2752results about "Multilayer circuit manufacture" patented technology

The invention relates to the technical field of printed circuit board manufacturing, in particular to a PCB lamination parameter control method and system, and the method comprises the steps: receiving a global pressure adjustment instruction; acquiring real-time temperature data of the to-be-laminated sheet, and constructing a surface temperature distribution diagram of the to-be-laminated sheet; the surface temperature distribution diagram is analyzed, and operation areas, with different thermal response attributes, of the to-be-laminated sheet are divided; according to the thermal response attribute of each operation region and the global pressure adjustment instruction, obtaining a region area weight and a response deviation coefficient, carrying out differential decomposition on the global pressure adjustment instruction, and calculating differential pressure adjustment amounts of the plurality of operation regions; and mapping the differential pressure adjustment amount to a multi-partition hydraulic execution mechanism in the laminating equipment, and controlling a target pressure value output by each operation area. The method has the advantages that refined and differentiated pressure adjustment of operation areas with different thermal response attributes in the plate can be achieved, and local defects caused by uneven material response are effectively avoided.

The invention relates to a printed circuit board multilayer interconnection method, which comprises the following steps: firstly, automatically identifying and dividing interconnection channel areas of a circuit board, acquiring multi-dimensional parameters such as materials, thermal expansion coefficients and thermal cycle working conditions, realizing differential distribution and accurate preparation of a nano composite sensing material based on the multi-dimensional parameters, and obtaining the multi-dimensional parameters of the circuit board through an in-situ physical parameter acquisition and self-adaptive discrimination algorithm. Dynamic discrimination of stress abnormity and reverse driving of a micro heater are realized, the structure is induced to generate directional deformation so as to realize local automatic compensation, multi-point parameter data before and after compensation are used for health state modeling and residual life prediction, and big data archiving is combined to feed back manufacturing process optimization.

The invention discloses a hot-pressing control method and system for a flexible circuit board, and particularly relates to the technical field of flexible electronic manufacturing process control, and the method comprises the following steps: calculating a heat conduction equilibrium coefficient through collecting the temperature and heat flux density data of each region in the flexible circuit board, and achieving the real-time evaluation of a heat diffusion characteristic; in combination with an infrared scanning mode, acquiring reflectivity data, analyzing dynamic change of the reflectivity data along with time, and identifying an abnormal region in which coating residues possibly exist; further comparing the position relationship between the thermal diffusion anomaly and the infrared reflection anomaly, screening a space overlapping region as a high-risk point, and executing a preset regulation and control strategy; according to the method, the heat conduction equilibrium coefficient is calculated by collecting heat flow and temperature data, the coating residue abnormal area is recognized by combining infrared reflectivity time sequence characteristics, the high-risk area is screened based on the space overlap ratio for dynamic regulation and control, accurate recognition, differential control and closed-loop optimization of hot pressing defects are achieved, and the hot pressing quality and consistency are improved.

The invention discloses a reinforced composite PCB and a preparation method thereof, and belongs to the technical field of PCB preparation. The preparation method of the reinforced composite PCB comprises the following steps: step 1, processing an inner-layer core board to obtain a preprocessed inner-layer core board; 2, cutting, drilling and activating the modified composite film to obtain a treated modified composite film; and 3, sequentially carrying out stacking, hot pressing treatment, pressure relief, cooling, drilling, hole metallization treatment, outer layer pattern transfer, pattern electroplating, outer layer etching, resistance welding, surface treatment, molding and testing on a copper foil, a prepreg, the pretreated inner layer core plate, the prepreg, the treated modified composite film, the prepreg, the pretreated inner layer core plate, the prepreg and the copper foil. And the composite PCB is obtained. The circuit board prepared by the method has excellent thermal stability and mechanical properties.

The invention provides an embedded substrate and a manufacturing method thereof. The manufacturing method specifically comprises the following steps: forming a conduction copper column and a shielding copper column on a first circuit layer of the substrate; pressing a second dielectric layer on the first circuit layer, the conduction copper column and the shielding copper column; mounting a component on the second dielectric layer; pressing the component into the second dielectric layer to enable the shielding copper column and the first circuit layer to surround the component; pressing a fourth dielectric layer on the second dielectric layer and the component, and curing the second dielectric layer and the fourth dielectric layer; forming an outer circuit layer on the fourth dielectric layer; and the outer circuit layer is in conducting connection with the conducting copper column, the shielding copper column and the terminal of the component. The shielding copper columns can reduce the deviation of the component in the extrusion process of the component and improve the yield, five surfaces of the embedded component are all provided with metal copper, and a good electromagnetic shielding effect can be achieved. Moreover, the second dielectric layer and the fourth dielectric layer are made of high-thermal-conductivity materials, so that heat can be quickly guided into the shielding copper columns, and the heat dissipation effect is obviously improved.

A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on the resin insulating layer and including a seed layer and a metal layer on the seed layer, a via conductor formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer, and a base layer formed on the resin insulating layer and including resin and one of iron and chromium in a range of 0.2 at % to 5.0 at % with respect to the resin such that the base layer includes part formed between the resin insulating layer and the seed layer.

According to the glass phased-array antenna control module and the manufacturing method thereof, a control circuit is manufactured on a glass substrate through a TFT manufacturing process, high-precision control over a phased-array antenna is achieved, the accuracy of beam pointing of the phased-array antenna and the quality of signal processing are guaranteed, and the manufacturing cost of the phased-array antenna is reduced. Through the combination of a TFT manufacturing process and a TGV technology, the layout space of a control circuit is saved, the installation space of an antenna chip is saved through a COB packaging mode, the high integration level of the phased-array antenna is achieved, the requirements for miniaturization and multi-functionalization of the phased-array antenna are met, and the application range of the phased-array antenna is widened. According to the phased-array antenna, the grounding isolation holes are formed in the periphery of the antenna chip, so that good crosstalk resistance is achieved, the stability and reliability of the phased-array antenna are improved, the performance of the phased-array antenna is comprehensively improved, the phased-array antenna has higher competitiveness in the fields of satellite communication, vehicle-mounted radars, military radars and the like, and the application prospect is wide. And the requirements of various fields on high-performance phased-array antennas can be better met.

A printed circuit board according to an embodiment comprises: an insulating layer; a circuit pattern disposed on the upper surface of the insulating layer; a support layer which is disposed on the upper surface of the insulating layer to expose the upper surface of the circuit pattern and is in contact with the sides of the circuit pattern; and a protective layer disposed on the upper surfaces of the support layer and the circuit pattern, wherein the upper region of the insulating layer comprises a first region and a second region, and the protective layer comprises an open region exposing the upper surfaces of the support layer and the circuit pattern that are disposed in the first region, and the support layer comprises a first upper surface positioned at the highest level among the upper surfaces of the support layer and a second upper surface positioned at the lowest level among the upper surfaces of the support layer, the second upper surface being lower than the first upper surface, and the protective layer comprises a first portion which contacts the upper surface of the circuit pattern of the first region and a second portion which contacts the upper surface of the support layer of the first region, and the second portion of the protective layer contacts the second upper surface of the support layer and includes a first lower surface which is lower than the upper surface of the circuit pattern.

The invention relates to the technical field of flexible electronic integrated systems, in particular to a multilayer flexible circuit, a preparation method thereof and a flexible electronic system. The multi-layer flexible circuit comprises a flexible substrate layer and a flexible conductive layer which are arranged in a stacked mode, and the flexible conductive layer comprises metal nanowire aerogel and a filled flexible base material. The flexible base material and the flexible substrate layer in the flexible conductive layer have tensile properties. The metal nanowire aerogel is in lap joint in the flexible conductive layer to form a rich conductive network, so that the flexible conductive layer has good conductivity. The special form of the metal nanowire aerogel enables the flexible conductive layer to have good electrical stability, namely resistance-strain insensitivity and resistance stability after long-term deformation, and when the flexible conductive layer deforms, the resistance does not change obviously. Due to the stacked structure design, the mechanical stretchable upper limit of the multi-layer flexible circuit is remarkably improved, the resistance change rate under the same deformation is remarkably reduced, and the resistance change is low after long-term use.

A printed wiring board includes a first conductor layer, a resin insulating layer having an opening, a second conductor layer including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor including the seed layer and the electrolytic plating layer and connecting the first conductor and second conductor layers. The seed layer has a first portion on the surface of the insulating layer, a second portion on an inner wall surface in the opening of the insulating layer, and a third portion on a portion of the first conductor layer exposed by the opening of the insulating layer such that the first portion is thicker than the second portion and the third portion, the second portion has a first film and a second film electrically connected to the first film, and a portion of the first film is formed on the second film.

An electronic device is provided. The electronic device includes a substrate, a through hole, a first circuit structure, and an electronic unit. The substrate includes a first side and a second side opposite to the first side. The through hole penetrates the substrate and connects the first side to the second side. The first circuit structure is disposed on the first side and includes a first metal layer and a first dielectric layer. The first metal layer overlaps a first portion of the first side. The first dielectric layer overlaps a second portion of the first side. The first portion is connected to the second portion. The electronic unit is electrically connected to the first circuit structure. Moreover, a surface roughness of the first portion is lower than a surface roughness of the second portion.

The invention relates to the technical field of circuit boards, in particular to a method for improving local thickness unevenness of a rigid-flex board and the rigid-flex board. The method comprises the following steps: S1, extracting residual copper rate distribution, setting a residual copper rate threshold value, and identifying a glue filling area and a non-glue filling area of a rigid-flex board plane according to the residual copper rate threshold value; s2, windowing parameters are obtained according to the hole ring height and diameter of the non-glue-filling area, and windowing is conducted on the cover film according to the windowing parameters; after windowing is completed, the covering film is attached to the corresponding position, the hole ring is sleeved with the window, and the local thickness of the rigid-flex board is consistent; or dividing a high-voltage region and a low-voltage region in the non-glue filling region according to the voltage level and the signal characteristic in the circuit design; the copper is thickened in the high-voltage area, and a step is formed by the thickened copper layer in the high-voltage area; when the glue filling area is filled with glue, pressure difference is formed, the glue layer flows towards the low-pressure area, uniform filling of the glue layer is achieved, and the local thickness of the rigid-flex board is consistent. According to the invention, uneven local thickness of the rigid-flex board is improved.

The invention discloses a production method of an anti-falling combined type double-layer circuit board, and relates to the technical field of production of combined type double-layer circuit boards, and the production method comprises the following steps: S1, milling an annular groove I in the bottom surface of a first circuit board; s2, an annular groove II is milled in the top surface of the second circuit board; s3, embedding the frame-shaped curing adhesive into the annular groove II of the second circuit board from top to bottom; s4, buckling the annular groove I of the first circuit board outside the upper half part of the frame-shaped curing adhesive from top to bottom; s5, taking out one stent; s6, enabling the exposed part of the protection plate to be tightly attached to the bottom surface of the second circuit board; s7, the exposed part of the protection plate is tightly attached to the outer side wall of the strip-shaped through groove; s8, the two exposed parts of the support are supported on the table top of the machine table; and S9, after the pressure is maintained for a period of time, a first combined double-layer circuit board B can be finally produced. The method has the beneficial effect that the production quality of the combined double-layer circuit board is improved.

A printed wiring board includes a first conductor layer, a resin insulating layer having an opening, a second conductor layer including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor including the seed and electrolytic plating layers and connecting the first and second conductor layers. The seed layer has a first portion on the surface of the insulating layer, a second portion on an inner wall surface in the opening of the insulating layer, and a third portion on a portion of the first conductor layer exposed by the opening of the insulating layer such that the first portion is thicker than the second and third portions, and the insulating layer includes resin and inorganic particles including first particles forming the inner wall surface and second particles embedded in the insulating layer and having shapes different from shapes of the first particles.

According to the printed circuit board and the preparation method thereof provided by the invention, the glass core plate is used for replacing a traditional resin material, and the characteristics of low thermal expansion coefficient, low humidity coefficient and low dielectric constant of the glass core plate are utilized, so that warping and signal interference caused by temperature change and environment humidity are effectively reduced, and the stability and reliability of the PCB are remarkably improved. Meanwhile, by repeatedly constructing a multilayer layer-adding structure, adopting an ABF layer at the position adjacent to the glass substrate and adopting dielectric layers with Dk < = 3.0 and Df < = 0.001 for the rest, signal attenuation and interference can be effectively reduced, signal integrity and transmission efficiency can be ensured, overall buckling deformation of the PCB structure can be reduced or even avoided, and the PCB structure is more stable in performance. The multi-layer adding meets the requirements of different application scenarios for the number of layers of the PCB, improves the flexibility and applicability of the PCB, and enables the PCB to be especially suitable for the application scenarios of high-frequency and high-speed signal transmission.

To provide a laminated substrate capable of ensuring a long-term reliability by preventing stress from being applied to a conductive paste for electrical connection when the laminated substrate is manufactured by laminating a plurality of multilayer substrates.SOLUTION: In a laminated substrate 100 formed by laminating a plurality of multilayer substrates 10, in each multilayer substrate 10, a through hole 30 penetrating through each multilayer substrate 10 and having an inner wall surface plated and filled with a resin 32 therein, and bonding lands 34 electrically connected to the through hole 30 are formed on an upper surface and a lower surface of the through hole 30. An insulating adhesive layer 40 and a conductive paste via 50 for electrically connecting the bonding lands 34 of the opposed multilayer substrates to each other by a conductive paste filled in a through hole 46 formed in the insulating adhesive layer 40 are provided between the multilayer substrates 10, and the conductive paste via 50 is provided at a position different from the position where the through hole 30 is formed.SELECTED DRAWING: Figure 1

A radio frequency module includes a module substrate having a first main surface facing a second main surface, and a module substrate having a third main surface facing a fourth main surface. The third main surface faces the second main surface. Multiple electronic components, including a power amplifier, are disposed between the second and third main surfaces on the first main surface, and on the fourth main surface. Multiple external connection terminals are disposed on the third main surface. The power amplifier has a fifth main surface facing a sixth main surface and includes a circuit portion formed nearer to the fifth main surface than the sixth main surface and includes an amplifier transistor. in the power amplifier, the fifth main surface faces the third main surface, and the sixth main surface faces the second main surface. A heat dissipation conductor is joined to the main surface.

The invention relates to the technical field of printed circuit boards, and discloses a printed circuit board with an embedded ceramic part and a manufacturing method thereof.The manufacturing method of the printed circuit board with the embedded ceramic part comprises the steps that a laminated board is provided and comprises a first sub-board, a first dielectric layer, an embedded layer, a second dielectric layer and a second sub-board which are sequentially arranged in a stacked mode, the embedded layer comprises an embedded substrate and a ceramic part, the embedded substrate is provided with an embedded groove, the embedded substrate comprises a convex part arranged on the inner wall of the embedded groove, the ceramic part is arranged in the embedded groove, the edge of the ceramic part is provided with a concave part, and the convex part is accommodated in the concave part in a clearance manner; and processing a first via hole in the laminated plate, wherein the first via hole penetrates through the first sub-plate, the first dielectric layer, the lug boss, the second dielectric layer and the second sub-plate. According to the printed circuit board of the buried ceramic piece and the manufacturing method thereof, the problem that the quality of a subsequently drilled through hole is affected due to the fact that the pre-drilled hole located in the edge of the ceramic block is prone to the phenomena of insufficient glue filling and glue filling cavity in the prior art is solved.

A semiconductor package according to an embodiment includes a first insulating layer; a first circuit pattern disposed on the first insulating layer and including a first pad; a first molding layer disposed on an upper surface of the first insulating layer; a through electrode including a first conductive coupling part disposed on the first pad and having a first width and a through part disposed on the first conductive coupling part and having a second width smaller than the first width, and passing through of the first molding layer; and a second conductive coupling part disposed on the through part of the through electrode; wherein the first width of the first conductive coupling part is smaller than a third width of the second conductive coupling part.

The invention discloses a method and system for improving drilling deviation of a printed circuit board, and the method comprises the steps: carrying out the first lamination of a multi-layer printed circuit board, and obtaining a first laminated board; performing global scanning on the first laminated plate by using X-ray imaging equipment to obtain actual coordinates of an inner-layer bonding pad; the actual coordinates are compared with the design coordinates, and the offset of each area is calculated; generating a regionalized pre-compensation matrix according to the offset; and writing the pre-compensation matrix into follow-up engineering data of the same batch, and performing reverse compensation on the inner-layer graph, so that the corresponding relation between the inner-layer circuit bonding pad and the center of the drill hole after lamination is recovered. According to the method, the deviation can be predicted and adjusted at the initial stage of production, high-precision alignment of the plates in the whole production process is ensured, scrapping caused by deviation is remarkably reduced, and the overall reliability of a production line is improved.

The invention relates to the technical field of printed circuit manufacturing, and discloses a semiconductor test printed circuit board warping control method, which comprises the following steps of: firstly, establishing a symmetric stress substrate through inner layer residual copper rate control and symmetric lamination; then, the plate is placed in the middle layer during pressing, and a uniform heat transfer path is constructed through the teflon base plates arranged up and down; and finally, long-time cold pressing is performed after hot pressing to neutralize internal stress, through the synergistic process combination, warping control of the super-multilayer thick plate is converted from dependence on later physical correction into the technological process that high flatness can be achieved in an endogenous mode in the pressing and curing stage, and the technological process is simplified. Therefore, interlayer stress generated by accumulation due to material thermal expansion difference and uneven thermal field is inhibited, and a yield-controllable engineering path is provided for reliable manufacturing of high-density and high-thickness semiconductor test boards.

A wiring substrate according to one embodiment includes a plurality of wiring layers and a plurality of insulating layers alternately stacked in a stacking direction. The plurality of wiring layers include a first wiring layer closest to a surface on one side in the stacking direction of the wiring substrate and a second wiring layer second closest to the surface. A distance from the surface to the first wiring layer is larger than a distance from the first wiring layer to the second wiring layer.

The invention provides a high-frequency multilayer circuit board processing method and a high-frequency multilayer circuit board. The high-frequency multilayer circuit board processing method comprises the following steps: obtaining an inner-layer core board, a prepreg and a copper foil, and carrying out lamination treatment on the inner-layer core board, the prepreg and the copper foil to obtain a laminated board body; wherein the number of the inner-layer core plates is multiple; carrying out drilling treatment on the laminated plate body; carrying out riveting treatment on the laminated plate body after drilling; fusing the riveted laminated board body to obtain a semi-finished product of the high-frequency multilayer circuit board; performing film coating treatment on the semi-finished product of the high-frequency multilayer circuit board; laminating the semi-finished product of the high-frequency multi-layer circuit board coated with the film; and carrying out post-processing treatment on the laminated semi-finished product of the high-frequency multilayer circuit board. According to the processing method of the high-frequency multilayer circuit board, the high-frequency multilayer circuit board is relatively high in use reliability.

The utility model discloses a hot pressing device for preparing a high-precision multilayer circuit board, which comprises a base and a multilayer circuit board body, the upper ends of four corners of the base are fixedly connected with supporting rods, the upper ends of the four supporting rods are provided with the same supporting seat, and the upper end of the central position of the supporting seat is fixedly provided with a hydraulic cylinder; and a horizontal sliding seat is connected among the four supporting rods in a sliding manner. Buffering protection is provided for the material loading seat through the hydraulic buffers and the buffering air bags made of the polyurethane rubber, buffering protection is provided for the pressure bearing seat through the rectangular annular base plate made of the polyurethane rubber, the material loading seat and the pressure bearing seat are prevented from being damaged in the long-term hot pressing process, the service life of the material loading seat and the service life of the pressure bearing seat are prolonged, and the service life of the material loading seat and the pressure bearing seat is prolonged. Balls and limiting grooves are matched with a rectangular annular base plate made of polyurethane rubber to limit the pressure-bearing seat, so that an air cylinder is matched with a jacking block to penetrate through a rectangular opening to jack the pressure-bearing seat out, and the hot-pressed multilayer circuit board in the material carrying seat can be conveniently and quickly taken out.

The invention relates to the technical field of circuit board pressing, in particular to a circuit board pressing device which comprises a workbench, a placing table used for placing a material plate is arranged on the workbench, a pressing plate is arranged over the placing table, the pressing plate is driven by a driving part, and the placing table is provided with a driving part; the positioning assembly comprises at least one right-angle support mounted on the placement table; the pushing assembly comprises at least one pushing piece capable of sliding relative to the placing table; the output end of the driving part is connected with a linkage assembly, and when the output end of the driving part drives the pressing plate to press downwards, the pushing part is synchronously driven to slide to push the material plate so that the material plate can bear vertical pressing force and horizontal limiting force at the same time in the pressing process. The invention aims to provide the circuit board pressing device which synchronously realizes vertical pressing and horizontal limiting and reduces deviation and warping of a material plate in the pressing process.

An FPC cable is provided that includes a first ground trace on a first side of an insulator substrate and a second ground trace on the first side of the insulator substrate spaced from the first ground trace. A plurality of signal lines are located between the first ground trace and the second ground trace. A ground reference layer is located on a second side of the insulator substrate, with the ground reference layer comprising a plurality of ground reference layer segments spaced from one another. Each of the ground reference layer segments is connected with a via to the first ground trace and the second ground trace.

A printed circuit board includes: a bridge including a first insulating material, a wiring pattern disposed in the first insulating layer, a metal post disposed on the first insulating material and connected to the wiring pattern, and a second insulating material disposed on the first insulating material and covering at least a portion of the metal post; a first build-up insulating material disposed around the bridge; and a first redistribution pattern disposed on the second insulating material and the first build-up insulating material and including a metal pad connected to the metal post.

A wiring circuit board includes a metal supporting layer, a first metal thin film, an insulating layer including a through hole, a second metal thin film disposed on the first metal thin film in the through hole, and a conductive pattern electrically connected to the metal supporting layer through the first metal thin film and the second metal thin film in the through hole. The first metal thin film includes an oxide coating at least on a contact surface in contact with the insulating layer. In the central part of the through hole, the oxide coating has a thickness of 0 or a thickness smaller than a thickness of the oxide coating on the contact surface.

This invention discloses an automatic design method and auxiliary files for rigid-flex PCBs. First, the shapes of flexible and rigid PCBs are distinguished, corresponding shape areas are selected and converted into copper foil attributes. Then, by increasing or decreasing the size of the copper foil and using negative stacking of copper foil, the required spacing between different shapes is created. This allows for the rapid creation of auxiliary files for rigid-flex PCBs that meet process requirements. The invention can quickly and automatically generate auxiliary files, improving the efficiency of auxiliary file processing, reducing errors caused by missing requirements, increasing the yield of rigid-flex PCBs, reducing production scrap rates, and improving the quality of rigid-flex PCBs.

According to the preparation method of the low-signal-loss copper-clad plate for the AI server, a microwave resonant cavity is integrated between heating plates of a laminating machine, on-line non-intrusive detection on dielectric response of a base material is achieved, the curing degree and stress distribution of resin of each layer are inversed in real time in combination with frequency domain analysis and material dielectric modeling, and the low-signal-loss copper-clad plate for the AI server is obtained. A pre-trained physical information neural network is used to map the three-dimensional pressure-deformation relation; according to the method, model prediction control is adopted to dynamically generate a pressure instruction, closed-loop feedback adjustment and optimization are carried out, technological parameter self-tuning and multi-objective optimization are matched, a knowledge base is established, and strategy autonomous recommendation is realized, so that the flexibility and precision of pressure distribution regulation and control and the consistency of finished products are improved, and continuous iterative optimization of technological experience is supported.