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High-density electronic package and method for making same

A technology of electronic packaging and electronic devices, applied in the field of electronic device packaging

Inactive Publication Date: 2002-06-05
AMERASIA INT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Specifically, compared to a molded epoxy device package with a material cost of only US$0.01-0.05 (not including tooling), a sealed cavity device package can have a material cost of US$0.90-1.00 or more, and conventional tape A lidded device package with distributing adhesive can have a material cost of US$0.20-0.40

Method used

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  • High-density electronic package and method for making same
  • High-density electronic package and method for making same
  • High-density electronic package and method for making same

Examples

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Embodiment Construction

[0031] Electronic packaging is subject to heat-induced forces and moisture sealing. Each device package consists of a semiconductor chip or die, which is attached to an intermediate stack substrate, such as an FR4 stack, by die glue. Fine gold or aluminum bond wires connect the connection terminals of the semiconductor chip to corresponding conductors on the substrate, which is connected to the underlying substrate by a connection that may be a solder or conductive adhesive conductor. Semiconductor chips and bond wires are typically encapsulated with a molded encapsulant or covered with a cover that provides mechanical support and moisture barrier.

[0032] Mechanical stresses arise due to differences in coefficient of thermal expansion (CTE) and high modulus of elasticity (ME), ie stiffness, of the different materials used in such modules. The silicon semiconductor die has a CTE of about 3 ppm / °C, the adhesive has a CTE of about 40 ppm / °C, the substrate has a CTE of about 1...

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PUM

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Abstract

A high density electronic package includes a low-modulus-of-elasticity flexible adhesive interposer substrate to which an electronic device, such as a semiconductor chip or die or other component, is attached. The flexible adhesive interposer substrate includes a sheet or layer of a molecularly flexible adhesive having via holes therein in which are built up conductive vias to which contacts of the electronic device connect. A thin layer of metal foil on one surface of the flexible adhesive sheet is patterned to provide contacts and to connect electrically to the conductive vias. The electronic device may be covered by a lid or by an encapsulant attached to the flexible adhesive interposer substrate and / or the electronic device. An electronic package may include a plurality of electronic devices and respective flexible adhesive interposers that are electrically interconnected.

Description

technical field [0001] The present invention relates to an electronic device package, and more particularly to an electronic device package comprising a flexible substrate comprising a low modulus of elasticity flexible dielectric adhesive. Background technique [0002] With the development of semiconductor integrated circuit technology, the number of circuits that can be fabricated on a single semiconductor chip and the speed of operation have been greatly increased, due to the increase in the number of input and output terminals connecting the chips and the reduction in the spacing or spacing between these connection terminals making efficient use of these integrated circuits more difficult. The connection problem is exacerbated when the number of connection terminals exceeds what is conveniently and economically available in conventional mechanical packaging. [0003] One solution to such problems is to use a semiconductor chip mounted on a next-l...

Claims

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Application Information

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IPC IPC(8): H01L23/29B32B3/08B32B7/12B32B33/00B32B37/20G06K19/077H01L23/055H01L23/12H01L23/31H01L23/498H01L23/538H01L25/065H01Q1/22H01Q1/36H01Q1/38H01Q7/00H01Q23/00H05K1/00H05K1/11H05K1/16H05K3/40H05K3/42
CPCH01L2924/1532H01L23/4985B32B2429/00H01L2224/45124H01L2924/0105H01L23/055H01L2224/97G06K19/07743H01L2224/16H01L23/49855H01L2224/73253H01Q7/005H01L2924/15311H01L2225/06541B32B3/08H01L2924/01028H01L2924/19041H01L2224/48091H01L2924/01013H01L2224/32225H01L23/5387H01Q1/36H01L24/45H01L2924/15174H05K1/165H01L2924/19043H01L2224/73204H01L24/48H01L2924/15173H01L2225/06527H01L2924/01033H05K2203/1453H05K3/423H01L2924/01078H01L2224/16225H01L2225/06582H05K2201/0394H01L2924/01015H01L2225/06572G06K19/07745H01L2924/01023H01Q7/00H01L2924/01046H01L2924/01082B32B37/203H01L2225/06586H01L2924/16152H01L2924/01004H01L2224/16237H01L2224/32245H01L2924/01002H01L2924/09701H05K1/113B32B2310/0831H01L2924/01029H01Q1/2208H01Q1/38H05K2201/10674H01L2225/06579H01L23/49838H01L2924/30107G06K19/07747B32B33/00H01L24/97H01L2225/0652H05K1/0393H01Q1/22B32B7/12H01L2924/01047H01L2924/01079H05K3/4069H01L25/0657H05K2201/0355B32B2425/00H01L2224/48227H01L2225/06517H01L2924/14H01L2924/01005H01L2924/19042H01L2924/01006H01L2225/0651H01Q23/00H01L2924/01014H01L2924/01058H01L2224/45144H01L2224/73265H01L2924/3025H01L2924/15787H01L24/73H01L2924/1627H01L2224/05573H01L2224/05568H01L2224/056H01L2924/181H01L2924/00014H01L2924/00H01L2924/00012H01L2224/05644H01L2224/05655H01L2224/05664H05K3/46
Inventor 凯文·K·T·钟
Owner AMERASIA INT TECH
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