2976results about "Electric connection testing" patented technology

A system and method for monitoring connectivity in a cable system includes radio frequency identification (RFID) transponders on cable ends and RFID sensors at connection points. The RFID sensors are connected to a central monitoring system. Presence of a particular cable end at a particular connection point is detected and recorded by the central monitoring system.

A circuit tracer for use with circuit breakers equipped with sensors capable of sensing at least a change in the power consumption of the circuit and transmitting, preferably wirelessly, such information. The information is received directly or indirectly by a circuit tracer having a display, the display showing all the circuit breakers equipped with the sensors. Upon changing the load of an electricity outlet, such as a wall outlet, a light source, HVAC, pump, electrical machinery, etc., the sensor equipped circuit breaker provides an indication of such power or current consumption change to the circuit tracer. This allows the user of the circuit tracer to associate on the circuit tracer the circuit breaker with the specific electricity outlet. The association information may be saved on a central server or database for future use.

A fault detection apparatus according to an embodiment is provided with a measurement unit, a memory unit, a control unit, and a display unit. The measurement unit measures a first time period taken until a reflection signal reflected on a fault of a test apparatus is received after a first signal is transmitted to the test apparatus. The memory unit includes a CAD data unit having CAD data of the test apparatus, and a model data unit to store model data indicating a relation between the first time period and a predicted conduction distance of the first signal according to the CAD data. The control unit calculates a range of a test object selected in the test apparatus based on the CAD data, calculates the predicted conduction distance from the first time period based on the model data, and specifies a position of a fault of the test apparatus which is separated by the predicted conduction distance from the measurement unit in the range of the test object. The display unit displays the position of the fault in the CAD data.

An inductive power transfer system comprises a transmitter coil TX and a receiver coil RX spaced from the transmitter coil. A transmitter circuit comprises the transmitter coil and is in the form of a Class E amplifier with a first inductor U_choke and a transistor in series between the terminals of a power supply, a first transmitter capacitor C_par in parallel with the transistor between the first inductor and a power supply terminal, a primary tank circuit in parallel with the first transmitter capacitor, the primary tank circuit comprising the transmitter coil and a second transmitter capacitor C_res arranged in parallel with the transmitter coil, and a third transmitter capacitor C_ser in series with the first inductor between the first transmitter capacitor and the primary tank circuit. The transistor is arranged to switch at a first frequency ω_d and the capacitance of the second transmitter capacitor is selected such that the resonant frequency ω_OTX of the primary tank circuit is greater than the first frequency. The receiver circuit comprises a Class E rectifier having a first receiver capacitor C_L arranged in parallel with a load R_L and a secondary tank circuit in parallel with the first receiver capacitor. The secondary tank circuit comprises the receiver coil and a second receiver capacitor C_res arranged in parallel or series with the receiver coil. A first diode D_r2 is provided between the secondary tank circuit and the first receiver capacitor. The capacitance of the second receiver capacitor is selected such that the resonant frequency ω_oRX of the secondary tank circuit differs from the first frequency, so that the secondary tank circuit operates in semi-resonance and maintains some reactive impedance. The transmitter circuit is configured to vary the first frequency, in order to achieve a desired impedance of the primary tank circuit.

A bump shear test is disclosed for evaluating the mechanical integrity of low-k interconnect stacks in an integrated circuit which includes a die test structure (11) having a stiff structural component (501, 502) positioned above and affixed to a conductive metal pad (103) formed in a last metal layer (104). The die test structure (11) may also include a dedicated support structure (41) below the conductive metal pad which includes a predetermined pattern of metal lines formed in the interconnect layers (18, 22, 26). After mounting the integrated circuit in a test device, a shear knife (601) is positioned for lateral movement to cause the shear knife to contact the stiff structural component (501). Any damage to the die test structure caused by the lateral movement of the shear knife may be assessed to evaluate the mechanical integrity of the interconnect stack.

Electrical fire risks and consumer safety are major concerns driving regulators worldwide to implement more stringent electrical code and enforcement. While there are many commercially available protective devices available, none affords total protection, and they are made and classified only to protect circuits from specific or limited number of faults.

This invention is about an apparatus, system and method for protection of electrical circuits and consumers from literally all known electrical faults in Direct Current (DC) and Alternating Current (AC) single and multi-phase systems such as and including Arc Faults, Ground and Leakage Faults, Surge, Overload, Short Circuit, Glowing Connections, Miswired Connections, overvoltage, undervoltage and Phase-Loss. Said apparatus, system and method come in the form of or in a housing as a Circuit Breaker, Receptacle, Convenience Outlet, Attachment Plug, Equipment Controller, a circuit, or a system integrated with another system, device or apparatus.

Systems, methods, apparatuses, and computer-readable media provide electric supply equipment 200 configured to perform diagnostics. The electric supply equipment 200 may include a receptacle 210 for forming a closed circuit loop. The electric supply equipment 200 includes a connector 203 for charging devices, such as electric vehicles 101. The connector 203 may include one or more conductors, some of which may be wrapped with insulation. When the connector 103, 203 is not used for charging, the connector 203 may be connected to a receptacle 210 of the electric supply equipment 200. Thus, the electric supply equipment 200, via the receptacle 210, may form a closed loop circuit with the conductors. Further, the electric supply equipment 200 may include a diagnostic unit 250 for performing diagnostic tests on the conductors. In particular, the diagnostic unit 250 may access ends of the conductors via the receptacle 210.

A welding system includes a power source configured to generate power and deliver the power to a welding electrode. The power source comprises a positive stud and a negative stud. The welding system also includes control circuitry configured to determine whether the welding electrode is properly connected to the positive and negative studs of the power source.

A method and apparatus for providing a tracer function for networked cable systems used in information technology. A self contained and self powered indicator circuit is described that enables tracing the location of both ends of a networked cable without the use of external test equipment.

A method and a circuit is disclosed that facilitates identifying a remote end and optionally an intermediate location of an installed cable, such as a cable for carrying data, without the need to disconnect the cable. One or more circuits may be connected across two wires along the length of a cable. Each circuit includes a power connector, a switching circuit and an indicator, such as a light emitting diode (LED), connected across the two wires included in a cable. The circuit is configured such that the indicator in each circuit connected to the two wires is illuminated in responsive to a nominal DC voltage applied to the power connector in any circuits connected across the two wires without disrupting any data being carried thereby. In one embodiment of the invention, the circuit is directly into a cable connector. In an alternate embodiment of the invention, the circuit is configured to be retrofit in the field for use with existing cables.

The present invention relates to a method and system configured to monitor devices that are physically connected over a data network, said system comprising at least one scanner configured to monitor said data network and to determine devices that are physically connected over said data network, said at least one scanner being connected to at least one panel over said data network, wherein at least one terminal of each panel is connected to an electronic circuitry, which comprises one or more electronic components, for enabling said at least one scanner to determine changes in one of voltage or current level over at least one of said one or more electronic components, said changes occurring due to connecting or disconnecting devices over said data network, thereby enabling said at least one scanner to monitor devices that are physically connected over said data network.

A low power circuit and method for detects in-situ failures or precursors to failures in solder-joint networks on actual operational devices and packages in the field. An amplifying detector such as provided by a common-gate transistor sources current to the network to generate a signal voltage and a reference voltage that is sensitive to the low voltage applied to the other side of the network. Generation of this self-adjusting reference voltage makes the detection circuit insensitive to the network low-voltage. Additional power savings and performance gains can be provided with the addition of a differential amplifier to set a fixed bias point and a level shifter to cancel noise. The detected failure or precursor of a selected monitor solder-joint network(s) is an indicator of the integrity of other operational solder-joint networks in the package, on the PWB or between PWBs.

An inspection system, for inspecting pin grid arrays on integrated circuit devices includes a pin base mask configured to receive a device having a pin grid array. A dark-field, low-angle lighting system emits light onto the pin grid array. The pin base mask and low-angle lighting system provide for a clear and definitive image of the pin grid array. A camera captures the image of the pin grid array. A processor, coupled to the camera, analyzes the images captured by the camera. Based on the captured image, the processor determines whether any pins on the pin grid array are bent or missing, or whether there are extra pins present.

A testing system includes a hand-held transmitter that plugs into a receptacle electrically coupled to a selected branch circuit. The transmitter includes a circuit effective to test an arc fault circuit interrupter electrically coupled to the branch circuit by creating a first pulse on the branch circuit that is effective to trip the arc fault circuit interrupter. The transmitter can perform at least one additional test including: determining whether the receptacle is wired properly; determining a location of a circuit interrupting device electrically coupled to the branch circuit by creating a second pulse on the branch circuit that can be sensed by a receiver located proximately to the respective circuit interrupting device and broadly tuned about a frequency of the second pulse; and testing a ground fault circuit interrupter electrically coupled to the branch circuit by creating a third pulse on the branch circuit that is effective to trip the ground fault circuit interrupter.

An enhanced remote power switch includes a communications interface for sending and receiving messages to control the power applied to a power cord, thereby turning on/off a target server. The power cord is connected to the target server at the target server end by use of a bonding device. A rack interface pod (RIP) or other monitoring device also can be connected to the target server by way of another bonding device. The bonding device can be wrapped around or connected to the keyboard, video or mouse (KVM) cable(s) connecting the target server and the monitoring device to ensure that the target server does not unintentionally get associated with a different monitoring device than it had initially been paired with. In addition, at least one data port of the remote power switch is in communication with an information tag to help identify the target servers attached to the power switch.

An electronic cigarette includes a control chip, the control chip includes: a driving module configured to output a current to drive the electronic cigarette to work; an open-circuit detecting module electrically connected to the driving module, and configured to sample and detect the current, and send out an open-circuit enable signal when a sampled current is less than a internal reference current; a short-circuit detecting module electrically connected to the driving module, and configured to sample and detect the current, and send out a short-circuit enable signal when the sampled current is greater than the internal reference current; and a control module electrically connected to the driving module, and configured to receive the open-circuit enable signal and the short-circuit enable signal, and send a shutdown signal to the driving module.

The solder-joint integrity of digital electronic packages, such as FPGAs or microcontrollers that have internally connected input/output buffers, is evaluated by applying a time-varying voltage through one or more solder-joint networks to charge a charge-storage component. Each network includes an I/O buffer on the die in the package and a solder-joint connection, typically one or more such connections inside the package and between the package and a board. The time constant for charging the component is proportional to the resistance of the solder-joint network, hence the voltage across the charge-storage component is a measurement of the integrity of the solder-joint network.

An arrangement for use in connection with an electricity meter includes an electricity meter housing and at least one connection between a first conductor and a second conductor carrying line voltage. The arrangement further includes a processing circuit that is configured to obtain a first voltage measurement within the meter housing on a first side of the at least one connection, and to obtain a second voltage measurement on a second side of the at least one connection. The processing circuit is further configured to determine a value corresponding to an impedance across the at least one connection.

A circuit analyzer tests a power circuit including an earth leakage ground fault circuit interrupter, a receptacle, and a line, a neutral and a ground electrically connected between the circuit interrupter and the receptacle. The circuit analyzer includes a plurality of pushbuttons for inputting a plurality of test requests. A microprocessor outputs a plurality of test signals responsive to the test requests. A plurality of load circuits selectively provide a load between the line and the neutral responsive to one of the test signals. A display confirms tripping of the ground fault circuit interrupter responsive to the load, in order to determine if the neutral is electrically connected to the ground between the circuit interrupter and the receptacle.