160results about "Circuit fluid transport" patented technology

The invention belongs to the technical field of optical communication, and relates to a miniature capillary heat conductor, miniature high-heat-density equipment and a heat conductor installation method, and the heat conductor comprises a shell and a heat conduction module packaged in the shell; the heat conduction module comprises a first heat conduction block, a second heat conduction block, a third heat conduction block and a fourth heat conduction block, each of the first heat conduction block, the second heat conduction block, the third heat conduction block and the fourth heat conduction block comprises a plurality of layers of microcirculation units, and each microcirculation unit is filled with a phase change working medium; the microcirculation unit comprises a heat absorption area, an evaporation area and a heat dissipation area which are communicated in sequence, the heat absorption area is used for making contact with the back face of the chip to conduct heat, the evaporation area extends downwards and outwards from the heat absorption area to the heat dissipation area, the heat dissipation area is used for dissipating heat to the back face of the PCB, the area of the heat dissipation area is larger than that of the heat absorption area, and the heat dissipation area is located on the outer side of the heat absorption area; the beneficial effect of the invention is that the technical problem that the heat conduction efficiency is not ideal because the existing optical module conducts heat through the PCB via hole on the back of the chip is solved.

Disclosed are a vibration sensor, an electronic device and a vibration detection method. The vibration sensor comprises a circuit board assembly, a housing, a chip assembly, a vibration-pickup assembly and a through-hole. A back cavity is formed inside the circuit board assembly, the housing is mounted over the circuit board assembly, and the chip assembly is provided on a side of the circuit board assembly proximate to the housing and is electrically connected to the circuit board assembly. The vibration-pickup assembly is provided inside the cavity and dividing the cavity into a first cavity and a second cavity. The through-hole of the vibration sensor may be in communication with the back cavity and the second cavity.

The invention discloses a chip packaging module structure and an electronic product, and relates to the technical field of chip packaging, the chip packaging module structure comprises a PCB, an insulating substrate, a first radiator and a second radiator; the insulation substrate is arranged on the PCB, the insulation substrate is provided with a first side and a second side, the insulation substrate is provided with a first chip in an integrated mode, the first chip is located on the second side of the insulation substrate, the insulation substrate is provided with a plurality of via holes penetrating through the first side and the second side, metal is arranged in each via hole, at least part of the via holes are conductive holes, and the first chip is arranged on the first side of the insulation substrate. The metal in the conductive hole is used as a part of an electric connection structure between the PCB and the plurality of chips; the first radiator is in thermal conduction connection with the first chip; the second radiator is arranged on the other side of the PCB, and a longitudinal heat conduction structure is formed between the second radiator and the first chip, so that the second radiator is in heat conduction connection with the first chip; the technical scheme provided by the invention aims to improve the heat dissipation efficiency.

Methods, apparatus, systems, and articles of manufacture are disclosed to cool electronic devices. An example thermal solution to cool an electronic device Includes a first cooling plate at a first side of a printed circuit board and a second cooling plate at a second side of the printed circuit board, the second side opposite the first side. The second cooling plate is fluidically coupled with the first cooling plate.

Some embodiments relate to an integrated circuit cooling system including: an impingement coolant block overlying a semiconductor die; an inlet opening in the impingement coolant block and coupled to an inlet; a plurality of tubes extending in a first direction directly beneath the inlet opening and having first ends and second ends, where the plurality of tubes are respectively centered on first axes; a plurality of valves coupling the first ends of the plurality of tubes to the inlet opening; a plurality of impingement openings within the impingement coolant block and respectively surrounding the second ends of the second plurality of tubes, where the plurality of impingement openings are respectively centered on the first axes; and an outlet opening within the impingement coolant block and between the inlet opening and the plurality of impingement openings, the outlet opening physically coupling the plurality of impingement openings to an outlet.

The invention provides a circuit board assembly and an electronic device, the circuit board assembly comprises a board main body and at least one chip, the board main body comprises a first surface and a second surface which are opposite, the first surface comprises at least one chip area, each chip is arranged on the corresponding chip area, and a power pin of a core area of the chip is fanned out through a via hole in the corresponding chip area. A plurality of liquid cooling channels corresponding to the chips are arranged in the plate body, and heat generated by the chips is rapidly absorbed by cooling media filled in the liquid cooling channels. The problem that the high integration level and the heat dissipation design of the circuit board assembly related to the high-power chip and the electronic equipment are difficult to be compatible is solved, the integration level and the miniaturization of the circuit board assembly and the electronic equipment are improved, and the production cost is further reduced.

A showerhead for a processing chamber includes a faceplate with a plurality of openings. A plurality of compartments are recessed into a top surface of the faceplate. The showerhead includes a plurality of MEMS devices. Each MEMS device is disposed in a corresponding compartment of the plurality of compartments. A printed circuit board including a plurality of ports therethrough is coupled to each MEMS device. Each MEMS device is configured to regulate a gas flow into each corresponding compartment through a corresponding port of the plurality of ports in the printed circuit board.

The automatic cleaning device includes a moving platform, a circuit board including a circuit board body mounted on the moving platform and having an intermediate region and an edge region surrounding the intermediate region, an interface device mounted on the circuit board body and located in the edge region, and an electronic device mounted on the circuit board body and located in the intermediate region, and a blocking rib disposed between the interface device and the electronic device and configured to prevent liquid and / or moisture from contacting the electronic device.

The printed circuit board module comprises: a printed circuit board including a first areaand a second area; an electronic component disposed in the first area; and a partition line disposed between the first area and the second area, wherein the partition line is disposed to be stepped with respect to a surface of the printed circuit board.

Described herein are devices, systems, methods, and processes for an efficient liquid cooling system for electronic components mounted on a printed circuit board (PCB). The system utilizes PCB through holes to carry a liquid coolant. The cooling system includes a coolant loop through which a pump circulates the coolant. A cooling sub-assembly includes a cooling channel thermally coupled to the component to be cooled. The cooling sub-assembly further includes a coolant supply PCB through hole that carries the cooled coolant from a supply manifold on the bottom side of the PCB to the cooling channel on the top side of the PCB and a coolant return PCB through hole that carries the heated coolant from the cooling channel to the return manifold on the bottom side of the PCB. The cooling system includes a control system for coolant distribution that can react to component temperatures.

The present application relates to the technical field of heat dissipation apparatuses, and discloses a heat dissipation apparatus. The heat dissipation apparatus comprises: an apparatus main body, a water inlet, a water outlet, a jet chamber, and a heat dissipation chamber, which are arranged inside the apparatus main body; the jet chamber is provided at a position corresponding to a projection of the water inlet inside the apparatus main body; the water inlet is in communication with the jet chamber; the jet chamber is located between the water inlet and the heat dissipation chamber; an inner wall of the jet chamber is provided with a plurality of circumferentially arrayed jet flow holes; and the jet chamber is configured for introducing a heat dissipation medium, entering through the water inlet, into the heat dissipation chamber by means of the jet flow holes. The present application achieves longitudinal-to-transverse transport of a heat dissipation medium by means of a process in which a heat dissipation medium enters a jet chamber through a water inlet and is then introduced into a heat dissipation chamber. This facilitates uniform fluid distribution of the heat dissipation medium, and fully leverages the heat-removal capability of the heat dissipation medium, thereby improving the overall temperature uniformity of the heat dissipation apparatus and enhancing convective heat transfer capacity.

The present invention presents a method of fabrication for a physiological sensor with electronic, electrochemical, and chemical components. The fabrication method comprises steps for manufacturing an apparatus comprising at least one electrochemical sensor, a microcontroller, and a transceiver. The fabrication process includes the steps of substrate fabrication, circuit fabrication, pick and place, reflow soldering, electrode fabrication, membrane fabrication, sealing and curing, layer bonding, and dressing. The physiological sensor is operable to analyze biological fluids such as sweat.

To provide a flexible substrate and a bus bar module that can increase the moisture resistance of the joints between an electronic component and a conductor circuit while suppressing losses in manufacturing yield.SOLUTION: A flexible substrate 1 includes an electronic component 10, a base film 21, a conductor circuit 22, and a coverlay 23. The electronic component 10 has electrodes 12a, 12b. The conductor circuit 22 is formed on a second surface (vertically lower surface) 21b of the base film 21, and has a bonding region 30 where the electrodes 12a, 12b are bonded using a bonding material. The coverlay 23 covers at least a portion of the second surface (vertically lower surface) 22b of the conductor circuit 22, and has an opening 24a that exposes the bonding region 30 to the outside.SELECTED DRAWING: Figure 2

Described herein are devices, systems, methods, and processes for an efficient liquid cooling system for electronic components mounted on a printed circuit board (PCB). The system utilizes PCB through holes to carry a liquid coolant. The cooling system includes a coolant loop through which a pump circulates the coolant. A cooling sub-assembly includes a cooling channel thermally coupled to the component to be cooled. The cooling sub-assembly further includes a coolant supply PCB through hole that carries the cooled coolant from a supply manifold on the bottom side of the PCB to the cooling channel on the top side of the PCB and a coolant return PCB through hole that carries the heated coolant from the cooling channel to the return manifold on the bottom side of the PCB. The cooling system includes a control system for coolant distribution that can react to component temperatures.

The invention relates to a method (100) for manufacturing a multilayer composite article (10) with an integrated conductor arrangement (20). It is proposed to position a displacement body (30) on a carrier layer (12) of the multilayer composite article (10) on which the conductor arrangement (20) is positioned, such that when the cover layer (13) is applied to the carrier layer (12) in a predetermined layer thickness (a), a section of the cover layer (13) applied to the displacement body (30) is so thin that the position of the displacement body (30) in the multilayer composite article is haptically and / or visually discernible from the outside.

A printed circuit board holder for use in a rotational application including the printed circuit board holder configured to be mechanically affixed at an interior diameter surface to a rotor shaft of an electric motor having at least one fluid channel running from an interior diameter surface to an exterior diameter surface, a printed circuit board mechanically affixed to a planar surface of the holder wherein the printed circuit board has a thermally conductive layer in contact with the printed circuit board holder, a component mounted to the printed circuit board such that the component is positioned over the at least one fluid channel and wherein a thermal energy generated by the component is thermally conducted from the component to a fluid within the at least one fluid channel via the thermally conductive layer.

Methods, systems, and devices for duct structures for cooling of memory system components are described. For example, a memory system may include multiple memory devices in a first region of the memory system. The memory system may also include circuitry within a second region of the memory system, which may be associated with management of memory device operations. In some examples, the circuitry may be associated with a high operating temperature. The memory system may also include one or more physical ducts made of a material associated with a thermal conductivity that is less than a thermal conductivity of one or more other materials in the memory system. The one or more physical ducts may extend, over a third region of the memory system and between the circuitry and a region associated with a temperature that is less than the operating temperature of the circuitry.

A liquid cooling system comprising a printed circuit board, a gasket seated on a top side of the printed circuit board gasket encircling one or more components on the printed circuit board, an enclosure on the gasket and fastened against the printed circuit board to form a sealed chamber, and a transfer liquid within the sealed chamber contacting one or more components mounted on the printed circuit board to provide cooling for the one or more components.

Provided is a control device that comprises a printed wiring board and takes into account the dissipation of heat from a power supply IC. A control device (60) has a transformer (41) that is mounted on a first surface (51a) of a printed wiring board (51) such that a heat dissipation space (450) is formed between the transformer (41) and the first surface (51a). A power supply IC (43) is mounted on a second surface (51b) of the printed wiring board (51) so as to be opposite at least a portion of the transformer (41). The printed wiring board (51) has a plurality of ventilation holes (511) that lead to the heat dissipation space 450 at locations that are opposite the transformer (41) and locations that are opposite the power supply IC (43).

Central processing units, integrated circuits, power transistors, voltage regulators, load switches, and other components generate heat during operation. These components must be properly cooled to maintain optimal performance and prevent failure. [Solution] The liquid cooling system comprises a printed circuit board 240, a gasket 230 seated on the upper side of the printed circuit board surrounding one or more components (IC chips) on the printed circuit board, a housing 220 located on the gasket and fastened to the printed circuit board to form a sealing chamber, and a transfer liquid in the sealing chamber that contacts one or more components mounted on the printed circuit board and provides cooling to one or more components.

A system includes a power conversion unit, wherein the power conversion unit includes: a power module; and a first cooling module configured to extract heat from the power module, wherein the power module includes: a printed circuit board; and a switching power device embedded within the printed circuit board, wherein the first cooling module is directly attached to a first end of the printed circuit board.

The present disclosure describes a printed circuit board with a built-in vapor chamber. A printed circuit board (PCB) includes a plurality of substrate layers. The PCB includes a first laminate including a hot region of the vapor chamber configured to absorb heat from at least one component coupled to an outermost substrate of the PCB. The PCB also includes a second laminate including a cold region of the vapor chamber, the cold region configured to condense the substrate. Further, the PCB includes an intermediate laminate between the first laminate and the second laminate, the intermediate laminate including a vapor chamber.

The present disclosure relates to a method for manufacturing a printed circuit board having an embedded cooling cavity. The method includes processing a portion of a soluble material to form a pattern; plating the pattern; filling the plating pattern with an electrically insulating material; and removing the remaining soluble material with a solvent to form a cooling cavity.

The invention discloses a flexible circuit board and a manufacturing method thereof. The flexible circuit board comprises a circuit substrate and a covering film, the covering films are arranged on a first surface and a second surface, which are opposite to each other, of the circuit substrate; the circuit substrate comprises a valid circuit area and an invalid circuit area; a copper layer is arranged between the invalid circuit area and the covering film; the copper layer is provided with a glue guide groove used for communicating the effective circuit area with the external environment. According to the invention, through structure optimization, high-efficiency exhaust and gummosis in the circuit board pressing process can be completed without drilling.

A heatsink (10) assembly comprising a substrate (11) having an active circuitry, at least one cavity (11c) located adjacent to at least one heat producing element (11a) of the active circuitry, at least one vessel (13) sealably coupled to said substrate in fluid communication with the at least one cavity (11c), and a phase change material (PCM) (14) contained inside the vessel (13). The vessel (13) and at least one cavity (11c) configured to facilitate migration of the PCM (14) from the vessel (13) into the at least one cavity (11c) for absorbing heat produced by the at least one heat producing element (11c) of the active circuitry.

An assembly including:a printed circuit board (PCB) having a first surface and a second surface;at least one energy transmitter mounted on the first surface;at least one cooling element associated with the PCB second surface, wherein the cooling element is configured to cool the at least one energy transmitter via the PCB.

The invention relates to a recyclable assembly (10; 10a) comprising a carrier element (15; 15a) which is connected to components (1 to 6) in the region of connection points (18), and comprising at least one volume-variable expansion element (25; 25a) which is designed to occupy a first volume in a first state and a second volume which is larger than the first volume in a second state, wherein the at least one expansion element (25; 25a) has at least one chamber (G, H; J) and / or at least one channel (A to E) which can be filled with a pressurized gaseous, liquid or solid medium (M) to form the second state.

A substrate structure includes a frame body, a cooling housing, and a first chip. The frame body includes a first wall plate and a second wall plate that are disposed at a spacing. An accommodation cavity is formed between the first wall plate and the second wall plate. The cooling housing is at least partially disposed in the accommodation cavity, and is fastened to the frame body. A cooling cavity is formed between the cooling housing and the second wall plate. The first chip is disposed in the cooling cavity, and is connected to the second wall plate. The cooling cavity is configured to be filled by cooling fluid that immerses the first chip. The first chip is mounted in the substrate structure in a form of chip embedding. The cooling housing in the frame body forms the cooling cavity for circulating the cooling fluid.

A showerhead for a processing chamber includes a faceplate with a plurality of openings. A plurality of compartments are recessed into a top surface of the faceplate. The showerhead includes a plurality of MEMS devices. Each MEMS device is disposed in a corresponding compartment of the plurality of compartments. A printed circuit board including a plurality of ports therethrough is coupled to each MEMS device. Each MEMS device is configured to regulate a gas flow into each corresponding compartment through a corresponding port of the plurality of ports in the printed circuit board.

A composite circuit board structure is divided into an element bearing area and a circuit layout area. The composite circuit board structure comprises a glass substrate, a conductive circuit, a bottom end substrate, a liquid-cooled heat conduction channel structure and a heat conduction through hole structure. The conductive circuits are arranged on the upper surface of the glass substrate and are continuously distributed in the element bearing area and the circuit layout area. The bottom end substrate is disposed on and contacts a lower surface of the glass substrate. The liquid-cooled heat conduction channel structures are arranged in the glass substrate or the bottom end substrate and distributed in the line layout area and the element bearing area, one ends of the liquid-cooled heat conduction channel structures are communicated with the cooling liquid inlet, and the other ends of the liquid-cooled heat conduction channel structures are communicated with the cooling liquid outlet and used for enabling cooling liquid to circulate in the liquid-cooled heat conduction channel structures. The plurality of heat conduction through hole structures are arranged in the glass substrate of the element bearing area, extend from the upper surface of the glass substrate to the lower surface of the glass substrate, and are adjacent to and separated from the liquid-cooled heat conduction channel structures.