1009 results about "Electronic packages" patented technology

A surgical stapling end effector comprising a cartridge channel jaw, an anvil jaw, and a surgical staple cartridge positioned within the cartridge channel jaw is disclosed. The surgical staple cartridge comprises a plurality of staples, a cartridge body comprising a plurality of staple cavities, a longitudinal slot, and an outer lateral cartridge wall comprising a recess defined therein. The surgical staple cartridge further comprises an electronics sub-assembly positioned within the recess, wherein the electronics sub-assembly comprises electrical pathways, a printed circuit board removably attached to the outer lateral cartridge wall within the recess, and a wireless transmission coil electrically coupled to the printed circuit board by way of the electrical pathways, wherein the wireless transmission coil is configured to transmit at least one of power or data between the printed circuit board and a corresponding wireless transmission coil of an instrument to which the surgical staple cartridge is attached.

An electronic package and a manufacturing method thereof are provided, in which a supporting structure having a supporting body is disposed on a carrying structure and is in contact with or in proximity to an electronic component, and a barrier structure is disposed on the supporting body, such that the electronic component is exposed from an opening of the barrier structure. Furthermore, a thermal conduction layer is formed on the electronic component exposed from the opening of the barrier structure, and the barrier structure blocks or surrounds the thermal conduction layer on the electronic component, thereby preventing the thermal conduction layer from overflowing.

A method for forming the same is provided. The method comprises: providing a package substrate; attaching back conductive blocks onto a back surface of the package substrate via back solder bump; loading the package substrate on a first bottom chase with the back conductive blocks facing upward, and pressing, with a first top chase, the back conductive blocks against the first bottom chase to reshape the back solder bumps and horizontally align top surfaces of the back conductive blocks with each other; attaching front conductive blocks onto a front surface of the package substrate via front solder bumps; loading the package substrate on a second bottom chase with the front conductive blocks facing upward, and pressing, with a second top chase, the front conductive blocks against the second bottom chase to reshape the front solder bumps and horizontally align top surfaces of the front conductive blocks with each other.

A substrate structure is provided, in which an insulating protection layer is formed on a substrate body having a plurality of electrical contact pads, and the insulating protection layer has a plurality of openings corresponding to the plurality of exposed electrical contact pads, and the insulating protection layer is formed with a hollow portion surrounding a partial edge of at least one of the electrical contact pads at at least one of the openings, so as to reduce the barrier of the insulating protection layer.

An electronic package and a method for manufacturing the same include: a first supporting structure having a first circuit layer, a packaging module disposed on the first supporting structure and electrically connected to the first circuit layer, a first electronic component disposed on the first supporting structure and electrically connected to the first circuit layer, and a second electronic component stacked on the first electronic component and electrically connected to the first electronic component. By stacking the first electronic component and the second electronic component, the surface area of ​​the first supporting structure occupied by the electronic components is reduced, so that there is enough space to place the packaging module.

An electronic package provides a plurality of conductive posts having separable blocks and a first electronic component having a separable block, and a cladding layer wraps the first electronic component, the separable blocks and the conductive posts to expose the separable blocks out of a surface of the cladding layer, and then the separable blocks are removed to form a plurality of conductive posts having a plurality of separable blocks and a plurality of conductive posts having a plurality of separable blocks and a plurality of conductive posts having a plurality of separable blocks and a plurality of conductive posts having a plurality of separable blocks. And a plurality of conductive columns are arranged on the surface of the cladding layer so as to form a plurality of concave parts on the surface of the cladding layer, and the plurality of conductive columns and the first electronic element are exposed out of the concave parts, so that through the design of the concave parts, the contact area between a circuit part subsequently formed on the cladding layer and the cladding layer is increased, and the condition of delamination of the circuit part is avoided during thermal circulation.

An electronic package is mainly characterized in that a dam body is formed at the edge of the electronic package to prevent a packaging material from overflowing to the lower part, so that the packaging material does not contact a conductive element below the packaging material, and the problem that the conductive element is not wetted during subsequent reflow soldering of the conductive element can be avoided.

The invention relates to an electronic package with a recessed terminal. A power module includes a substrate including an electrically insulating layer. A first conductive region, a second conductive region, and a third conductive region are each disposed on the electrically insulating layer. The conductive regions are electrically isolated from each other. A plurality of high-side power switches are disposed on and electrically coupled to the first conductive region. A first connector is coupled between the plurality of high side power switches and the second conductive region. A plurality of low-side power switches are disposed on and electrically coupled to the second conductive region. The insulative encapsulant at least partially encapsulates the power module assembly. The enclosure defines a plurality of recesses disposed in a bottom surface of the power module. A plurality of conductive pins extend from the bottom surface. Each conductive pin is aligned with a respective recess of the plurality of recesses.

Electronic packages and package-on-package structures are described. In an embodiment, an electronic package include multiple staircased dies and multiple vertical wire bonds encapsulated by a molding layer, where the multiple vertical wire bonds protrude from a top surface of the molding layer so that the vertical wire bonds stand proud above a top surface of the molding layer.

An electronic package and a manufacturing method thereof are provided, in which a plurality of conductive pillars with detachable blocks and a first electronic component with detachable blocks are provided, and the first electronic component, the plurality of detachable blocks and the plurality of conductive pillars are covered with an encapsulating layer, so that the plurality of detachable blocks are exposed from the surface of the encapsulating layer, and then the plurality of detachable blocks are removed to form a plurality of recesses on the surface of the encapsulating layer, so that the plurality of conductive pillars and the first electronic component are exposed from the recesses. Therefore, through the design of the recesses, the contact area between the circuit portion subsequently formed on the encapsulating layer and the encapsulating layer can be increased, thereby preventing from peeling of the circuit portion during thermal cycles.

Provided are an electronic package and a manufacturing method thereof. An electronic component is embedded in an encapsulation layer, the electronic component has a first electrode pad and a second electrode pad on two opposite sides thereof to form a double-sided power supply structure, and thus a circuit structure and a wiring structure on the two opposite sides of the electronic component can be electrically connected to the first electrode pad and the second electrode pad, thereby it is beneficial for reducing loss of the power.

The invention provides two-component low-hardness silicone rubber based on a vinyl silicone oil / silicon dioxide composite material and a preparation process of the two-component low-hardness silicone rubber. By introducing modified silicon dioxide, a photoinitiator and a platinum catalyst and combining a dual cross-linking mechanism of ultraviolet curing and thermocuring, rapid curing and uniform deep cross-linking of the silicone rubber are realized. And the modified silicon dioxide adopts a core-shell structure design, so that the compatibility of the filler and a matrix is improved, and the mechanical property and long-term stability of the material are effectively improved. The prepared silicone rubber has low hardness, high tensile strength, excellent high temperature resistance and self-repairing capability, and is suitable for the fields of electronic packaging, medical instruments, automobile parts and the like. The process is simple and convenient, the curing speed is high, the product performance is excellent, and the industrial application value is wide.

The invention relates to a high-performance electronic packaging adhesive based on graphene composite diamond micro-powder and a preparation method of the high-performance electronic packaging adhesive. By adding surface-modified graphene composite diamond micro-powder and a fumed silica dispersing agent into an epoxy resin system, an efficient heat-conducting grid is formed in a resin matrix, so that the heat-conducting effect is remarkably improved, the interface interaction between a heat-conducting filler and the resin matrix is synergistically and efficiently enhanced, and the compatibility is improved; the influence on the processability and the mechanical property of the resin matrix when a large amount of heat-conducting filler is conventionally added is avoided. In addition, a self-developed liquid nitrogen-phosphorus flame retardant and a toughening agent are added, so that the packaging adhesive has good flame retardance and toughness while high heat conductivity is ensured. The proportion range of the modified graphene composite diamond micropowder and fumed silica is determined by optimizing the formula, the addition amount of the heat-conducting filler in the packaging adhesive is reduced to the maximum extent, the reaction cost is effectively reduced, and meanwhile, the advantages of high heat conductivity, high flame retardance and good toughness of the packaging adhesive are synergistically realized. The packaging adhesive is suitable for the field of wider electronic packaging materials.

An antenna substrate, electronic package and manufacturing method thereof are provided in which an antenna substrate including a silicon core layer, a circuit structure and conductive pillars, and the circuit structure has a first dielectric layer, a first circuit layer and a first antenna portion. The circuit structure and the conductive pillars are formed on opposite sides of the silicon core layer, and the antenna substrate is stacked and bonded to a circuit board having a second antenna portion through the conductive pillars. Thereby, the present disclosure can thin a thickness of the antenna substrate and the electronic package, or precisely control a distance between the antenna substrate and the circuit board.

Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, a microelectronic device package may include a redistribution layer (RDL) and an interposer over the RDL. In an embodiment, a glass core may be formed over the RDL and surround the interposer. In an embodiment, the microelectronic device package may further comprise a plurality of dies over the interposer. In an embodiment, the plurality of dies are communicatively coupled with the interposer.

An electronic package and a method of fabricating the same are provided, including providing a first carrier structure and a second carrier structure having a thickness smaller than that of the first carrier structure, disposing at least one first electronic component on the first carrier structure, and disposing at least one second electronic component on the second carrier structure. The first electronic component and the second electronic component are wrapped by a wrapping layer, so that the second electronic component can be arranged on the second bearing structure by adopting a packaging module, and the problem that the packaging module is too high is avoided.

An electronic package and a manufacturing method thereof are provided, mainly an electronic component stacking structure is arranged on a bearing structure to integrate a plurality of chips in a single package, so that the electronic package can meet the requirement of miniaturization without increasing the layout area of the bearing structure.

An electronic package and a manufacturing method thereof are provided, in which an electronic element is disposed on a carrier structure, then a cladding layer is formed to cover the electronic element, and a shielding layer is formed on the cladding layer to cover the electronic element. The cladding layer is bonded to a shielding structure, and the shielding structure is located between the shielding layer and the electronic element, so as to prevent the electronic element from being subjected to external electromagnetic interference via multiple shielding mechanisms of the shielding structure and the shielding layer.

The invention belongs to the technical field of electronic packaging materials, and particularly relates to an epoxy resin composite material with a low thermal expansion coefficient, a cured product and application. The epoxy resin composite material with low thermal expansion coefficient, high thermal conductivity and good flowability is prepared by compounding the negative thermal expansion filler, the thermal conductive filler, the epoxy resin and the curing agent through the synergistic effect of the components, so that the epoxy resin composite material has good flowability and filling property during plastic packaging; the packaging operation can be better carried out, the packaging effect is improved, the working stability of electronic components is effectively improved, the working life is prolonged, and the packaging material has wide application prospects in the field of electronic packaging materials.

An electronic package is provided, in which an electronic element that is electrically connected to a plurality of conductive vias and a functional part that has a hollow area are disposed on a photonic die that has the plurality of conductive vias and at least one external connection portion, where a cladding layer covers the electronic element and the functional part, such that the external connection portion is exposed from the hollow area and the cladding layer for an optical fiber to insert into the hollow area and connect to the external connection portion, so as to achieve the purpose of optoelectronic integration.

A microelectronic socket structure and a method of forming the same. The socket structure comprises: a socket structure housing defining a cavity therein; and an interconnection structure including: a contact element disposed at least in part within the cavity, and configured to be electrically coupled to a corresponding microelectronic package, the contact element corresponding to one of a signal contact element or a ground contact element; and a conductive structure disposed at least in part within the cavity, electrically coupled to the contact element, and having an outer contour that is non-conformal with respect to an outer contour of the contact element.

An electronic package and its supporting structure and manufacturing method. The supporting structure includes a protective layer formed on a metal part with multiple conductive columns, and the protective layer exposes the end faces of the conductive columns to allow conductors to be formed on the end faces of the conductive columns to avoid damage to the protective layer.

An electronic package and an interposer are mainly characterized in that a recess is formed on a conductive via on a back side of an interposer body of the interposer, and a wiring structure electrically connected to the conductive via is directly formed on the back side of the interposer body and in the recess, without making a passivation layer, omitting a CVD process and a CMP process. Therefore, the manufacturing process can be effectively simplified, and a large amount of manufacturing time and material cost are saved.

Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects are provided. An example optical interconnect joins first and second optical conduits. A first direct oxide bond at room temperature joins outer claddings of the two optical conduits and a second direct bond joins the inner light-transmitting cores of the two conduits at an annealing temperature. The two low-temperature bonds allow photonics to coexist in an integrated circuit or microelectronics package without conventional high-temperatures detrimental to microelectronics. Direct-bonded square, rectangular, polygonal, and noncircular optical interfaces provide better matching with rectangular waveguides and better performance. Direct oxide-bonding processes can be applied to create running waveguides, photonic wires, and optical routing in an integrated circuit package or in chip-to-chip optical communications without need for conventional optical couplers. An example wafer-level process fabricates running waveguides, optical routing, and direct-bonded optical interconnects for silicon photonics and optoelectronics packages when two wafers are joined.

The invention provides a method for synthesizing aluminum nitride fibers by preheating combustion, which comprises the following steps: preheating aluminum powder and aluminum nitride serving as raw materials in a low-pressure nitrogen environment, and then inducing a combustion synthesis reaction to prepare the aluminum nitride fibers with the average diameter of 0.3-0.8 mu m and the average length of 400-800 mu m. The preparation method has the characteristics of simple process, low preparation cost and the like, and the prepared aluminum nitride fiber can be used as a high-thermal-conductivity filler for electronic packaging.

An electrical connector assembly includes: a printed circuit board; an electrical connector seated upon the printed circuit board; an electronic package coupled to the electrical connector; a frame structure affixed to the printed circuit board; a metallic securing seat affixed to the frame structure and having plural securing posts; a heat sink positioned upon the electronic package and having plural through holes aligned with the securing posts; plural fasteners each extending through a corresponding through hole to engage a corresponding securing post and plural springs each compressed between an associated fastener and the heat sink; and a retention member mounted to a corresponding securing post for engaging the heat sink, wherein the retention member has a mounting part and a latching part pivoted to the mounting part.

An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

An electronic package includes an interposer having an interposer substrate, a cavity that passes into but not through the interposer substrate, a through interposer via (TIV) within the interposer substrate, and an interposer pad electrically coupled to the TIV. The electronic package includes a nested component in the cavity, wherein the nested component includes a component pad coupled to a through-component via. A core via is beneath the nested component, the core via extending from the nested component through the interposer substrate. A die is coupled to the interposer pad by a first interconnect and coupled to the component pad by a second interconnect.

The invention relates to the technical field of electronic packaging materials, and discloses an epoxy molding compound and a preparation method thereof. The epoxy molding compound is prepared from the following raw materials in percentage by weight: 70 to 90 percent of filler, 5 to 15 percent of epoxy resin, 3.1 to 10.5 percent of phenolic resin-stearylamine intermediate, 0.2 to 0.8 percent of catalyst, 1 to 5 percent of stress absorbent, 0.2 to 2 percent of coupling agent, 0.1 to 1.2 percent of release agent and 0.1 to 0.5 percent of coloring agent. According to the invention, by adding the phenolic resin-stearylamine intermediate into the epoxy molding compound, the final volume resistivity of the epoxy molding compound can be reduced to 108-1011 omega.cm, and by reducing the volume resistivity and improving the conductivity of the material, rapid release of static electricity is realized, and the problem of electrostatic adsorption is solved.

The invention discloses an antistatic polyester film capable of phase change temperature regulation and a preparation method thereof, the film provided by the invention has a double-layer structure, the bottom layer is a temperature regulation functional layer doped with a phase change material, and the surface layer is a functional layer doped with carbon black to prevent electrostatic aggregation. According to the antistatic polyester film capable of adjusting the temperature through phase change, the adjusting temperature is 27 DEG C, the phase change enthalpy is 17 j / g, the surface resistivity of the surface layer is 1.1 * 10 < 7 > omega / m < 2 >, and the antistatic polyester film is expected to be applied to the fields of intelligent wearable equipment, medical sensors, electronic packaging materials, supercapacitor protection layers and the like.