The utility model discloses an MEMS pressure
chip for isolating packaging stress, which comprises tube shells, an
adhesive is fixed at the top ends of the tube shells, a
silicon support is fixed at the top end of the
adhesive, a gauge pressure hole is arranged between the two groups of tube shells, an upper end
expansion joint is arranged at the top end in the
silicon support, and a lower end
expansion joint is arranged at the top end in the
silicon support. A lower end
expansion joint is arranged at the bottom end of the interior of the silicon support, and a
chip body is installed at the top end of the silicon support. According to the utility model, the packaging stress is isolated by designing a brand new support structure on the
chip, and meanwhile, the glass support is changed into
monocrystalline silicon which is easier to process and consistent with the property of the chip, so that the influence of the packaging stress on the sensor is thoroughly eliminated. The
thermal expansion stress release structure design is used for adapting to material expansion and shrinkage caused by temperature changes, and excessive stress and potential damage are prevented. These structures typically utilize expansion joints or other design features, allowing the material to move freely without constraint, thereby releasing stress.