75results about How to "Reduce inductance" patented technology

The present invention provides a power module and an internal positioning method thereof, comprising a main body, the main body comprising a substrate assembly, a copper frame and a chip; the copper frame and the chip are respectively connected to the substrate assembly; the copper frame comprises a first copper belt; the substrate assembly or the chip is provided with a limiting assembly that enables the first copper belt to be positioned correspondingly on the chip. The present invention limits the movement of the copper frame or the copper belt by adding a limiting piece on the surface of the insulating substrate or the surface of the chip, thereby playing a positioning role, and can prevent the copper frame or the copper belt from being unable to be accurately positioned when the copper frame or the copper belt is used for chip surface connection, resulting in a positional deviation from the center of the chip, thereby causing a short circuit problem.

The utility model discloses a magnetic circuit assembly, a bone conduction sounding device and a bone conduction earphone. The magnetic circuit assembly comprises a magnetic circuit assembly, a coil and a short circuit piece. The magnetic circuit assembly comprises a magnet and a magnetic conductive plate connected with the magnet, and the magnet is magnetized in the axis direction of the magnetic circuit assembly; the coil surrounds the periphery of the magnetic conductive plate and is used for driving the magnetic circuit assembly to vibrate in the axis direction. And the short-circuit piece is arranged in an alternating magnetic field generated after the coil is electrified, is of a hollow annular structure and is made of a conductive material. According to the magnetic circuit assembly, the bone conduction sounding device and the bone conduction earphone provided by the utility model, the short-circuit piece made of conductive materials is added, and the inductance of the coil is reduced through the short-circuit piece, so that the overall inductive reactance of the magnetic circuit assembly is reduced, and the magnetic performance condition is achieved and improved.

The embodiment of the utility model provides an integrated circuit. The integrated circuit comprises a first IC chip connected to a second IC chip. The first IC chip includes a plurality of photodetectors disposed in the first substrate and the first bonding structure. The first bonding structure includes a first plurality of bonding contacts disposed on the first plurality of conductive bonding pads. The second IC chip includes a second bonding structure and a second substrate. The first bonding interface is disposed between the first bonding structure and the second bonding structure. The second bonding structure includes a second plurality of bonding contacts. The first bonding structure also includes a first plurality of shielding structures between adjacent ones of the first plurality of conductive bonding pads. The shielding structure blocks an electromagnetic field between adjacent conductive bonding pads, thereby reducing parasitic capacitance and inductance between the conductive bonding pads of the bonding structure.

The utility model discloses a vehicle-mounted capacitor, which comprises an insulating layer, a capacitor inner core, an input busbar and an output busbar, the output busbar comprises a positive busbar and a negative busbar which are stacked, the positive busbar comprises a positive welding pole plate and a positive alternating current leading-out end, and the negative busbar comprises a negative welding pole plate and a negative alternating current leading-out end; the input busbar comprises a positive direct-current bus end and a negative direct-current bus end, the positive direct-current bus end and the negative direct-current bus end are located on a positive welding pole plate and a negative welding pole plate respectively, the positive welding pole plate and the negative welding pole plate are arranged in a stacked mode, and the positive direct-current bus end and the negative direct-current bus end are arranged in a stacked mode; a first concave groove and a second concave groove are formed in the two opposite sides of the insulating layer respectively, so that the positive pole alternating current leading-out end and the negative pole alternating current leading-out end are arranged in the first concave groove and the second concave groove in the two opposite sides of the insulating layer in a stacked mode respectively. And the riding experience of the user is improved.

The present invention discloses a three-phase asymmetric grid-connected filter, comprising: the first end of the first inductor is respectively connected to the first end of the second inductor, the first end of the first resonant circuit and the first end of the third capacitor; the first end of the third inductor is connected to the first end of the fourth inductor, the first end of the second resonant circuit and the second end of the first resonant circuit; the first end of the fifth inductor is connected to the second end of the second resonant circuit, the second end of the sixth inductor and the second end of the third capacitor; the first resonant circuit is composed of the first capacitor and the seventh inductor; the second resonant circuit is composed of the second capacitor and the eighth inductor. The application of the embodiments of the present invention aims to solve the problem that the existing trap-type high-order filter has insufficient anti-parameter drift capability and cannot really save inductance.

The present application provides an electric working machine, and a method of assembling a drive unit for driving a motor of the electric working machine, one aspect of which relates to an electric working machine provided with a motor, a circuit substrate, a first semiconductor switch, a second semiconductor switch, a first conductive line, a second conductive line, and a solid metal member. The circuit substrate has a first circuit surface, a second circuit surface, and a through hole. The first semiconductor switch is mounted on the first circuit surface and has a first terminal. The second semiconductor switch is mounted on the second circuit surface and has a second terminal. The first conductive line is disposed on the first circuit surface and electrically connected to the first terminal. The second conductive line is disposed on the second circuit surface and electrically connected to the second terminal. The solid metal member is inserted into the through hole and electrically connected to the first conductive line and the second conductive line.

The invention relates to an oil pump motor and dual-motor integrated control device applied to a new energy automobile. The oil pump motor and dual-motor integrated control device comprises a control device shell, a protective cover, an oil pump motor and dual-motor control unit, a control unit mounting shell, an anti-interference shielding assembly, a cooling support assembly and a six-phase detection assembly. The anti-interference shielding assembly, the cooling support assembly, the control unit installation shell and the six-phase detection assembly are installed in the control device shell, the oil pump motor and the dual-motor control unit are installed in the control unit installation shell, and the protection cover covers the control unit installation shell. Compared with the prior art, the power generator controller, the driving motor controller and the oil pump motor controller are integrated in the oil pump motor and the dual-motor control unit, the integration requirement of the new energy automobile market is better met, parts such as external wire harnesses and circuit boards are saved, the integration degree is high, and the size and the cost are saved; and the two paths of current realize the advantages of supplying power to the generator, the driving motor and the oil pump motor and the like.

The invention provides a method for measuring low-voltage direct-current resistance of a three-phase transformer bank, and belongs to the technical field of transformer measurement. The invention provides a method for measuring low-voltage direct-current resistance of a three-phase transformer bank. The method comprises the following steps of: connecting all phases of windings on a high-voltage side together; connecting the high-voltage side three-phase winding with the low-voltage side three-phase winding; direct current is introduced into the high-voltage side three-phase winding; measuring the voltage of the corresponding high-voltage side winding and the corresponding low-voltage side winding to be measured and the current of the corresponding high-voltage side winding or the corresponding low-voltage side winding; and calculating the direct current resistance of the to-be-measured phase according to the measured voltage and current. The three-phase transformer bank low-voltage direct-current resistance measuring method provided by the invention has the advantages that during measurement, direct current is introduced into the high-voltage side three-phase windings, so that the current in the three high-voltage side windings forms a loop, the number of excitation ampere turns of the three-phase iron core columns is increased, the three iron core columns are magnetically saturated, the inductance of coils is reduced, and the measurement accuracy is improved. And the test time is shortened.

The application provides a deep trench field effect transistor and a preparation method thereof, which comprises the following steps: forming a P-type layer and an N-type layer in an N-type substrate; forming a gate trench and a terminal trench; forming an N-type source region by ion implantation; forming a gate oxide layer in the trench; forming a first polysilicon layer, a thick oxide layer and a second polysilicon layer in the trench; depositing a dielectric layer; forming a drain contact region, a source contact region, a gate contact region and a terminal contact region; forming a source electrode, a gate electrode and a drain electrode, wherein the source electrode is connected with the N-type source region and the terminal contact region simultaneously. The source electrode, the gate electrode and the drain electrode can be attached to a heat dissipation substrate simultaneously, the heat dissipation path is greatly optimized, and the source path inductance is reduced; the source contact region of the application is arranged in the terminal region, and the source contact region is realized by directly etching the dielectric layer and the substrate below the dielectric layer, the process controllability is high, the steps are simple, and the etching process of the source contact region has high stability.

The invention discloses a compact Marx generator based on an impact ionization semiconductor device, and relates to the field of a pulse power technology and a power semiconductor device crossing technology. Comprising N stages of sub Marx generators which are cascaded in sequence, and each sub Marx generator comprises an impact ionization semiconductor device, a first charging isolation element, a second charging isolation element, an energy storage unit, a first ground capacitor and a second ground capacitor; for any stage of sub Marx generator, the first end of the impact ionization semiconductor device is connected with the first end of the first charging isolation element, the first end of the first ground capacitor and the first end of the energy storage unit, the second end of the first ground capacitor is grounded, the second end of the impact ionization semiconductor device is connected with the first end of the second charging isolation element, and the second end of the second charging isolation element is grounded. The second end of the second charging isolation element is connected with the second end of the energy storage unit and the first end of the second ground capacitor, and the second end of the second ground capacitor is grounded. According to the compact Marx generator, the conduction safety is improved.

An electronic device (100) applied to an electric motor includes a wiring substrate (101), an electric connection wiring (150) disposed at a substantially center of the wiring substrate and connected to a power source, a plurality of motor connection wirings (114-116) disposed at a periphery side of the wiring substrate compared to the electric connection wiring and connected to the electric motor, and a plurality of semiconductor modules (120) each including a plurality of semiconductor elements (123b, 124b) and a resin mold (125) integrally sealing the plurality of semiconductor elements. The plurality of semiconductor modules are disposed on the electric connection wiring or at a position at the periphery side of the wiring substrate compared to the electric connection wiring and at a center side of the wiring substrate compared to the motor connection wirings, and electrodes of at least a part of the plurality of semiconductor modules are mounted on the electric connection wiring.

The present application relates to the field of magnetic material technology, and more specifically, to an aluminum-nickel-iron magnetic powder core and its preparation method and application. An aluminum-nickel-iron magnetic powder core comprises the following components in parts by weight: 30-85 parts of modified aluminum-nickel-iron magnetic powder, 11-55 parts of resin composition, 2-10 parts of diluent, 0.3-1.2 parts of curing agent and 0.5-2.5 parts of accelerator, wherein the resin composition comprises polyetherimide modified epoxy resin, phenolic resin and hyperbranched polyimide resin. An aluminum-nickel-iron magnetic powder core of the present application improves the problems of insufficient magnetic properties, high eddy current loss, poor high-frequency performance of existing magnetic powder cores, and difficulty in meeting some market demands, so that the obtained aluminum-nickel-iron magnetic powder core has high effective magnetic permeability, large magnetic flux density, and low eddy current loss, meeting the market demand for magnetic powder core performance.

A power conversion device includes: a first power circuit portion and a second power circuit portion each having a power semiconductor element and a plurality of conductor portions sandwiching the power semiconductor element and connected to an emitter and a collector of the power semiconductor element, respectively; and a flow path forming body accommodating the first and second power circuit portions and allowing a refrigerant to flow, the conductor portions on the emitter side of the first power circuit portion being arranged opposite to the conductor portions on the collector side of the second power circuit portion, and the conductor portions on the emitter side of the first power circuit portion and the conductor portions on the collector side of the second power circuit portion being connected by a plurality of electrically conductive fins in contact with the refrigerant.

The electrical connector (10) includes a pair of plates (20) having a first conductive plate (12) and a second conductive plate (14), each plate having a central portion (24) and two connecting lugs (32, 34). The connecting lugs of each plate extend longitudinally from opposite edges (28, 30) of the central portion and are laterally offset from each other. The first and second plates are stacked on top of each other, with the central portions overlapping and separated by a gap (36). The connecting lugs of the first and second plates on each of the opposite edge sides are laterally offset from each other. The electrical connector further includes an insulating structure comprising a sandwich of electrically insulating material accommodated in the gap (36) between the central portions of the first and second plates.

The invention discloses a power module and electronic equipment. The power module comprises a power chip; the driving integrated circuit is electrically connected with the power chip; the heat dissipation substrate is provided with a first surface and a second surface which are oppositely arranged, a first side and a second side which are opposite in the length direction of the heat dissipation substrate, and a third side close to the driving integrated circuit, the power chip is arranged on the first surface of the heat dissipation substrate, and the heat dissipation substrate comprises an insulating layer, a first conductive layer and a second conductive layer, the second conductive layer comprises a main body part and an extension part connected with the main body part, the extension part extends towards the outer side of the insulating layer, and the extension part is arranged on at least one of the first side, the second side and the third side; at least one core-pulling pinhole is formed in the side, opposite to the second face of the heat dissipation substrate, of the packaging resin, the projection, in the thickness direction of the packaging resin, of the core-pulling pinhole is partially overlapped with the corresponding extending part, and the core-pulling pinhole is located on the outer side of the insulating layer.

The invention discloses an intermediate layer power supply network wiring method and system. The method comprises the following steps: determining each grid of a connection layer; constructing a plurality of first connecting lines along the first direction and a plurality of second connecting lines along the second direction; combining the adjacent pins in the first direction and the second direction into a group of communicated pins in each grid; dividing each grid into a plurality of groups of grids; establishing a connection relationship between the first connecting lines and each group of grids, so that the pins in each group of grids are correspondingly connected with the first connecting lines or all the first connecting lines are distributed to the corresponding grids; establishing a connection relationship between the second connecting lines and each group of grids, so that the pins in each group of grids are correspondingly connected with the second connecting lines or all the second connecting lines are distributed to the corresponding grids; and performing wiring according to the pins or the grids connected with the first connecting lines and the second connecting lines respectively. According to the invention, the performance of the corresponding chip integration system can be improved.

The invention relates to an electronic device antenna with a narrow bezel display. An electronic device can be provided with a side wall and a conductive plate. Sections of the sidewalls can form radiating arms of the antenna. The display is mountable to the sidewall. The display can include a conductive frame and a flexible printed circuit. The flexible circuit can have a bend. The conductive foam is capable of shorting conductive traces on the flexible circuit to the conductive frame near the bend. A low injection pressure overmold (LIPO) can be molded over the flexible circuit, foam, and frame. Conductive springs can short the frame to the conductive plate. The spring can include a wider and / or thinner portion, which optionally includes one or more notches for reducing the inductance of the spring. The conductive plate, spring, frame, foam, and conductive trace can form part of an antenna ground for an antenna.

The present disclosure provides a thermal ablation catheter with a thermocouple, comprising: a thermocouple temperature measuring end, which is in a sandwich structure, including a first electrode, a second electrode and a sandwich weld, wherein the free ends of the first electrode and the second electrode face oppositely and are parallel to each other and close to each other, and are conductively connected through the sandwich weld; a liner, which is a hollow structure for accommodating a thermal ablation component, and the thermocouple temperature measuring end is arranged on the outer circumferential surface of the liner; a heating resistance wire, which is wound around the outer circumference of the liner in a helical shape; wherein the thermocouple temperature measuring end is arranged on the liner between two adjacent turns of the heating resistance wire, the outer surface of the thermocouple temperature measuring end and the outer surface of the heating resistance wire are on the same circumferential surface, the first electrode, the second electrode and the heating resistance wire are arranged in parallel, the thermocouple temperature measuring end is centrally symmetrical, and the first electrode and the adjacent thermal resistance wires, the second electrode and the adjacent thermal resistance wires are centrally symmetrical about the center point of the thermocouple temperature measuring end.

The invention discloses a photovoltaic direct current collection system, a control method and a storage medium. The system comprises photovoltaic group strings PV +, the photovoltaic group strings PV + are connected in parallel in pairs, are connected in parallel after passing through a hybrid solid-state switch, and are used as positive pole input of a DC / DC converter after passing through a switch contact of a direct current isolation switch; the photovoltaic group strings PV-and PV-are connected in parallel in pairs, pass through the switch, then are connected in parallel, and pass through the switch contact of the direct-current isolating switch to serve as the cathode input of the DC / DC converter; the DC-DC converter outputs a DC bus DC-BUS, and the insulation detection circuit is connected to the DC bus DC-BUS in parallel. And one path of PV + and PV-passes through the switch unit Kc and the diode full-bridge rectification unit and then is connected with the DC-BUS in parallel. The invention has the advantages of simple and compact structure, low cost, wide application range, good control effect and the like.

The utility model relates to a VGA male socket connector in the connector technical field, which comprises a hardware shell, a plastic main body and a hardware terminal, the surface of the plastic main body is provided with hardware, one end of the hardware terminal in the horizontal direction is connected with a conductor of a cylindrical structure, one end of the hardware terminal in the vertical direction is in a flat structure, and the other end of the hardware terminal in the vertical direction is connected with the plastic main body. A groove for reducing the surface volume of the hardware terminal is formed in one end of the hardware terminal, which is of a flat structure; the limiting structure is a convex point which is bulged towards one end; according to the utility model, two salient points are respectively stamped on two sides of the hardware shell of the connector through stamping, so that when the connector is assembled with an external mechanism, the distance between the control panel and the connector can be regulated and controlled through the heights of the salient points between the mechanism panel and the connector, that is, when the mechanism panel is locked with the connector, the control panel is locked with the connector through the salient points. And the panel is pressed by the salient points after being contacted with the salient points, so that the panel cannot move forwards any more, and the distance between the panel and the connector is accurately ensured.

The invention provides a terahertz chip, an assembly and a preparation method thereof, and belongs to the technical field of terahertz chip assembly. The GSG electrode comprises a first signal electrode, a second signal electrode, a first grounding electrode and a second grounding electrode. The first grounding electrode, the first signal electrode and the second grounding electrode which are sequentially arranged at the edge of the substrate at equal intervals are used for GSG probe testing, the size of the electrodes used for probe testing can be consistent with the size of the structure before improvement, and the consistency and accuracy of probe testing are kept. And extending the first signal electrode towards the edge of the substrate to form a second signal electrode, wherein the second signal electrode is used for bonding. Since the probe test position in the GSG electrode is separated from the bonding position, the size of the second signal electrode is not limited by the distance between the probes, and the size of the second signal electrode can be increased to match multi-wire bonding. The multiple bonding wires are connected in parallel, parasitic inductance is reduced after parallel connection, limitation on the length and height of the bonding wires is reduced, and the bonding process difficulty is reduced.

This utility model relates to the field of current transformer technology and discloses an environmentally friendly anti-interference current transformer, including two current transformer housings. Current transformer assemblies are disposed inside the two current transformer housings, and bases are installed on the bottom surfaces of both current transformer housings. This environmentally friendly anti-interference current transformer facilitates disassembly of the current transformer housings by setting a fixing plate on the upper surface of the housings and connecting them with bolts, while also using a snap-fit ​​mechanism between the two housings. This facilitates the recycling of the internal components. During use, the secondary winding coil is spirally and uniformly wound, reducing the distributed capacitance and inductance of the winding and enhancing the overall anti-interference capability. As the cable passes through the middle area of ​​the current transformer housing, it is guided by a limiting rope to be as close as possible to the center of the iron core, reducing the problem of uneven magnetic field distribution within the iron core caused by eccentricity and improving the anti-interference capability.

The invention relates to the technical field of PCB design, and discloses a PCB with an overclocking characteristic, the PCB comprises a bare board, a BGA array, a graphics card golden finger, a differential line and an RAM golden finger, the differential line is arranged on the upper surface of the bare board, the BGA array, the graphics card golden finger and the RAM golden finger are all installed on the top of the bare board, and the BGA array is arranged on the upper surface of the bare board. The RAM golden finger is communicated with the BGA array through a single-sided board, the BGA array is communicated with the graphics card golden finger through the differential lines, the differential lines are obliquely arranged relative to the BGA array, the differential lines are parallel to each other, and the BGA array is used for being connected with a CPU (Central Processing Unit); the graphics card golden finger accords with a high-speed communication protocol and is used for connecting a graphics card; and the RAM golden finger is used for connecting a memory bank. According to the invention, crosstalk can be reduced, skew effect of the glass fiber is reduced, and parasitic capacitance and inductance of the residual end of the via hole are reduced, so that time difference is reduced, and overclocking failure is avoided.

The utility model discloses a single-tooth punching sheet structure of a sectional type permanent magnet motor, a plurality of single-tooth punching sheets are stacked in sequence to form a single-tooth iron core, a plurality of single-tooth iron cores are assembled along the circumferential direction to form a stator iron core, each single-tooth punching sheet comprises a stator tooth and magnet yokes, the magnet yokes respectively protrude from the front end part of the stator tooth to two sides, and the magnet yokes are arranged on the stator tooth. And the free end of the magnet yoke is provided with a reinforcing part protruding towards the circle center direction of the stator iron core. According to the utility model, the two adjacent single-tooth punching sheets are correspondingly matched and spliced to form the reinforcing convex parts, so that the splicing contact area between the single-tooth punching sheets can be increased, and the stability of the spliced stator iron core is improved; the air gap magnetic resistance of the motor can be reduced, the inductance of the motor is reduced, and the electrical time constant is reduced, so that the response speed of the motor is improved; and moreover, the increased contact surface is also beneficial to dispersing over-concentrated magnetic flux density of the yoke part of the motor, reducing local heating of the motor and reducing the size of the motor. And meanwhile, the service life of the stator punching sheet processing die can be prolonged.

The present invention provides an air-spinning high-speed motor, comprising a rotating shaft and a stator, wherein a spinning cup is fixed at one end of the rotating shaft, and a thrust member for axially positioning the rotating shaft is provided at the other end; a radial magnetic suspension bearing and a hybrid magnetic suspension bearing composed of the radial magnetic suspension bearing and the axial magnetic suspension bearing are provided on the outer side of the rotating shaft; the radial magnetic suspension bearing and the hybrid magnetic suspension bearing support the rotating shaft between the electromagnets without contact. The present invention utilizes an active magnetic suspension bearing to support the air-spinning rotor without contact, so that the rotor can rotate at high speed, thereby effectively improving the quality of the spun yarn.

The motor controller comprises a circuit board, a plurality of power devices, a first copper bar and a second copper bar, the plurality of power devices are sequentially arranged in rows along a first direction, and each power device is provided with at least one pin, so that each power device is electrically connected with the circuit board through the pin on the power device; the first copper bar extends along a first direction and is arranged on the circuit board, the first copper bar is provided with a plurality of pins, and each pin is used for being electrically connected with a pin on each power device; the second copper bar is arranged on the circuit board in an extending mode in the first direction and is adjacent to the first copper bar, the second copper bar is provided with a plurality of pins, and all the pins are electrically connected with the circuit board. According to the utility model, the problems of unreasonable layout and unreasonable wiring of the power devices of the motor controller in the prior art are solved.

The embodiment of the utility model discloses a filter and vehicle-mounted equipment. The filter comprises a noise sensing module used for sensing a noise signal on a power line, and the noise sensing module and the power line are electrically isolated through a magnetic core assembly; and the signal generation module is electrically connected with the noise sensing module and is used for receiving and processing the noise signal, generating a compensation signal opposite to the noise signal in phase and injecting the compensation signal into the power line. Through the above mode, the embodiment of the utility model can effectively reduce electromagnetic interference, reduce the number of common-mode chokes or necessary common-mode chokes, so that the noise reduction performance of the filter is fully exerted, the hardware cost is reduced, and the size of the filter is greatly reduced.

The invention discloses a length self-sensing artificial muscle, and relates to an inductance type length sensor technology and an artificial muscle technology. A fluid-driven artificial muscle is seamlessly integrated with an inductance type length sensor, the artificial muscle is a fluid-driven elastic telescopic unit, and the inductance type length sensor is a wire winding which is wound outside the artificial muscle and is formed by connecting a plurality of groups of coils in series. The mutual inductance between the wire windings is reduced or increased along with the stretching of the artificial muscle, so that the inductance of the coil is monotonically reduced along with the increase of the length of the artificial muscle. The length of the artificial muscle can be detected in real time by measuring the inductance of the coil, and the resolution is up to the submillimeter level and is not influenced by factors such as load size and deformation speed. The length self-sensing artificial muscle provided by the scheme can be widely applied to various robot systems driven by the artificial muscle, such as an earthworm crawling imitating robot capable of body sensing, a rigid-flexible hybrid bionic arm capable of realizing accurate position control and interactive response, a complex humanoid robot system and the like.

The utility model discloses an integrated Pinfin laminated low-inductance power module, which relates to the technical field of inductance power modules and comprises an integrated insulating substrate, needle columns, insulating ceramics and the like are integrally formed by the integrated insulating substrate, the needle columns only carry out heat dissipation on the integrated insulating substrate, and the upper surface of the integrated insulating substrate is provided with a plurality of radiating fins. Metal islands are formed through insulating ceramics, different electrical function bases are achieved, and the upper surface of the integrated insulating substrate is connected with a chip. According to the integrated Pinfin laminated low-inductance power module, by using the independent copper-clad insulating substrate and the pin integrated insulating substrate, more space is provided for arrangement of chips and wires, extremely small inductance and a better current sharing condition are realized, and meanwhile, a more direct heat dissipation structure is formed by reducing layer structures, so that the heat dissipation efficiency is improved. And the production cost can be reduced.

The present invention relates to the technical field of power semiconductor modules, and proposes a low-inductance packaging structure of a power semiconductor module, comprising a substrate and a power semiconductor module unit arranged on the substrate, the power semiconductor module unit is used to form a dual-switch circuit structure capable of reducing inductance, the power semiconductor module unit comprises a plurality of lining plates arranged at intervals on the substrate, adjacent lining plates are connected by a first bonding wire, two connected lining plates are connected with a power terminal group extending out of an outer tube shell, the power terminal group comprises two sub-power terminals which are partially overlapped but not in contact with each other, and are used to generate electromagnetic coupling when the two sub-power terminals conduct currents in different directions to reduce inductance; a low-inductance packaging method of a power semiconductor module is also proposed, which is used to manufacture the low-inductance packaging structure of a power semiconductor module proposed by the present invention. The present invention has the advantages of high reliability, high power density and low inductance.