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Ultrasonic straight-blade cutter wear test equipment and method
ActiveCN119437970Aavoid cumbersomeComprehensive technical supportInvestigating abrasion/wear resistanceInvestigating machinabilityReciprocating motionUltrasonic machining
The invention provides an ultrasonic straight-blade cutter wear test device and method, and aims to simulate and research a wear evolution rule of a cutter in ultrasonic machining. The ultrasonic straight-blade cutter wear test equipment comprises a cutting system, a positioning system, a holding system, a cutter system and a test system. The cutting system outputs linear reciprocating motion to simulate a low-frequency contact period of a hole grid and a cutter; the positioning system achieves accurate tool setting, and it is ensured that a tool is just in contact with a sample piece; the holding system is used for fixing and tensioning the sample piece and maintaining a stable cutting condition; the cutter system applies high-frequency vibration to the ultrasonic straight-edge cutter to simulate a high-frequency vibration period in actual ultrasonic machining; the testing system monitors the contact condition of the cutter and the sample piece in real time and records the abrasion behavior. According to the ultrasonic straight-blade cutter wear test equipment, by simulating the superposition effect of a low-frequency contact period and a high-frequency vibration period, the cutter wear rule in an ultrasonic machining environment is truly revealed, and powerful technical support is provided for prolonging the service life of a cutter and improving the performance of the cutter.
Owner:TSINGHUA SHENZHEN INTERNATIONAL GRADUATE SCHOOL
Medical image diagnosis report automatic generation method based on cross-modal global feature fusion Transform
PendingCN119274734AImprove alignment accuracyreduce overheadBiological modelsMedical imagesEffective solutionRadiology
The invention provides a method for automatically generating a medical image diagnosis report based on cross-modal global feature fusion Transformer, and relates to the technical field of image generation. Global feature extraction of a medical image is realized by introducing a sliding window encoder SWE and a grid circulation network MRN; meanwhile, by fusing a cross-modal attention mechanism FMCA and a fusion embedding layer FE, the alignment precision of visual features and text features is remarkably improved, a classification value taking strategy is provided for an initial classification threshold according to a screening index and a threshold division coefficient, and an adjusted classification threshold is formed according to the classification value taking strategy, so that the classification accuracy of the visual features and the text features is improved. The adjusted classification threshold is used for performing grouping setting on the medical images and the diagnosis report texts in the serial number set to form screened medical image and report text subsets; according to the innovative method, the recognition capability of the model on complex lesions is enhanced, and an effective solution is provided for medical image diagnosis automation.
Owner:CHINA WEST NORMAL UNIVERSITY
Automatic tipping paper printing control method based on image detection
PendingCN119610879AImprove alignment accuracyquality improvementPrinting press partsEvaluation resultAutomatic control
The invention discloses an automatic control method for tipping paper printing based on image detection, and relates to the technical field of tipping paper printing, and the method specifically comprises the following steps: obtaining surface feature information of each sub-region in a wrinkling region in a tipping paper printing process in real time, and analyzing the surface feature information after obtaining, respectively generating a light intensity anomaly index and a tension instability index of each sub-region; and constructing a wrinkling influence evaluation model for the light intensity anomaly index and the tension instability index of each generated sub-region, respectively generating a comprehensive evaluation coefficient of each sub-region, performing analysis after generation, and evaluating the influence degree of each sub-region in the wrinkling region on the generated printing alignment parameter. And dividing each sub-region in the wrinkling region into a non-influence region, a low-influence region and a high-influence region according to an evaluation result. According to the invention, the problem of insufficient characteristic identification and evaluation of the wrinkling area is solved, and intelligent improvement of printing alignment precision and finished product quality is realized.
Owner:QUJING KIRIN FUPAI PRINTING
Wafer bonding device and wafer bonding method
PendingCN119673815AImproved structure is simplereduce volumeSemiconductor/solid-state device testing/measurementSemiconductor/solid-state device manufacturingStructural engineeringWafer bonding
The invention provides a wafer bonding device and a wafer bonding method, and relates to the technical field of semiconductor processing. The wafer bonding device comprises a carrying seat, a driving structure arranged on the carrying seat, and a target chuck and a bearing chuck which are arranged along the Z direction, at least one of the target chuck and the bearing chuck is in transmission connection with the driving structure, and the driving structure is configured to be capable of driving the target chuck and the bearing chuck to relatively move along the X-Y direction and the Z direction; a plurality of notches are formed in the edge of the target chuck; the carrying base is provided with a plurality of visual systems, the visual systems are located on the side, away from the bearing chuck, of the target chuck, the axial direction of the visual systems is consistent with the Z direction, the visual systems correspond to the notches one to one, and the visual systems are configured to shoot images, corresponding to the notches, of the wafers loaded on the target chuck and the bearing chuck. The wafer bonding device is good in wafer bonding quality, high in yield, small in size and small in occupied space.
Owner:BEIJING U PRECISION TECH
Marine target detection method and system based on progressive light thunder information deep fusion
PendingCN119493112AImprove robustnessimprove accuracyCharacter and pattern recognitionNeural learning methodsPaired DataPoint cloud
The invention discloses a marine target detection method and system based on progressive light thunder information deep fusion, and the method is realized based on an X-band radar and a visible light camera, and the method comprises the steps: receiving a radar echo signal and a visible light visual image of a to-be-detected marine target, and forming a plurality of paired data; preprocessing the radar echo signal to obtain radar echo data after matched filtering, and obtaining radar point cloud data through a constant false alarm algorithm; carrying out nonlinear modal calibration on the preprocessed radar echo signal and radar point cloud data to obtain a radar pseudo image, and carrying out weighted addition on the radar pseudo image and a visible light visual image to carry out first-stage fusion; inputting the paired radar pseudo image, visible light visual image and weighted fusion image into a pre-trained target detection model to obtain the category and position information of the marine target contained in the to-be-detected area; the target detection model adopts a two-stage fusion strategy and combines a gating attention mechanism to realize deep fusion of light thunder information and improve the detection precision.
Owner:NANHAI RES STATION OF INST OF ACOUSTICS CHINESE ACADEMY OF SCI
Mouth shape generation method and device for voice driving
ActiveCN119252275AImprove alignment accuracyimprove accuracySpeech analysisBiological modelsImaging processingImage resolution
The invention provides a mouth shape generation method and device for voice driving, and relates to the technical field of natural language processing. The method comprises the following steps: based on an ffmpeg tool, carrying out image processing according to original video data to obtain spliced frame image data and facial feature points; according to the original audio data, performing feature extraction through a deep audio feature extractor to obtain audio features; performing feature fusion through an audio-video sequence feature fusion device to obtain fusion features; performing video generation through a lip action generator according to the facial feature points and the fusion features to obtain synthesized video data; optimizing a lip action generator according to the original video data and the synthesized video data; and performing video generation based on the depth audio feature extractor, the audio-video sequence feature fusion device and the optimized lip action generator to obtain target synthesized video data. The invention relates to a mouth shape generation method aiming at voice driving, which is high in video resolution and sufficient in facial texture detail reservation.
Owner:BEIJING LANGUAGE AND CULTURE UNIVERSITY
Rigid-flex printed circuit board and manufacturing method thereof
PendingCN119450912Aprevent leakageavoid scratchesPrinted circuit assemblingPrinted circuits structural associationsSilicone tapeMechanical engineering
The invention relates to a rigid-flex board and a manufacturing method thereof. A first covering film and a second covering film are respectively attached to the upper surface and the lower surface of a preset flexible area of a flexible board; a first flexible through window is formed in the position of the first prepreg in the preset flexible area, and a second flexible through window is formed in the position of the second prepreg in the preset flexible area; a first adhesive tape is pre-attached to the first rigid plate, a second adhesive tape is pre-attached to the second rigid plate, and the first adhesive tape and the second adhesive tape are milled; and sequentially laminating the first rigid plate, the first adhesive tape, the first prepreg, the first covering film, the flexible plate, the second covering film, the second prepreg, the second adhesive tape and the second rigid plate, arranging the first adhesive tape in the first flexible through window, arranging the second adhesive tape in the second flexible through window, and laminating to obtain the rigid-flexible combined plate. Compared with the prior art, the rigid-flex printed circuit board can be prevented from being attacked by liquid medicine and kept intact, the manufacturing reliability and the production efficiency of the rigid-flex printed circuit board are improved, and the production cost is reduced.
Owner:SHANGHAI FAST PCB CIRCUIT TECH CORP LTD
Mask assembly, evaporation equipment and evaporation method
PendingCN119433434Areduce distortionImprove alignment accuracyVacuum evaporation coatingSputtering coatingBearing surfaceMechanical engineering
The invention discloses a mask assembly, evaporation equipment and an evaporation method, the application number is CN202310335049.1, the application date is a divisional application of March 30, 2023, and the invention relates to the mask assembly, the evaporation equipment and the evaporation method, the mask assembly comprises at least one mask frame and a mask sheet arranged on the bearing surface of the mask frame; the mask frame comprises a mask frame and at least one support beam located in a surrounding area of the mask frame; and the bearing surface of the supporting beam is flush with the bearing surface of the mask frame. The problem that the mask sheet deforms due to gravity can be reduced, the method is suitable for mask sheets of various sizes, the alignment accuracy of the target substrate is improved, and the evaporation effect is improved.
Owner:JIHUA LAB
Bearing table, alignment method, equipment, storage medium and program product
PendingCN119650475AImprove processing qualityImprove alignment accuracySemiconductor/solid-state device manufacturingComputer hardwareWafer
The embodiment of the invention provides a bearing table, an alignment method and device, a storage medium and a program product. The detector is arranged above the carrying table and is used for acquiring multiple pieces of edge position data of a wafer relative to a first preset position of the carrying table; the processor is electrically connected with the detector and used for determining the position deviation between the second preset position and the first preset position of the wafer according to the multiple pieces of edge position data and generating an adjusting signal according to the position deviation, and the adjusting signal comprises a voltage value corresponding to the position deviation; and the adjusting assembly is connected with the carrying table, is electrically connected with the processor, bears the wafer in the adjusting process, and is used for generating a driving force for adjusting the pose of the wafer relative to the carrying table according to the voltage value contained in the adjusting signal. By adopting the technical scheme, the alignment precision between the wafer and the bearing table can be improved.
Owner:ZHEJIANG ICSPROUT SEMICONDUCTOR CO LTD
Efficient plugging type micro-connection structure system of multi-core optical fiber and connection method thereof
PendingCN119575563AImprove efficiencyHigh precisionCoupling light guidesOptical fiber connectorMaterials science
The invention relates to the technical field of multi-core optical fiber connection, and provides a multi-core optical fiber high-efficiency plugging type micro-connection structure system and a connection method thereof.The system comprises a multi-core optical fiber connector body, an optical fiber plugging terminal, an optical fiber alignment auxiliary terminal and an optical fiber dynamic correction terminal; the multi-core optical fiber connector body is used for being connected with an optical fiber core of a multi-core optical fiber; the optical fiber plugging and unplugging terminal is used for realizing plugging and unplugging operation of the multi-core optical fiber connector body and the butt joint seat and simultaneously realizing mechanical alignment of the multi-core optical fiber connector body and the butt joint seat; the optical fiber alignment auxiliary terminal is used for assisting the multi-core optical fiber to realize micron-order alignment in the connection process through positioning and dynamic adjustment; the optical fiber dynamic correction terminal is used for correcting optical fiber connection offset caused by temperature change, stress and manufacturing errors in real time and maintaining the stability of the system. The method has the effect of improving the connection quality of the multi-core optical fiber.
Owner:ZHONGSHAN MEISU PHOTOELECTRIC TECH CO LTD
Stamping equipment for automobile engine oil pan production
ActiveCN121972582Aavoid burnsReduce cumbersome operationsMetal-working feeding devicesShaping safety devicesIndustrial engineeringMotor oil
The invention provides stamping equipment for automobile engine oil pan production, and belongs to the technical field of oil pan stamping equipment. Which comprises a stamping equipment body and is characterized in that a lower die and an upper die are installed on the stamping equipment body, a first supporting frame is installed on one side of the stamping equipment body, and a second supporting frame is installed on the other side of the stamping equipment body; an automobile oil pan material plate is placed on the top of the first supporting frame. By arranging the auxiliary feeding mechanism and the auxiliary discharging mechanism, the auxiliary feeding mechanism can be utilized, workers do not need to make direct contact with an automobile oil pan material plate, the automobile oil pan material plate can be rapidly and stably transferred to the position between the lower die and the upper die, and accurate alignment can be achieved after transferring, and the automobile oil pan material plate can be reliably placed on the top of the lower die; and compared with a traditional manual handheld plate feeding mode, the feeding device is safer and more reliable.
Owner:DALIAN KWD INNOVATION AUTOMOTIVE PARTS LTD
Connector terminal automatic assembling device and assembling method thereof
ActiveCN119651310AThe conveying structure is stableImprove stabilityContact member assembly/disassemblyStructural engineeringBar pressing
The invention discloses a connector terminal automatic assembling device and an assembling method thereof, and belongs to the technical field of connector production. An automatic connector terminal assembling device comprises a terminal installation assembly, and the terminal installation assembly is matched with the horizontal position of a positioning hole used for installing a terminal in a connector body. The conveying assembly is used for conveying the connector body; the positioning assembly is arranged above the conveying assembly and is used for positioning the connector body at the moment when the terminal is installed; the connector body conveying structure provided by the invention is stable, the alignment precision of the terminal and the connector body is high, and the terminal assembling precision is improved; the connector body is limited and pressed, so that the acting force of the pressing rod can be kept stable, the connector body is pressed at the moment when the terminal is mounted in the connector body, the assembly precision is ensured, and the reject ratio is reduced; air flow can be triggered, dust blowing treatment is carried out, and the assembling quality of the connector is guaranteed.
Owner:DONGGUAN YANZHAN AUTOMATION TECH CO LTD
Quick alignment method for moving base of strapdown inertial reference system of unmanned pod
ActiveCN119666028Alower requirementImprove alignment accuracyInternal combustion piston enginesSatellite radio beaconingKaiman filterSingular value decomposition
The invention belongs to the technical field of navigation, and discloses an unmanned pod strapdown inertial reference system moving base rapid alignment method which is suitable for rapid initial alignment of a strapdown inertial reference system with GNSS external observation information in the moving process. A more accurate initial attitude is obtained through an optimization algorithm based on singular value decomposition, and the error convergence time is shortened; through a backtracking alignment mode, data of a coarse alignment stage of the strapdown inertial reference system is used for a fine alignment stage, the alignment precision can be improved within limited alignment time, the process can be completed only by storing a small amount of data, the requirement for a computing platform is reduced, and meanwhile, the accuracy of alignment is improved. By designing the invariant Kalman filter, the problem of inaccurate error estimation caused by high system instability under a dynamic condition is solved, and the method has important engineering practice significance.
Owner:NAT UNIV OF DEFENSE TECH
Repeated overlay alignment method for sensor chip projection lithography machine
ActiveCN119292016AImprove alignment accuracyeasy to handleImage enhancementImage analysisEngineeringExposure
The invention provides a multi-overlay alignment method for a sensing chip projection photoetching machine, which belongs to the field of photoetching and comprises a primary overlay alignment algorithm and a secondary overlay alignment algorithm. The primary overlay alignment algorithm calculates the position coordinates of the diaphragm in the image and the deviation values in the X direction and the Y direction by recognizing the outer contour of the diaphragm, and is used for determining the position of the diaphragm through primary exposure. And the secondary overlay alignment algorithm is used for accurately calculating the center coordinate of the diaphragm and the deviation values of the X direction, the Y direction and the rotation angle (R direction) by identifying the left and right positioning marks in the pattern aiming at the diaphragm with a layer of pattern. Through the deviation values, the air bearing table, the workpiece table and the mask table of the photoetching machine can be compensated in real time, so that accurate exposure of the diaphragm is ensured. According to the alignment method disclosed by the invention, the alignment precision of each layer of pattern in the manufacturing process of the sensing chip is remarkably improved, and defects caused by alignment errors are reduced.
Owner:INST OF OPTICS & ELECTRONICS CHINESE ACAD OF SCI
Ironing equipment
ActiveCN222294504Uavoid burnsreduce spreadIroning apparatusTextiles and paperMechanical engineeringWater tanks
Owner:深圳市腾奔科技有限公司
Cavity package carrier and processing method thereof
PendingCN119212258AImprove flatnessImprove alignment accuracyElectrical connection printed elementsMultilayer circuit manufactureMechanical engineeringLaser Powder Bed Fusion
The processing method comprises the following steps: carrying out etching, lamination and UV cutting on a double-sided copper-clad plate A to prepare a first part of which the warping degree is a non-zero value and which is provided with a first copper layer and a through groove; performing single-sided circuit pattern manufacturing on the double-sided copper-clad plate B to obtain a second part provided with an inner-layer circuit; the first component and the second component are connected through a bonding layer in a pressing mode, an intermediate plate B with a blind groove is obtained, and the blind groove is formed by a through groove and a second component which seals one port of the through groove in a partially-enclosed mode; and the bonding layer on the bottom of the blind groove is removed through laser, interlayer conduction, blind groove metallization, outer layer circuit manufacturing and outer layer solder mask operation are carried out on the intermediate plate B, and the Cavity packaging carrier plate is obtained. According to the processing method, the alignment precision of the holes, the grooves and the circuit patterns in the packaging carrier plate can be improved, and the defect that a sandwich structure is prone to deviation in the assembling process is overcome; the alignment degree of the obtained Cavity packaging carrier plate is high, and the packaging test difficulty of a circuit board product is reduced.
Owner:JIANGSU PROVISION ELECTRONICS CO LTD
Wafer bonding jig and bonding equipment
ActiveCN222581143USimple structureEasy to driveSemiconductor/solid-state device manufacturingWafer bondingMechanical engineering
The utility model relates to the technical field of semiconductor manufacturing, and provides a wafer bonding jig and bonding equipment, and the wafer bonding jig comprises a jig body and an isolation unit. The jig body is provided with a bearing area; the isolation unit comprises an isolation base and an isolation piece; the isolation piece is arranged on the isolation base, the isolation base is movably arranged on the isolation base in the direction parallel to the bearing area, the isolation base is provided with a matching face, and the matching face faces the bearing area in the direction parallel to the bearing area. According to the utility model, the structure of the isolation unit is improved, so that the pressing head is linked with the isolation piece in the downward pressing process, and the downward pressing process of the pressing head and the pulling-out process of the isolation piece are kept synchronous.
Owner:SHANGHAI OPTICAL KEY SEMICON EQUIP CO LTD
Auxiliary device for replacing dotted line knife
The utility model discloses an auxiliary device for replacing a dotted line knife, which comprises a crease box, a dotted line knife and a dotted line knife driving device are arranged in the crease box, a dotted line knife positioning mechanism is arranged above the dotted line knife, a gear locking mechanism is arranged above the dotted line knife driving device, and the gear locking mechanism is connected with the dotted line knife positioning mechanism. The dotted line knife positioning mechanism comprises a first seat body and a horizontal adjusting plate, the horizontal adjusting plate is arranged on the first seat body, and two positioning blocks are movably mounted at the bottom of the horizontal adjusting plate; the gear locking mechanism comprises a second seat body and a gear locking plate, and the gear locking plate is installed on the second seat body. The device can record the position of the dotted line cutter before replacement, and assists in positioning the new dotted line cutter when the new dotted line cutter is replaced, so that the new dotted line cutter is consistent with the old dotted line cutter in position after being mounted, and the replacement efficiency is effectively improved.
Owner:CHINA TOBACCO HENAN IND CO LTD
Wafer alignment device and wafer bonding method
PendingCN119275160AHigh precisionavoid misalignmentSemiconductor/solid-state device manufacturingLight beamEngineering
The invention discloses a wafer alignment device and a bonding method. The wafer alignment device comprises: an infrared light source for providing an infrared beam for aligning a first wafer and a second wafer; the confocal optical system is located on one side of the first wafer and used for transmitting the infrared light beams to the second surface of the first wafer and the first surface, opposite to the first surface, of the second wafer through the first wafer so as to obtain positioning of a first identifier on the second surface and positioning of a second identifier on the first surface respectively; and the movement mechanism is respectively connected with the first wafer and the second wafer, and moves the position of the first wafer and / or the second wafer based on the positioning of the first identifier and the second identifier, so that the first identifier and the second identifier are vertically aligned by means of an infrared beam. According to the invention, alignment errors caused by optical axis deviation of the two sets of optical systems and movement errors caused by avoidance of the movement platform in order to obtain the wafer identifier on the other side can be avoided, so that the alignment precision is improved, and the wafer bonding precision is further improved.
Owner:PIOTECH (HAINING) SEMICON EQUIP CO LTD
Welding equipment for cylindrical battery
ActiveCN222626688UImprove alignment accuracyquality improvementWelding/cutting auxillary devicesAuxillary welding devicesElectrical batteryBattery cell
The utility model relates to the technical field of batteries, in particular to welding equipment for a cylindrical battery, the welding equipment comprises a supporting cup, a supporting clamp, a sleeving tower and a welding tower, a first bearing part is arranged in the supporting cup, and the first bearing part is used for bearing a battery cell; an aligning part and a second bearing part are arranged on the supporting clamp, the second bearing part is used for bearing a flow collecting disc, and the aligning part is used for aligning when the supporting cup is sleeved with the aligning part; the sleeving tower is used for sleeving the supporting cup, the battery cell and the supporting clamp to form a middle assembly and outputting the middle assembly; the welding tower is used for receiving the middle assembly and transferring the current collecting disc to the second bearing part, and the welding tower is used for welding the battery cell and the current collecting disc. And the alignment precision during welding of the battery cell and the collector plate can be improved.
Owner:CALB GROUP CO LTD
Multi-sensor data time synchronization error compensation method and device
ActiveCN121855600AImprove alignment accuracyImprove stabilitySynchronisation arrangementNavigation by speed/acceleration measurementsOriginal dataAdaptive optimization
The invention is suitable for the technical field of data processing, and particularly relates to a sensor data time synchronization error compensation method and device, and the method comprises the steps: obtaining the multi-sensor original data of a current frame, and extracting the multi-sensor feature data; obtaining an error estimation vector based on the error estimation network; performing error compensation on the multi-sensor original data to obtain multi-sensor compensation data; constructing a factor graph, and performing optimization solution on the factor graph to obtain a residual set; calculating a comprehensive quality score according to the residual set; according to the comprehensive quality score and the comprehensive quality scores of the first M frames, determining that a triggering condition is met, and triggering fine adjustment; and based on the multi-sensor original data, the multi-sensor feature data and the comprehensive quality score in the time window, performing fine adjustment on the model parameters of the error estimation network to obtain the error estimation network after fine adjustment. According to the method, more accurate compensation of time sequence errors and data distortion among multiple sensors is realized, and continuous self-adaptive optimization is realized.
Owner:RUIAN KEFENG ELECTRONICS
Multi-view video processing method and related device
ActiveCN119676484Aachieve alignmentAccurate alignment implementationSelective content distributionTimestampEngineering
The invention provides a multi-view video processing method and a related device. According to the method, feature recognition is carried out on audios collected from multiple visual angles, after the audios are aligned, display timestamp information is printed on each path of video, multiple video codes with different definitions are carried out, and transmission is carried out through a multicast protocol in the mode of the same or different IPs and different ports. And the live broadcast terminal obtains the corresponding live broadcast video stream according to the own playing capability, so that multi-view video decoding and synchronous playing are realized. The audio and picture synchronization problem of the multi-view video is solved through an audio synchronization technology based on feature recognition, multicast transmission, terminal capability matching and the like, and the requirements of various types of terminals with different capabilities for playing the multi-view video are met. The method is suitable for realizing multi-view video live broadcast through a multicast protocol, and provides a solution for a multicast service scene in the field of articulated naturality web.
Owner:E SURFING VISION TECHNOLOGY CO LTD
Multi-layer circuit board pressing method and multi-layer circuit board
PendingCN119317047AImprove production yieldImprove alignment accuracyMultilayer circuit manufactureConductive pattern layout detailsStructural engineeringMechanical engineering
The invention discloses a multilayer circuit board pressing method and a multilayer circuit board. The multilayer circuit board laminating method comprises the following steps: providing a first circuit board; one side surface of the first circuit board comprises a fixing hole setting area; a groove is formed in the fixing hole setting area; a fixing hole penetrating through the first circuit board is formed in the bottom of the groove through punching equipment; sequentially stacking the target number of first circuit boards and prepregs according to the stacking design for pre-typesetting; and fixing the first circuit board and the prepreg through a pin by adopting a pin positioning lamination process, and then pressing. By the adoption of the scheme, the punching capacity requirement of punching equipment can be met, manual single punching is not needed, the preparation efficiency of fixing holes is improved, and the punching technological process is simplified; and the alignment precision of the fixing holes and the perpendicularity of the fixing holes can be improved, so that the quality of the fixing holes is improved, the fixing effect is ensured, and the production yield of the multilayer circuit board is improved.
Owner:DELTON TECH (GUANGZHOU) INC
High-precision circuit board and preparation method thereof
ActiveCN119545688Aimprove consistencySolving Manufacturing ChallengesInsulating substrate metal adhesion improvementPrinted circuit secondary treatmentDaughterboardBlind hole
The invention discloses a high-precision circuit board and a preparation method thereof. The preparation method comprises the following steps: acquiring a preset circuit diagram; setting a plurality of conductive layer groups according to a preset circuit diagram; wherein the conductive layers which need to form the same blind hole or buried hole form a conductive layer group, and the adjacent conductive layers which do not need to form the blind hole or buried hole form a conductive layer group; each conductive layer group comprises a core plate; placing the conductive layers in a stacked manner, placing bonding layers between the core plates in the same group or between the core plates and the conductive layers, and placing auxiliary layers between different conductive layer groups; laminating the conductive layer, the bonding layer and the auxiliary layer which are stacked, and stripping the auxiliary layer after lamination so as to enable the conductive layer group to form a sub-board; drilling a hole in a preset position of the daughter board to form a through hole; the daughter boards are placed in a stacked mode, and bonding layers are placed between the adjacent daughter boards; and laminating the sub-board and the bonding layer which are stacked. By adopting the technical scheme, the problems of alignment and warping caused by an asymmetric structure due to respective pressing of the sub-boards can be solved.
Owner:DELTON TECH (GUANGZHOU) INC
Multi-layer overlay alignment method for micro-nano device
ActiveCN119535919AImprove alignment accuracyImprove alignment efficiencyOriginals for photomechanical treatmentNano-deviceNano manufacturing
The invention relates to the technical field of micro-nano manufacturing, and particularly discloses a multi-layer overlay alignment method for a micro-nano device. Comprising the following steps: pre-aligning a substrate, calibrating unit length of a coordinate system of a microscopic camera system, selecting a main observation area, resolving a deflection angle between the coordinate systems and an axis deflection angle of a coordinate system of a workbench, adjusting a phase attitude of the substrate and a mask plate, adjusting a relative position of the substrate and the mask plate, performing alignment judgment on the relative position attitude, and the like. According to the method, the error correction and compensation function is integrated, the influence of machining errors, assembly errors, mechanism repeated positioning errors and the like of parts such as a precision workbench and a microscopic camera system on the alignment adjustment process is weakened, and the alignment precision and efficiency are improved.
Owner:三河建华高科有限责任公司
Container door adjusting method, fixed crane system, device and electronic equipment
The embodiment of the invention provides a container door adjusting method, a fixed crane system, a device and electronic equipment. The method comprises the steps that when it is detected that a container truck is located at a first position, first pose information of the container truck and second pose information of a container on the container truck are obtained firstly; then, when it is detected that the container is grabbed by the lifting appliance of the fixed crane and moved to a preset second position, third pose information of the container truck and fourth pose information of the container are obtained; determining target adjustment information of the container according to the second pose information and the fourth pose information of the container and the first pose information and the third pose information of the container truck; therefore, according to the target adjustment information of the container, the lifting appliance of the fixed crane carries out container placing operation. According to the method, the alignment precision in the container door adjusting process of the container is improved.
Owner:SANY MARINE HEAVY INDUSTRY CO LTD
Adapter plate, semiconductor device and preparation method thereof
PendingCN119153395Aimprove qualityimprove performanceSemiconductor/solid-state device detailsSolid-state devicesDevice materialElectrical connection
The invention provides an adapter plate, a semiconductor device and a preparation method thereof. The preparation method of the adapter plate comprises the following steps: S1, providing a glass substrate; s2, a plurality of open holes are formed in the glass substrate, each open hole is formed through one-time machining, each open hole comprises a blind hole and a through hole penetrating through the glass substrate, each through hole sequentially comprises a first part serving as an interconnection switching hole, a second part serving as a contact hole and a third part serving as a wiring hole from bottom to top, and the blind holes serve as the wiring holes; s3, filling the holes with conductive material layers at one time, wherein the conductive material layers are exposed on the front surface and the back surface of the glass substrate; and S4, forming an electric lead-out structure electrically connected with the conductive material layer on the surface of the glass substrate to prepare the adapter plate. According to the invention, punching of the three material layers of the switching layer, the through hole interconnection layer and the wiring dielectric layer can be completed only through one-time processing, and then one-time filling is carried out, so that the process steps are greatly simplified, the production cost can be greatly reduced, and the production efficiency is improved.
Owner:SJ SEMICONDUCTOR (JIANGYIN) CORP
Bushing assembling mechanism for plastic oil pan
ActiveCN222608640UImprove installation efficiencyReduce labor costsMetal working apparatusStructural engineeringMechanical engineering
The utility model discloses a lining assembling mechanism for a plastic oil pan, which can install a lining on the plastic oil pan, and is characterized by comprising a rack, a feeding assembly, a loading assembly, a bearing assembly and a press fitting assembly. According to the lining assembling mechanism, the three-axis movement module is arranged to drive the feeding assembly, the feeding assembly is matched with the material receiving assembly to automatically install the lining on the plastic oil pan, the lining installing efficiency is improved, the labor cost is saved, the guiding devices are installed on the bottom plates of the bearing assembly and the installing assembly, the lining installing and pressing speed is conveniently increased, and the lining assembling efficiency is improved. And the alignment precision in the mounting and pressing processes is also improved, and the product quality is ensured.
Owner:SUZHOU FEIRUIDENG AUTOMATION TECHNOLOGY CO LTD
A wafer alignment method and related device
ActiveCN119170548BImprove search efficiencyReduced precision requirementsSemiconductor/solid-state device manufacturingWaferTesting Methods
The present invention relates to a wafer alignment method and related devices, the alignment method comprising: selecting a suitable alignment mark in a chip of a wafer to establish a work menu, and recording the position of the alignment mark and the size of the chip; using a pre-aligner to perform pre-alignment on the wafer, placing the wafer on a chuck, and recording the target angle of the wafer; performing rough alignment of the wafer; and performing fine alignment of the wafer. The wafer alignment method and related devices provided by the present invention improve the search efficiency of the alignment mark in the subsequent precise alignment step by performing rough alignment on the wafer; and perform precise alignment through the alignment mark at the far end of the wafer to improve the alignment accuracy of the wafer.
Owner:SHANGHAI NORREC SEMICON EQUIP CO LTD
Vacuum gauge dynamic comparison device
InactiveCN222353415Uavoid enteringHigh measurement accuracyFluid pressure measurementPumping vacuumVacuum pump
The utility model belongs to the technical field of vacuum gauge detection, and discloses a vacuum gauge dynamic comparison device which comprises a controller and a vacuum chamber, and the vacuum chamber is communicated with a standard vacuum gauge and a vacuum gauge to be detected. The vacuum chamber is further communicated with an inflation device and a vacuumizing device. The vacuumizing device comprises a first support and a second support, the first support is connected with a first vacuum pump, the output end of the first vacuum pump is communicated with the vacuum chamber through a first pipeline, the second support is connected with a second vacuum pump, and the output end of a third vacuum pump is communicated with the vacuum chamber through a second pipeline; a first valve is arranged on the first pipeline, and a second valve is arranged on the second pipeline; the controller is respectively connected with the first vacuum pump, the second vacuum pump, the third vacuum pump, the standard vacuum gauge and the to-be-tested vacuum gauge; according to the utility model, the vacuum gauge can be compared under the ultrahigh vacuum condition, the comparison precision is improved, the structure is simple and compact, and the operation is convenient.
Owner:UNIV OF SCI & TECH OF CHINA