83 results about "Electronic packages" patented technology

The application discloses a kind of low dielectric high-strength phosphate-based geopolymer and preparation method thereof.The preparation method includes the following steps: (1) acid activator pretreatment: phosphoric acid solution is mixed with water to carry out ion balance treatment, and fully ionized pre-equilibrium acid activator is obtained;(2) mixed pulping: siliceous raw material is mixed with the pre-equilibrium acid activator, the molar ratio of P / Al is controlled to be 0.6-1.2, and uniform geopolymer slurry is obtained by stirring;(3) forming and curing: the slurry is cast into shape and cured, and an Al-O-P covalent bond dominated network skeleton is constructed to obtain a green geopolymer;(4) dehydration treatment: the green geopolymer is subjected to dehydration treatment.The application effectively solves the problems of high loss, easy moisture absorption and mutual exclusion of strength and dielectric properties of inorganic cementing materials at high frequency, and is suitable for 5G / 6G high-frequency communication, radar wave-transparent, electronic packaging and intelligent building fields.

An electronic package includes a carrier and electronic components and a heat sink disposed on the carrier. The carrier has a ground layer exposed on the side of the carrier and the ground layer is in direct contact with the heat sink to dissipate heat from the carrier and provide shielding space for the electronic components.

An electronic package and method for manufacturing is provided. The package includes an electronic component having a terminal, a solidified molding compound encapsulating the electronic component, a lead including an inner and a mounting portion. The molding compound includes a first recess at or near a perimeter of a bottom surface of the mounting portion, exposing a portion of a bottom surface of the inner portion arranged near the mounting portion, and / or a second recess at the perimeter of the bottom surface of the mounting portion, the second recess exposing a portion of a side surface of the mounting portion extending between the top and the bottom surface of the mounting portion. The package provides more exposed lead space for a larger solder covering area using the first and / or second recess. Thus, solder strain accumulation is reduced or mitigated, and reliability of the electronic package can be enhanced.

An electronic package, a substrate structure and a manufacturing method thereof are provided. An electronic component is disposed on the substrate structure having a plurality of electrical contact pads and a metal sheet by means of solder material. An insulating protective layer of the substrate structure has an opening exposing the plurality of electrical contact pads, the metal sheet is disposed at the periphery of the electrical contact pads, and a separation space is formed so as to reduce the amount of solder paste that spreads out of the solder material, so that the problem of short circuit caused by the expansion of the solder material can be prevented from occurring to each of the plurality of electrical contact pads.

An electrically conductive silicone adhesive exhibiting high electrical conductivity and high adhesive strength useful for providing adhesion and electrical paths in electronic packages, and a method of making the electrically conductive silicone adhesive from a curable composition comprising a reactive organosiloxane and an electrically conductive particulate filler.

An electronic package is mainly provided with an electronic component and a circuit structure on a carrier structure, and the circuit structure covers the electronic component and is formed with an opening, so that the electronic component is exposed from the opening. Moreover, a heat conductive member contacting the electronic component is accommodated in the opening, and a heat dissipation structure is disposed on the heat conductive member to provide a heat dissipation path for the electronic component via the heat conductive member and the heat dissipation structure.

A method includes forming a layer stack with at least one electrically insulating layer structure and at least one patterned electrically conductive layer structure on a temporary carrier, the layer stack includes a lower surface adjoining the temporary carrier and an upper surface opposite to the lower surface; mounting a first component at the upper surface; placing a first frame structure at the upper surface, the first frame structure surrounding at least partially the first component; covering the first component with a first coating material, the first coating material spatially extending at least partially into voids at or within the first frame structure and into voids at or within the layer stack; and removing the temporary carrier. The lower surface of the layer stack is an even surface. The opposite upper surface of the layer stack is an uneven surface. An electronic package can be manufactured with the described method.

The present application provides an electronic package and substrate structure thereof. The substrate structure includes an insulating layer, a wiring layer, a conductive via and an insulating protective layer. The conductive via is free from overlapping with an edge of an opening of the insulating protective layer. This is to avoid stress concentration on the insulating protective layer during a probe testing and to prevent the insulation protective layer from cracking.

An electronic package and a manufacturing method thereof are provided, in which a first optoelectronic element having a first optical fiber connection portion is disposed on an electronic module, a second optoelectronic element having a second optical fiber connection portion is disposed on a first level layer of a lower carrying portion of a step-shaped carrier structure, and the electronic module is disposed on a second level layer of the step-shaped carrier structure and the second optoelectronic element having the second optical fiber connection portion, so that the electronic module is electrically connected to the second optoelectronic element having the second optical fiber connection portion. Thereby, two optoelectronic elements having optical fiber connection portions can be easily and vertically integrated, and the second optoelectronic element can be stably carried by the step-shaped carrier structure.

An electronic package and a heat conducting structure thereof, the electronic package includes a carrier, an electronic component disposed on the carrier, and a heat sink coupled to the electronic component with a heat conducting structure in between, and the heat conducting structure includes a middle layer and a nano layer disposed on at least one side of the middle layer, so that the middle layer provides high thermal conductivity and high compressibility, and the nano layer provides high thermal conductivity, thereby improving the heat dissipation effect of the electronic package.

This invention belongs to the field of polymer materials and 3D printing technology, and particularly relates to a photocurable 3D printing bio-based resin, its preparation method, and its applications. By weight, the resin is mainly composed of 50-70 parts of a photosensitive resin prepolymer matrix, 30-50 parts of the reactive diluent hydroxyethyl methacrylate (HEMA), and 1-5 parts of a photoinitiator. The prepolymer matrix is ​​prepared by ring-opening esterification of malic acid and citric acid with glycidyl methacrylate (GMA) through a specific step-temperature controlled process, followed by the compounding of precisely synthesized photosensitive malic acid monomer (MG) and photosensitive citric acid crosslinking agent (CG). This invention utilizes HEMA to effectively break the large molecular hydrogen bond network between prepolymers, achieving an effective reduction in resin viscosity while maintaining a high bio-based content. The resin of this invention exhibits low viscosity, rapid photoresponse, high double bond conversion rate, and excellent curing heat stability, making it highly suitable for stereolithography (SLA), digital light processing (DLP), and applications in electronic packaging and electromagnetic shielding.

The application discloses a modulus UV-controllable double-curing conductive adhesive film and a preparation method and application thereof, and belongs to the technical field of electronic packaging materials. The conductive adhesive film comprises an A component, a B component and a conductive filler. The A component comprises a functional acrylate copolymer prepared from a monomer mixture through solution polymerization. The monomer mixture comprises soft monomers, hard monomers, hydroxyl-containing monomers, epoxy-containing monomers, polymerizable benzophenone photoinitiators, silane coupling agents and free radical polymerization initiators. The B component comprises one or a combination of latent epoxy curing agents, conductive accelerators, curing accelerators and anti-settling agents. The application completely solves the problem of oxygen inhibition, realizes controllable adjustment of the modulus and pressure sensitivity of the adhesive film, has no small molecule residue, has excellent conductive performance and good storage stability.

A method for making an electronic package is provided. The method includes providing a substrate strip comprising substrate assemblies, each substrate assembly comprises a first substrate and a second substrate connected to the first substrate via a flexible link, the first substrate comprises a first mounting surface, the second substrate comprises a second mounting surface that is not at a same side of the substrate assembly as the first mounting surface; disposing the substrate strip on a first carrier; attaching a first electronic component onto the first mounting surface; disposing the substrate strip on a second carrier with a plurality of cavities, the first electronic component is received within one of the plurality of cavities; attaching a second electronic component onto the second mounting surface; singulating the substrate assemblies from each other; and bending the flexible link to form an angle between the first substrate and the second substrate.

A mesh-structured copper heat sink and its QFN package include: several mesh sections of equal length extending outward from a center point; each mesh section can extend outward by several more identical mesh sections; mesh sections of the same level are interconnected by copper straight rods with a width of 0.1 mm, forming a nested isosceles triangular mesh structure with different side lengths. The vertex angle of the isosceles triangle is a factor of 360° and satisfies the requirement of four-dimensional symmetry. This invention, by employing a combination of mesh sections and mesh angles, increases the specific surface area for heat exchange between the QFN and air, thereby effectively reducing the temperature of the package and significantly enhancing heat dissipation, meeting the high cost-performance requirements of the electronic packaging heat dissipation field.

An electronic package and a manufacturing method thereof are provided, in which an electronic element is disposed on a carrier structure, and an antenna structure is stacked on the carrier structure via conductors, where at least one through hole is formed on and penetrating through the antenna structure, and an insulating support body is formed between the carrier structure and the antenna structure, so that the insulating support body is correspondingly formed at the through hole and / or an edge of the antenna structure, and the through hole is free from being filled up by the insulating support body, such that the through hole has an air medium. The design of the through hole allows the characteristic of the dielectric constant of air being 1 to be utilized so as to reduce the signal loss and the signal offset, thereby facilitating the signal transmission of the antenna body.

An electronic package and a manufacturing method thereof are provided, in which a groove space for accommodating an electronic element is formed on a wiring structure, and an encapsulation layer is formed on the wiring structure to cover the electronic element. Via the design of the groove space, the overall thickness of the electronic package can be easily thinned to meet the demand for miniaturization.

This invention relates to the field of electronic packaging technology and discloses a multi-physics coupled packaging simulation method, including S1, macroscopic equivalent model construction, which establishes a macroscopic packaging model containing multi-physics loads and performs equivalent processing on the microscopic complex structure to efficiently obtain the overall temperature, displacement, and stress distribution; S2, key region identification, which combines macroscopic equivalent modeling with microscopic fine modeling and establishes a macro-micro bidirectional coupling mechanism to enable the macroscopic structural response and microscopic local behavior to be solved collaboratively under the same analysis framework; at the same time, combined with an adaptive iteration strategy, the microscopic model is dynamically introduced only in key high-risk areas to avoid the degree-of-freedom explosion problem caused by global fine modeling, thereby significantly reducing the overall computational scale while ensuring the accuracy of stress and strain prediction in key areas, effectively solving the problem of "difficulty in balancing accuracy and efficiency" in the prior art, and achieving a unity of high efficiency and high accuracy in multi-scale simulation.

The present application discloses an electronic package and its manufacturing method. The electronic package comprises a functional pad, a surface treatment layer formed on a part of the surface of the functional pad, and an electronic component. The electronic component is contacted and combined with the functional pad and the surface treatment layer through a bonding layer. The surface treatment layer of the electronic package has a buffering effect when the electronic package is subjected to cold and hot impact, thereby improving the packaging reliability of the electronic package.

The present application relates to an electronic package and its manufacturing method, which comprises providing a supporting structure with electronic components and a package layer covering the electronic components, forming a heat conducting structure on the package layer, and allowing the heat conducting structure and the package layer not to cover the electronic components, then placing the supporting structure on a substrate through a plurality of solder bumps, and irradiating the electronic components, the supporting structure and the heat conducting structure with a laser beam to transfer the heat energy of the laser beam to the plurality of solder bumps through the heat conducting structure, so as to effectively make the solder bumps fixed to the supporting structure to avoid the problem of non-wetting solder.

An electronic package module and a method for manufacturing the same are provided. The method includes providing a circuit substrate including a first surface. On the first surface, a dielectric substrate and at least a first electronic component are disposed. A first encapsulation layer covering the first electronic component and the dielectric substrate is formed on the first surface. A masking material is disposed on the first encapsulation layer such that the masking material covers the dielectric substrate and an opening of the masking material overlaps the first electronic component. A thermally conductive solder is deposited on the first encapsulation layer using the masking material as a mask. After the masking material is removed, the dielectric substrate is connected to a main board. Thus, heat dissipation of the electronic component toward the main board can be accelerated by the thermally conductive solder on the first encapsulation layer.

1. Name of the designed product: ceramic tube shell (LCC4) for electronic package. 2. Use of the designed product: package component for optical isolation switch. 3. Design points of the designed product: in shape. 4. Picture or photo best showing the design points: perspective view 1.

The utility model relates to an electronic package, which is mainly characterized in that a first electronic component is arranged on a circuit structure, a second electronic component is stacked on the first electronic component, the second electronic component is externally suspended and protrudes out of the first electronic component, and a strengthening layer is formed on the second electronic component to strengthen bending resistance.

The application discloses a toughening agent containing norbornane structure and application thereof in preparation of modified bismaleimide resin. The toughening agent containing norbornane structure is obtained by introducing multiple high-reactivity double bonds on the norbornane structure, and the introduction of the stereofatty cyclic structure with a large free volume reduces the dipole density per unit area in the resin system. Meanwhile, the terpolymerization among the bismaleimide monomer, the diallyl bisphenol A and the toughening agent containing norbornane structure changes the crosslinking mode of the original bismaleimide monomer / diallyl bisphenol A system, so that the toughened bismaleimide resin has good dielectric properties and excellent toughness and heat resistance, and has a good application prospect in the field of electronic packaging materials.

An electronic package is provided in which an electronic component is arranged on a wiring structure and covered with a packaging layer, and a frame body that does not contact the wiring structure is embedded in the packaging layer.

The invention relates to a semiconductor structure comprising: a wafer; a chiplet fixed to said wafer, and comprising a semiconductor device and one or more metallic layers connected to said semiconductor device; an interface structure for connecting an electronic package to the wafer; and a heat dissipation structure for transferring heat from the chiplet to the interface structure. Figure for the abstract: Fig. 8

The application discloses a kind of high dispersion, high modulus MDQ silicone resin and its preparation method, the method uses α, ω-dihydroxy polydimethylsiloxane (hydroxyl silicone oil) instead of traditional difunctional silane monomer as D chain source, avoid the cyclization side reaction of small molecule monomer, realize the uniform access of D chain;Combined with the stepwise feeding process of "first forming MQ skeleton and then introducing D unit" and the catalyst adding mode of "secondary acid supplement", the precise control of molecular structure is realized.The obtained MDQ silicone resin has a dispersion particle size of less than 100 nm, a storage modulus of 12-18 MPa, a light transmittance of more than 90%, and is high-temperature crack-free, with high dispersion, high modulus and high light transmittance, and is suitable for high light transmittance silicone gel, electronic packaging glue, organic silicone adhesive and organic silicone molding material, etc.

An electronic package structure and a method for manufacturing the same are provided. The electronic package structure includes a metal-containing layer, an electronic component, an encapsulant and a reinforcement structure. The electronic component is disposed over the metal-containing layer. The encapsulant encapsulates the electronic component, and defines a designated cavity. The reinforcement structure contacts the metal-containing layer, and overlaps a vertical projection of the designated cavity. A rigidity of the reinforcement structure is greater than a rigidity of the metal-containing layer.

The utility model relates to the technical field of packaging shell, provide an electronic packaging shell of high -efficient heat dissipation, its including shell, first fin and second fin, the shell is sealed housing, is equipped with the interface on the lateral wall of shell, first fin is the flat plate, first fin is integrally formed on the top surface of shell in vertical form, first fin is equidistant evenly distributed on the top surface of shell, second fin is the air -permeable board, second fin horizontal arrangement integrally formed connection all first fin. The electronic packaging shell of high -efficient heat dissipation can guarantee the exchange efficiency of shell surface air, realizes stable and high -efficiently to complete heat dissipation.

The present application provides an electronic packaging device, comprising a lead frame provided with a mounting slot in the shape of "#" or "king", the inside and surface of the mounting slot of the lead frame are provided with insulating glue, the insulating glue forms an integral whole with the pins of the lead frame after solidification, a chip is provided with a die-bonding glue DAF film, the chip and the die-bonding glue DAF film are separated after baking and scribing, the scribed chip is mounted on the lead frame, the chip is connected with the lead frame through a bonding wire, the lead frame is provided with a plastic encapsulation body for plastic encapsulation of the chip, the gap between the pins of the lead frame is filled with insulating glue by first coating insulating glue on the hollow lead frame, and a fixed shape is formed, the pins of the lead frame and the gap between the pins are fixed by the insulating glue, and the problem of no suspension and shaking of the chip on the frame is solved.

An electronic package structure and a method of manufacturing the same are provided. The electronic package structure includes a metal-containing layer, an electronic component, an encapsulation, and a reinforcement structure. The electronic component is disposed over the metal-containing layer. The encapsulation encapsulates the electronic component and defines a designated cavity. The reinforcement structure contacts the metal-containing layer and overlaps a vertical projection of the designated cavity. A stiffness of the reinforcement structure is greater than a stiffness of the metal-containing layer.