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2878 results about "Coolant flow" patented technology

Coolant flow is either laminar or turbulent, or in transition between laminar and turbulent. For laminar flow, heat transfer increases proportional to the cube root of the flow rate.

Modular battery system

Disclosed herein is a modular battery system having at least one set of battery modules, preferably monoblock modules connected in series. Each of the battery modules may be designed with a first endplate and a second endplate, wherein each battery module is set between the first and second endplates and at least one band member couples the endplates to each other, binding the battery module between the endplates. The endplates are secured between a pair of rails and the system is disposed in a system housing. A cooling manifold provides a system wherein coolant flows into and out of each battery module. The system housing preferably has a coolant inlet and a coolant outlet. The cooling manifold is in flow communication with the coolant inlet and the coolant outlet. A battery monitoring system, which may include a battery control module and at least one remote sensing module, preferably monitors and collects performance and status information, such as voltage and temperature, of the battery modules. An integrated control unit (ICU) may be disposed in the system housing. The ICU supports electronics, some of which are used to collect electrical energy produced by the battery modules and / or monitor the system.
Owner:BATTERY PATENT TRUST

Cell necrosis apparatus with cooled microwave antenna

InactiveUS20050245920A1Minimize potential for bucklingSmall sizeElectrotherapySurgical instruments for heatingElectricityCoolant flow
A cell necrosis apparatus for delivering thermal microwave energy to a specific site in a body, including: a. a microwave generator, b. a coolant delivery system for delivering and circulating a quantity of cooled liquid coolant via inlet and return passageways, c. a probe including a probe handle and a probe body having a proximal portion coupled to the probe handle and a distal portion, d. a microwave antenna in the distal portion of the probe body for applying thermal microwave energy to a specific site in cell necrosis treatment, and e. a microwave transmission line extending from the microwave generator to and through the probe handle and to and through the probe body to the microwave antenna and electrically coupled thereto, where the inlet and return coolant flow passageways extend from the coolant delivery system to and through the probe handle and thence extend coaxially about the microwave transmission line and along the length thereof within the probe body, and extend coaxially about the antenna and long the length thereof within the probe body, and where a first of the inlet and return coolant flow passageways is radially outward of and immediately adjacent the microwave transmission line and the antenna within the probe body and the other of the inlet flow passageways is radially outward of the first flow passageway.
Owner:TELEFLEX LIFE SCI LTD

Non-linear fin heat sink

A non-linear fin heat sink is provided for dissipating / removing heat uniformly from a device, where the heat generation is non-uniform over that device, while also providing a small and relatively lightweight heat sink. The heat sink has extended surface protrusions that are optimally shaped in recognition of convective heat transfer, conductive heat transfer, and flow resistance allowing the heat sink to offset the temperature rise of a coolant media and provide enhanced cooling for the coolant temperature, deliver optimized cooling efficiency per the local physical properties of the coolant media, be used with a fluid for effectuating heat transfer; either liquid coolant, gas coolant or a combination thereof. Furthermore the heat sink features turbulence enhancement of the coolant stream by a pin array through which coolant stream passes, such fin array featuring a non-linear shape, spacing, and height pattern to provide optimal cooling while simultaneously reducing volume and flow resistance.
Owner:THERMAL TECH

CMC Vane Assembly Apparatus and Method

A metal vane core or strut (64) is formed integrally with an outer backing plate (40). An inner backing plate (38) is formed separately. A spring (74) with holes (75) is installed in a peripheral spring chamber (76) on the strut. Inner and outer CMC shroud covers (46, 48) are formed, cured, then attached to facing surfaces of the inner and outer backing plates (38, 40). A CMC vane airfoil (22) is formed, cured, and slid over the strut (64). The spring (74) urges continuous contact between the strut (64) and airfoil (66), eliminating vibrations while allowing differential expansion. The inner end (88) of the strut is fastened to the inner backing plate (38). A cooling channel (68) in the strut is connected by holes (69) along the leading edge of the strut to peripheral cooling paths (70, 71) around the strut. Coolant flows through and around the strut, including through the spring holes.
Owner:SIEMENS ENERGY INC

Powder feeder for material deposition systems

A method and apparatus for embedding features and controlling material composition in a three-dimensional structure (130) is disclosed. The invention enables the control of material characteristics, within a structure (130) made from a plurality of materials, directly from computer renderings of solid models of the components. The method uses stereolithography and solid model computer file formats to control a multi-axis head (480) in a directed material deposition process (123). Material feedstock (126, 127) is deposited onto a pre-heated substrate (19). Depositions (15) in a layer-by-layer pattern, defined by solid models (141, 146), create a three-dimensional article having complex geometric details. Thermal management of finished solid articles (250-302), not available through conventional processing techniques, is enabled by embedded voids (152) and / or composite materials (126, 127), which include dissimilar metals (210, 216). Finished articles control pressure drop and produce uniform coolant flow and pressure characteristics. High-efficiency heat transfer is engineered within a solid structure by incorporating other solid materials with diverse indexes. Embedding multi-material structures (132, 134) within a normally solid component (141) produces articles with diverse mechanical properties. Laser and powder delivery systems (420, 170) are integrated in a multi-axis deposition head (480) having a focused particle beam (502) to reduce material waste.
Owner:OPTOMEC DESIGN CO

Nested bipolar plate for fuel cell and method

Between adjacent MEA's is a bipolar plate assembly having a first sub-plate with a flow channel which is open to the anode side of the one of the MEA's. A second sub-plate has a flow channel which is open to the cathode side of the adjacent MEA. The sub-plates are nested together to form a coolant flow channel between the sub-plates. The coolant flow path has a height dimension wherein the distance between the adjacent MEA's is substantially unaffected by the height dimension of the coolant flow path. A method of manufacturing a bi-polar plate assembly includes forming a closed coolant flow channel between the sub-plates by nesting the sub-plates together. A method of operating a fuel cell includes passing the coolant through a flow path having a height dimension which is substantially aligned with the height dimension of the hydrogen flow path, the oxygen flow path, or both.
Owner:GM GLOBAL TECH OPERATIONS LLC

Liquid cooling apparatus and method for cooling blades of an electronic system chassis

Apparatus and method are provided for facilitating liquid cooling of a plurality of blades of an electronic system chassis. The apparatus includes a chassis-level manifold assembly with a first coolant path and a plurality of second coolant paths. The first coolant path is isolated from the plurality of second coolant paths by a heat exchanger. The heat exchanger facilitates transfer of heat from coolant within the second coolant paths to coolant within the first coolant path. Each second coolant path is isolated from the other second coolant paths, and coolant passing therethrough facilitates cooling of a respective blade. When operational, each second coolant path forms a portion of a respective closed loop coolant path extending between the manifold assembly and the electronic system chassis, and in one embodiment, each blade is an immersion-blade, with multiple components thereof immersion-cooled by coolant flowing through the respective second coolant path.
Owner:BRAINSCOPE SPV LLC +1

Cooling apparatus for semiconductor chips

A cooling apparatus for semiconductor chips includes radiation fins formed on the opposite surface of metal base opposite to the surface of metal base, to which an insulator base board mounting semiconductor chips thereon, is disposed. The radiation fins, such as sheet-shaped fins having different lengths are arranged such that the surface area density of the fins becomes higher in the coolant flow direction, whereby the surface area density is the total surface area of radiation fins on a unit surface area of the metal base. As a result, the temperatures of semiconductor chips arranged along the coolant flow direction are closer to each other.
Owner:FUJI ELECTRIC CO LTD

Air conditioner for vehicle

InactiveUS20100281901A1Solve insufficient heating capacityReduce energy lossAir-treating devicesRailway heating/coolingCoolant flowEngineering
In an air conditioner for a vehicle, in a heating operation for heating a vehicle compartment, when heating capacity is obtained by flowing a coolant through an inside of an indoor heat exchanger, the coolant flows directly in the inside of the indoor heat exchanger to heat air to be supplied to the vehicle compartment. In contrast, when the heating capacity is not obtained by flowing the coolant through the inside of the indoor heat exchanger, the coolant flows through a first water-refrigerant heat exchanger and a refrigerant in a heat pump cycle circulates so that heat of the coolant is absorbed by the refrigerant in the first water-refrigerant heat exchanger, and the air is heated in the indoor heat exchanger by using heat of the refrigerant that has absorbed the heat of the coolant.
Owner:DENSO CORP +1
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