499results about "Circuit fluid transport" patented technology

Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

A multilayered microfluidic DNA analysis system includes a cell lysis chamber, a DNA separation chamber, a DNA amplification chamber, and a DNA detection system. The multilayered microfluidic DNA analysis system is provided as a substantially monolithic structure formed from a plurality of green-sheet layers sintered together. The substantially monolithic structure has defined therein a means for heating the DNA amplification chamber and a means for cooling the DNA amplification chamber. The means for heating and means for cooling operate to cycle the temperature of the DNA amplification chamber as required for performing a DNA amplification process, such as PCR.

In a module with a built-in semiconductor, higher densification is achieved by disposing inner vias close to a semiconductor device. A module which has a space 107 between a first wiring layer 102a and a built-in semiconductor device 105 is obtained by: mounting the semiconductor device 105 on a first wiring layer 102a of a wiring board 103 without using a sealing resin; stacking on the circuit board an electrically insulating substrate having a through bore (inner via) 104 filled with a conductive paste and an opening for receiving the semiconductor device, and a mold release carrier having a second wiring layer 102b in the stated order; and heating and pressurizing so that the semiconductor device 105 is incorporated in a core layer 101 which is formed by curing the electrically insulating substrate.

The present invention provides electronic systems, including device arrays, comprising functional device(s) and / or device component(s) at least partially enclosed via one or more fluid containment chambers, such that the device(s) and / or device component(s) are at least partially, and optionally entirely, immersed in a containment fluid. Useful containment fluids for use in fluid containment chambers of electronic devices of the invention include lubricants, electrolytes and / or electronically resistive fluids. In some embodiments, for example, electronic systems of the invention comprise one or more electronic devices and / or device components provided in free-standing and / or tethered configurations that decouple forces originating upon deformation, stretching or compression of a supporting substrate from the free standing or tethered device or device component.

A device for invasive use, comprising a support member comprising a flexible material. The support member comprises a layer of a conductive line or pattern thereon. The support member is formed into an elongated tube shape, and the inside of the support member can be sealed from the outside of the support member. An electrically conductive line or pattern extends on the inside of the tube shaped support member, and the support member may comprise a sensing, stimulating and / or processing element. Furthermore, there is described a manufacturing method for the device, a system where the device is a part of the system and the use of the device for invasive use.

An engine control circuit device which has higher heat resistance and can be installed in a place exposed to severe thermal environments. In an engine control circuit device comprising a circuit board on which a plurality of packaged electronic parts are mounted, and a connector mounted on the circuit board for connection to an external circuit, the device further comprises a resin portion formed of a thermo-setting resin and covering the connector except for a connecting portion thereof and the circuit board, and a cooling pipe integrally molded in the resin portion and allowing a coolant to flow through it, thereby cooling the resin portion.

The invention relates to a method for forming a self-aligned transition between a transmission line (1) and a module (2) to be connected to said transmission line (1). The invention equally relates to such a module (2), to such a transmission line (1), to an intermediate element (5) possibly to be positioned between such a module (2) and such a transmission line (1), and finally to a system comprising such a transition. In order to enable a simple and precise connection of a transmission line (1) with some other module (2), it is proposed to use matching solder particles (8) and soldering pads on module (2) and transmission line (1) or intermediate element (5) respectively, and to apply a reflow treatment to the joined elements (1) and (2) or (5) and (2), thereby forming a self-aligning connection. The invention is to be applied particularly to waveguide-to-microstrip transitions.

The battery module includes a plurality of battery units, a housing, a wiring board, and a lid. The battery unit is composed of one or more battery cells each having a vent mechanism. At least one surface of the housing is an open end. The housing has a plurality of storage parts partitioned by one or more partition walls. Each battery unit is stored in each storage part. The wiring board covers the open end of the housing, is disposed at the vent mechanism side of the cell, and has connection terminals connected to the battery units. The lid covers the open end of the housing and the wiring board, and has an open part. Through holes are provided on the wiring board in positions facing the battery units and in a different region from that of the connection terminals.

A multi-layer circuit board with heat pipes and a method forming a multi-layer circuit board with heat pipes is disclosed. The circuit board includes a heat pump which communicates with the heat pipe to circulate an amount of cooling material within the heat pipe effective to efficiently dissipate heat from the circuit board.

A cooling apparatus, system, and method are provided. The cooling apparatus includes at least one printed circuit board having opposed major surfaces, and at least one electrical component or other heat source positioned on one major surface of the printed circuit board. The cooling apparatus also includes a pulsating heat pipe having at least a portion that is positioned to either extend along and proximate to one of the major surfaces or be embedded within the printed circuit board. As such, the pulsating heat pipe is capable of transferring heat from the printed circuit board.

Method of manufacture of a composite wiring structure for use with at least one semiconductor device, the structure having a first conductive member upon which the semiconductor device can be mounted for electrical connection thereto. A dielectric member, made of ceramic or organo-ceramic composite material, is bonded to the first conductive member and contains embedded therein a conductive network and a thermal distribution network. A second conductive member may be incorporated with the composite wiring structure, with a capacitor electrically connected between the conductive network and the second conductive member. Bonding between the dielectric member and the conductive members may be in the form of a direct covalent bond formed at a temperature insufficient to adversely effect the structural integrity of the conductive network and the thermal distribution network.

An apparatus, system and method for cooling vertically stacked printed circuit boards (PCBs). In one embodiment, a first PCB is disposed within a substantially enclosed lower chamber inside a PCB containment housing. A second PCB is disposed above the first PCB within the housing to define a substantially enclosed upper chamber above the lower chamber. The second PCB includes one or more airflow apertures defined therethrough and providing vertical air flow coupling between the upper and lower chambers. An airflow actuating device is utilized to generate a primary forced airflow within the upper chamber which is substantially parallel to the surface plane of the second PCB. The primary forced airflow further induces a negative air pressure in the upper chamber such that a mixed convection airflow is established between the upper and lower chambers via the second PCB apertures.

The present invention provides a thermally and electrically conductive apparatus that can provide both thermal conductivity and electrical conductivity for one or more electronic devices connected thereto. The apparatus comprises a thermally conductive element that is in thermal contact with one or more electronic devices and optionally in contact with a heat dissipation system. A portion of the thermally conductive element is surrounded by a multilayer coating system comprising two or more layers. The multilayer coating system includes alternating electrically insulating and electrically conductive layers in order to provide paths for the supply of electric current to the one or more electronic devices. A conductive layer of the multilayer coating system may be selectively patterned to connect to one or more electronic devices. In this manner, the combination of an electronic circuit carrier and a thermally conductive element can unify thermal conductivity with the provision of power and / or communication into a single integrated unit for use with electronic devices.

A dual sided board thermal management system for efficiently thermally managing a printed circuit board having electronic components on opposing sides thereof. The dual sided board thermal management system generally includes a housing surrounding a portion of a printed circuit board, and a plurality of coolant dispensing units within the housing directed towards opposite sides of the printed circuit board to thermally manage electronic components on opposite sides of the printed circuit board.

A method of using sacrificial materials for fabricating internal cavities and channels in laminated dielectric structures, which can be used as dielectric substrates and package mounts for microelectronic and microfluidic devices. A sacrificial mandrel is placed in-between two or more sheets of a deformable dielectric material (e.g., unfired LTCC glass / ceramic dielectric), wherein the sacrificial mandrel is not inserted into a cutout made in any of the sheets. The stack of sheets is laminated together, which deforms the sheet or sheets around the sacrificial mandrel. After lamination, the mandrel is removed, (e.g., during LTCC burnout), thereby creating a hollow internal cavity in the monolithic ceramic structure.

Disclosed herein are a variety of microfluidic devices and solid, typically electrically conductive devices that can be formed using such devices as molds. In certain embodiments, the devices that are formed comprise conductive pathways formed by solidifying a liquid metal present in one or more microfluidic channels (such devices hereinafter referred to as “microsolidic” devices). In certain such devices, in which electrical connections can be formed and / or reformed between regions in a microfluidic structure; in some cases, the devices / circuits formed may be flexible and / or involve flexible electrical components. In certain embodiments, the solid metal wires / conductive pathways formed in microfluidic channel(s) may remain contained within the microfluidic structure. In certain such embodiments, the conductive pathways formed may be located in proximity to other microfluidic channel(s) of the structure that carry flowing fluid, such that the conductive pathway can create energy (e.g. electromagnetic and / or thermal energy) that interacts withy and / or affects the flowing fluid and / or a component contained therein or carried thereby. In other embodiments, a microsolidic structure may be removed from a microfluidic mold to form a stand-alone structure. In certain embodiments, the solid metal structures formed may interact with light energy incident upon a structure or may be used to fabricate a light-weight electrode. Another aspect of the invention relates to the formation of self-assembled structures that may comprise these electrically conductive pathways / connections.

A light device having a light source, lenses adjacent to the light source, a housing for securing the light source and the lenses, and a light fixture for securing the housing. The light source includes high efficiency light emitting diodes (LEDs), driver circuitry, and a heat sink mounted and integrated on a common board. The driver circuitry receives multiple input voltages, supplies an appropriate power signal, provides over-voltage protection and controls dimming for the LEDs. Lenses magnify and focus light emitting from the LEDs at a diffusion angle between 10° and 100°. The housing comprises a first and a second portion fittable together (e.g., threads, screws and openings). LEDs are operable between 250 mA to 1 A at 3.2 volts and produce at least 55 lumens per LED. The light fixture may be rotateable to adjust the direction of the light from the LED. The light fixture may be puck-shape.

A light-emitting diode (LED) assembly includes a heat dissipation device (30) and at least one LED (10). The heat dissipation device has a connecting surface (33) with circuitry (20) being directly formed thereon. The at least one LED is electrically connected with the circuitry, and is maintained in thermal and mechanical contact with the connecting surface to dissipate heat generated thereby through the heat dissipation device. A method for making the LED assembly includes steps of: (A) providing a heat dissipation device having a surface for the LED to be mounted thereon; (B) insulating the surface; (C) forming circuitry on the insulated surface directly to obtain a connecting surface; (D) attaching the LED to the connecting surface of the heat dissipation device thermally and mechanically, and connecting the LED with the circuitry electrically to form the LED assembly.

Disclosed herein are a transmission line of coaxial type and a manufacturing method thereof, capable of preventing a radiative signal loss of signal lines during transmission of an RF signal and removing signal interference between adjacent signal lines, thus allowing signal lines to be compactly arrayed during a manufacture of IC, and reducing a dimension of the IC. The transmission line of coaxial type includes grooves provided on a semiconductor substrate, a first ground layer, an electrically conductive epoxy coated on a flat part of the first ground layer except the grooves, second ground layers provided on the electrically conductive epoxy, a dielectric film provided at a position above the grooves and the second ground layers, a third ground layer provided on an upper surface of the dielectric film, and signal lines placed in spaces defined by the grooves and a lower surface of the dielectric film. In this case, the electrically conductive epoxy is coated on only contact surfaces of the first and second ground layers, and the signal lines are attached to the lower surface of the dielectric film.

The present invention relates to layer manufacturing, more particularly to a method for additive layer manufacturing of objects comprised of more than one material with free-form capability for all included materials. The invention can for example be used for producing packaging for Microsystems where the ceramic acts as an insulator and the secondary material is used to produce electrical or optical 3D conductor lines or electrical or optical 3D vias. The fine powder used in this method enables it to be used for building components with small feature size and demand for high precision. Other intended uses for this method is to build small mechanical precision parts or grinding tools, dental objects or medical implants.

The proposal relates to a device for protecting an electrical and / or electronic component, arranged on a carrier substrate, from electrostatic discharges, an overvoltage occurring in the case of discharge at a carrier-substrate contact element connected to the component being diverted to a ground connection, bypassing the component. It is proposed that the protective device include a first electroconductive structure conductively connected to the jeopardized contact element, and a second electroconductive structure arranged adjacent to the first structure on the carrier substrate and conductively connected to the ground connection. Mutually facing sections of the electroconductive structures are set apart spatially from one another by a defined gap in such a way that an overvoltage transmitted to the contact element is transferred by a spark discharge in the gap from the section of the first electroconductive structure to the section of the second electroconductive structure, and is diverted to the ground connection.

A flexible display apparatus is disclosed. The flexible display apparatus includes a display panel, a cover substrate, a first receiving portion and a first fluid. The display panel includes a first region and a second region surrounding at least one sides of the first region. The cover substrate is disposed over the display panel. The first receiving portion is disposed between the display panel and the cover substrate. The first receiving portion overlaps the first region of the display panel and has an empty space. The first fluid is disposed in the first receiving portion.