9results about How to "Reduce inductance" patented technology

The present application provides an electric working machine, and a method of assembling a drive unit for driving a motor of the electric working machine, one aspect of which relates to an electric working machine provided with a motor, a circuit substrate, a first semiconductor switch, a second semiconductor switch, a first conductive line, a second conductive line, and a solid metal member. The circuit substrate has a first circuit surface, a second circuit surface, and a through hole. The first semiconductor switch is mounted on the first circuit surface and has a first terminal. The second semiconductor switch is mounted on the second circuit surface and has a second terminal. The first conductive line is disposed on the first circuit surface and electrically connected to the first terminal. The second conductive line is disposed on the second circuit surface and electrically connected to the second terminal. The solid metal member is inserted into the through hole and electrically connected to the first conductive line and the second conductive line.

This utility model relates to the field of current transformer technology and discloses an environmentally friendly anti-interference current transformer, including two current transformer housings. Current transformer assemblies are disposed inside the two current transformer housings, and bases are installed on the bottom surfaces of both current transformer housings. This environmentally friendly anti-interference current transformer facilitates disassembly of the current transformer housings by setting a fixing plate on the upper surface of the housings and connecting them with bolts, while also using a snap-fit ​​mechanism between the two housings. This facilitates the recycling of the internal components. During use, the secondary winding coil is spirally and uniformly wound, reducing the distributed capacitance and inductance of the winding and enhancing the overall anti-interference capability. As the cable passes through the middle area of ​​the current transformer housing, it is guided by a limiting rope to be as close as possible to the center of the iron core, reducing the problem of uneven magnetic field distribution within the iron core caused by eccentricity and improving the anti-interference capability.

A semiconductor device having a connection mechanism capable of reducing inductance is provided. A capacitor has a case including a capacitor element, a first connection terminal, a second connection terminal, and a second insulating sheet provided between the first connection terminal and the second connection terminal, the first connection terminal, the second insulating sheet, and the second connection terminal extending outward from the case. A semiconductor module has a terminal stack portion in which a first power terminal, a first insulating sheet, and a second power terminal are overlaid in this order. The first power terminal has a first bonding region electrically connected to the first connection terminal, the second power terminal has a second bonding region electrically connected to the second connection terminal, and the first insulating sheet has a platform portion extending in a direction from the second bonding region toward the first bonding region in plan view.

The embodiment of the application provides a kind of power module electric connection component, power module and motor controller, belong to power electronics technical field.The electric connection component of the power module includes first electric conductor and second electric conductor, and at least two connecting parts and at least one accommodating part are included on the first electric conductor, the accommodating part is located between two adjacent connecting parts, the accommodating part is recessed towards the direction away from the connecting part, one end of each connecting part is used to be electrically connected with the power chip of power module, and the other end of the connecting part is used to be electrically connected with one of the positive electrode connecting end and the negative electrode connecting end of direct current power supply part;Second electric conductor is arranged on the accommodating part, and the second electric conductor is insulated from the accommodating part, one end of the second electric conductor is used to be electrically connected with the power chip, and the other end of the second electric conductor is used to be electrically connected with the other of the positive electrode connecting end and the negative electrode connecting end.The electric connection component of the power module of the application, by arranging the second electric conductor on the accommodating part, is conducive to reducing parasitic inductance.

This application discloses a hybrid interposer and a method for forming the same. The method includes: providing a glass interposer, the glass interposer including a plurality of discrete functional regions and a cut-out region located between adjacent functional regions, the glass interposer including opposing first and second surfaces; forming a first bonding layer on the first surface of the glass interposer; providing a plurality of silicon interposers, each silicon interposer including opposing third and fourth surfaces, the third surface having a second bonding layer; bonding at least one silicon interposer to each functional region of the glass interposer, such that the second bonding layer and the first bonding layer are mixed-bonded; and forming a molding compound covering the silicon interposers on the first surface of the glass interposer, the molding compound exposing the fourth surface of the silicon interposers. This method improves the size and interconnect density of the interposer and reduces the warpage of the interposer.

The application provides an isolated three-phase AC-DC multi-port single-stage converter, which can be used as an AC-DC multi-port access power router. The core of the converter is composed of three tap transformers, primary / secondary three-phase conversion bridges, inductors and bus capacitors, and the converter has two AC ports and two DC ports and supports bidirectional power transmission between the ports. The topology can adapt to multiple power conversion scenarios: a single-phase AC application can be adapted by deleting a group of components; the topology is converted into an isolated three-phase AC-DC bidirectional single-stage converter by removing the secondary AC inductor; and the topology becomes a unidirectional converter by replacing the secondary switch with a diode and adding a filter inductor. The conversion bridges on both sides of the converter are controlled by SPWM or SVM, and the driving pulses can be synchronized, staggered or phase-shifted, so that AC and DC voltage decoupling control can be achieved. The application adopts a single-stage conversion architecture, which is simple, efficient, cost-reducing, quantity-reducing, dynamic response-improving and reliability-improving, and the control strategy is mature and easy to realize digitally.

This utility model relates to the field of circuit equipment technology and discloses a busbar copper bus structure for improving parasitic inductance. It includes an improved busbar copper bus and a non-improved busbar copper bus. The improved busbar copper bus has a copper busbar substrate in the middle, a bent portion fixedly connected to the top of the substrate, a connecting portion fixedly connected to the top of the bent portion, and wiring extension plates fixedly connected to the lower sides of both sides of the substrate. A bent plate is fixedly connected to the other end of each wiring extension plate, and a wiring plate is fixedly connected to the other end of each bent plate. This busbar copper bus structure for improving parasitic inductance has a short distance of 17.5mm from the positive terminal of the positive busbar copper bus to the positive capacitor terminal, resulting in a shorter current path and better overall performance. It achieves the following technical effects: 1. Reduced parasitic inductance; 2. Improved dynamic response; 3. Optimized current sharing and thermal performance; 4. Suppression of electromagnetic interference (EMI); 5. Maximized capacitor efficiency.

The invention discloses a gallium nitride power device and a packaging method thereof. The packaging method comprises the steps of wafer pretreatment and chip packaging, wherein a copper-titanium-nickel-molybdenum metal layer is grown through electroplating / sputtering in pretreatment, a welding column is formed through etching, an air channel is reserved, and a single chip is obtained through scribing; the heat stress is relieved through the copper-titanium-nickel-molybdenum buffer layer, cavities are eliminated through the welding columns and the bottom partition design, the bonding cost is reduced through the copper connecting structure, meanwhile, the parasitic inductance can be reduced, and the heat dissipation efficiency is improved by combining the diamond cooling fins; finally, current uniformity improvement, reliability enhancement and cost optimization of gallium nitride device packaging are realized, and technical support is provided for large-scale industrial application.