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2575results about How to "Improve alignment accuracy" patented technology

Novel wavelength division multiplexing demultiplexing optical assembly applied to high-speed parallel long-distance transmission

The invention relates to a novel wavelength division multiplexing demultiplexing optical assembly applied to high-speed parallel long-distance transmission. The output end of a laser group is sequentially provided with a lens group, an optical regulating plate group, a lower layer silicon lens array and a lower layer optical filter group, wherein the output end of the lower layer optical filter group is provided with a lower layer free space wavelength division multiplexing device, the output end of the lower layer free space wavelength division multiplexing device is provided with an optical isolator, the output end of the optical isolator is provided with a focusing lens, the output end of the focusing lens is connected with an input optical fiber, an output optical fiber is connected with a collimating lens, the output end of the collimating lens is connected with a prism, the output end of the prism is provided with an upper layer free space wavelength division multiplexing device, the output end of the upper layer free space wavelength division multiplexing device is provided with the upper layer optical filter group, the output end of the upper layer optical fiber group is provided with an upper layer silicon lens array, and the output end of the upper layer silicon lens array is provided with a detector group. The optical signal multiplexing and demultiplexing is realized by using the optical filter array structure.
Owner:INNOLIGHT TECHNOLOGY (SUZHOU) LTD

Method and structure for aligning mechanical based device to integrated circuits

A method for bonding substrates together. The method includes providing a first substrate comprising a first surface. The first substrate comprises a plurality of first chips thereon. Each of the chips has integrated circuit devices. The first substrate includes a first alignment mark on the first substrate and a second alignment mark on the first substrate. The method also includes providing a second substrate comprising a silicon bearing material and second surface. The second substrate comprising a plurality of second chips thereon. Each of the chips comprises a plurality of mechanical structures. The second substrate has a first silicon based pattern on the second substrate and a second silicon based pattern on the second substrate. The method includes moving the first alignment mark of the first substrate to the first silicon based pattern on the second substrate and aligning the second alignment mark of the first substrate to the second silicon based pattern on the second substrate. A portion of at least one of the first substrate or the second substrate is illuminated with electromagnetic radiation. The method includes detecting a portion of the electromagnetic radiation and using the detected portion of the electromagnetic radiation to align the first substrate with the second substrate. The method also includes coupling the first substrate with the second substrate by contacting the first surface with the second surface and bonding the first surface with the second surface.
Owner:MIRADIA INC

Alignment method for attaching chip or flexible circuit board to circuit substrate

The invention discloses an alignment method for attaching a chip or a flexible circuit board to a circuit substrate, which is characterized by comprising the following steps of: designing two identification points on the circuit substrate in advance; after the circuit substrate is transferred to a framing table board and positioned, shooting images of the two identification points by using a camera, converting the images of the two identification points into position coordinates of an image coordinate system by using an image processing system; converting image coordinates of the two identification points into mechanical coordinate values of a mechanical coordinate system by using a relationship between the image coordinate system and the mechanical coordinate system; finding out an X-directional offset, a Y-directional offset and a deflection angle around a Z axis between the actual positions of the two identification points and a target position through calculation; and finally adjusting the two identification points to the target position by using an X-directional movement mechanism, a Y-directional movement mechanism and a rotating mechanism around the Z axis, so that the chip or the flexible circuit board is aligned with a conducting terminal of the circuit substrate. By the invention, the alignment precision of a chip on glass (COG), a film on glass (FOG) and a chip on film (COF) is greatly improved.
Owner:苏州凯蒂亚半导体制造设备有限公司

Optical fiber strapdown inertial navigation double-shaft rotation modulation method and double-shaft rotation mechanism

ActiveCN102749079AModulation errorAccurate Motion ParametersNavigation by speed/acceleration measurementsDual axisContinuous rotation
The present invention belongs to the technical field of inertial navigation, and specifically relates to an optical fiber strapdown inertial navigation double-shaft rotation modulation method and a double-shaft rotation mechanism. A purpose of the present invention is to improve alignment accuracy of an inertial navigation system and navigation accuracy during long-distance navigation. The method comprises: S1, establishing a double-shaft rotation mechanism, such that any two axial directions of an inertial measurement unit are parallel to two rotation shafts of the double-shaft rotation mechanism, and rotations of the rotation shafts are continuous; S2, controlling rotation of the rotation mechanism, and carrying out initial alignment to obtain an error of an initial attitude matrix; and S3, carrying out concurrent rotation on the two shafts of the rotation mechanism, and carrying out inertial navigation to obtain an attitude matrix in a transporter coordinate system. According to the present invention, with establishment of the continuously-rotating double-shaft rotation mechanism, an error of an inertial device can be modulated well, and navigation accuracy can be improved; with double shaft rotation modulation and attitude matrix change, an attitude matrix in a transporter coordinate system can be obtained so as to obtain accurate transporter movement parameters.
Owner:BEIJING AUTOMATION CONTROL EQUIP INST
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