The invention discloses a COC or COP micro-fluidic
chip bonding device and bonding method.The bonding device comprises a shell and an equipment box, a plurality of fixing columns used for supporting a lower clamp are fixedly arranged at the bottom of the shell, an upper clamp driven by a lifting component is arranged above the lower clamp, and the upper clamp is connected with the equipment box through a lifting component. The lower clamp is provided with a ventilation groove in a penetrating mode and a containing groove located above the ventilation groove and used for containing a substrate and a cover plate, the upper clamp is provided with a
laser scanning groove in a penetrating mode and a lower pressing groove located below the
laser scanning groove, connected with a flexible pressing ring and corresponding to the containing groove, and a
laser scanning
head moving along with the lifting component is arranged above the
laser scanning groove. And a first blowing part and a second blowing part are respectively arranged at the upper part of the upper clamp and below the lower clamp. According to the micro-fluidic
chip bonding device, the cover plate and the substrate can be quickly cooled by air, the
chip is prevented from continuously heating, the flexible pressing ring can ensure that the positioning pressure on the periphery of the cover plate and the periphery of the substrate is uniform, the
bonding strength on the periphery of the chip is consistent, and the bonding quality of the micro-fluidic chip is further ensured.