5082results about "Multilayer circuit manufacture" patented technology

The invention relates to the technical field of flexible circuit board production, in particular to a process optimization method and system for a flexible circuit board production line. The method comprises the following steps: acquiring characteristic data of a flexible circuit board material; executing a circuit board thermocuring action according to the material characteristic data of the flexible circuit board, performing thermal stress intensity evaluation, and generating stress hot spot distribution data; performing real-time curing temperature control feedback adjustment according to the stress hotspot distribution data to obtain circuit board curing effect evaluation data; detecting a real-time surface wettability index of the to-be-processed flexible circuit board in front of the laminating station; and fitting process parameter compensation is carried out based on the circuit board curing effect evaluation data and the real-time surface wettability index so as to realize curing-fitting process optimization of the flexible circuit board production line. According to the invention, intelligent optimization of the curing-laminating process of the flexible circuit board production line is realized, and the quality problems of uneven stress and overlarge deformation in the thermocuring-laminating process are effectively solved.

The invention relates to the technical field of PCB processing, in particular to a pressing device of a PCB and a pressing process of the pressing device. The pressing device of the PCB comprises a base, a support is fixedly connected to the base, a first hydraulic cylinder is fixedly installed at the top of the support, and a piston rod of the first hydraulic cylinder is fixedly connected with a hot pressing plate; the multi-layer laminating machine further comprises a discharging plate, the discharging plate is installed on the base through a second hydraulic cylinder, the discharging plate is used for stacking multiple layers of laminated raw material plates, and the base is provided with a positioning piece used for aligning the laminated plates stacked on the discharging plate. By means of the mounting frame driven by the air cylinder and the four-corner positioning angle blocks, accurate alignment of multiple layers of laminated boards can be achieved, in the hot pressing process, the extrusion piece pushes the hinged plate to drive the pushing and pressing roller to unfold and evenly push the multiple layers of boards on the discharging plate to be flat, the risk of warping and layering is reduced, and the quality of subsequent hot pressing of PCBs is improved.

The invention belongs to the technical field of circuit boards, and discloses a composite pressing process of a high multilayer rigid-flex circuit board, which comprises the following steps: performing microstructure processing on the surface of a rigid base material to form a three-dimensional reinforced interface, and performing chemical grafting modification treatment on a flexible base material to generate a multilayer pretreated substrate; identifying the positioning mark of each layer of substrate through an optical positioning system, establishing a lamination stress prediction model in combination with the thermodynamic parameters of the material, and outputting a lamination configuration scheme containing an interlayer matching relationship; placing the configured laminated structure in a multi-temperature-zone press, and executing a three-stage gradient heating and pressurizing program to realize interface fusion between adjacent layers of substrates; monitoring an interlayer deformation difference value of the substrate in real time through a sensing network, and eliminating the deformation difference to obtain a press-fit molded circuit substrate; through heterogeneous interface strengthening design, multi-physical field cooperative pressing and real-time deformation compensation, accurate interface fusion and low-warpage forming of the high-multilayer rigid-flex circuit board are realized.

The invention relates to the technical field of PCB processing, and discloses a multi-layer circuit board drilling method and device based on machine vision, and the method comprises the steps: obtaining a multi-layer circuit board image; preprocessing the multi-layer circuit board image to obtain a to-be-identified image; inputting the to-be-recognized image into a pre-trained defect detection model to obtain defect position data; carrying out point location identification and matching on the to-be-identified image to obtain an optimal hole location coordinate, and carrying out correction according to the optimal hole location coordinate to obtain hole location information data; according to the hole site information data and the defect position data, nodes are constructed respectively, distance calculation is carried out, and a hole site node graph is generated; according to the hole site node graph, performing path planning by applying an ant colony algorithm, and performing iterative search to obtain an optimal drilling path; and drilling the multilayer circuit board according to the optimal drilling path. The method has the following effect that the drilling efficiency of the multilayer circuit board can be improved.

The invention relates to the technical field of ceramic substrates, and provides a low-dielectric-loss multilayer ceramic substrate and a preparation method thereof. The low-dielectric-loss multilayer ceramic substrate is prepared from, by weight, 90-100 parts of aluminum oxide, 1-3 parts of plasticizer, 3-5 parts of sintering aid, 6-10 parts of binder, 1-3 parts of dispersing agent and 50-60 parts of water, the aluminum oxide is composed of first aluminum oxide and second aluminum oxide, and the first aluminum oxide and the second aluminum oxide are different in form. According to the technical scheme, the problem of high dielectric loss of the multilayer ceramic substrate in the prior art is solved.

The embodiment of the invention discloses an embedded substrate, a power supply device and electronic equipment. The embedded substrate comprises a front surface first adding layer jointed with the first surface of the core part maintaining body, a conduction structure electrically connected with a circuit layer of the dielectric layer is arranged in the dielectric layer of the front surface first adding layer, and the conduction structure comprises a first conduction structure electrically connected with a bonding pad on the chip; the dielectric layer of the first additional layer on the front side is made of an exposable and developable material, an open pore for constructing the conduction structure is formed through exposure and development, the open window of the outer protection layer has a first projection on the first surface, the first open pore for constructing the first conduction structure has a second projection on the first surface, and the second projection covers the first projection. Through the arrangement, the first conduction structure with a larger through-flow cross section is constructed and formed by utilizing the windowing size of the chip side, so that the through-flow capability is effectively improved, and the heat conduction capability is high. In addition, the bonding stress between the circuit layer and the front surface of the chip can be reduced, the layering risk is reduced, and the reliability is better.

The invention relates to the technical field of printed embedded PCBs, and discloses an embedded PCB and a manufacturing method thereof.The embedded PCB comprises a daughter board, a first dielectric layer and a first circuit layer which are sequentially arranged in a stacked mode in the first direction, a device is embedded in the daughter board, the device is located on the side, close to the first dielectric layer, of the daughter board, and the first dielectric layer is located on the first circuit layer. One side, close to the first dielectric layer, of the device is provided with a first part, and the first part is provided with a first protection part; a first connection hole is formed in the first dielectric layer, a first conductive part is filled in the first connection hole, the first protection part is connected and electrically conducted with the first conductive part, and the first conductive part is connected and electrically conducted with the first circuit layer. The embedded PCB and the manufacturing method thereof provided by the invention are used for improving the problem of poor hole filling in the electroplating hole filling process in the related technology.

The invention discloses a manufacturing method of a high-precision bearing type rigid-flexible combined circuit board, a forming line is designed in a processing process board, the manufacturing method comprises the following steps: manufacturing a flexible board comprising a flexible area and a rigid combined area, taking a rigid copper-clad plate, and manufacturing a circuit pattern, the circuit pattern comprises an auxiliary circuit pattern corresponding to a bonding pad pattern of the flexible board, a first groove body is manufactured on the outline of the flexible area, a first connecting position is arranged between the first groove body and the auxiliary area, a second groove body is manufactured on the outline of the rigid combination area, a second connecting position is arranged between the second groove body and the auxiliary area, a rigid bearing plate is formed, the flexible plate and the rigid bearing plate are pressed and formed, and the high-precision bearing type rigid-flexible combined circuit board is formed. The flexible plate and the rigid bearing plate are manufactured independently, the rigid bearing plate is manufactured according to the forming line to form the groove body, then overall pressing is conducted, the flexible plate is formed through laser cutting, the problems of pulling, tearing and the like of the flexible plate caused by milling forming of the overall plate body are effectively solved, and the machining quality and reliability are improved.

The invention discloses a printed circuit board production parameter intelligent dynamic optimization method and system, and relates to the technical field of circuit board processing optimization, and the method comprises the steps: monitoring the real-time temperature data of a lamination part in real time; processing the real-time temperature data, and identifying a temperature unstable region in the production process; screening hot pressing roller process sections with stable temperature distribution to execute lamination operation; evaluating the risk level of the current lamination process; screening a low-risk temperature distribution mode based on the risk level to carry out lamination production, obtaining a quality deviation coefficient, and judging whether a preset process standard is met or not based on the quality deviation coefficient; and for products which do not meet the preset process standard, temperature control parameters in the production process of the products are traced, and the temperature set value of the hot pressing roller is dynamically adjusted. The method has the advantages that the real-time quantitative evaluation of the wear state of the hot pressing roller is realized, and the line width precision control capability and the interlayer alignment consistency are remarkably improved.

The invention discloses a rigid-flex circuit board slotting process based on a laser depth control technology. The rigid-flex circuit board slotting process comprises the steps that the surface of a rigid layer of a rigid-flex circuit board is pretreated, and a laser sensitive layer is sprayed; cNC depth-controlled milling is adopted to form a grooved rough blank structure on the surface of the pretreated rigid layer; positioning laser is used for scanning, a three-dimensional model is established through collected reflected signals, then layered depth-controlled ablation is conducted, second-power laser is sequentially adopted for fine cutting, third-power laser is sequentially adopted for depth calibration, and a groove body structure is formed; cleaning an interface, scanning a groove bottom area and synchronously introducing low-temperature gas; performing morphology repairing treatment, and generating a periodic micro-nano structure on the groove wall by adopting short pulse laser to form a stress concentration resistant surface; depositing an insulating medium layer, and forming a continuous packaging protection layer on the groove wall and the bottom through a vacuum coating process; the high-precision depth-controlled slotting of the rigid-flex circuit board is realized, and meanwhile, the ultra-low thermal damage and anti-fatigue structure and long-acting environmental stability are realized.

The present invention discloses an exposure alignment method and device for a multi-layer PCB, wherein the exposure alignment method for the multi-layer PCB includes: performing multi-spectrum scanning on each layer of the PCB to obtain feedback signals; performing resonance focusing processing on the interface of each layer to obtain characteristic data; performing block division according to the characteristic data and forming quantum dot micro-marks; performing selective phase processing and holographic exposure through spatial light modulation; setting a bionic self-repairing film between layers and performing electric field stimulation; performing asynchronous curing and topographic processing; and finally performing iterative correction verification. The technical solution of the present invention can effectively solve the accuracy and yield problems of thick-layer PCBs containing ferrite, metal heat sinks and high-dielectric composite layers during the exposure alignment process.

The invention discloses a method for manufacturing a rigid-flex printed circuit board with a surface flexible layer, which comprises the following steps of: taking a double-sided flexible copper-clad plate, manufacturing a through hole and electroplating, and then manufacturing a circuit pattern to form a pattern plate; manufacturing a first windowing covering film for windowing corresponding to the golden finger area and covering the through hole and a second windowing covering film for windowing corresponding to the through hole and the ineffective area, respectively attaching the first windowing covering film and the second windowing covering film to the two surfaces of the pattern board, and then carrying out electrometallization to form a flexible core board; taking a rigid copper-clad plate, windowing the rigid copper-clad plate corresponding to the flexible layered area, and then manufacturing a circuit pattern to form a rigid core plate; stacking and laminating the structures to form a laminated plate; drilling and electroplating are carried out on the laminated plate, then laser ablation is carried out on a through hole area, and the rigid-flexible combined plate is formed through post-process processing; by forming a new processing flow, the defects of low adaptability, processing precision and reliability of a traditional rigid-flex printed circuit board manufacturing method are systematically solved, and high-precision processing of the rigid-flex printed circuit board with high integration level is formed.

The invention discloses a multilayer three-dimensional stacked circuit board and a preparation method thereof, and the method specifically comprises the steps: obtaining a substrate with a single conductive surface, and carrying out the spraying of a stress buffer layer on the conductive surface of the substrate; covering a layer of insulating material on the stress buffer layer, and forming a pattern insulating layer through photoetching; performing pulse electroplating processing on the exposed pattern of the pattern insulating layer to obtain a first circuit board; silk-screening a flexible connection layer on the pattern bonding pad layer of the first circuit board, and carrying out three-dimensional stacking processing on the flexible connection layer to obtain a second circuit board; and assembling a circuit protection layer on the second circuit board, and processing a stress release groove between the second circuit board and the circuit protection layer to obtain the multi-layer three-dimensional stacked circuit board. Through the design of the stress buffer layer and the stress release groove, interlayer stress can be reduced, circuit board breakage or cracking caused by overlarge interlayer stress is avoided, and the technical problem that large interlayer stress is generated in the circuit board preparation process in the prior art is solved.

The invention relates to the technical field of printed circuit board manufacturing, in particular to a PCB lamination parameter control method and system, and the method comprises the steps: receiving a global pressure adjustment instruction; acquiring real-time temperature data of the to-be-laminated sheet, and constructing a surface temperature distribution diagram of the to-be-laminated sheet; the surface temperature distribution diagram is analyzed, and operation areas, with different thermal response attributes, of the to-be-laminated sheet are divided; according to the thermal response attribute of each operation region and the global pressure adjustment instruction, obtaining a region area weight and a response deviation coefficient, carrying out differential decomposition on the global pressure adjustment instruction, and calculating differential pressure adjustment amounts of the plurality of operation regions; and mapping the differential pressure adjustment amount to a multi-partition hydraulic execution mechanism in the laminating equipment, and controlling a target pressure value output by each operation area. The method has the advantages that refined and differentiated pressure adjustment of operation areas with different thermal response attributes in the plate can be achieved, and local defects caused by uneven material response are effectively avoided.

The invention provides a charge control electric field driven jet micro-nano 3D printing curved surface conformal multilayer circuit method and system. A high-precision conformal thin film dielectric layer is formed by utilizing charge injection electrowetting and contact electric field driving jet micro-nano 3D printing; and the high-resolution curved surface conformal circuit is manufactured by combining active residual charge elimination and non-contact electric field driving spray deposition micro-nano 3D printing. Through organic combination of active charge regulation and control and electric field driven jet micro-nano 3D printing, a high-precision conformal film dielectric layer and conductive layer conformal circuit and an interlayer interconnection circuit thereof are integrally printed. According to the curved surface conformal multilayer circuit manufacturing method, efficient, low-cost, high-precision and uniform manufacturing of the curved surface conformal multilayer circuit is achieved.

The invention discloses a processing method of a millimeter wave radar circuit board, which adopts a continuous blind slot to replace a plurality of independent blind hole structures in a traditional structure, so that a continuous radio frequency circuit pattern can be formed, the signal shielding area is effectively increased, and the millimeter wave radar circuit board has a better signal shielding effect. Besides, the processing method of the embodiment of the invention also cancels the procedures of repeated electroplating, single-side copper reduction, circuit etching and the like in the traditional processing method, and can directly realize the manufacturing of the outer circuit, the first copper layer and the second copper layer through activation and copper deposition, thereby greatly shortening the processing flow of the millimeter wave radar circuit board, and improving the production efficiency of the millimeter wave radar circuit board. And the production efficiency of the millimeter wave radar circuit board is improved. In addition, the invention further discloses the millimeter-wave radar circuit board formed by the processing method of the millimeter-wave radar circuit board.

The invention discloses an automatic processing device and method for PCB lamination, and the method comprises the steps: depositing an erodable film on a lamination material layer and arranging a cavity concentric with a through hole array before the lamination of a PCB, and collecting acoustic resonance frequency data to obtain a reference matrix; dynamic dot frequency tracking processing is carried out on the multi-point acoustic time sequence signals in the pressing heating stage, and a through hole instantaneous acoustic track library is obtained; performing coupling judgment on time-temperature-pressure ternary working condition data according to the trajectory library to obtain a blockage risk matrix; carrying out time delay and gradient adjustment on a pressing temperature and pressure curve based on the risk matrix; and carrying out three-dimensional inversion processing on the whole board broadband acoustic spectrum collected before cooling, calculating through hole filling rate distribution and judging the quality of the board. According to the scheme, the resin filling state of the micro through hole can be monitored in real time in the PCB pressing process, an acoustic detection channel is constructed through the erodable film and the cavity structure, early warning and active intervention of the blocking risk are achieved, and the pressing quality is ensured.

The invention discloses a cross-level laser drilling method utilizing UV laser and carbon dioxide laser, and belongs to the technical field of printed circuit boards. The cross-level laser drilling method utilizing the UV laser and the carbon dioxide laser burns through a required penetrating layer with a copper layer through high-energy UV laser drilling; the dielectric layer on the reserved layer bottom copper is burnt out and subjected to hole finishing by adopting carbon dioxide laser drilling, so that no adhesive residue is ensured under the condition that the hole bottom is not burnt through, the conduction connection performance of the printed circuit board is ensured, the processing quality stability of the printed circuit board is improved, and the production cost is reduced. And the problems of burning through and burning loss of a bottom copper layer caused by high energy of UV laser can be well improved.

The invention provides a multilayer circuit board and a processing method thereof, a chip system and electronic equipment, and the processing method comprises the steps: processing a second hole channel, a first conductive pattern and a second conductive pattern on a first substrate, and processing a third hole channel on a second substrate; the first substrate, the second substrate and the first insulating layer are stacked, pressed and fixed; the processing method further comprises the following steps: carrying out electroplating hole filling on the first substrate to form a second conductive channel; the processing method further comprises the steps that the second substrate is electroplated so that a sixth conductive pattern and a third conductive channel can be formed, the first insulating layer comprises a first conductive part, and the first conductive pattern, the second conductive pattern and the sixth conductive pattern are electrically connected with the second conductive channel through the third conductive channel and the first conductive part. The second hole channel and the third hole channel are filled in an electroplating hole filling mode, so that the wiring density and the chip signal transmission capability of the multilayer circuit board are improved, and the electrical performance and the thermal performance of the multilayer circuit board are improved; electroplating hole filling is suitable for mass production, and the process yield is stable.

The invention relates to a printed circuit board multilayer interconnection method, which comprises the following steps: firstly, automatically identifying and dividing interconnection channel areas of a circuit board, acquiring multi-dimensional parameters such as materials, thermal expansion coefficients and thermal cycle working conditions, realizing differential distribution and accurate preparation of a nano composite sensing material based on the multi-dimensional parameters, and obtaining the multi-dimensional parameters of the circuit board through an in-situ physical parameter acquisition and self-adaptive discrimination algorithm. Dynamic discrimination of stress abnormity and reverse driving of a micro heater are realized, the structure is induced to generate directional deformation so as to realize local automatic compensation, multi-point parameter data before and after compensation are used for health state modeling and residual life prediction, and big data archiving is combined to feed back manufacturing process optimization.

An embedded substrate, a power supply apparatus, and an electronic device. The embedded substrate comprises a front first additional layer, which is joint with a first surface of a chip holding body, wherein a conduction structure which is electrically connected to a circuit layer of the front first additional layer is provided in a dielectric layer of the front first additional layer, the conduction structure comprising a first conduction structure electrically connected to a pad on a chip; the dielectric layer of the front first additional layer is made of an exposable and developable material, and openings for constructing the conduction structure are formed by means of exposure and development; and a window of an outer protection layer has a first projection on the first surface, a first opening for constructing the first conduction structure has a second projection on the first surface, and the second projection covers the first projection. By means of such arrangements, a first conduction structure having a relatively large through-flow section is constructed by using the size of a window on a chip side, thereby effectively improving a through-flow capability, and achieving a good thermal conductivity capability. In addition, the joining stress between a circuit layer and the front surface of the chip can be reduced, thereby lowering the risk of delamination, and providing relatively good reliability.

The invention discloses a hot-pressing control method and system for a flexible circuit board, and particularly relates to the technical field of flexible electronic manufacturing process control, and the method comprises the following steps: calculating a heat conduction equilibrium coefficient through collecting the temperature and heat flux density data of each region in the flexible circuit board, and achieving the real-time evaluation of a heat diffusion characteristic; in combination with an infrared scanning mode, acquiring reflectivity data, analyzing dynamic change of the reflectivity data along with time, and identifying an abnormal region in which coating residues possibly exist; further comparing the position relationship between the thermal diffusion anomaly and the infrared reflection anomaly, screening a space overlapping region as a high-risk point, and executing a preset regulation and control strategy; according to the method, the heat conduction equilibrium coefficient is calculated by collecting heat flow and temperature data, the coating residue abnormal area is recognized by combining infrared reflectivity time sequence characteristics, the high-risk area is screened based on the space overlap ratio for dynamic regulation and control, accurate recognition, differential control and closed-loop optimization of hot pressing defects are achieved, and the hot pressing quality and consistency are improved.

The invention belongs to the technical field of integrated circuit board manufacturing, and particularly relates to a pressing device for an integrated circuit board, which comprises a cabinet body and a protective cover arranged above the cabinet body, a lower pressing plate and an upper pressing plate which are used for pressing the integrated circuit board are mounted in the protective cover, the lower pressing plate is arranged in a square frame fixedly arranged on the top surface of the cabinet body, and the upper pressing plate is connected with a power driving unit arranged in the protective cover; a plurality of heat conduction parts are mounted on the corresponding surfaces of the upper pressing plate and the lower pressing plate in an array manner, and a graphene heating film is mounted in each heat conduction part; a cavity is formed in the upper pressing plate, multiple sets of pressure compensation mechanisms are installed in the cavity in an array mode, and each set of pressure compensation mechanism corresponds to each heat conduction part. According to the invention, stable and high-quality press-fit forming operation of the integrated circuit board can be carried out between the upper pressing plate and the lower pressing plate which independently control the temperature and uniformly apply pressure, so that the press-fit forming quality and the press-fit forming yield of the integrated circuit board can be improved.

The invention relates to a back drilling method for reducing circuit board via hole stubs, which comprises the following steps: S1, blind hole pre-processing: performing laser pre-processing at the tail end of a target via hole stub to form a positioning blind hole; s2, back drilling, wherein a drill bit with an impedance monitoring module is adopted to conduct tracking drilling on the positioning blind hole; s3, monitoring a dynamic resistance value, and collecting an electrical impedance value of the impedance monitoring module in real time; and S4, tool retracting is conducted, and when it is monitored that the electrical impedance value reaches a preset value, drilling is stopped immediately, and the drill bit is retracted. According to the method, the laser preprocessing technology and the impedance feedback technology are combined, dependence and uncertainty on empirical judgment are reduced, the production process is simplified, the machining cost is reduced, and accurate control over the back drilling via hole stub can be achieved. The length of the via hole stub can be effectively reduced, reflection, scattering and delay in high-speed signal transmission are reduced, signal integrity is improved, and the method is particularly suitable for design of high-frequency and high-density interconnected circuit boards.

A module includes: a substrate having a first surface; a first component mounted on the first surface; a first sealing resin layer disposed to cover a side surface of the first component and the first surface; and a redistribution layer covering a surface of the first sealing resin layer on a side far from the substrate. The redistribution layer includes: a first metal film disposed to correspond to a projection area of the first component; a first insulating film covering a surface of the first metal film on a side far from the substrate; and a first group of conductor vias passing through the first insulating film and protruding from the first metal film in a direction away from the substrate.

To provide a ceramic board which has good heat dissipation, and in which an integration density is high.SOLUTION: According to an embodiment, the present invention discloses a manufacturing method of an ultrathin high-density multilayer interconnection ceramic board, containing steps of: preparing a ceramic wafer, performing a laser punching to the ceramic wafer, and forming a via hole; performing a vacuum magnetron sputtering to the ceramic wafer, and forming a seed titan layer and a copper layer onto a front surface of the ceramic wafer and on a wall of the via hole by the sputtering; manufacturing a ceramic double-layer core plate; manufacturing a multilayer substrate; manufacturing a vertical interconnection multilayer substrate; and manufacturing a high-end multilayer HDI ceramic board. The multilayer ceramic plate manufactured in the above mentioned processing can be easily processed as compared with LTCC and HTCC, and an energy consumption amount for the processing is deteriorated. A heat conductivity of a finished product is improved. A wiring is more accurate; a conductive resistance is low; and a signal transmission loss is low.SELECTED DRAWING: Figure 1

Disclosed is a printed circuit board and a manufacturing method for manufacturing the same, the printed circuit board including: a first insulating layer; a through-hole penetrating through the first insulating layer; a via conductor layer disposed in the through-hole, and having first and second groove portions recessed inwardly of the through-hole from an upper surface and a lower surface of the first insulating layer, respectively; a cavity penetrating through at least a portion of the first insulating layer; an electronic component disposed in the cavity; and a second insulating layer covering at least a portion of the first insulating layer, and disposed in at least a portion of each of the through-hole and the cavity.

Disclosed herein are a package substrate, a chip package, and method for fabricating the same. The package substrate includes a package core comprising vias; a plurality of build-up layers disposed on an upper surface of the package core, the plurality of build-up layers comprising metal traces connected with the vias; and a magnetic core inductor disposed in a cavity of the package core. The magnetic core inductor includes a magnetic inlay, and a first metal layer disposed in the cavity on the magnetic inlay below the plurality of build-up layers. A second metal layer may be further disposed between the first metal layer and the metal traces. Both the first and second metal layers may be floating or grounded. The first and second metal layers are configured to shield other electronic components from being interfered by the magnetic field generated by the magnetic core inductor.

A circuit carrier includes a substrate, a first build-up circuit structure, a second build-up circuit structure, a fine redistribution structure and at least one conductive through hole. The substrate has a top surface and a bottom surface opposite to each other. The first build-up circuit structure is disposed on the top surface of the substrate and electrically connected to the substrate. The second build-up circuit structure is disposed on the bottom surface of the substrate and electrically connected to the substrate. The fine redistribution structure is directly attached on the first build-up circuit structure, wherein a line width and a line spacing of the fine redistribution structure are smaller than those of the first build-up circuit structure. The conductive through hole penetrates the fine redistribution structure and a portion of the first build-up circuit structure and is electrically connected to the fine redistribution structure and the first build-up circuit structure.

The invention discloses a method for manufacturing a circuit board embedded with a carbon oil resistor, which comprises the following steps of: taking a double-sided copper-clad plate, manufacturing a circuit pattern comprising a carbon oil connecting pattern which comprises a wire end and a connecting end, adhering a dry film to two sides, a dry film windowing pattern is manufactured in the area, corresponding to the carbon oil pattern, of the surface where the carbon oil connection pattern is located, plasma treatment is conducted, then film stripping is conducted, a carbon oil layer is manufactured in the area of the carbon oil pattern, a bonding layer prepreg is taken, core plates of other layers are taken and stacked and pressed together with the carbon oil plate, and the circuit board embedded with the carbon oil resistor is formed through subsequent procedure manufacturing; by designing the connecting end, the carbon oil layer has a larger bonding area, the bonding force of the carbon oil layer is increased, prepregs are laminated and bonded to the surface of the carbon oil layer, the interlayer bonding force of the carbon oil layer is improved, and the problems of falling, layering of a multi-layer board and even board explosion of the multi-layer board caused by poor bonding of the carbon oil layer are solved.