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40598results about How to "Improve robustness" patented technology

Enterprise management system

A Managed Site (10), a logical network entity, is composed of a number of Sub Sites (20) in a one to many relationship. A Sub Site (20) is a logical component, which is composed of a number of Engines (30). Nodes (40) similarly relates to their Engine (30) in a many to one relationship. A Node (40) is a collection of Managed Elements (ME's) (50) (while being an ME (50) itself), which represent network state information. The subsite (20) consists of the engine (30) connected to server nodes (40). One or more clients (110) are connected to the management engine (30) and access management engine (30) information relating to managed elements (50) including nodes (40). The connected manager engines may communicate with one another so that, for example, in the event of a failure, one of the manager engines remaining on line commences monitoring of manage elements assigned to the failed manager engine. Upon accessing the manager engine (30), the client interface displays relationships among managed elements (50) using meaningful connectors and tree-like structures. In addition to basic managed element state monitoring functionality, the manager engine (30) provides a variety of automated tasks ensuring the health of the network and optimal failure correction in the event of a problem. For example, the manager engine (30) performs root cause analysis utilizing an algorithm tracing through manged element (50) relationships and indicating the source of the failure.
Owner:MICROSOFT TECH LICENSING LLC

High density integrated circuit packaging with chip stacking and via interconnections

Chip stacks with decreased conductor length and improved noise immunity are formed by laser drilling of individual chips, such as memory chips, preferably near but within the periphery thereof, and forming conductors therethrough, preferably by metallization or filling with conductive paste which may be stabilized by transient liquid phase (TLP) processes and preferably with or during metallization of conductive pads, possibly including connector patterns on both sides of at least some of the chips in the stack. At least some of the chips in the stack then have electrical and mechanical connections made therebetween, preferably with electroplated solder preforms consistent with TLP processes. The connections may be contained by a layer of resilient material surrounding the connections and which may be formed in-situ. High density circuit packages thus obtained may be mounted on a carrier by surface mount techniques or separable connectors such as a plug and socket arrangement. The carrier may be of the same material as the chip stacks to match coefficients of thermal expansion. High-density circuit packages may also be in the form of removable memory modules in generally planar or prism shaped form similar to a pen or as a thermal conduction module.
Owner:INT BUSINESS MASCH CORP

Method and system for wireless communication networks using relaying

InactiveUS20050014464A1Easy to adjustCharacterization is accurate and reliableSite diversityTransmission path divisionRadio channelTransmitter
The present invention relates to wireless networks using relaying. In the method according to the present invention of performing communication in a two-hop wireless communication network, a transmitter 210, a receiver 220 and at least one relay station 215 are engaged in a communication session. The relay station 215 forwards signals from a first link between the transmitter 210 and the relay station 215 to a second link between the relay stations 215 and the receiver 220. The forwarding performed by the at least one relay station 215 is adapted as a response to estimated radio channel characteristics of at least the first link. Preferably the forwarding is adapted as a response to estimated radio channel characteristics of both the first and second link.
Owner:TELEFON AB LM ERICSSON (PUBL)

High density integrated circuit packaging with chip stacking and via interconnections

Chip stacks with decreased conductor length and improved noise immunity are formed by laser drilling of individual chips, such as memory chips, preferably near but within the periphery thereof, and forming conductors therethrough, preferably by metallization or filling with conductive paste which may be stabilized by transient liquid phase (TLP) processes and preferably with or during metallization of conductive pads, possibly including connector patterns on both sides of at least some of the chips in the stack. At least some of the chips in the stack then have electrical and mechanical connections made therebetween, preferably with electroplated solder preforms consistent with TLP processes. The connections may be contained by a layer of resilient material surrounding the connections and which may be formed in-situ. High density circuit packages thus obtained may be mounted on a carrier by surface mount techniques or separable connectors such as a plug and socket arrangement. The carrier may be of the same material as the chip stacks to match coefficients of thermal expansion. High-density circuit packages may also be in the form of removable memory modules in generally planar or prism shaped form similar to a pen or as a thermal conduction module.
Owner:IBM CORP

Integrated use of model-based metrology and a process model

Methods and systems for performing measurements based on a measurement model integrating a metrology-based target model with a process-based target model. Systems employing integrated measurement models may be used to measure structural and material characteristics of one or more targets and may also be used to measure process parameter values. A process-based target model may be integrated with a metrology-based target model in a number of different ways. In some examples, constraints on ranges of values of metrology model parameters are determined based on the process-based target model. In some other examples, the integrated measurement model includes the metrology-based target model constrained by the process-based target model. In some other examples, one or more metrology model parameters are expressed in terms of other metrology model parameters based on the process model. In some other examples, process parameters are substituted into the metrology model.
Owner:KLA TENCOR TECH CORP

End-to-end identification method for scene text with random shape

The invention discloses an end-to-end identification method for a scene text with a random shape. The method comprises the steps of extracting a text characteristic through a characteristic pyramid network for generating a candidate text box by an area extracting network; adjusting the position of the candidate text box through quick area classification regression branch for obtaining more accurate position of a text bounding box; inputting the position information of the bounding box into a dividing branch, obtaining a predicated character sequence through a pixel voting algorithm; and finally processing the predicated character sequence through a weighted editing distance algorithm, finding out a most matched word of the predicated character sequence in a given dictionary, thereby obtaining a final text identification result. According to the method of the invention, the scene texts with the random shape can be simultaneously detected and identified, wherein the scene texts comprisehorizontal text, multidirectional text and curved text. Furthermore end-to-end training can be completely performed. Compared with prior art, the identification method according to the invention has advantages of obtaining advantageous effects in accuracy and versatility, and realizing high application value.
Owner:HUAZHONG UNIV OF SCI & TECH
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