High-density electronic package and method for making same
A technology of electronic packaging and electronic devices, applied in the field of electronic device packaging
Inactive Publication Date: 2002-06-05
AMERASIA INT TECH
View PDF2 Cites 58 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Specifically, compared to a molded epoxy device package with a material cost of only US$0.01-0.05 (not including tooling), a sealed cavity device package can h
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0031] Electronic packaging is subject to heat-induced forces and moisture sealing. Each device package consists of a semiconductor chip or die, which is attached to an intermediate stack substrate, such as an FR4 stack, by die glue. Fine gold or aluminum bond wires connect the connection terminals of the semiconductor chip to corresponding conductors on the substrate, which is connected to the underlying substrate by a connection that may be a solder or conductive adhesive conductor. Semiconductor chips and bond wires are typically encapsulated with a molded encapsulant or covered with a cover that provides mechanical support and moisture barrier.
[0032] Mechanical stresses arise due to differences in coefficient of thermal expansion (CTE) and high modulus of elasticity (ME), ie stiffness, of the different materials used in such modules. The silicon semiconductor die has a CTE of about 3 ppm / °C, the adhesive has a CTE of about 40 ppm / °C, the substrate has a CTE of about 1...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more PUM
Login to view more Abstract
A high density electronic package includes a low-modulus-of-elasticity flexible adhesive interposer substrate to which an electronic device, such as a semiconductor chip or die or other component, is attached. The flexible adhesive interposer substrate includes a sheet or layer of a molecularly flexible adhesive having via holes therein in which are built up conductive vias to which contacts of the electronic device connect. A thin layer of metal foil on one surface of the flexible adhesive sheet is patterned to provide contacts and to connect electrically to the conductive vias. The electronic device may be covered by a lid or by an encapsulant attached to the flexible adhesive interposer substrate and/or the electronic device. An electronic package may include a plurality of electronic devices and respective flexible adhesive interposers that are electrically interconnected.
Description
technical field [0001] The present invention relates to an electronic device package, and more particularly to an electronic device package comprising a flexible substrate comprising a low modulus of elasticity flexible dielectric adhesive. Background technique [0002] With the development of semiconductor integrated circuit technology, the number of circuits that can be fabricated on a single semiconductor chip and the speed of operation have been greatly increased, due to the increase in the number of input and output terminals connecting the chips and the reduction in the spacing or spacing between these connection terminals making efficient use of these integrated circuits more difficult. The connection problem is exacerbated when the number of connection terminals exceeds what is conveniently and economically available in conventional mechanical packaging. [0003] One solution to such problems is to use a semiconductor chip mounted on a next-l...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more Application Information
Patent Timeline
Login to view more IPC IPC(8): H01L23/29B32B3/08B32B7/12B32B33/00B32B37/20G06K19/077H01L23/055H01L23/12H01L23/31H01L23/498H01L23/538H01L25/065H01Q1/22H01Q1/36H01Q1/38H01Q7/00H01Q23/00H05K1/00H05K1/11H05K1/16H05K3/40H05K3/42
CPCH01L2924/1532H01L23/4985B32B2429/00H01L2224/45124H01L2924/0105H01L23/055H01L2224/97G06K19/07743H01L2224/16H01L23/49855H01L2224/73253H01Q7/005H01L2924/15311H01L2225/06541B32B3/08H01L2924/01028H01L2924/19041H01L2224/48091H01L2924/01013H01L2224/32225H01L23/5387H01Q1/36H01L24/45H01L2924/15174H05K1/165H01L2924/19043H01L2224/73204H01L24/48H01L2924/15173H01L2225/06527H01L2924/01033H05K2203/1453H05K3/423H01L2924/01078H01L2224/16225H01L2225/06582H05K2201/0394H01L2924/01015H01L2225/06572G06K19/07745H01L2924/01023H01Q7/00H01L2924/01046H01L2924/01082B32B37/203H01L2225/06586H01L2924/16152H01L2924/01004H01L2224/16237H01L2224/32245H01L2924/01002H01L2924/09701H05K1/113B32B2310/0831H01L2924/01029H01Q1/2208H01Q1/38H05K2201/10674H01L2225/06579H01L23/49838H01L2924/30107G06K19/07747B32B33/00H01L24/97H01L2225/0652H05K1/0393H01Q1/22B32B7/12H01L2924/01047H01L2924/01079H05K3/4069H01L25/0657H05K2201/0355B32B2425/00H01L2224/48227H01L2225/06517H01L2924/14H01L2924/01005H01L2924/19042H01L2924/01006H01L2225/0651H01Q23/00H01L2924/01014H01L2924/01058H01L2224/45144H01L2224/73265H01L2924/3025H01L2924/15787H01L24/73H01L2924/1627H01L2224/05573H01L2224/05568H01L2224/056H01L2924/181H01L2924/00014H01L2924/00H01L2924/00012H01L2224/05644H01L2224/05655H01L2224/05664H05K3/46
Inventor 凯文·K·T·钟
Owner AMERASIA INT TECH
Who we serve
- R&D Engineer
- R&D Manager
- IP Professional
Why Eureka
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Social media
Try Eureka
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap