227 results about "Pin array" patented technology

A reinforced solder bump connector structure is formed between a contact pad arranged on a semiconductor chip and a ball pad arranged on a mounting substrate. The semiconductor chip includes at least one reinforcing protrusion extending upwardly from a surface of an intermediate layer. The mounting substrate includes at least one reinforcing protrusion extending upwardly from a ball pad, the protrusions from both the chip and the substrate being embedded within the solder bump connector. In some configurations, the reinforcing protrusion from the contact pad and the ball pad are sized and arranged to have overlapping under portions. These overlapping portions may assume a wide variety of configurations that allow the protrusions to overlap without contacting each other including pin arrays and combinations of surrounding and surrounded elements. In each configuration, the reinforcing protrusions will tend to suppress crack formation and / or crack propagation thereby improving reliability.

A semiconductor device and method of fabricating the same. The semiconductor device includes at least one first contact pin on a first substrate and at least one second contact pin on a second substrate. The at least one first and second contact pins may be included in first and second contact pin arrays. The first and second contact pins of the first and second contact pin arrays may be aligned.

A reinforced solder bump connector structure is formed between a contact pad arranged on a semiconductor chip and a ball pad arranged on a mounting substrate. The semiconductor chip includes at least one reinforcing protrusion extending upwardly from a surface of an intermediate layer. The mounting substrate includes at least one reinforcing protrusion extending upwardly from a ball pad, the protrusions from both the chip and the substrate being embedded within the solder bump connector. In some configurations, the reinforcing protrusions from the contact pad and the ball pad are sized and arranged to have overlapping upper portions. These overlapping portions may assume a wide variety of configurations that allow the protrusions to overlap without contacting each other including pin arrays and combinations of surrounding and surrounded elements. In each configuration, the reinforcing protrusions will tend to suppress crack formation and / or crack propagation thereby improving reliability.

A turbine blade with a generally hollow airfoil having an outer wall that defines a chamber for receiving cooling air, the airfoil comprising a leading edge that resides in an upstream direction, a trailing edge that resides in a downstream direction, a convex suction side, a concave pressure side, and an insert disposed within the chamber that is configured to initially receive at least a portion of the cooling air entering the chamber and direct the cooling air through a plurality of insert apertures to cool the inner surface of the outer wall, the insert further comprising a configuration that generally conforms to the contour of the outer wall of the chamber but in spaced relation thereto, wherein the chamber and insert narrow as they extend toward the trailing edge, the insert eventually terminating and the chamber eventually terminating at a pin array section, wherein a first distance exists that comprises the generally axial distance between the position of downstream termination point of the insert and the position of an upstream beginning point of the pin array section, wherein the pin array section, at a downstream end, comprises a plurality of openings that define an inlet to a plurality of trailing edge cooling apertures, and wherein the chamber, the insert, and the pin array section are configured such that the first distance is approximately minimized.