75results about "Circuit fluid transport" patented technology

The invention discloses a chip packaging module structure and an electronic product, and relates to the technical field of chip packaging, the chip packaging module structure comprises a PCB, an insulating substrate, a first radiator and a second radiator; the insulation substrate is arranged on the PCB, the insulation substrate is provided with a first side and a second side, the insulation substrate is provided with a first chip in an integrated mode, the first chip is located on the second side of the insulation substrate, the insulation substrate is provided with a plurality of via holes penetrating through the first side and the second side, metal is arranged in each via hole, at least part of the via holes are conductive holes, and the first chip is arranged on the first side of the insulation substrate. The metal in the conductive hole is used as a part of an electric connection structure between the PCB and the plurality of chips; the first radiator is in thermal conduction connection with the first chip; the second radiator is arranged on the other side of the PCB, and a longitudinal heat conduction structure is formed between the second radiator and the first chip, so that the second radiator is in heat conduction connection with the first chip; the technical scheme provided by the invention aims to improve the heat dissipation efficiency.

The printed circuit board module comprises: a printed circuit board including a first areaand a second area; an electronic component disposed in the first area; and a partition line disposed between the first area and the second area, wherein the partition line is disposed to be stepped with respect to a surface of the printed circuit board.

Described herein are devices, systems, methods, and processes for an efficient liquid cooling system for electronic components mounted on a printed circuit board (PCB). The system utilizes PCB through holes to carry a liquid coolant. The cooling system includes a coolant loop through which a pump circulates the coolant. A cooling sub-assembly includes a cooling channel thermally coupled to the component to be cooled. The cooling sub-assembly further includes a coolant supply PCB through hole that carries the cooled coolant from a supply manifold on the bottom side of the PCB to the cooling channel on the top side of the PCB and a coolant return PCB through hole that carries the heated coolant from the cooling channel to the return manifold on the bottom side of the PCB. The cooling system includes a control system for coolant distribution that can react to component temperatures.

The present application relates to the technical field of heat dissipation apparatuses, and discloses a heat dissipation apparatus. The heat dissipation apparatus comprises: an apparatus main body, a water inlet, a water outlet, a jet chamber, and a heat dissipation chamber, which are arranged inside the apparatus main body; the jet chamber is provided at a position corresponding to a projection of the water inlet inside the apparatus main body; the water inlet is in communication with the jet chamber; the jet chamber is located between the water inlet and the heat dissipation chamber; an inner wall of the jet chamber is provided with a plurality of circumferentially arrayed jet flow holes; and the jet chamber is configured for introducing a heat dissipation medium, entering through the water inlet, into the heat dissipation chamber by means of the jet flow holes. The present application achieves longitudinal-to-transverse transport of a heat dissipation medium by means of a process in which a heat dissipation medium enters a jet chamber through a water inlet and is then introduced into a heat dissipation chamber. This facilitates uniform fluid distribution of the heat dissipation medium, and fully leverages the heat-removal capability of the heat dissipation medium, thereby improving the overall temperature uniformity of the heat dissipation apparatus and enhancing convective heat transfer capacity.

To provide a flexible substrate and a bus bar module that can increase the moisture resistance of the joints between an electronic component and a conductor circuit while suppressing losses in manufacturing yield.SOLUTION: A flexible substrate 1 includes an electronic component 10, a base film 21, a conductor circuit 22, and a coverlay 23. The electronic component 10 has electrodes 12a, 12b. The conductor circuit 22 is formed on a second surface (vertically lower surface) 21b of the base film 21, and has a bonding region 30 where the electrodes 12a, 12b are bonded using a bonding material. The coverlay 23 covers at least a portion of the second surface (vertically lower surface) 22b of the conductor circuit 22, and has an opening 24a that exposes the bonding region 30 to the outside.SELECTED DRAWING: Figure 2

The invention relates to a method (100) for manufacturing a multilayer composite article (10) with an integrated conductor arrangement (20). It is proposed to position a displacement body (30) on a carrier layer (12) of the multilayer composite article (10) on which the conductor arrangement (20) is positioned, such that when the cover layer (13) is applied to the carrier layer (12) in a predetermined layer thickness (a), a section of the cover layer (13) applied to the displacement body (30) is so thin that the position of the displacement body (30) in the multilayer composite article is haptically and / or visually discernible from the outside.

A printed circuit board holder for use in a rotational application including the printed circuit board holder configured to be mechanically affixed at an interior diameter surface to a rotor shaft of an electric motor having at least one fluid channel running from an interior diameter surface to an exterior diameter surface, a printed circuit board mechanically affixed to a planar surface of the holder wherein the printed circuit board has a thermally conductive layer in contact with the printed circuit board holder, a component mounted to the printed circuit board such that the component is positioned over the at least one fluid channel and wherein a thermal energy generated by the component is thermally conducted from the component to a fluid within the at least one fluid channel via the thermally conductive layer.

Methods, systems, and devices for duct structures for cooling of memory system components are described. For example, a memory system may include multiple memory devices in a first region of the memory system. The memory system may also include circuitry within a second region of the memory system, which may be associated with management of memory device operations. In some examples, the circuitry may be associated with a high operating temperature. The memory system may also include one or more physical ducts made of a material associated with a thermal conductivity that is less than a thermal conductivity of one or more other materials in the memory system. The one or more physical ducts may extend, over a third region of the memory system and between the circuitry and a region associated with a temperature that is less than the operating temperature of the circuitry.

A liquid cooling system comprising a printed circuit board, a gasket seated on a top side of the printed circuit board gasket encircling one or more components on the printed circuit board, an enclosure on the gasket and fastened against the printed circuit board to form a sealed chamber, and a transfer liquid within the sealed chamber contacting one or more components mounted on the printed circuit board to provide cooling for the one or more components.

Central processing units, integrated circuits, power transistors, voltage regulators, load switches, and other components generate heat during operation. These components must be properly cooled to maintain optimal performance and prevent failure. [Solution] The liquid cooling system comprises a printed circuit board 240, a gasket 230 seated on the upper side of the printed circuit board surrounding one or more components (IC chips) on the printed circuit board, a housing 220 located on the gasket and fastened to the printed circuit board to form a sealing chamber, and a transfer liquid in the sealing chamber that contacts one or more components mounted on the printed circuit board and provides cooling to one or more components.

A system includes a power conversion unit, wherein the power conversion unit includes: a power module; and a first cooling module configured to extract heat from the power module, wherein the power module includes: a printed circuit board; and a switching power device embedded within the printed circuit board, wherein the first cooling module is directly attached to a first end of the printed circuit board.

The present disclosure relates to a method for manufacturing a printed circuit board having an embedded cooling cavity. The method includes processing a portion of a soluble material to form a pattern; plating the pattern; filling the plating pattern with an electrically insulating material; and removing the remaining soluble material with a solvent to form a cooling cavity.

A substrate structure includes a frame body, a cooling housing, and a first chip. The frame body includes a first wall plate and a second wall plate that are disposed at a spacing. An accommodation cavity is formed between the first wall plate and the second wall plate. The cooling housing is at least partially disposed in the accommodation cavity, and is fastened to the frame body. A cooling cavity is formed between the cooling housing and the second wall plate. The first chip is disposed in the cooling cavity, and is connected to the second wall plate. The cooling cavity is configured to be filled by cooling fluid that immerses the first chip. The first chip is mounted in the substrate structure in a form of chip embedding. The cooling housing in the frame body forms the cooling cavity for circulating the cooling fluid.

An inlay for a component carrier includes a gas-permeable porous layer structure, an upper layer structure, arranged on the gas-permeable porous layer structure, the upper layer structure defining a cavity such that a portion of the gas-permeable porous layer structure is exposed and an upper metal layer structure arranged on the upper layer structure. A component carrier with the inlay and manufacturing methods of the inlay and the component carrier are described.

Method for manufacturing a semiconductor unit (100) for a power converter, the method comprising a step of providing a printed circuit board apparatus comprising a printed circuit board (108) in which a power semiconductor (104) arranged on a substrate (102) is embedded, a step of removing a part of the printed circuit board (108) in order to at least partially expose a side of the substrate (102) facing away from the power semiconductor (104), and a step of forming a coolant guide structure (106) for guiding a liquid coolant in the substrate (102) starting from the side of the substrate (102) facing away from the power semiconductor (104).

A wave soldering device, a manufacturing method thereof and a printed circuit board are provided. The wave soldering device includes: a substrate including a front surface and a back surface opposite to each other; a target hole group including a pad through-hole, a plurality of pad through-holes are provided and distributed at intervals along a first direction, the plurality of pad through-holes penetrate through the front surface and the back surface of the substrate; a virtual hole group including a virtual hole, a plurality of virtual holes are provided, the plurality of virtual holes penetrate through the back surface of the substrate, the plurality of virtual holes are located on the same side of the plurality of pad through-holes in a one-to-one correspondence, a diameter of the virtual hole is less than a diameter of the pad through-hole.

The invention relates to the field of printed circuit boards, in particular to a printed circuit board with a microchannel, which comprises a first solder mask layer, a second solder mask layer, a first electric copper layer arranged on the first solder mask layer, a second electric copper layer arranged on the second solder mask layer, and an insulating base layer arranged between the first electric copper layer and the second electric copper layer, according to the invention, a three-dimensional channel network is formed in the insulating base layer in a bonding state through cooperation of the main channel, the branch capillary channels and the vertical communicating holes, so that heat of the whole insulating base layer is fully dissipated, and direct mounting of a GaN power device with a heat flux of 35W / cm < 2 > can be supported; and meanwhile, the multiplexing structure of the vertical communicating holes reduces the aperture ratio of the insulating base plate body, the problem that the mechanical strength is reduced due to the fact that heat dissipation holes and electrical holes are independently formed in a traditional scheme is avoided, cooling working media generate vortexes in a main channel and branch capillary channels through particles, the convection coefficient is increased, and efficient and low-resistance heat dissipation is achieved.

Methods for the production of electrically conductive structures on membranes and cell culture systems based thereon, equipped with sensors, comprising the steps - Providing a plastic film which has at least one adhesive surface, e.g. having an adhesive layer on one side, wherein the plastic film preferably rests on a substrate, e.g. paper or plastic, - Providing a plan (layout) for electrically conductive structures, - Removing areas from the plastic film where the electrically conductive structures are arranged according to the plan, e.g. by laser irradiation of the plastic film along the electrically conductive structures of the plan, in order to produce a plastic film with perforations according to the electrically conductive structures of the plan, - Applying the plastic film with perforations according to the electrically conductive structures of the plan onto a membrane, so that the plastic film adheres to the membrane with adhesive, - Sputtering conductive material onto the plastic film to apply conductive material to the plastic film and, through its perforations, to the membrane, - Removing the plastic film from the membrane to produce a membrane with electrically conductive structures attached to it.

The invention discloses a chip packaging module structure, and relates to the technical field of optical communication and photoelectric co-packaging, and the chip packaging module structure comprises a circuit board, an insulating substrate, a photonic integrated chip and an optical array assembly. Wherein the insulating substrate is arranged on one side of the circuit board; the photonic integrated chip is arranged on the insulating substrate, and the photonic integrated chip is provided with an optical waveguide; the optical fiber array assembly is supported on the substrate or the circuit board, and the optical fiber array assembly can move relative to the insulating substrate so as to be in butt joint with the connecting port of the optical waveguide for optical coupling; wherein a connecting port of the optical waveguide is directly or indirectly laterally exposed out of the periphery of the insulating substrate; according to the invention, by optimizing the layout and integration mode of the photonic integrated chip and the electronic integrated chip on the glass insulation substrate, the problem that the output end of the photonic integrated chip is polluted is avoided, and meanwhile, the convenience and coupling efficiency of optical interconnection are effectively improved.

Provided is a control device including a printed wiring board in consideration of heat dissipation of a power supply IC. In the control device (60), a transformer (41) forms a heat dissipation space (450) with a first surface (51a) of the printed wiring board (51), and is mounted on the first surface (51a). Furthermore, the power supply IC (43) is mounted on a second surface (51b) of the printed wiring board (51) so as to face at least a part of the transformer (41). Further, the printed wiring board (51) has a plurality of vent holes (511) at locations facing the transformer (41) and at locations facing the power supply IC (43), the plurality of vent holes (511) leading to the heat dissipation space 450.

The invention provides an electronic device and a chip protector thereof. The electronic device comprises a circuit board and a chip protector. The circuit board is provided with a board surface, and the board surface is provided with a chip and an electronic element. The chip protection patch comprises a base layer, an elastic layer and a protection layer. The base layer has a first surface, a second surface and a first opening. The elastic layer is stacked on the first surface. The elastic layer comprises a first bonding surface, an outer surface and a second opening part. The first bonding surface is bonded to the first surface. The protective layer is stacked on the second surface. The protective layer comprises a second bonding surface, an attaching surface and a third opening part. The second bonding surface is bonded to the second surface. The first opening part, the second opening part and the third opening part are mutually overlapped to form a chip accommodating space. The attaching surface of the chip protection paster is attached to the board surface, the attaching surface covers the electronic component, and the chip is located in the chip containing space.

A method of manufacturing a heat sink-integrated power module substrate according to an embodiment of the present disclosure may include preparing a ceramic heat sink, forming a pattern of a conductive material on a top surface of the ceramic heat sink, and forming an electrode pattern by firing the conductive material. Here, the pattern of the conductive material may be formed on the top surface of the ceramic heat sink using screen printing.

A heat exchanger includes a stack of channel plates including first and second channel plates alternately stacked on one another such that fluids A and B are heat-exchanged each other. The first channel plate has a fluid path for fluid A on one surface thereof, wherein inflow and outflow parts for fluid A are formed on the fluid path for fluid A, and the second channel plate has a fluid path for fluid B intersecting with the fluid path for fluid A on one surface thereof. The first channel plate has communicating structures corresponding to the inflow and outflow parts for fluid B. The heat exchanger also includes an upper plate section attached to an upper surface of the stack, and a lower plate section attached to an undersurface of the stack.

Methods, systems, and devices for duct structures for cooling of memory system components are described. For example, a memory system may include multiple memory devices in a first region of the memory system. The memory system may also include circuitry within a second region of the memory system, which may be associated with management of memory device operations. In some examples, the circuitry may be associated with a high operating temperature. The memory system may also include one or more physical ducts made of a material associated with a thermal conductivity that is less than a thermal conductivity of one or more other materials in the memory system. The one or more physical ducts may extend, over a third region of the memory system and between the circuitry and a region associated with a temperature that is less than the operating temperature of the circuitry.

A liquid circulating cooling package substrate includes a circulating cooling structure including a cooling chamber in a first dielectric layer to expose a heat dissipation face, a metal heat dissipation layer on the inner surface of the cooling chamber, an upright support column formed on a metal heat dissipation layer, and a cooling cover supported on the support column to close the cooling chamber along the periphery of the cooling chamber. The metal heat dissipation layer completely covers the heat dissipation face and the inner side surface of the cooling chamber, and a liquid inlet and a liquid outlet are formed on the cooling cover. A circulating cooling structure is provided in the first dielectric layer, and the circulating cooling structure is formed during the processing of an embedded package substrate such that the processing flow is simple and the cost is low.

The present invention relates to a method for manufacturing a multilayer ceramic substrate having a cooling system, which includes a preparation operation of preparing a plurality of ceramic sheets formed by sintering ceramic green sheets, wherein the plurality of ceramic sheets include a first ceramic sheet and a second ceramic sheet; a via hole forming operation of forming a via hole in the ceramic sheets; a via electrode forming operation of forming a via electrode in the via hole; a pattern electrode forming operation of forming a pattern electrode on one surface of the ceramic sheets; a bonding layer forming operation of forming a bonding layer by coating one surface of the ceramic sheets with a bonding agent; a cover part processing operation of bonding and laminating a plurality of first ceramic sheets to each other, processing the first ceramic sheets, and forming an inlet into which a fluid is introduced and an outlet through which the fluid is discharged; an accommodation part processing operation of bonding and laminating a plurality of second ceramic sheets to each other, processing the second ceramic sheets, and forming a fluid accommodation space; and a bonding operation of bonding the laminated first ceramic sheets and the laminated second ceramic sheets to each other.According to the present invention, since an interposer provided with a processing chip and / or a memory chip is installed in a fluid accommodation space formed inside the multilayer ceramic substrate, the corresponding chip can be effectively cooled, and heat generated from the corresponding chip can be prevented from being transferred to the multilayer ceramic substrate.

A device may include a plurality of power chips arranged in a first row in a first plane and being electrically coupled to a printed circuit board, the first plane being non-parallel to a plane of the printed circuit board. A device may include a plurality of power chips arranged in a second row in a second plane and being electrically coupled to the printed circuit board, the second plane being non-parallel to the plane of the printed circuit board and non-parallel to the first plane.

A composite circuit board structure has a component bonding area and a circuit layout area. The composite circuit board structure includes a glass substrate, a conductive circuit, a bottom substrate, a liquid-cooled heat-conducting channel structure, and a heat conduction structure. The conductive circuit is arranged on the upper surface of the glass substrate and distributed within the component bonding area and the circuit layout area. The bottom substrate is arranged on the lower surface of the glass substrate. The liquid-cooled heat-conducting channel structure is arranged in the glass substrate or the bottom substrate. One end of the liquid-cooled heat-conducting channel structure is connected to the coolant inlet, and another end of the liquid-cooled heat-conducting channel structure is connected to the coolant outlet, for allowing circulation of a cooling liquid therethrough. The heat conduction structures are arranged in the glass substrate and separated from the liquid-cooled heat-conducting channel structure.

The present application relates to a kind of printed board devices embedded in component heat dissipation structure, including fluid connector, upper printed board, cooling liquid flow channel plate, lower printed board;The upper surface of lower printed board is provided with recess, and cooling liquid flow channel plate is horizontally installed in the recess;Upper printed board is assembled on lower printed board, and the lower surface of upper printed board is closely attached to the upper surface of lower printed board and the upper surface of cooling liquid flow channel plate, and upper and lower printed board are fixed by adhesive material PP glue and press-fit mode between, and the electrical signal connection of the contact position of upper and lower printed board is realized by metal pad;Fluid connector is installed on the upper surface of upper printed board and fixed between cooling liquid flow channel plate and lower printed board.The present application uses the way of printed board embedded cooling liquid flow channel plate heat dissipation, so that instrument equipment space structure arrangement is more tight, occupies smaller space, more suitable for the development and design of precision instrument equipment, solve the problem of larger space occupied by traditional heat dissipation mode.

A soft and stretchable microelectrode array (sMEA) including a first circuit board having a first though hole; a second circuit board having a second through hole; a microelectrode array including a plurality of microelectrodes embedded in an elastomeric substrate, wherein the microelectrode array is disposed between the first and second printed circuit boards, and includes an exposed portion corresponding the first and second through holes; a plurality of contact pads formed on a top or bottom surface of the first printed circuit board and electrically connected to the plurality of microelectrodes; and a culture well mounted on the first printed circuit board and encompassing the first through hole. Further, the exposed portion of the microelectrode array includes a 3D pocket lined with stretched microelectrodes for electrically stimulating and recording signals from an organoid placed in the 3D pocket.