Ultrasonic wire cutting saw for hard-fragile material processing

Abstract

The invention is a kind of supersonic wave tangent line saw for hard and crisp material, which comprises the bed, longitudinal working slide flat, transversal work slide flat, piece bracket, diamond line saw, supersonic wave vibrating device, saw reciprocating motion mechanism and electricity control device, the supersonic vibrating device is fixed on the upper arm of the C type work bracket through screw, the electrical signal is transformed into mechanical vibration, and enlarges the amplitude through a pole, the diamond saw vibrates as wave, it generates reciprocating motion through cranked rod, C type work bracket, slide flat seat. The saw is in linear high frequency vibration state and reciprocating motion; the invention is simple and has a high productivity.

Description

technical field [0001] The invention relates to a hard and brittle material cutting processing technology, in particular to an ultrasonic wire cutting saw used for hard and brittle material processing. Background technique [0002] At present, hard and brittle materials such as stone, gemstone, silicon crystal, quartz crystal, cemented carbide, etc. usually have excellent and stable physical and chemical properties. Therefore, it is widely used in many fields such as construction industry, aerospace, electronics, chemical industry, and biological engineering. However, the cutting of hard and brittle materials is very difficult, the machining accuracy is low, and the cost is high. Usually, diamond circular saws, band saws, and wire saws are used. Diamond circular saws and diamond band saws are limited by the substrate. In the process, it cannot turn or cut the curved surface; although the diamond wire saw can process the curved surface, but in the processing, the wire saw or...

AI Technical Summary

Problems solved by technology

However, the cutting of hard and brittle materials is very difficult, the machining accuracy is low, and the cost is high. Usually, diamond circular saws, band saws, and wire saws are used. Diamond circular saws and diamond band saws are limited by the substrate. In the process, it cannot turn or cut the curved surface; although the diamond wire saw can process the curved surface, but in the processing, the wire saw or the closed curve has a length of tens of meters to hundreds of meters, and the wire saw bypasses the guide wheel. , The surface tension of the wire saw is different, which affects the bonding strength between the diamond abrasive grains and the matrix, and the abrasive grains are easy to fall off, and its performance decreases and leads to an increase in processing costs.

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