The invention provides a multi-band composite high-integration TR
assembly. The multi-band composite high-integration TR
assembly comprises a shell, a front multi-layer board, a back multi-layer board, a C / X /
Ku band receiving and transmitting circuit, a C / X /
Ku band single receiving circuit and a
Ka band receiving and transmitting circuit, wherein the front multi-layer board and the back multi-layer board are connected in the shell, the C / X /
Ku band receiving and transmitting circuit is connected with the front multi-layer board, and the
Ka band receiving and transmitting circuit is connected with the back multi-layer board. The low-cost scheme design of an all-
solid-state
microwave multilayer board suitable for
batch production and testing is adopted, ports and
transmission line layout are reasonably designed, multi-band composite mode transmission is achieved in the form of the front face and the back face, a C / X / Ku-band transmitting circuit and an H-polarization receiving circuit are integrated on the front face, and the transmission efficiency is improved. A C / X / Ku
frequency band V polarization receiving circuit and a Ka
frequency band receiving and transmitting circuit are integrated on the reverse side, different functional circuits are respectively transmitted through a
microstrip line and a strip line through an interface circuit structure covering 1-40 GHz and an in-board
vertical transition structure, the isolation degree of different circuits is improved, mutual
crosstalk between different signals is avoided, and the transmission efficiency is improved. And the functions of high integration, high consistency, ultra
wide band,
numerical control phase shift,
numerical control attenuation and the like of the
assembly are realized.