331 results about "Motherboard" patented technology

This utility model discloses an intelligent AI golf teaching camera, including a front shell and a rear shell, which are connected by a snap-fit. The front shell has a fixed glass panel and a camera bracket installed inside. The bracket has a posture camera and a trajectory camera tilted on it, which are used to collect the swing action and the ball trajectory, respectively. The outer side of the front shell has an elliptical conical opening that matches the camera, forming an "eyelash"-like anthropomorphic design. The motherboard integrates a BirdieCoach hardware module, which completes the core AI calculation through a local main control unit. The mobile phone is only used as a display and interaction medium. The rear shell has a fan bracket that holds the battery. The fan is close to the motherboard and the battery, and together with the bottom ventilation port, it forms an active heat dissipation channel. The rear shell has a built-in magnetic ring for easy installation. The motherboard integrates an IMU sensor to calibrate the tilt state of the device in real time. This design achieves high-precision motion analysis and teaching guidance through dual-camera collaboration, local AI calculation, and emotional interaction, and is portable, has efficient heat dissipation, and strong user stickiness.

This application belongs to the field of electronic device technology, specifically relating to a stylus and electronic components. This application aims to solve the problem of low positioning accuracy in related styluses. The stylus and electronic components of this application coordinate the positioning of the stylus through a dual electric field link. The motherboard, a first conductive component, a conductive elastic component, a conductive support, and the pen tip constitute the first electric field link, with the pen tip acting as a transmitter to emit a first electric field signal. The motherboard, a second conductive component, and the electric field transmitter constitute the second electric field link, with the electric field transmitter emitting a second electric field signal. The second electric field signal is radiated onto the touchscreen. The touch chip can calculate the distance between the second and first electric field signals in real time. Based on the calculated distance, it calculates the tilt angle or degree of tilt of the stylus relative to the touchscreen, and then corrects the landing position of the pen tip, further improving the accuracy of the pen tip's position displayed on the touchscreen and making the stylus trajectory less prone to deviation during writing.

This utility model discloses a motherboard component testing device, relating to the technical field of testing equipment. The device includes a placement base with several support legs fixedly connected to its bottom outer wall. Several limiting blocks are also fixedly connected to the outer wall of the placement base, and electric telescopic rods are fixedly connected to the inner walls of each limiting block. By incorporating clamping plates, the device enables the motor to rotate. When the motor is started, it drives a transmission rod, which in turn drives a gear, which in turn drives a ring rack. The ring rack then drives several gears, which in turn move the rack, causing the clamping plates to move. The clamping plates simultaneously move closer together to clamp the sides of the motherboard, securing it in place. Once the motherboard is secured, the motor can be turned off. This device provides multi-angle clamping before testing, ensuring the motherboard remains in a fixed position for inspection, thus improving the reliability of the equipment.

This application provides a substrate structure and its fabrication method, a substrate motherboard, a chip packaging module, and an electronic device. The substrate structure includes: a first substrate layer, including a first surface and a second surface perpendicular to the thickness direction, the first surface and the second surface being opposite to each other; the first substrate layer is embedded with a first target pad layer, at least one first circuit layer, and a first connection circuit layer that are electrically connected layer by layer, the first target pad layer being located on the first surface of the first substrate layer, and the first connection circuit layer being located on the second surface of the first substrate layer; a second substrate layer, adjacent to the second surface of the first substrate layer, and embedded with a second connection circuit layer, at least one second circuit layer, and a second target pad layer that are electrically connected layer by layer, the second connection circuit layer being electrically connected to the first connection circuit layer; the minimum linewidth of the circuit in the second circuit layer, the minimum linewidth of the circuit in the second connection circuit layer, and the minimum linewidth of the circuit in the first connection circuit layer are all greater than the minimum linewidth of the circuit in the first circuit layer.

This invention belongs to the field of motherboard power supply technology. It discloses a motherboard intelligent power supply method and system based on fault diagnosis feedback. The method involves determining the motherboard's historical power supply data and storing it in a preset fault database. Within this database, a collection area, an isolation area, and a trust area are defined. A collection channel is established between the isolation area and the collection area, and a verification channel is established between the isolation area and the trust area. The data within the corresponding collection area is monitored and verified within the collection channel, and the data that passes the monitoring and verification is input as an anomaly parameter to the isolation area. Furthermore, this invention solves the problem that when existing motherboards are undergoing fault diagnosis, if the fault is a maliciously created fault, the fault database is easily affected by the malicious fault, leading to inaccurate power supply strategies output.

A passively-cooled personal computer includes a housing, a motherboard disposed within the housing, a central processing unit (CPU) mounted on the motherboard, and a passive cooler thermally coupled to the CPU. The passive cooler includes a plurality of heat pipes and at least one set of stacked fins. The heat pipes extend through the fins and transport heat from the CPU to the fins. The set of stacked fins has a large cross-section in a horizontal plane and a small cross-section in a vertical plane.

The present application relates to the technical field of liquid-cooled servers. Disclosed is an immersion-type server, comprising an enclosure, a mounting rack, a motherboard, a power circulation mechanism, and a convection switching device, wherein the mounting rack is arranged inside the enclosure; the mounting rack is spaced apart from a side wall of the enclosure to form a first flow space, and the mounting rack is provided with an accommodating cavity, the top end of the accommodating cavity being in communication with the first flow space; the motherboard is fixed in the accommodating cavity, and a temperature sensor is disposed on the motherboard; the power circulation mechanism is arranged in the first flow space; the convection switching device is fixed between the enclosure and the mounting rack, and is spaced apart from a base plate of the enclosure to form a second flow space, the second flow space being in communication with the bottom end of the accommodating cavity; and the convection switching device has a communicating position for communicating the first flow space with the second flow space and a separating position for separating the first flow space from the second flow space. The present application achieves rational flow of a cooling medium inside the server, preventing the phenomenon of uneven temperature distribution between the upper and lower portions of the cooling medium, and thereby improving cooling efficiency.

This application belongs to the field of robotics technology, providing a modular pipeline inspection robot and its control method suitable for pressurized water-filled pipe networks. It includes a head-mounted vision acquisition mechanism, a magnetic flux leakage (MF) detection mechanism, and a propulsion mechanism. The head-mounted vision acquisition mechanism acquires images of the inner surface of the pipe and is rotatably and sealingly connected to the MF detection mechanism. The MF detection mechanism includes a folding mechanism and a MF detection sensor. The folding mechanism is configured to be driven to control the MF detection sensor to be in contact with or away from the inner surface of the pipe. The MF detection sensor is used to acquire pipeline defect data. The MF detection mechanism is rotatably and sealingly connected to the tail-mounted main propeller. The control motherboard adjusts the thrust of each vertical propeller in real time through closed-loop control, controlling the robot to travel along the centerline of the pipe. This robot has a compact structure, flexible movement, can adapt to water-filled and certain pressure environments, and integrates multiple detection methods, improving the reliability and applicability of pipeline inspection.

This utility model discloses a mouse device with identity authentication function, relating to the field of mouse technology. It includes: a mouse body with an internal PCB motherboard integrating a charging management chip, an MCU control chip, a FIDO 2.0 authentication chip, and an NFC communication chip; a fingerprint recognition module disposed on the upper surface of the mouse body and connected to the MCU control chip via an SPI bus; an NFC antenna surrounding the bottom of the mouse body and connected to the NFC communication chip via a 50Ω microstrip line; and an electromagnetic shielding structure disposed between the bottom layer of the PCB motherboard and the top of the NFC antenna. This utility model adopts a modular structure to integrate the FIDO 2.0 authentication chip, fingerprint recognition module, NFC communication module, and MCU inside the mouse. By optimizing the PCB layout and electromagnetic interference shielding measures, it ensures that each module works collaboratively without interfering with each other, facilitating identity authentication during one-handed operation.

This invention provides a PCB motherboard for electromagnetic interference protection, belonging to the field of PCB motherboards. It includes a protective shell and a PCB motherboard, with the PCB motherboard fixedly connected inside the protective shell. The surface of the protective shell is provided with protective components, and the surface of the protective components is provided with anti-push components. This invention utilizes a triangular plate, which tilts the vertical plate by moving it. The electromagnetic shielding layer then slides, moving the arc plate to the surface of the slide rail until the bottom of the electromagnetic shielding layer abuts against the top of the protective shell, thus completing the installation of the electromagnetic interference protection structure. This eliminates the need for repeated rotation of nuts and bolts, avoiding excessive tightening force that could damage the substrate and the anti-shielding structure. It solves the problems of low efficiency and easy damage to the substrate surface during the disassembly and assembly of existing PCB anti-electromagnetic interference structures.

The utility model discloses a kind of SMC product rivet fixing mother plate structure, it is related to fixed mother plate technical field, including mounting plate, the top of mounting plate is clamped with fixed mother plate body, the top of fixed mother plate body is equipped with first clamping slot, first clamping slot extends to mounting plate inside, second clamping slot is equipped on the inner wall of first clamping slot, the inboard bottom end of first clamping slot is equipped with circular groove.The utility model uses above structure, to avoid the displacement of fixed mother plate body, by first clamping block, second clamping block can be sent into circular groove, then second clamping block is adjusted to with second clamping slot is not corresponding point position, and then second clamping block point position and fixed mother plate body point position can be effectively clamped, to avoid the displacement of fixed mother plate body, when fixed mother plate body needs to be disassembled in later period, second clamping block is adjusted to with second clamping slot corresponding point position, then first clamping block can be directly extracted.

This application provides a high-speed connector device and data center equipment with configurable port orientation, applicable to the field of communication equipment technology. The high-speed connector device includes a motherboard and a high-speed connector, which is configured with a first orientation or a second orientation. The motherboard has a physically fixed pad group, and the pins of the pad group adopt a first pin definition or a second pin definition. The first and second pin definitions are set based on the symmetry of the pin layout of the high-speed connector. When the high-speed connector is configured with the first orientation, the pad group adopts the first pin definition; when the high-speed connector is configured with the second orientation, the pad group adopts the second pin definition. This application utilizes the inherent physical symmetry of the high-speed connector pin layout, and by sharing the same physically fixed pad group and binding the connector orientation with the pin definition, it achieves configurable port orientation, reducing PCB R&D costs and production cycle, and improving equipment compatibility.

1. Name of the product in this design: Multifunctional X-ray Inspection Machine. 2. Purpose of this design: For the repair of motherboards and chips in mobile phones and electronic products. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1.

A server and its chassis are disclosed. The server includes a motherboard, connecting cables, and a server chassis. The server chassis includes a chassis body, two guide plates, and an expansion device. The two guide plates are respectively fixed to the base plate of the chassis body and are spaced apart from each other. Each guide plate has a long side, a short side, and two assembly portions spaced apart from each other. Each assembly portion includes a guide groove and a first positioning groove. The expansion device has two guide posts spaced apart from each other on its two sides. These guide posts extend into the guide grooves along their extension direction and are fixed to the first positioning grooves along the assembly direction, thereby fixing the expansion device in the assembly space. The motherboard is fixed to the base plate and has a connector. The two ends of the connecting cables are electrically connected to the connector and the expansion device.

This utility model discloses a sweeping and vibration structure using a sonic motor, including a toothbrush handle, a charging interface, a bracket, a power supply, a sonic motor, a motherboard, a main control chip, a driver, an H-bridge drive circuit, and a brush head. The charging interface is located at the bottom of the toothbrush handle. The bracket is installed inside the toothbrush handle. The power supply is installed at the bottom of the bracket via the charging interface. The sonic motor is installed on the upper part of the bracket. The motherboard is installed on the side of the bracket via the sonic motor and the power supply. The main control chip is installed at the bottom of the motherboard. The driver is installed at the top of the motherboard. The H-bridge drive circuit is distributed on the motherboard. The brush head is installed on the top of the toothbrush handle via the sonic motor. This utility model solves the problem of high R&D costs and technical difficulty in developing sweeping and vibration structures for electric toothbrushes.

To provide a motherboard for display devices that can improve yield. [Solution] According to the embodiment, the mother board for a display device comprises a display area for displaying an image, a margin area outside a cut line for cutting out the display area, a display element disposed in the display area, a first partition wall disposed in the margin area and including a plurality of first segments and a plurality of second segments, and a first sealing layer formed of an inorganic insulating material, disposed above the display element and the first segments, and not disposed above the second segments. The second segments have a planar shape different from that of the first segments.

This invention proposes a PCBA motherboard for a wireless charger, comprising a board body, a main chip module, a driver module, a power device module, a communication chip, and positioning holes. The main chip module, driver module, and power device module are mounted on the top of the board body. The advantages of this invention are: the gaps between the thermal pads allow airflow, further improving heat dissipation; the large heat dissipation surface allows heat to be conducted to the upper thermal layer; and the presence of several circular holes in certain areas significantly increases the heat dissipation area, enabling heat to dissipate more quickly into the surrounding environment. This effectively improves the heat dissipation performance of the wireless charger's PCBA. This design not only extends the lifespan of the motherboard and various electronic components but also improves the overall stability and reliability of the wireless charger.

A motherboard testing and monitoring method, system, medium, and product based on ARM devices are disclosed, relating to the testing field of structural components or devices not included in other categories. The method includes: responding to a test start command by closing the power-on pin of the device under test (DUT) to trigger its power-on; acquiring voltage data from the power indicator pin of the DUT to determine its power-on startup state; capturing real-time frame images of the display screen after the DUT enters and maintains the preset power-on startup state for a preset duration; performing feature matching calculations on the real-time frame images to determine the display content on the screen and generating a system fault record; generating a normal power-on record and triggering the DUT to power off when the operating system loading characteristics are met; and generating a single test completion record and triggering the next round of testing after the voltage data drops to the shutdown state. Implementing this application can improve the accuracy of fault type attribution for the entire power-on / off process of a computer motherboard.

1. Name of the product in this design: Expansion Board (EX-TLBaseUART). 2. Intended use of this design: for use in an embedded motherboard of an electronic device. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.

This application relates to the field of wearable device technology, and more particularly to a wearable device. The wearable device body includes a housing, a screen assembly, a motherboard, a functional module, and an elastic wave receiving unit. At least one of the screen assembly and the housing is configured to deform under user operation to generate elastic waves. The elastic wave receiving unit is configured to receive the elastic waves and generate an elastic wave signal. The motherboard is configured to control the functional module to perform corresponding functions when the elastic wave signal matches a target elastic wave signal. The wearable device of this application, by utilizing the elastic wave receiving unit to achieve functional control of the wearable device, not only facilitates user operation but also, because elastic waves are low-frequency waves with high energy and long wavelengths, have strong anti-interference capabilities, thereby improving signal transmission reliability. Furthermore, it eliminates the need for additional openings in the wearable device, thus reducing the difficulty of waterproofing and effectively improving the waterproofness of the wearable device.

A heat dissipation assembly is configured to be thermally coupled to a first heat source and a second heat source which has a thermal design power greater than a thermal design power of the first heat source. The heat dissipation assembly includes a heat exchanger and a cold plate. The heat exchanger is configured to be thermally coupled to the first heat source and receive a coolant, such that the coolant absorbs heat generated by the first heat source so as to have temperature increase. The cold plate is configured to be thermally coupled to the second heat source, and the cold plate is in fluid communication with the heat exchanger for receiving the coolant from the heat exchanger, such that the coolant absorbs heat generated by the second heat source so as to vaporize.

This utility model relates to the field of antenna PCB technology, specifically to an ultra-long high-frequency double-sided multilayer antenna PCB, including a motherboard. A terminal block is fixedly connected to the front surface of the motherboard, a resistor is fixedly connected to the surface of the motherboard, and a control chip is fixedly connected to the surface of the motherboard. An assisting component is disposed inside the mounting hole of the motherboard. The assisting component includes a front sleeve, which is fixedly connected to the inner wall of the mounting hole of the motherboard. A knob is rotatably connected to the inner wall of the front sleeve, and a guide ring is fixedly connected to the inner wall of the front sleeve. A groove is formed on the surface of the knob. This utility model, by setting up the assisting component, ensures that the screws and the motherboard are not in direct contact during installation, reducing the risk of damage to the motherboard during installation due to screws being inserted into the pre-drilled holes, and further improving the safety of the motherboard during installation.

This invention provides a multifunctional, highly integrated power control and distribution internal bus system architecture, comprising: a set of DIST internal buses, with the master station located in the telemetry and remote control module, and substations distributed in various functional modules, including at least one LVDS internal bus substation; a set of CRST internal buses, with both master and slave stations located in the telemetry and remote control module, used to send charging and discharging parameter setting commands to the charging and discharging regulation module; multiple sets of internal bus extension interfaces located in the pyrotechnics and thermal control modules, used to transmit address, command enable, and pulse trigger signals, wherein the pulse trigger signal is output by the LVDS substation in the shunt regulation module, and the command enable signal is issued by the master station; and a set of motherboards to interconnect the above buses. The DIST internal bus, CRST internal bus, and internal bus extension interfaces adopt a unified timing to achieve synchronous data sampling and uploading. This invention improves the system's scalability and compatibility by being compatible with highly integrated LVDS substations and discrete hardware extension interface substations, and ensures the real-time performance of telemetry data.

This utility model relates to the field of electronic device chassis technology, and more particularly to a modular drive motherboard chassis. A modular drive motherboard chassis includes a chassis body, a fixed plate, a pull-out plate, a slider, guide rails, a sliding plate, and a clamping assembly. The fixed plate is fixedly connected inside the chassis body. Vertically positioned limiting grooves are formed on the left and right sides of the top of the fixed plate. A pull-out plate is slidably mounted on the upper part of the fixed plate, with a gripping groove on the front side. A slider adapted to the limiting grooves is fixedly connected to the bottom of the pull-out plate and slidably connected to the fixed plate via the slider. Horizontally positioned guide rails are formed on the front and rear sides of the top of the pull-out plate. A sliding plate is slidably connected to the upper part of the two guide rails, and a clamping assembly is located on the left side of the sliding plate. This utility model, through the coordinated design of the clamping assembly, allows users to flexibly adjust the clamping position according to the motherboard size and achieve rapid positioning and clamping, thereby improving installation efficiency and clamping stability.

Provided in the embodiments of the present application are a method for sending indicator light signals, and a storage medium, an integrated hard disk and a computer program product. The method is applied to the integrated hard disk, and the integrated hard disk comprises a motherboard, a backplane and a hard disk interface card, wherein transmission channels of a virtual pin port of a central processing unit on the motherboard have been expanded to N transmission channels by means of a channel expansion component, and the N transmission channels are correspondingly connected to N first connectors on the motherboard on a one-to-one basis. The method comprises: respectively sending N enable signals to first-type pins of N first connectors, so as to forward the N enable signals to a logic control device by means of first-type pins of N second connectors that are correspondingly connected to the N first connectors on a one-to-one basis; and respectively sending N indicator light signals to second-type pins of the N first connectors by means of N transmission channels, so as to forward the N indicator light signals to the logic control device by means of second-type pins of the N second connectors.

The utility model relates to set top box technical field discloses modularization power supply interface's set top box mainboard, including lower shell, the inner wall left and right sides of lower shell all are established with the long slide groove, the inner wall of long slide groove all are connected with fixed mechanism, the fixed mechanism is used for clamping fixed, circuit board, the outer wall left and right sides of lower shell all are fixedly connected with quick -detach mechanism, quick -detach mechanism is used for quick installation and disassembly, the fixed mechanism includes a plurality of concave long boards, a plurality of concave long boards are connected in the inside of long slide groove respectively slide, in the utility model, manual rotation rotation long rod, drive bevel gear no.

The utility model discloses a host and a computer, and relates to the technical field of computers, the host comprises a case, a mainboard and a support mechanism; the case comprises a bottom plate and an upper cover arranged above the bottom plate at an interval, and the bottom plate is provided with a first through hole penetrating through the upper side and the lower side of the bottom plate; the supporting mechanism comprises supporting feet, a supporting assembly and a clamping assembly. The supporting legs are arranged below the bottom plate, the bottom end of the supporting assembly is connected with the supporting legs, the supporting assembly penetrates into the case through the first through hole, and the clamping assembly is connected to the supporting assembly in a sleeving mode and located in the case. The mainboard is located in the case and clamped by the clamping assembly, and the top end of the supporting assembly is connected with the upper cover. According to the host, the number of integrally formed parts on the case can be reduced, and the die opening of a case die is simplified, so that the manufacturing of the case is simplified.

This application provides a display device, relating to the field of electronic technology. The first motherboard and the second motherboard in the display device operate in different operating system environments. An analog-to-digital converter (ADC) module integrated on the second motherboard is connected to an audio acquisition module. The audio acquisition module converts the acquired first sound signal into a first analog electrical signal. The ADC module performs analog-to-digital conversion on the first analog electrical signal to obtain first audio data. An audio processing module performs noise reduction processing on the first audio signal to obtain second audio data. The audio processing module then sends the second audio data to the first motherboard. In this application, the ADC module is integrated on the second motherboard, working in conjunction with the audio processing module located on the second motherboard. The audio processing module performs noise reduction processing on the audio signal, eliminating the need for a separate, powerful integrated chip outside the second motherboard. This saves on the cost of the display device.

This invention belongs to the field of server upgrade management technology, specifically providing a system and method for implementing dual BMC switching upgrades. The system includes a motherboard and an I / O switching board. The motherboard has a master BMC, and the I / O switching board has a slave BMC and a path selection chip. The path selection chip is connected to a network interface and is connected to both the master and slave BMCs via a PHY chip. The slave BMC is connected to the path selection chip and is used to control the path selection of the path selection chip. The slave BMC is used to connect to the module to be upgraded. The path selection chip, controlled by the master BMC via I2C and Heartbeat, selects whether network control belongs to the master or slave BMC. Thus, when the GPU needs to be managed and upgraded in S5 state, network control can be switched from the master BMC to the slave BMC, thereby completing the switching of the slave BMC's management upgrade path.

The application provides a server mainboard virtualization capability verification method, system and device and a storage medium. The method comprises the following steps: creating a virtual machine on a system virtualization module of a server host; configuring a test scene; binding physical cores and HT cores of the same CPU core in the same virtual machine; performing CPU stability testing on the bound cores in the virtual machine through test software; identifying the number of CPU cores and performing CPU stability testing on all the CPU cores; collecting test logs; and verifying whether the mainboard supports virtualization capability according to the test logs. The application can effectively verify whether the physical machine mainboard of the server supports virtualization and is stable, and can also verify that the normally tested virtual machine is not affected by the operation of other virtual machines.