12results about "Circuit fluid transport" patented technology

The printed circuit board module comprises: a printed circuit board including a first areaand a second area; an electronic component disposed in the first area; and a partition line disposed between the first area and the second area, wherein the partition line is disposed to be stepped with respect to a surface of the printed circuit board.

Described herein are devices, systems, methods, and processes for an efficient liquid cooling system for electronic components mounted on a printed circuit board (PCB). The system utilizes PCB through holes to carry a liquid coolant. The cooling system includes a coolant loop through which a pump circulates the coolant. A cooling sub-assembly includes a cooling channel thermally coupled to the component to be cooled. The cooling sub-assembly further includes a coolant supply PCB through hole that carries the cooled coolant from a supply manifold on the bottom side of the PCB to the cooling channel on the top side of the PCB and a coolant return PCB through hole that carries the heated coolant from the cooling channel to the return manifold on the bottom side of the PCB. The cooling system includes a control system for coolant distribution that can react to component temperatures.

A liquid cooling system comprising a printed circuit board, a gasket seated on a top side of the printed circuit board gasket encircling one or more components on the printed circuit board, an enclosure on the gasket and fastened against the printed circuit board to form a sealed chamber, and a transfer liquid within the sealed chamber contacting one or more components mounted on the printed circuit board to provide cooling for the one or more components.

A substrate structure includes a frame body, a cooling housing, and a first chip. The frame body includes a first wall plate and a second wall plate that are disposed at a spacing. An accommodation cavity is formed between the first wall plate and the second wall plate. The cooling housing is at least partially disposed in the accommodation cavity, and is fastened to the frame body. A cooling cavity is formed between the cooling housing and the second wall plate. The first chip is disposed in the cooling cavity, and is connected to the second wall plate. The cooling cavity is configured to be filled by cooling fluid that immerses the first chip. The first chip is mounted in the substrate structure in a form of chip embedding. The cooling housing in the frame body forms the cooling cavity for circulating the cooling fluid.

A device may include a plurality of power chips arranged in a first row in a first plane and being electrically coupled to a printed circuit board, the first plane being non-parallel to a plane of the printed circuit board. A device may include a plurality of power chips arranged in a second row in a second plane and being electrically coupled to the printed circuit board, the second plane being non-parallel to the plane of the printed circuit board and non-parallel to the first plane.

A composite circuit board structure has a component bonding area and a circuit layout area. The composite circuit board structure includes a glass substrate, a conductive circuit, a bottom substrate, a liquid-cooled heat-conducting channel structure, and a heat conduction structure. The conductive circuit is arranged on the upper surface of the glass substrate and distributed within the component bonding area and the circuit layout area. The bottom substrate is arranged on the lower surface of the glass substrate. The liquid-cooled heat-conducting channel structure is arranged in the glass substrate or the bottom substrate. One end of the liquid-cooled heat-conducting channel structure is connected to the coolant inlet, and another end of the liquid-cooled heat-conducting channel structure is connected to the coolant outlet, for allowing circulation of a cooling liquid therethrough. The heat conduction structures are arranged in the glass substrate and separated from the liquid-cooled heat-conducting channel structure.

A thermal test chip assembly includes a printer wiring board or substrate, a vertical stack of thermal test chips and optionally functional chips, and an interconnection means between the chips and the wiring board. A thermal test chip with non-uniform thickness includes a semiconductor substrate, and at least one resistor and at least one diode fabricated on the substrate. Variable non-uniform thicknesses and material deletion regions are employed to emulate the thermal characteristics of a stacked die configuration. Unit cells enable thermal test chips of predetermined size and power arrayed in m x n combinations. Thermal assemblies including vertical die stacks are emulated, and thermal test sets including support equipment are disclosed.

The assembly includes a printed circuit board (PCB) having a first surface and a second surface, at least one energy transmitter mounted to the first surface, and at least one cooling element coupled to the second surface of the PCB, the cooling element configured to cool the at least one energy transmitter via the PCB.

An electronic device includes a first PCB, a second PCB, an interposer disposed between a first peripheral portion of the first PCB and a second peripheral portion of the second PCB, and one or more electronic components disposed in an internal space defined by a rear side of the first PCB, a front side of the second PCB, and an inner side of the interposer. The first PCB defines a first through hole positioned in the first peripheral portion, and the interposer defines a second through hole connected to the first through hole.

Method (100) of manufacturing a product, the method comprising: melting (104) a solid metal material to obtain a molten metal material; applying (108) the molten metal material onto a polymer structure deformable by applying heat and / or pressure, wherein the molten metal material solidifies upon coming into contact with the polymer structure so as to form metallic structures of customizable shape and structure; and three-dimensional deforming (112) the polymer structure including the metallic structures by providing heat and / or pressure to the polymer structure including the metallic structures so as to obtain a specific shape.