45 results about "Pin array" patented technology

The invention discloses a lead frame, an SSD module and an SSD device. The scheme comprises a first base island which is used for installing a storage control chip; the second base island is used for installing a Flash; and the pin array is distributed at the periphery of the first base island. Due to the arrangement of the first base island and the second base island, the lead frame can be integrated with the storage control chip and the Flash at the same time, the SSD module can be manufactured by packaging the lead frame, the storage control chip and the Flash do not need to be independently packaged and then assembled into the SSD module, the manufacturing difficulty of the SSD module is reduced, and the packaging cost of the SSD device can be effectively reduced. The pin array in the lead frame is distributed around the first base island, so that the SSD module can be manufactured by adopting QFN packaging, and compared with BGA packaging, the packaging cost of the SSD device can be further reduced, and the profit margin of an SSD manufacturer is improved.

The application relates to the technical field of electrical connection equipment, and discloses a high-current small bus plug-in box rotary plug, which is used to solve the problems that the structure of key conductive components is single, the setting space is cramped, the conductive temperature rises fast, and the components are prone to aging in the prior art. The application is characterized in that the space of the regular octagonal flame-retardant PC shell and the insulating partition plate is optimized, the T2 oxygen-free copper Z-shaped large-section pin array is symmetrically arranged, the uniform contact pressure guaranteed by the spring assembly is matched, the conductive cross-sectional area is 2-3 times higher than that of the traditional reed structure, the galvanic corrosion of dissimilar metals is effectively avoided, the current-carrying capacity and the current transmission stability are greatly improved, the multidirectional heat exchange channels formed by the regular octagonal included angle, the pin array bending gap and the internal cavity are combined, the separation and heat dissipation of the insulating partition plate are combined, the cold and hot air efficient convection is realized, and the temperature rise of the key components is significantly reduced.

The invention relates to a method for creating a bus-type-independent electronics platform for a control electronics (1) of an electric drive, in particular a fluid pump, wherein the control electronics (1) for a plurality of variants of the fluid pump has a control electronics board (2) with a uniform board layout (3) and the board layout (3) has a connection pin pattern (4) with a plurality of connection pins (5), the fluid pump has a connector module (6) as an interface from the connection pin pattern (4) of the control electronics (1) to a pin pattern of a customer's vehicle electrical system, comprising the steps: - Providing all necessary connection pins (5) for all bus types to be covered in the connection pin pattern (4) of the PCB layout (3); - Arranging input pins (8) of the connector module (6) in an input pin pattern (9) corresponding to a connection pin pattern (5) of the control electronics board (2), in particular corresponding to a bus type to be contacted; - Arranging output pins (10) in an output pin pattern (11) of the connector module (6) corresponding to the pin pattern of a mating connector module of the customer's vehicle electrical system; - Transferring the input pin pattern (9) of the connector module (6) into the output pin pattern (11) of the connector module (6) within a connector module housing (13), wherein several conductor sections (14), each forming an input pin (8) of the connector module (6) at one end and an output pin (10) of the connector module (6) at the other end, are formed as stamped and bent parts, and the conductor sections (14) are overmolded or overmolded at least in an area between the input pins (8) and the output pins (10) to form a conductor section bundle (14).

1. Name of the product in this design: Hook and Loop (Concealed). 2. Purpose of this design: It is mainly used as a concealed hook for hanging clothes, towels, bath items, etc. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.

The utility model discloses a positioning fixture for Hall sensor production, which comprises a box-shaped base, a bottom plate is slidably mounted in the base, a reset part is arranged between the bottom of the bottom plate and the base, the output end of the reset part is abutted against the bottom plate, a bearing plate and an upper panel are fixedly mounted on the base, the bearing plate is positioned above the bottom plate, and the upper panel is positioned above the bearing plate. A plurality of through holes are formed in a rectangular array of the bearing plate, the upper panel is located above the bearing plate, the upper panel and the bearing plate are correspondingly provided with a plurality of through holes, positioning pins are slidably installed in the through holes, sealing rings are arranged between the through holes and the positioning pins, the space between the bearing plate and the upper panel is filled with magnetorheological fluid, and an electromagnet is fixedly installed on the side face of the base. And the electromagnet is connected with a control switch. The placement positions are formed through the positioning pin array, so that the positioning pins can form corresponding placement points according to the shape of the side where the Hall current sensors are placed, and the placement requirements of the Hall current sensors in different shapes can be met conveniently.

A heat sink includes a base extending from a first end to a second end and a plurality of pin fins extending from the base and arranged in a number of columns including a first column and a second column. Each pin fin includes a lower portion at or near the base and an opposing top portion spaced apart from the base. A plurality of bridged ribs includes a first plurality of bridged ribs, wherein the first plurality of bridged ribs each connect the top portion of one of the pin fins in the first column with the top portion of one of the pin fins in the second column.

This utility model relates to the field of automated pin inspection technology, and more particularly to a mechanism for automatically inspecting the shape of pins, including a CCD component for optical inspection of the pin shape of a product; a product fixture platform with fixture acupoints on its surface, the fixture acupoints being through holes, and the upper diameter of the fixture acupoints being smaller than the outer diameter of the product to be inspected; the fixture acupoints are used to align the placement direction of the product to be inspected with the detection direction of the CCD component; a bottom pin fixture located below the product fixture platform and capable of being ejected from the fixture acupoints; the surface of the bottom pin fixture having an array of pin holes for verifying the compliance of the pin array on the product; a product clamping component for clamping and positioning the product on the fixture acupoints; and a lifting component for driving the bottom pin fixture to move vertically. This application improves the problem of inaccurate detection results caused by pins obstructing each other.

This utility model relates to the field of camera module testing technology, specifically disclosing an automatic testing system for camera modules, including a pin test fixture, at least one test control board, a switch, and a host computer. The pin test fixture is signal-connected to the camera module under test, and includes a fixture body and a pin array disposed on the fixture body. The test control board is electrically connected to the pin test fixture, and includes a microcontroller, a multi-channel ADC acquisition module, and a signal output interface. The microcontroller is electrically connected to both the multi-channel ADC acquisition module and the signal output interface, and the signal output interface is electrically connected to the pin test fixture via wires. The switch is electrically connected to both the microcontroller and the host computer. The host computer is used to send test commands, receive test data, and display test results. This system solves the problems of low testing efficiency, easily damaged connectors, and unstable signal transmission.

This invention discloses a multi-level adaptive machining auxiliary clamping device, belonging to the field of robotic automated drilling and riveting. The base module of this invention is used to stably connect the pressure foot to the robot's end effector and provides mounting positions for the conformal module, locking module, and alignment module. The conformal module uses a cylindrical pin array to automatically adapt to the surface shape of workpieces with different curvatures and conforms accordingly. The locking module is used to lock the conformed cylindrical pin array, ensuring the stability of the conformation. The alignment module is used to align the perpendicularity of the tool axis to the workpiece surface before drilling. This invention has a simple structure, low cost, and convenient installation. By applying clamping force to the workpiece surface, it can reduce the influence of drilling axial force on the workpiece, reduce chatter during machining, and improve machining stability. Simultaneously, this device can achieve automatic conformal clamping of workpieces with different curvatures, ensuring stable clamping while reducing workpiece deformation and further improving drilling accuracy.

The invention discloses a tool and process for welding a sensor chip pin header and a circuit board, relates to the technical field of sensor processing, and is used for facilitating the installation and positioning of a sensor chip and the circuit board and improving the assembly efficiency and the yield. The tool for welding the sensor chip pin header and the circuit board is used for welding, positioning and fixing the sensor chip, the pin header and the circuit board, the sensor chip comprises a chip body and a plurality of contact pins, and the contact pins extend outwards along the side wall of the chip body and are distributed in parallel. The circuit board is provided with pin holes for the pins to pass through and pin header holes for the pin header to pass through at intervals, and the pin holes and the pin header holes penetrate through the circuit board along the thickness direction of the circuit board. The sensor chip pin header and circuit board welding tool comprises a chip mounting plate, a welding cover plate, a sliding limiting plate and a locking piece. A plurality of working grooves used for installing circuit boards are formed in the plate face of one side of the chip installation plate in parallel at intervals, and the circuit boards can be placed in the working grooves.

A multi-commodity flow-based synchronous escape routing method and apparatus, and a medium. The method comprises: creating a grid pin array (GPA) routing graph on the basis of a chip GPA, and creating an irregular pin array routing graph on the basis of an array having a miss pin; creating escape boundary nodes in synchronous escape routing on the basis of the created GPA routing graph; creating an overall synchronous escape routing graph on the basis of the created escape boundary nodes; on the basis of the created overall synchronous escape routing graph, creating a multi-commodity flow-based synchronous escape routing model; solving the synchronous escape routing model to obtain a routing result, and designing a constraint for grouping and same-layer arrangement in the synchronous escape routing; and optimizing routing paths of the synchronous escape routing model, and accelerating the synchronous escape routing on the basis of an optimization result. By modeling routing constraints and path optimization methods, the present invention supports the simultaneous action of multiple acceleration methods, thereby improving system efficiency.

The application discloses a pattern and current-voltage linkage test method, a test machine and a storage medium, and belongs to the technical field of semiconductor testing, wherein the pattern and current-voltage linkage test method comprises the following steps: a trigger processing module acquires a trigger command sent by an upper computer, and according to the trigger command, corresponding pre-stored patterns are called from a memory; the pre-stored patterns comprise pattern waveforms and current-voltage microinstructions; when the trigger processing module identifies the pattern waveforms, the trigger processing module sends the pattern waveforms to a pattern module, and the pattern module controls an electronic pin array to output the pattern waveforms according to the pattern waveforms; if the trigger processing module identifies the current-voltage microinstructions, the trigger processing module sends the current-voltage microinstructions to a current-voltage test module, and the current-voltage test module controls the electronic pin array to perform current-voltage testing according to the current-voltage microinstructions. The method does not pass through the upper computer, realizes the pattern and current-voltage linkage test in a business FPGA, saves communication time, and improves test efficiency.

The invention relates to the field of molecular diagnosis equipment, and discloses an NGS library preparation instrument based on a digital microfluidic technology. Comprising a rack and a top plate fixedly arranged on the rack. And the substrate is provided with an opening penetrating through the thickness direction. And the chip bearing platform is arranged in the opening and is used for bearing the digital micro-fluidic chip. And the driving plate is fixed below the substrate, is positioned below the opening area, is provided with a pin array and is in contact with a bottom electrode of the chip. The pressing and releasing mechanism comprises a first pressing and releasing part and a second pressing and releasing part, elastic abutting force is applied through an elastic assembly, so that the digital micro-fluidic chip is electrically connected with the pin array, and the abutting force can be released to release the chip. A temperature control module; and a magnetic bead control module. The preparation instrument executes multiple steps of sample treatment, temperature control, magnetic bead separation and the like in the NGS library preparation process.

The present disclosure relates to a pin arrangement structure, a package substrate, and a package structure, and relates to the field of package technologies. The pin arrangement structure includes a first pin array region. First pin units and second pin units in the first pin array region are sequentially arranged alternately in a first direction, and the first pin units and the second pin units are both provided with high-speed single-ended signal pins. A number of pins of the first pin units in a second direction is greater than a number of pins of the second pin units in the second direction, two adjacent second pin units are staggered in the first direction, and first reference ground pins are arranged at other pin positions of the first pin array region. Therefore, isolation is formed between the high-speed single-ended signal pins, improving isolation between signals and reducing crosstalk between the signals. At the same time, compared with existing arrangement, the arrangement reduces the number of pins and saves a region area of the pins.

The utility model relates to a magnetic assembly welding all-in-one machine clamp capable of flexibly fixing a wiring board, which comprises a clamp seat, the clamp seat is provided with a placing groove matched with a magnet yoke, the clamp seat is further provided with a fixing seat positioned on one side of the placing groove, and the top surface of the fixing seat is provided with a positioning pin and a pin hole for inserting the positioning pin. The positioning pins are arranged to form outer pins and inner pins, the outer pins comprise a left outer pin, a left upper outer pin, a right upper outer pin and a right outer pin which correspond to the outer side face of the magnetic assembly wiring board in position, and the inner pins comprise a left inner pin, a left upper inner pin and a right inner pin which correspond to the inner side face of the magnetic assembly wiring board in position; the positioning pins are arranged to form the outer pins and the inner pins, the wiring board is clamped and fixed from the inner side and the outer side, the wiring board is prevented from deflecting and being separated from a coil in the welding process, only the positions of the positioning pins inserted into the pin holes need to be adjusted, the mode of fixing the wiring board from the left side or the right side is flexibly changed, and the clamp base does not need to be overall disassembled and assembled.

A novel method and interface are provided to generalize power delivery (PD) solutions and allow OEMs and suppliers to easily replace PD solutions using the same design and layout without having to re-spin the motherboard. This is achieved by defining a new interface and ball-out which support dual port PD solution that meet the system requirements. The embodiments employ an interposer to unify different PD solutions. The interposer is part of a unique Land Grid Array (LGA) soldered down solution with pre-defined interface employing a generic pinout to support PD solutions for dual type-C ports from different vendors. The interposer includes an LGA having a pattern of pads that is coupled to a LGA on a platform PCB with a matching pattern.

The application provides a millimeter wave rectangular waveguide embedded gap waveguide filter, which comprises, from top to bottom, an upper metal cover plate, an intermediate metal block and a lower metal cover plate; the upper metal cover plate is provided with a coaxial input port; the lower metal cover plate is provided with a coaxial output port; the upper surface and the lower surface of the intermediate metal block are provided with a first periodic metal pin array and a second periodic metal pin array; the first periodic metal pin array and the second periodic metal pin array are respectively provided with a gap between the upper metal cover plate and the lower metal cover plate; the first periodic metal pin array surrounds a first slot gap waveguide resonant cavity on the upper surface of the intermediate metal block; the second periodic metal pin array surrounds a second slot gap waveguide resonant cavity on the lower surface of the intermediate metal block; a rectangular waveguide resonant cavity formed by hollowing out the inside of the intermediate metal block is in communication with the first slot gap waveguide resonant cavity and the second slot gap waveguide resonant cavity respectively.

The invention belongs to the technical field of power supplies, and discloses a water-cooling heat dissipation type power supply structure and a manufacturing method thereof.The water-cooling heat dissipation type power supply structure comprises heat dissipation side wall pieces arranged on the two sides, and a plurality of power devices are arranged on the inner walls of the heat dissipation side wall pieces; the main circuit board is fixedly arranged between the heat dissipation side wall pieces on the left side and the right side, a power source component is arranged on the main circuit board, and the heat dissipation side wall pieces and the main circuit board are positioned through a welding positioning jig; the pin arrays of the power devices of the heat dissipation side wall pieces located on the two sides and the bonding pad array of the main circuit board are welded and fixed after being synchronously aligned in a three-dimensional space; the bottom plate is located at the bottom of the main circuit board and fixedly connected to the heat dissipation side wall pieces on the two sides, the bottom plate is used for making contact with the water-cooling radiator, and the heat dissipation side wall pieces provide mounting positions for the water-cooling radiator. The problem that in the prior art, heat dissipation performance is not high due to the fact that heat dissipation cannot be carried out on the power device independently is solved.

The utility model discloses an inter-board connection module, an inter-board connector and an electronic connection system, and relates to the technical field of electric connectors, the inter-board connection module is arranged between a daughter board and a mother board, a female seat of the inter-board connection module is electrically connected with the mother board, a male head of the inter-board connection module is electrically connected with the daughter board, and the daughter board is electrically connected with the daughter board. The pin arrangement mode of the inter-board connection module is 50 rows * 6 columns. The utility model aims to reduce the space volume of the inter-board connector under the condition of improving the effective utilization rate of the connector pins.

The application relates to the field of board-level interconnection technology of integrated devices, and particularly relates to a high-frequency integrated device board-level elastic interconnection structure and a processing method, the interconnection structure comprising a base and a cover plate, and a packaging array structure being arranged between the base and the cover plate; the packaging array structure comprises a substrate, an elastic pin array and a circuit board which are sequentially connected; the elastic pin array comprises a plurality of micro-spring pins, each micro-spring pin comprises two end rings which are connected with the substrate and the circuit board respectively, and a longitudinal elastic supporting structure is integrally formed between the two end rings. In the application, the micro-spring pin structure is integrally formed with the longitudinal elastic supporting structure and the end ring, the processing procedure is reduced, the overall reliability of the micro-spring pin is improved, mechanical vibration can be better coped with, the transmission of high-frequency signals is more stable, and the loss in the transmission process of the high-frequency signals can be reduced.

The invention relates to the technical field of motor control, and discloses an IGBT module, and the module comprises an aluminum substrate which is provided with a circuit layer and a metal substrate; the six IGBT discrete devices are welded on the circuit layer of the aluminum substrate and form a three-phase full-bridge inverter circuit; the gate emitter resistor and the gate emitter capacitor are welded on the aluminum substrate and are connected with the gate electrode and the emitter electrode of the IGBT discrete device; the thermistor is welded on the aluminum substrate; the pin header is welded on the aluminum substrate and is used for leading out a control signal and a detection signal; the radiating fin is fixedly connected with the metal base of the aluminum substrate through a fixing piece; wherein the metal base of the aluminum substrate forms a main heat dissipation path of the IGBT discrete device, and heat is conducted to the heat dissipation fins from the IGBT discrete device through the aluminum substrate to be dissipated downwards. Efficient bottom heat conduction and modular integration are achieved, the heat dissipation performance and the space utilization rate are improved, and the device is suitable for a high-power-density motor driving system.

A reusable base interface die provides standardized external interfaces, reconfigurable on-die memory, mixed-signal support, and a dense attach interface that couples to different processing stacks while maintaining consistent external behavior. The base interface die can be fabricated on a mature process node and verified before attachment, then bonded to two-die, three-die, or larger stacks including CPUs, accelerator logic, or cache dies. Configuration registers select memory organization and protocol parameters without changing package pinout or timing. Bypass circuitry preserves fabric connectivity when adjacent devices or attached stacks are absent. The architecture enables rapid productization across heterogeneous compute options with a common die and stable system interfaces.

This utility model discloses a lead frame with extended pins, relating to the field of semiconductor packaging technology. The lead frame includes a base island, a first pin array, and a second pin array. The base island, from top to bottom, includes an electrical shielding layer, a heat diffusion layer, a dielectric isolation layer, a signal transmission layer, a stress conditioning layer, and an interface enhancement layer. The heat diffusion layer is fixed above the electromagnetic shielding layer via interface metallurgical bonding, with its edge extending upwards to form a ring-shaped support platform. The first pin array extends horizontally outwards from the outer wall of the ring-shaped support platform of the heat diffusion layer and extends to the outer side of the base island. The second pin array extends inwards from the central region of the dielectric isolation layer towards the inner side of the ring-shaped support platform. This lead frame with extended pins, through a multi-layer composite base island structure and the coordinated design of the extended pins, achieves performance optimization in electromagnetic shielding, high-frequency signal attenuation reduction, and mechanical strength enhancement.

The present invention provides: an electro-conductive contact pin array for responding to a narrow pitch of a semiconductor package; and an inspection device, and provides an electro-conductive contact pin that maintains a restoring force while ensuring a compressible space.

The invention relates to the field of chip testing, in particular to a winding method for optimizing high-speed signal crosstalk and a chip testing carrier plate. The signal pin array comprises a plurality of groups of high-speed differential signal pins and a plurality of ground pins surrounding each group of high-speed differential signal pins; the winding method for optimizing the high-speed signal crosstalk comprises the following steps of: changing an in-plate hole of a corresponding ground pin positioned in an adjacent row of a high-speed differential signal pin into two small fan-out holes which are symmetrical by taking the ground pin as a center and are vertically distributed; and the high-speed differential signal pin takes a gap between two fan-out small holes of corresponding pins in adjacent rows as a part of a wiring path of the high-speed differential signal pin. According to the invention, crosstalk between high-speed signals can be well avoided under the condition that other wiring channels are not occupied and the number of wiring layers and the design difficulty are not increased.

The invention discloses a positioning and clamping device for CNC equipment, and belongs to the field of machining clamps. The device comprises a fixed base, a pin base, a plurality of pin assemblies arranged in a matrix, a self-locking assembly, a constraint frame, a thermoplastic elastomer working layer, an elastic film, a heating unit and a cooling unit. The core method comprises the following steps: softening a working layer by heating, and pressing a special-shaped curved surface workpiece into the working layer so that a pin assembly passively fits the curved surface of the workpiece; and then the pin assembly is locked through the self-locking assembly, the working layer is cooled and solidified, and a continuous rigid supporting face completely attached to the workpiece is formed. A vacuum adsorption function in the pin assembly is also integrated, so that the clamping force is enhanced. According to the device, self-adaptive, gapless and low-stress clamping of any special-shaped curved surface workpiece is achieved, the problems that due to the fact that traditional pin array supporting is discontinuous, the workpiece is prone to deformation, and a magnetorheological fluid scheme is high in energy consumption and unstable in material are solved, and the device has the advantages of being high in flexibility, low in energy consumption and stable and reliable in clamping.

A lead frame, an SSD module, and an SSD device. The lead frame includes: a first base island, configured to mount a storage control chip; a second base island, configured to mount a Flash; and a pin array, distributed around a periphery of the first base island.

An apparatus and method for reducing differential cross-talk in a pin arrangement of a socket are described. Socket pins within a differential pair use a modified shape to tighten the intra-pair pin coupling to reduce the crosstalk without changing the pin map. The middle vertical segment of one pin of a diagonally adjacent differential pin pair is modified to be closer to the other pin than other corresponding locations of the pins. The spring beam that extends from the middle vertical segment of the one pin is modified to accommodate the package landing pad that the spring beam contacts to maintain a uniform pitch.

A substrate to printed circuit board (PCB) interconnect with liquid metal and surface pins. A thin dielectric sheet with drilled openings is adjacent to the bottom of a system on chip or CPU package substrate. Holes in the dielectric sheet have a liquid metal (LM) therein, the holes correspond to landing metal pads on the package substrate. The PCB includes surface pins in an arrangement to match the LM filled holes. A pick and place assembly of the package substrate to the PCB can be done without needing a reflow step. A magnet ring can be positioned on the polyimide sheet and configured to pair with a metal plate on the PCB. Guideposts around the periphery of the package substrate may be used to assist in alignment during assembly.

The utility model relates to an intelligent switch capable of being accurately assembled, and relates to the technical field of intelligent household equipment, and the intelligent switch comprises a panel assembly which comprises a lamp panel, and the lamp panel is provided with a pin header; the guide assembly comprises a sealing plate arranged on the lamp panel, a guide block is arranged on the sealing plate, a guide groove is formed in the guide block in a penetrating mode, and the pin header extends into the guide groove; and the power supply assembly comprises a power supply board, the power supply board is provided with female headers, the female headers are inserted into the guide grooves, and the female headers are inserted into the pin headers in the guide grooves. According to the invention, the guide assembly is used for guiding the matched assembly of the pin header and the female header, so that the accuracy of the pin header and the female header during plugging and the structural reliability after assembly can be effectively improved.