This invention relates to the field of
precious metal special material preparation and
processing technology, and discloses a composite special gold wire suitable for high-temperature and high-density packaging and its preparation method. The gold wire contains the following components by weight percentage: 0.5% to 1% Pd, 0.05% to 0.1% Al, 0.005% to 0.015% Ga or Ge, 0.001% to 0.005% La, Ce, Yb or Sm, with the balance being pure gold. The gold wire is coated with a layer of thermosetting resin by impregnation and baking, and an inorganic phase layer mainly composed of
silicon dioxide is coated on the thermosetting resin by
electrophoretic deposition. This invention achieves a strong bond between the
silicon dioxide inorganic phase layer and the gold wire by
coating the gold wire with a thermosetting resin layer, making it less prone to detachment. Furthermore, by optimizing the core material composition, the resulting composite special gold wire exhibits superior long-term reliability when bonded to aluminum pad electronic components under high-temperature and complex service environments compared to conventional gold wires. Moreover, the wire arc maintains excellent rigidity in multi-pin, 3D stacked packaging environments, reducing short-circuit failures caused by physical contact or arc
discharge between adjacent gold wires.