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162results about How to "Reduce the thickness of the structure" patented technology

Conductor pattern structure of capacitive touch panel

Disclosed is a conductor pattern structure of a capacitive touch panel. First-axis conductor assemblies and second-axis conductor assemblies are formed on a surface of a substrate. Each first-axis conductor assembly includes a plurality of first-axis conductor cells that are interconnected by first-axis conduction lines. An insulation layer is formed on a surface of each first-axis conduction line. Each second-axis conductor assembly includes a plurality of second-axis conductor cells that are interconnected by second-axis conduction lines. Each second-axis conduction line extends across the insulation layer of the associated first-axis conduction line.
Owner:TRENDON TOUCH TECHNOLOGY CORPORATION

Thin touch panel

A thin touch panel includes a transparent substrate with a black bordering around the inner surface of the transparent substrate. A plurality of metal connecting structures, metal guiding lines, transparent insulating structures and a transparent sensing layer are formed on the inner surface, so that the transparent substrate not only provides a touch surface, but also has the touch sensing ability, to decrease the manufacture material and increase the transmittance of the touch panel. Besides, the manufacture of the thin touch panel may not use any optical adhesive to decrease the manufacture cost and improve the yield. Further, the thin touch panel may satisfy the trend of thin design.
Owner:BUWON PRECISION SCI

Package structure having MEMS element

A package structure having at least an MEMS element is provided, including a chip having electrical connecting pads and the MEMS element; a lid disposed on the chip to cover the MEMS element and having a metal layer provided thereon; first sub-bonding wires electrically connecting to the electrical connecting pads; second sub-bonding wires electrically connecting to the metal layer; an encapsulant disposed on the chip, wherein the top ends of the first and second sub-bonding wires are exposed from the encapsulant; and metallic traces disposed on the encapsulant and electrically connecting to the first sub-bonding wires. The package structure advantageously features reduced size, relatively low costs, diverse bump locations, and an enhanced EMI shielding effect.
Owner:SILICONWARE PRECISION IND CO LTD

Use of friction stir and laser shock processing in oil & gas and petrochemical applications

The use of friction stir and laser shock processing in oil & gas and / or petrochemical applications is provided by the present invention. The use includes subjecting friction stir weldments, fusion weldments, and other critical regions of ferrous and non-ferrous alloy components used in oil & gas and petrochemical applications to laser shock processing to create residual compressive stresses near the surface of the treated area. The residual compressive forces in the ferrous or non-ferrous components improve properties including, inter alia, surface strength, fatigue life, surface hardness, stress corrosion resistance, fatigue resistance, and environmental cracking resistance. Friction stir and laser shock processing find particular application in high strength pipelines, steel catenary risers, top tension risers, threaded components, liquefied natural gas containers, pressurized liquefied natural gas containers, deep water oil drill strings, riser / casing joints, and well-head equipment.
Owner:EXXON RES & ENG CO

Electronic substrate with heat dissipation structure

An electronic substrate with heat dissipation structure includes a substrate plate and at least one heat pipe. The substrate plate includes a wiring layer, a grounding layer and an insulation layer from top to bottom. The wiring layer has at least one heat-producing element mounted thereon, and is formed with a receiving hole for the heat pipe to tightly fit therein. Heat produced by the heat-producing element and distributed over a high-temperature zone of the substrate plate surrounding the heat-producing element is absorbed by the heat pipe and then transferred to a low-temperature zone of the substrate plate distant from the heat-producing element, from where the heat is dissipated into ambient air to achieve cooling effect at upgraded heat dissipation efficiency.
Owner:ASIA VITAL COMPONENTS SHENZHEN CO LTD

Semiconductor device

A semiconductor device includes a semiconductor substrate, a first electrode that is formed over said semiconductor substrate, a capacitive insulating film that is formed on the first electrode and is made of a metal oxide ferroelectric, a second electrode that is formed on the capacitive insulating film, an insulating film that has a first opening exposing a portion of an upper side of the second electrode and is formed so that it covers the first electrode, the capacitive insulating film, and the second electrode, a first barrier film having an amorphous structure which is formed inside the first opening and on the insulating film, and a wiring film that is formed over the first barrier film.
Owner:LAPIS SEMICON CO LTD

Bearing unit, production method therefor and spindle motor

A bearing unit comprises a bearing 60 formed of a sintered metal in which a magnetized magnetic powder is dispersed in its matrix and at least pores exposed on a bearing surface thereof are sealed by impregnation with a resin; a non-magnetic housing 90 accommodating the bearing 60; and a lubricating fluid M made of a magnetic fluid.
Owner:HITACHI POWDERED METALS COMPANY +1

Basalt fiber and carbon fiber compound geogrid with electric heating function

The invention discloses a basalt fiber and carbon fiber compound geogrid with electric heating function, which is formed by compounding materials of basalt fiber, carbon fiber beams, modified asphalt, polyacrylic emulsion or high temperature resistant heat convertible resin and the like. The geogrid not only has the function of reinforcement, but also has the functional characteristic of electric heating effect, has simple construction, low manufacture cost, convenient construction, safety and reliability, and is mainly used for melting snow and ice on the concrete pavement and the airfield runway.
Owner:ZHEJIANG GBF BASALT FIBER

Color asphalt ultrathin wearing layer and preparation method thereof

ActiveCN101929119AImprove skid resistanceExcellent waterproof fogIn situ pavingsChipsealRoad surface
The invention discloses a color asphalt ultrathin wearing layer and a preparation method thereof. The preparation method mainly comprises the following steps of: producing a mixed material: mixing 34-36 parts of 5-10 mm macadam, 11-13 parts of stone chips with a grain size less than 3 mm and 0.8-1.2 parts of mineral powder or cement, then adding 2-3 parts of color asphalt and mixing to obtain a color asphalt mixed material; paving: firstly spraying a layer of polymerized, modified and emulsified asphalt on the lower bearing layer of a road surface by the spraying system of an asphalt paver and then uniformly paving the color asphalt mixed material on a road by the spiral distributor of the asphalt paver; and statically rolling by using a double-steel wheel road roller and forming the road surface. The color asphalt ultrathin wearing layer obtained by using the method has relatively high use value, simple construction method, easy maintenance and low manufacturing cost and can meet the requirements of the color road surface.
Owner:广州新粤交通技术有限公司

Fabrication method of package structure having MEMS element

A fabrication method of a package structure having at least an MEMS element is provided, including: preparing a wafer having electrical connection pads and the at least an MEMS element; disposing lids for covering the at least an MEMS element, the lids having a metal layer formed thereon; electrically connecting the electrical connection pads and the metal layer with bonding wires; forming an encapsulant for covering the lids, bonding wires, electrical connection pads and metal layer; removing portions of the encapsulant to separate the bonding wires each into first and second sub-bonding wires, wherein top ends of the first and second sub-bonding wires are exposed, the first sub-bonding wires electrically connecting to the electrical connection pads, and the second sub-bonding wires electrically connecting to the metal layer; forming metallic traces on the encapsulant for electrically connecting to the first sub-bonding wires; forming bumps on the metallic traces; and performing a singulation process.
Owner:SILICONWARE PRECISION IND CO LTD

Intelligent handwriting board based on handwriting identification and synchronous terminal display

The invention discloses an intelligent handwriting board based on handwriting identification and synchronous terminal display. The intelligent handwriting board comprises a handwriting board body (3), a control module (9) and terminal equipment, wherein a sensing region (2) is arranged at the periphery of the handwriting board, infrared sensors for scanning handwriting tracks are arranged in the sensing region (2) and comprise infrared transmitters and infrared receivers, and the infrared transmitters and the infrared receivers are arranged in a correlative manner; the infrared sensors are used for transmitting data representing the handwriting tracks to the control module (9) by scanning the handwriting tracks; and a wireless communication unit (7) is arranged in the control module, and is used for transmitting the data to the terminal equipment in real time by means of wireless transmission, so that the content same as the content on the handwriting board body can be displayed in the terminal equipment in real time. By using the intelligent handwriting board, while the original handwriting experience can be maintained, the content of the handwriting board can be recorded and saved conveniently, and information synchronization of the terminal equipment and the handwriting board can be realized.
Owner:HANGZHOU TANNUO OPTOELECTRONICS MATERIALS CO LTD

Light-emergent direction adjusting element and control method and display device thereof

The invention relates to a light-emergent direction adjusting element. The light-emergent direction adjusting element comprises a first substrate, a second substrate opposite to the first substrate, and light-permeable parts arranged between the first substrate and the second substrate. Adjusting parts are arranged between every two adjacent light-permeable parts. Each adjusting part comprises anelectrode control unit and charged light shielding particles, wherein the charged light shielding particles are used for shielding light passing through the adjusting part under the control of the electrode control unit. By means of the element, by controlling the voltage input to a first electrode and a second electrode, the state of the charged light shielding particles in the adjusting parts can be adjusted, and therefore the angle of the emergent light shielded by the charged light shielding particles is adjusted, and the emergent direction of light is adjusted. Compared with the prior art, no scattering layer needs to be arranged, the manufacturing cost can be easily reduced, and the structure thickness can be easily reduced.
Owner:BOE TECH GRP CO LTD

PDMS packaging technology-based microfluid metamaterial structure

The invention belongs to novel flexible metamaterial wave absorber manufacturing field and relates to a PDMS packaging technology-based microfluid metamaterial structure. The design idea of the structure comprises the following steps that: a conventional sandwich wave absorbing structure is used in a combined manner, the original dielectric layer of the conventional sandwich wave absorbing structure is replaced with a PDMS packaged microfluid structure; the packaged microfluid is filled with a liquid having a high dielectric constant and large tangential angle loss; and a dielectric substrateand a metal pattern are sputtered to two sides of a package layer through a sputtering process, so that a flexible wave absorbing material is obtained. The process flow of the PDMS packaging technology-based microfluid metamaterial structure of the present invention is based on the PDMS package process, so that the PDMS packaging technology-based microfluid metamaterial structure can be thinner; compared with a conventional wave absorbing material structure, the PDMS packaged microfluid metamaterial wave absorber is thinner; and a material for making the wave absorber is flexible.
Owner:ZHONGBEI UNIV

Package structure of surface adhesive light -emitting diode and its producing method

A packaging structure adhered by LED on the surface provides a base plate with multiple pads isolated in between and an insertion part containing at least a LED chip. A wire couples the chip and pads, the insertion part is filled by a cover covering the wire for protection and the packaging structure is cut, which can reduce the thickness of LED illuminating through different faces of the cover.
Owner:SHANGJUXING

Reinforced concrete ribbed grid-like large floorslab and preparation method thereof

The invention relates to a steel bar concrete dense-rib well-shape building roof cover and relative construction method. It directly uses molded assemble phosphor plasterboard as the undetachable mold plate of on-site irrigation steel bar concrete dense-rib well-shape building roof cover, and uses the bottom plate of assemble phosphor plasterboard as the plaster suspending roof. Compared to present technique, it has lower height, light weight, undetachable phosphor plaster mold plate, easy construction, and sound, heat and fire insulation with lower cost.
Owner:GUIZHOU UNIV

Preparation and application of denitrifying bacteria immobilized fixed-type bioactive fillers based on reticulate carriers

The invention discloses preparation and an application of denitrifying bacteria immobilized fixed-type bioactive fillers based on reticulate carriers, and belongs to the technical field of water treatment. Bioactive fillers each comprise two parts: the carrier and an embedding body; the carrier is a sheet-shaped reticulate carrier formed by taking polyethylene, polyvinyl chloride, polypropylene or ABS resin as a main material, adding a hydrophilic material polyvinyl alcohol and carrying out hot melting or plate hot pressing; an embedding liquid is formed by mixing a polyvinyl alcohol solution and a denitrifying bacteria concentrated solution; the reticulate carrier is evenly coated with the embedding liquid, and the embedding body is formed after boric acid secondary cross-linking curing and is combined with the reticulate carrier to obtain the denitrifying bacteria immobilized bioactive filler. A plurality of bioactive fillers are fixed through a prefabricated frame and are placed in a water treatment reactor. The prepared denitrifying bacteria immobilized fixed-type bioactive fillers have good overall stability and good process property, can establish and maintain flora advantages of denitrifying bacteria in a short period of time, and maintain an efficient denitrification ability of a system.
Owner:BEIJING UNIV OF TECH

Straight-down type display device

The invention discloses a straight-down type display device, and relates to the technical field of display devices. By the straight-down type display device, the thickness of a side edge structure ofthe display device can be reduced, the occupancy ratio of a rear shell is reduced, and an appearance effect is improved. The straight-down type display device comprises the rear shell, a back panel, an intermediate frame, a diffusion plate and a display panel and is characterized in that a first end of the intermediate frame is near to one end of the display panel and is fixed with a side edge ofthe display panel and a side edge of the diffusion plate, a second end of the intermediate frame is near to the other end of the back panel and is fixed with the back panel, the first end of the intermediate frame and the second end of the intermediate frame are connected in an inclination way towards a direction near to the diffusion plate, the rear shell is fixedly arranged at one side, far awayfrom the display panel, of the back panel, and the second end, near to the back panel, of the intermediate frame is connected with the side edge of the rear shell. The straight-down type display device is used for manufacturing the display device.
Owner:HISENSE VISUAL TECH CO LTD

Preparation and application of anaerobic ammonia oxidizing bacteria immobilized star-shaped bioactive filler based on reticulate carrier

The invention discloses an anaerobic ammonia oxidizing bacteria immobilized star-shaped bioactive filler based on a reticulate carrier, and preparation and an application thereof, and belongs to the technical field of water treatment. The bioactive filler comprises two parts: an embedding body and the carrier; the carrier is a reticulate star-shaped carrier formed by taking polyethylene, polyvinyl chloride, polypropylene or ABS resin as a main material, adding polyvinyl alcohol and carrying out hot melting or plate hot pressing; an embedding liquid is formed by mixing an anaerobic ammonia oxidizing bacteria suspension and a polyvinyl alcohol solution and evenly coats the reticulate carrier; the embedding body is formed after boric acid secondary cross-linking immobilization of the embedding liquid and is combined onto the reticulate carrier to obtain the anaerobic ammonia oxidizing bacteria bioactive filler. With a reticulate carrier structure of the prepared bioactive filler, the embedding body can be allowed to penetrate through meshes to form a riveting fixing structure so as to increase the filler overall stability; the filler can still maintain a loose state, problems of blockage, water flow short-out and the like cannot appear, the concentration of anaerobic ammonia oxidizing bacteria on the filler is high, the treatment efficiency of the bioactive filler is high, and the performance is stable.
Owner:湖南汨罗循环经济产业园区科技创新服务中心

Display device and assembling method thereof

A display device is provided, which includes a back cover and a display module. The back cover has a positioning slot. The display module includes a first frame, a panel module and at least hinge bracket. The first frame is fixed to the back cover. The panel module is fixed to the first frame. The hinge bracket is screwless-mounted to the first frame. One end of the hinge bracket is inserted into the positioning slot to fix the display module to the back cover. Besides, a method for assembling a display device is also provided.
Owner:COMPAL ELECTRONICS INC

Chip Package Structure And Packaging Method

Example chip package structure and packaging methods are described. One example chip package structure includes: a redistribution layer (RDL) and a target chip including an active surface and a back surface, where the active surface of the target chip is connected to a first surface of the RDL. The example chip package structure further includes a substrate, where a first surface of the substrate is opposite to the back surface of the target chip. The example chip package structure further includes an interconnection channel that is located around the target chip. One end of the interconnection channel is connected to the first surface of the RDL, and the other end of the interconnection channel is connected to the first surface of the substrate.
Owner:HUAWEI TECH CO LTD

Conductor pattern structure of capacitive touch panel

Disclosed is a conductor pattern structure of a capacitive touch panel. First-axis conductor assemblies and second-axis conductor assemblies are formed on a surface of a substrate. Each first-axis conductor assembly includes a plurality of first-axis conductor cells that are interconnected by first-axis conduction lines. Each second-axis conductor assembly includes a plurality of second-axis conductor cells that are interconnected by second-axis conduction lines. At least part of each first-axis conduction lines is conductive in horizontal direction and insulating in vertical direction and each of the second-axis conduction lines respectively intersects with the at least part of corresponding first-axis conduction lines.
Owner:TPK TOUCH SOLUTIONS (XIAMEN) INC

Ice condensation resistant ultra-thin wearing course pavement and preparation method thereof

ActiveCN104032639ADelayed snow and icingEnsure driving safetyIn situ pavingsSnowpackPolymer modified
The invention discloses an ice condensation resistant ultra-thin wearing course pavement and a preparation method thereof. The ice condensation resistant ultra-thin wearing course pavement is prepared from the following raw materials in parts by weight: 15-17 parts of 10-15 mm gravels, 14-16 parts of 5-10 mm gravels, 11-13 parts of stone chips of which the particle size is smaller than 3 mm, 3-5 parts of ice condensation resistant agents, 2.2-2.6 parts of modified asphalt, and 1.1-1.4 parts of polymer modified emulsified asphalt, wherein the content of sodium chloride in the ice condensation resistant agents is 50-60%, and the solid content of the polymer modified emulsified asphalt is greater than or equal to 65%. According to the invention, ice condensation resistant ultra-thin wearing courses are paved on the pavement, so that the ice point of water in the surface of the pavement is reduced, snow accumulation and icing on the pavement are delayed, a new solution is put forward for solving the problem of the congelation of the pavement in winter is restrained, and safe running on the pavement is ensured.
Owner:广州新粤交通技术有限公司

Flexible substrate and preparation method thereof, color film substrate and display panel

The embodiment of the invention provides a preparation method of a flexible substrate, which comprises the following steps of: providing a hard substrate, and forming a thin film layer on the surfaceof the hard substrate; treating the surface of the thin film layer, so that a hydrophilic region and a hydrophobic region are formed on the surface of the thin film layer, wherein the hydrophilic region or the hydrophobic region comprises a preset black matrix pattern; coating a mixed solution comprising hydrophilic organic polymer and hydrophobic organic polymer on the whole surface of the thin film layer, and forming a flexible substrate layer comprising a transparent region and a black matrix region on the surface of the thin film layer after being subjected to constant temperature treatment and baking treatment; stripping the thin film layer and the hard substrate to obtain the flexible substrate. The preparation method is simple in process, saves the preparation of a prior black matrix, and greatly shortens the process time and the process cost. The invention also provides a flexible substrate, a color film substrate and a display panel.
Owner:TCL CHINA STAR OPTOELECTRONICS TECH CO LTD

Method for reinforcing post-earthquake bridge pier through super-toughening fiber concrete

The invention relates to the field of bridge pier reinforcing, in particular to a method for reinforcing a post-earthquake bridge pier through super-toughening fiber concrete. The damaged bridge pieris supported, failure concrete is chiseled away, a bearing platform face is roughened, and anchoring steel bars and original steel bars are welded; the original steel bars are welded, the anchoring steel bars in the super-toughening fiber concrete are laid, and the anchoring steel bars are welded to the original steel bars; a formwork is mounted, the super-toughening fiber concrete is poured, andafter completion, a vibration platform is adopted for vibration compaction; and the poured super-toughening fiber concrete is cured, after the mechanical index of the concrete meets the design requirement, the formwork is removed, and whole construction is completed. Owing to the fact that the post-earthquake bridge pier is reinforced through the super-toughening fiber concrete, the method has thecharacteristics of being small in thickness of the reinforced structure, large in rigidity, high in toughness, good in interlayer cohesiveness, good in durability and good in fatigue resistance.
Owner:CHANGAN UNIV

Conductor pattern structure of capacitive touch panel

Disclosed is a conductor pattern structure of a capacitive touch panel. First-axis conductor assemblies and second-axis conductor assemblies are formed on a surface of a substrate. Each first-axis conductor assembly includes a plurality of first-axis conductor cells that are interconnected by first-axis conduction lines. An insulation layer is formed on a surface of each first-axis conduction line. Each second-axis conductor assembly includes a plurality of second-axis conductor cells that are interconnected by second-axis conduction lines. Each second-axis conduction line extends across the insulation layer of the associated first-axis conduction line.
Owner:TRENDON TOUCH TECHNOLOGY CORPORATION

Thin touch panel

A thin touch panel includes a transparent substrate with a black bordering around the inner surface of the transparent substrate. A plurality of metal connecting structures, metal guiding lines, transparent insulating structures and a transparent sensing layer are formed on the inner surface, so that the transparent substrate not only provides a touch surface, but also has the touch sensing ability, to decrease the manufacture material and increase the transmittance of the touch panel. Besides, the manufacture of the thin touch panel may not use any optical adhesive to decrease the manufacture cost and improve the yield. Further, the thin touch panel may satisfy the trend of thin design.
Owner:BUWON PRECISION SCI

Low-frequency sound absorption metamaterial

The invention relates to a low-frequency sound absorption metamaterial, and belongs to the technical field of sound absorption metamaterials. The sound absorption metamaterial disclosed by the invention is mainly based on a circuit control theory of a piezoelectric material, a piezoelectric film and a piezoelectric stack are independently regulated and controlled through a piezoelectric film circuit and a piezoelectric stack circuit, and the matching condition of the acoustic resistance and the acoustic reactance can be greatly improved without changes of the geometric configuration and the size. The sound absorption strength, the sound absorption frequency and the sound absorption bandwidth of the sound absorption metamaterial are regulated and controlled, a wide sound absorption frequency range is achieved for sound waves below 300 Hz, and the sound absorption frequency can be regulated within the wide range. The sound absorption metamaterial is small in structural thickness, small in size and high in sound absorption efficiency, and the limitation of a traditional method and a common metamaterial in low-frequency (smaller than or equal to 300 Hz) sound absorption is broken through.
Owner:BEIJING INSTITUTE OF TECHNOLOGYGY

Subminiature integrated servo joint

The invention provides a subminiature integrated servo joint. The subminiature integrated servo joint comprises a subminiature harmonic reducer, a hollow torque motor, a drive unit, a housing, an output acquisition shaft, a pressing plate and a blanking cap. A steel wheel a, a steel wheel b and a roller in the subminiature harmonic reducer form a roller bearing and steel wheel integrated structure, a cam is mounted on the output acquisition shaft in a sleeving manner, the cam and a motor shaft adopt an integrated structure, a motor rotor is installed on the cam, a motor rotor is installed in the housing, and the upper end face of the housing is fixedly connected with the steel wheel a. The drive unit comprises a drive control plate, a coded disc and a coded disc installation plate, the coded disc installation plate is installed at the lower end of the output acquisition shaft, the coded disc is installed on the coded disc installation plate, the pressing plate is installed on the housing, a cylinder boss is machined in the pressing plate to install the drive control plate, and the blanking cap is fixed at the lower end of the housing. The diameter of the servo joint is the diameterof the harmonic reducer, the size is smaller, the structure is simpler, and the mass is lower.
Owner:睿尔曼智能科技(北京)有限公司
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