High-density electronic package and method for making same

Abstract

A high density electronic package includes a low-modulus-of-elasticity flexible adhesive interposer substrate to which an electronic device, such as a semiconductor chip or die or other component, is attached. The flexible adhesive interposer substrate includes a sheet or layer of a molecularly flexible adhesive having via holes therein in which are built up conductive vias to which contacts of the electronic device connect. A thin layer of metal foil on one surface of the flexible adhesive sheet is patterned to provide contacts and to connect electrically to the conductive vias. The electronic device may be covered by a lid or by an encapsulant attached to the flexible adhesive interposer substrate and / or the electronic device. An electronic package may include a plurality of electronic devices and respective flexible adhesive interposers that are electrically interconnected.

Description

technical field [0001] The present invention relates to an electronic device package, and more particularly to an electronic device package comprising a flexible substrate comprising a low modulus of elasticity flexible dielectric adhesive. Background technique [0002] With the development of semiconductor integrated circuit technology, the number of circuits that can be fabricated on a single semiconductor chip and the speed of operation have been greatly increased, due to the increase in the number of input and output terminals connecting the chips and the reduction in the spacing or spacing between these connection terminals making efficient use of these integrated circuits more difficult. The connection problem is exacerbated when the number of connection terminals exceeds what is conveniently and economically available in conventional mechanical packaging. [0003] One solution to such problems is to use a semiconductor chip mounted on a next-l...

AI Technical Summary

Problems solved by technology

Specifically, compared to a molded epoxy device package with a material cost of only US$0.01-0.05 (not including tooling), a sealed cavity device package can have a material cost of US$0.90-1.00 or more, and conventional tape A lidded device package with distributing adhesive can have a material cost of US$0.20-0.40

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