383 results about "Electronic packages" patented technology

Embodiments disclosed herein include electronic packages with photonics integrated circuits (PICs). In an embodiment, an electronic package comprises a glass substrate with a first recess and a second recess. In an embodiment, a PIC is in the first recess. In an embodiment, an optics module is in the second recess, and an optical waveguide is embedded in the glass substrate between the first recess and the second recess. In an embodiment, the optical waveguide optically couples the PIC to the optics module.

The invention discloses a phosphorus-nitrogen macromolecule modified MOFs flame retardant and an epoxy resin composite material and a preparation method thereof, and belongs to the technical field of flame-retardant composites.The nanometer flame retardant takes NH2-MIL-125 as a matrix, a phosphorus-chlorine bond compound and an amido compound are sequentially grafted, and in-situ polymerization is conducted to form a phosphorus-nitrogen coating layer; the composite material is prepared from 77.15 to 80.44 parts of epoxy resin, 16.85 to 17.56 parts of a curing agent and 1 to 6 parts of M (at) F-PZN through high-temperature curing. When the addition amount of the flame retardant is less than or equal to 6wt%, the peak value of the heat release rate of the composite material is reduced by 51.6%, the maximum smoke production rate is reduced by 51.5%, the tensile strength is improved by 62.2% compared with that of pure epoxy when the flame retardant is added by 2wt%, synergistic improvement of flame retardance, smoke suppression, toxicity reduction and mechanical properties is realized, and the flame retardant is suitable for the fields of electronic packaging, aerospace and the like.

The invention belongs to the technical field of functional composite materials, and particularly relates to an all-organic epoxy resin composite material as well as a preparation method and application thereof. The method comprises the following steps: S1, heating, melting and blending epoxy resin and phenolic hydroxyl polyphenyl ether to obtain a composite system; s2, adding a curing agent and a catalyst into the composite system, heating, stirring, reacting, vacuumizing, defoaming, casting the obtained mixed solution into a mold, curing, cooling and demolding to obtain the all-organic epoxy resin composite material. The heat conductivity coefficient of the obtained composite material is improved by 44.2% compared with that of pure epoxy resin, and the thermal expansion coefficient is reduced by 32.8%. The method is mild in condition, short in technological process, low in energy consumption and suitable for large-scale production, an innovative thought and an effective strategy are provided for development of a high-performance all-organic electronic packaging material, and silicon-free and ceramic-free all-organic upgrading of the packaging field is expected to be promoted.

An electronic package is provided, in which an electronic element is disposed on a carrier structure, and an interposer is stacked on the electronic element. Further, a wire is connected to the interposer and grounds the carrier structure, such that the wire and the interposer surround the electronic element. Therefore, the wire can be used as a shielding element when the electronic package is in operation to prevent the electronic element from being subjected to external electromagnetic interference.

An electronic package is provided, in which an electronic module and a plurality of conductive pillars are embedded in an encapsulation layer, and a circuit structure is formed on the encapsulation layer, where the electronic module includes a carrier structure having conductive vias and at least a first electronic element disposed on the carrier structure. The first electronic element has a plurality of conductors in a form of conductive through-silicon vias, and at least a second electronic element is disposed on the circuit structure. Therefore, the design of the electronic module can reduce the layout area occupied by the electronic element on a surface of a packaging zone of the circuit structure, such that other functional elements can be added to the electronic package according to requirements, and the electronic package can improve functional requirements of the end product.

An electronic package is provided, in which an electronic module including a first electronic element and a second electronic element is disposed on a carrier structure embedded with a third electronic element, and the third electronic element is a photonic chip electrically connected to the electronic module. Therefore, with this configuration, it is beneficial to reduce a layout area of the carrier structure to meet the requirement of miniaturization.

A continuity detector for determining the continuity of a Unit Under Test (UUT). The detector comprises a housing defining an interior volume, an electronics package disposed within the interior volume defined by the housing assembly, a first test contact and a second test contact to interface with the electrical wire or harness assembly, a precision resistance standard disposed within the housing and electrically coupled to the electronics package, and a power source disposed within the housing assembly. The first test contact and the second test contact are external to the interior volume. The first test contact and the second test contact are electrically coupled to the electronics package. The electronics package comprising a resistance measurement device and a comparator circuit. The comparator circuit is configured to determine if the resistance of the UUT is greater than, less than, or equal to the resistance of the resistance standard.

An electronic package and a manufacturing method thereof and an interposer are provided, in which grooves are formed on conductive through holes on a back side of an interposer body of the interposer, and a routing structure electrically connected to the conductive through holes is formed directly on the back side of the interposer body and in the grooves, without a passivation layer to be formed, such that the CVD process and CMP process are omitted, thereby effectively simplifying the manufacturing process and saving a lot of manufacturing time and material costs.

Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate with a cavity, where the first substrate comprises glass. In an embodiment, a second substrate is in the cavity. In an embodiment, a bond film covers a bottom of the second substrate and extends up sidewalls of the second substrate.

An electronics package can comprise a first die, a cooling element disposed over the first die, a second die disposed over the cooling element, and a plurality of vias extending through the cooling element from the first die to the second die. The cooling element can comprise at least one cavity. The at least one cavity can comprise a wicking layer disposed over an interior surface of the at least one cavity.

The invention relates to an epoxy resin adhesive composition and a preparation method thereof, and belongs to the technical field of high-performance polymer material modification and electronic packaging materials, and the epoxy resin adhesive composition comprises the following components by weight: 100 parts of basic epoxy resin; 5-30 parts of a hyperbranched liquid crystal modifier; adding the curing agent according to a stoichiometric ratio; 100 to 600 parts of a heat-conducting filler; 0.1-5 parts of an accelerant and an auxiliary agent; the hyperbranched liquid crystal modifier has a core-shell structure and is prepared from a hydrogen-containing hyperbranched polysiloxane core and an alkenyl-terminated liquid crystal epoxy monomer through a hydrosilylation reaction under the action of a catalyst, the hyperbranched polysiloxane core is introduced, the friction resistance among high-concentration fillers is reduced by utilizing the torispherical structure of the hyperbranched polysiloxane core, and the hyperbranched liquid crystal modifier has the advantages that the friction resistance is reduced; under the condition that 350 parts of heat-conducting filler is filled, the modifier is added, so that the high-filling system still has excellent flowability and leveling property while keeping high heat-conducting property, and is suitable for high-precision micro-encapsulation scenes; the heat conductivity of the scheme is obviously superior to that of a system which does not use the modifier or does not adopt a stepped heating process.

Apparatuses relating generally to a microelectronic package having protection from electromagnetic interference are disclosed. In an apparatus thereof, a platform has an upper surface and a lower surface opposite the upper surface and has a ground plane. A microelectronic device is coupled to the upper surface of the platform. Wire bond wires are coupled to the ground plane with a pitch. The wire bond wires extend away from the upper surface of the platform with upper ends of the wire bond wires extending above an upper surface of the microelectronic device. The wire bond wires are spaced apart from one another to provide a fence-like perimeter to provide an interference shielding cage. A conductive layer is coupled to at least a subset of the upper ends of the wire bond wires for electrical conductivity to provide a conductive shielding layer to cover the interference shielding cage.

The present disclosure provides a printed circuit board and an electronic package including the same. The printed circuit board includes a first insulating layer having at least one recess in one surface thereof, a first wiring layer embedded in one surface of the first insulating layer, and a first via layer including a first via penetrating at least a portion of the first insulating layer, one surface of the first via being outwardly exposed from a lower surface of each of the at least one recess.

An electronic package is provided and includes: a first circuit structure having a first surface, a second surface, and a first circuit layer; an electronic component set including a first electronic component having a first active surface and a first inactive surface, and a second electronic component having a second active surface and a second inactive surface, wherein the first inactive surface of the first electronic component is disposed on the first surface, and the second inactive surface of the second electronic component is offsetly attached to the first active surface; a packaging layer having a first packaging surface and a second packaging surface and covering the electronic component set; a second circuit structure disposed on the first packaging surface and electrically connected to the first circuit layer, the first active surface and the second active surface, respectively; and an optoelectronic component disposed on the second circuit structure.

A method for making an electronic package is provided. The method includes providing a substrate strip comprising substrate assemblies, each substrate assembly comprises a first substrate and a second substrate connected to the first substrate via a flexible link, the first substrate comprises a first mounting surface, the second substrate comprises a second mounting surface that is not at a same side of the substrate assembly as the first mounting surface; disposing the substrate strip on a first carrier; attaching a first electronic component onto the first mounting surface; disposing the substrate strip on a second carrier with a plurality of cavities, the first electronic component is received within one of the plurality of cavities; attaching a second electronic component onto the second mounting surface; singulating the substrate assemblies from each other; and bending the flexible link to form an angle between the first substrate and the second substrate.

Integrated circuit ("IC") structures and electronic packages that utilized an inorganic-convertible polymer to improve bond strength and thermal conductivity are described. In one embodiment, the inorganic-convertible polymer acts as a side fill material to seal a die periphery and improve direct bonding strength. In another embodiment, the inorganic-convertible polymer acts as a thermal bonding layer to increase the thermal conductivity between a die and a thermal solution.

The present application relates to the technical field of electronic packaging materials, and particularly relates to a thick copper packaging circuit board capable of resisting high-salt mist corrosion and a preparation method thereof, which comprises the following steps: S1: preparing a glass fiber-BT resin composite core layer for standby; S2: preparing a fluorine-modified polyimide packaging coating solution for standby; S3: preparing a surface corrosion-resistant composite coating for standby; S4: bonding the thick copper foil and the glass fiber-BT composite core layer to obtain a thick copper conductor; S5: applying the fluorine-modified polyimide packaging coating solution to the surface of the thick copper conductor layer to form a packaging layer; S6: spraying the corrosion-resistant coating on the surface of the packaging layer to form a composite corrosion-resistant coating; and S7: performing overall curing and hot pressing to finally obtain a thick copper packaging circuit board product. According to the present application, a multi-layer synergistic protection structure is constructed and the preparation process is optimized, so that the corrosion resistance and structural stability of the thick copper circuit board in a high-salt mist environment are significantly improved.

The present application relates to an electronic package and a manufacturing method thereof, which integrates a first antenna structure and a second antenna structure on a package module, and the radio frequency of the first antenna structure is different from that of the second antenna structure, so that the electronic package can emit / receive different antenna signals according to requirements, so that the electronic product using the electronic package can receive / transmit signals of required frequencies, and the antenna function of the electronic product is improved.

An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.

An electronic package 1012 has a substrate 2 having a first side 21 at least with one or more electronic components and a first mold structure 31 extending over at least part of the first side 21 of t

A method of making an electronics package for an electrical power module includes positioning a base plate into an electrolyte solution such that a first metallic layer of the base plate directly contacts the electrolyte solution. The method also includes positioning a deposition anode array into the electrolyte solution such that a gap is established between the first metallic layer and the deposition anode array. The method further includes connecting the first metallic layer to a power source and connecting the deposition anode array to the power source. The method also includes transmitting electrical energy from the power source through the deposition anode array, through the electrolyte solution, and to the first metallic layer, such that material is deposited onto the first metallic layer and forms an electrical connection pillar, an electrical-component retention feature, and an encapsulant retention feature of the electronics package.

Embodiments disclosed herein include an electronic package that comprises a substrate with a first surface and a second surface opposite from the first surface. In an embodiment, the substrate comprises glass. In an embodiment, the electronic package further comprises an opening through the substrate from the first surface to the second surface, where the opening comprises a first end proximate to the first surface of the substrate, a second end proximate to the second surface of the substrate, and a middle region between the first end and the second end. In an embodiment, the middle region has a discontinuous slope at junctions with the first end and the second end.

An electronics package includes a manifold housing defining an enclosure and including an inlet port fluidly coupled to an inlet manifold, an outlet port fluidly coupled to an outlet manifold, a first inlet, a second inlet, a third inlet, and a fourth inlet, each fluidly coupled to the inlet manifold and the enclosure, and a first outlet, a second outlet, a third outlet, and a fourth outlet, each fluidly coupled to the outlet manifold and the enclosure. The electronics package also includes a first circuit board coupled to the manifold housing, and a second circuit board coupled to the manifold housing such that the second circuit board is offset from the first circuit board by a first gap. The electronics package further includes a third circuit board coupled to the manifold housing such that the third circuit board is offset from the second circuit board by a second gap.

A method of manufacturing an electronic package is provided and includes disposing a circuit member and a plurality of electronic elements on opposite sides of a carrier structure having circuit layers respectively, so that any two of the plurality of electronic elements can be electrically connected to each other via the circuit layers and the circuit member, where a vertical projected area of the carrier structure is larger than a vertical projected area of the circuit member, such that the circuit member is free from being protruded from side surfaces of the carrier structure. Therefore, the circuit member replaces a part of circuit layers of the carrier structure to reduce the difficulty of fabricating the circuit layers in the carrier structure.

The invention relates to the technical field of conductive silver adhesives, in particular to a high-shear-strength conductive silver adhesive and a preparation method thereof.The high-shear-strength conductive silver adhesive is prepared from, by weight, 40-70 parts of conductive silver powder, 10-30 parts of epoxy resin, 2-10 parts of modified liquid resin, 3-10 parts of reactive diluent and 4-8 parts of curing agent. The liquid resin is modified by introducing the silallyl compound containing Schiff base, and the proportion of each component is accurately regulated and controlled, so that the conductive silver adhesive with high shear strength and excellent conductivity is successfully prepared, and the conductive silver adhesive has a wide application prospect in the field of high-end electronic packaging.

The invention discloses an environment-friendly ultrathin electronic packing material fabric and a production process thereof, the fabric is formed by warp knitting regenerated polyester DTY (draw textured yarn) and regenerated high-shrinkage FDY (fully drawn yarn), the structure of the fabric is a double-comb tricot stitch, the yarn laying number of a guide bar GB1 is 1-0 / 1-2 / / , and the yarn laying number of a guide bar GB2 is 1-2 / 1-0 / / ; the thickness of the fabric is not larger than 0.35 mm, the number of yarns in unit square centimeter is not smaller than 80000, and the height of fluff on the back face of the fabric is 0.1-0.3 mm. The high-quality electronic packaging material fabric which is ultrathin, high in density, soft, smooth, low in writing feeling, firm in edge and environment-friendly in the whole process is prepared through a more simplified process by combining the innovative process combination of'white body napping, refining shrinkage and shearing 'and the environment-friendly hot trimming technology through raw material and tissue structure design.

The application discloses a kind of low dielectric high-strength phosphate-based geopolymer and preparation method thereof.The preparation method includes the following steps: (1) acid activator pretreatment: phosphoric acid solution is mixed with water to carry out ion balance treatment, and fully ionized pre-equilibrium acid activator is obtained;(2) mixed pulping: siliceous raw material is mixed with the pre-equilibrium acid activator, the molar ratio of P / Al is controlled to be 0.6-1.2, and uniform geopolymer slurry is obtained by stirring;(3) forming and curing: the slurry is cast into shape and cured, and an Al-O-P covalent bond dominated network skeleton is constructed to obtain a green geopolymer;(4) dehydration treatment: the green geopolymer is subjected to dehydration treatment.The application effectively solves the problems of high loss, easy moisture absorption and mutual exclusion of strength and dielectric properties of inorganic cementing materials at high frequency, and is suitable for 5G / 6G high-frequency communication, radar wave-transparent, electronic packaging and intelligent building fields.

An auxiliary system for an electronic packaging device, comprising a ball feed mechanism, a ball feed assembly (400), and auxiliary tooling, wherein the ball feed assembly (400) is disposed above the ball feed mechanism, and the ball feed assembly (400) delivers a target component to a placement site of the ball feed mechanism; the auxiliary tooling comprises a pressure assembly disposed on each of a leading side and a trailing side of the ball feed assembly relative to a direction of motion thereof. While the ball feed assembly (400) is in motion, the pressure assembly on the leading side of the ball feed assembly (400) presses downward to exert pressure on the ball feed mechanism, while the pressure assembly on the side of the ball feed assembly (400) opposite to the direction of motion is raised. During a ball spreading process, the pressure assembly on the leading side of the ball feed assembly (400) is driven by a cylinder (652) to descend and press a solder ball stencil (200), while the pressure assembly on the side opposite to the direction of motion is driven by the cylinder (652) to rise and separate from the solder ball stencil (200), so that the solder ball stencil (200) at the placement site is in flush contact with a substrate, thereby ensuring solder balls are properly seated in apertures of the solder ball stencil (200), and therefore improving ball placement yield.

The invention discloses a carbon fiber reinforced ultrahigh-temperature-resistant liquid crystal polymer composite material and a preparation method thereof. Aiming at the problems of non-uniform impregnation, serious thermal degradation and the like when a continuous carbon fiber reinforced liquid crystal polymer (LCP) composite material is prepared by a traditional melting method, the invention adopts four key processes: firstly, carbon fibers and LCP fibers are blended and woven into cloth so as to create a uniform impregnation channel; the LCP is ground into micro powder under the freezing condition, and thermal plasticizing is avoided; preparing a prepreg in a normal-temperature solvent through a slurry method; and finally, forming through a segmented hot-pressing procedure. According to the process, the binding force between the carbon fiber and the liquid crystal polymer is remarkably improved. The composite material is suitable for the fields of aerospace high-temperature parts and 5G electronic packaging, and has high cost benefit and industrial potential.

Direct-bonded optoelectronic interconnects for high-density integrated photonics are provided. A combined electrical and optical interconnect enables direct-bonding of fully-processed optoelectronic dies or wafers to wafers with optoelectronic driver circuitry. The photonic devices may be III-V semiconductor devices. Direct-bonding to silicon or silicon-on-insulator (SOI) wafers enables the integration of photonics with high-density CMOS and other microelectronics packages. Each bonding surface has an optical window to be coupled by direct-bonding. Coplanar electrical contacts lie to the outside, or may circumscribe the respective optical windows and are also direct-bonded across the interface using metal-to-metal direct-bonding, without interfering with the optical windows. Direct hybrid bonding can accomplish both optical and electrical bonding in one overall operation, to mass-produce mLED video displays. The adhesive-free dielectric-to-dielectric direct bonding and solder-free metal-to-metal direct bonding creates high-density electrical interconnects on the same bonding interface as the bonded optical interconnect. Known-good-dies may be used, which is not possible conventionally, and photolithography over their top surfaces can scale to high density.