Multilayer printed wiring board and process for producing the same

a wiring board and multi-layer technology, applied in the direction of printed circuit manufacturing, printed circuit aspects, semiconductor/solid-state device details, etc., can solve the problems of wasteful material costs, little design freedom for wiring, and assembling processes of rigid portions on inner and outer layer rigid substrates. achieve the effect of reducing material costs, reducing substrate capacity, and high wiring design freedom
US20060180344A1Inactive Publication Date: 2006-08-17THE FUJIKURA CABLE WORKS LTD
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
THE FUJIKURA CABLE WORKS LTD
Publication Date
2006-08-17
Estimated Expiration
Not applicable · inactive patent

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Abstract

At least one base material having a wiring circuit that has been formed into a predetermined outer shape is bonded to a motherboard. The motherboard wiring board and the base material having a wiring circuit are electrically connected to each other at least one portion through an inner via hole. The outer shape of the base material having a wiring circuit is smaller than the outer shape of the motherboard, with the base material having a wiring circuit having an island shape on the motherboard.
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Description

TECHNICAL FIELD

[0001] The present invention relates to a multi-layer wiring board and a method for manufacturing the same. BACKGROUND ART

[0002] Recent electronic apparatuses have been made smaller and light weight in addition to developments in the applicability to high-frequency signals and digitized devices, and along with these developments, there have been demands for small-size devices, a high-density packaging property and the like in printed circuit boards being installed in the electronic apparatuses.

[0003] There is a rigid flex printed circuit board satisfying these demands which includes a rigid portion and a flex portion (for example, Japanese Patent Application Laid Open Publication No. 2002-158445).

[0004] With reference to FIGS. 1A to 2B, a manufacturing process of a conventional rigid flex printed circuit board will be described bellow. FIGS. 1A to 1D are flow charts that show manufacturing processes of the rigid flex printed circuit board. FIG. 2A is a perspective...

Claims

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