystal bars can be cut by the aid of reciprocating high-speed cutting movement of the diamond cutting wires, the surface roughness, the bending and the total thicknesses of cut SiC wafers hardly vary, and a plurality of target crystals can be cut in each procedure; the crystal can be cut at high speeds, crystal cutting elapsed time is short, and accordingly the silicon carbide wafers can be efficiently cut by the aid of the method and the equipment.

The invention pertains to the field of powder metallurgy technology, in particular to a preparation method of high-niobium titanium aluminum alloy powder. The raw material adopts a casting-state high-niobium titanium aluminum alloy cast ingot, the process comprises: melting - soaking treatment - turning - machining into a rod which can be connected - continuous inert gas atomization method by induction heating without a crucible, the preparation method comprises the specific steps of: (1) melting by adopting the plasma cooling bed process; (2) carrying out the soaking treatment by keeping the temperature at 1100 to 1300 DEG C for 24 to 48 hours; then removing the oxide scale on the surface of the cast ingot; (3) adopting the wire cutting and machining methods to process the cast ingot into the rod which has thread connection, the diameter of 20 to 25mm and the length of 200 to 500mm, and then carrying out turning to remove the oxide scale on the surface of the rod; (4) adopting the continuous inert gas atomization process by induction heating without the crucible to process the rod into the powder, and the process parameters are that the pressure of the inert gas is 2.0 to 5.0MPa and the argon gas flow rate is 160 to 220Ls <-1>. The preparation method has the advantages of excellent degree of sphericity of the prepared powder, high purity, great mobility and high yielding rate of the powder. The degree of sphericity of the prepared powder achieves 80 to 95 percent, and the yielding rate of the powder is 75 to 85 percent.

The invention discloses an electrical discharge wire cutting machining discharge state detection device, which comprises a current sensor, a voltage division circuit, a comparison circuit, a signal driving circuit and a floating voltage stabilizing power supply circuit; the detection device controls the three discharge states of no-load, spark and short-circuit during the processing process by the on-line real-time sampling of the duty ratio of the gap voltage waveform and the on-line real-time adjustment of the output voltage of an adjustable voltage stabilizing power supply; the floating on-line real-time detection is carried out by the respective lasting times of the no-load, the spark and the short-circuit in the single pulse width and the relative time utilization ratio, which can effectively solve the problem that the gap voltage is fluctuated along with the gap current and further improve the detection precision and the sensitivity of the discharge states of the no-load, the spark and the short-circuit.