1624results about "Printed inductor incorporation" patented technology

A multilayer printed circuit board (“PCB”) coil that simulates a coil formed from litz wire. The PCB includes a plurality of alternating conductor and insulating layers interconnected to cooperatively form the coil. Each conductor layer includes a trace that follows the desired coil shape and is divided into a plurality of discrete conductor segments. The segments are electrically connected across layers to provide a plurality of current flow paths (or filaments) that undulate between the layers in a regular, repeating pattern. The coil may be configured so that each filament spends a substantially equal amount of time in proximity to the paired coil and therefore contributes substantially equally to the self or mutual inductance of the coil. Each conductor layer may include a plurality of associated traces and intralayer connector that interconnected so that each filament undulates not only upwardly / downwardly, but also inwardly / outwardly in a regular, repeating pattern.

A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.

A transducer is provided for use in a position sensor which senses the position of two relatively movable members. In one form, the transducer has a plurality of sensor windings having a number of loops arranged in succession and connected in series so that signals induced in adjacent loops by a common electromagnetic field oppose each other and an excitation winding having at least one loop super-imposed on but electrically isolated from the loops of the sensor windings.

A product includes a power supply circuit board, which includes a power supply circuit having a stable frequency characteristic which enables communication among various products to be obtained. The product includes a power supply circuit board including a power supply circuit arranged thereon having an inductance element, and a wireless communication circuit board electrically connected to the power supply circuit. The wireless communication circuit board is mounted on the power supply circuit board. The product further includes a radiation plate which emits a transmission signal which is supplied from the power supply circuit through electromagnetic field coupling and which has a frequency substantially determined in accordance with a resonant frequency of the power supply circuit, and which is used to supply a reception signal to the power supply circuit through electromagnetic field coupling.

A filter for use in a coaxial cable network includes a printed circuit board having first and second opposed major surfaces, and first and second opposing sides. The opposed major surfaces are substantially parallel to a single plane, and are bisected by a longitudinal axis. The first and second opposing sides are substantially parallel to the longitudinal axis. The filter further includes an input terminal and an output terminal connected to the printed circuit board. The input terminal and the output terminal have an axis extending substantially parallel to the longitudinal axis. A signal path is disposed on the printed circuit board and extends from the input terminal toward the output terminal. The filter further includes a plurality of resonator elements fabricated upon the first opposed major surface. In one embodiment, the inductor elements are arranged in series along the signal path defining a footprint of less than 540 square millimeters. The filter passes a first range of frequencies in a provider bandwidth and attenuates a second range of frequencies in a personal data network bandwidth. In one embodiment, the resonator elements are parallel inductor elements and capacitor elements, the inductor elements being etched spiral inductors.

A low temperature co-fired ceramic assembly (LTCC) with a constraining core to minimize shrinkage of outer ceramic layers during firing. The outer ceramic layers have high density circuit features. A ceramic core includes several ceramic layers. Several via holes are located in the first and second ceramic layers. Several low density circuit features are located on the ceramic layers that make up the core. Outer ceramic layers are placed top and bottom of the ceramic core. The outer ceramic layers have via holes and high density circuit features. The circuit features patterned on the ceramic layers include resistors, capacitors, circuit lines, vias, inductors, or bond pads. The ceramic core is fired first in a furnace. The outer layers are then laminated to the ceramic core and fired. The ceramic core controls the shrinkage rate of the outer ceramic layers during firing allowing higher density circuit features on the outer layers.

A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.

A parallel resonant circuit is realized by stacking first to fourth wiring patterns each having at least an inductance element. One of the adjacent first and second wiring patterns is set to a signal input node and the other thereof is set to a signal output node. Then, the signal input node is connected to the signal output node via inductance elements of the first wiring pattern, third wiring pattern, fourth wiring pattern and second wiring pattern in order. By adjacently forming wiring layers of the signal input and output nodes, a capacitance value between the input and output nodes is increased compared to that when they are separated. Also, by increasing the line width of the first and second wiring patterns, the capacitance value can be further increased. Therefore, it is possible to achieve a large capacitance value in a small area and downsizing of the electronic device.

A module having a stacked magnetic device and semiconductor device, and method of forming the same. In one embodiment, the module includes a printed wiring board including a patterned conductor formed on an upper surface thereof. The module also includes a magnetic core mounted on the upper surface of the printed wiring board proximate the patterned conductor and a semiconductor device mounted on an upper surface of the magnetic core.

An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.

A circuit board having an embedded inductor and a process for making the circuit board is provided. In general, the process begins by providing a core structure including a dielectric core layer and a first metal layer on a top surface of the dielectric core layer. The first metal layer is etched to form first inductor windings. A material, such as an epoxy material, including magnetic filler material is deposited over the first inductor windings. Thereafter, a prepreg layer is placed over and attached to the material deposited over the first inductor windings to form the circuit board having the embedded inductor.

A method for producing a high density inductor includes the steps of forming a coil having a spiral shape, sealing the coil in the interior of a core member, and forming a terminal electrode for allowing electric conduction to said coil on the outside of said core member. In this method, the coil is formed by repeating a process of forming a wire layer by means of a thin film forming process and a process of forming an additional wire layer on top of the wire layer by means of the thin film forming process to pile up the wire layers. With this production method, it is possible to form a coil with a high aspect ratio. In addition, the inductor is designed in such a way that the core member envelopes only the coil. With that design, it is possible to make the inductor compact.

A planar coil including and insulating substrate, and a coil conductive filament having a thickness of 20 to 400 mum and formed on at least one surface of the insulating substrate, the coil conductive filament having a gap whose aspect ratio (H / G) is at least 1. The coil conductive filament has a cross-section in a substantially mushroom shape having a head and a neck, the head has a width (L) which is a least twice as large as a width (l) of the neck thereof, at most 1.5 times as large as a height of the head, and at least twice as large as a minimum spacing (G) between adjacent coil conductive filaments.

A connector is provided for simultaneously improving both the NEXT high frequency performance when low crosstalk plugs are used and the NEXT low frequency performance when high crosstalk plugs are used. The connector includes a first compensation structure provided on an inner metalized layer of the PCB at a first stage area of the PCB, and a second compensation structure, provided at a second stage area of the PCB, for increasing compensation capacitance with increasing frequency.

A switching power supply has a transformer for power transmission. A core is provided having an intermediate leg and at least a pair of external legs arranged at equal intervals from the intermediate leg; a first printed coil is provided on a first substrate which has an intermediate hole and a pair of external holes respectively inserted in the intermediate leg and the pair of external legs of the core, the first printed coil being wound around the intermediate hole; a second printed coil is provided on a second substrate which has an intermediate hole and a pair of external holes respectively inserted in the intermediate leg and the pair of external legs of the core, the second printed coil including a pair of external printed coils which are connected in series and are respectively wound around the pair of the external holes and each having the same number of turns but wound in opposite directions. The pair of external printed coils of the second printed coil generate magnetic fields in opposite directions to each other in the intermediate leg such that the magnetic fields in the intermediate leg cancel each other and induce no induction voltage in the first printed coil, and induction voltages induced in the external printed coils of the second printed coil by magnetic flux generated by the first printed coil are substantially canceled, whereby the first printed coil and the second printed coil form separate inductors which are not magnetically coupled. A third printed coil is provided on a third substrate which has an intermediate hole and a pair of external holes respectively inserted in the intermediate leg and the pair of external legs of the core, the third printed coil being wound around the intermediate hole, whereby the first printed coil is magnetically coupled with the third printed coil to form a first transformer; and further wherein the tranformer for power transmission comprises the first transformer.

An electronic filtering device includes continuous trace on a dielectric substrate and a dissipation layer communicatively coupled to the trace. The dissipation layer may include disconnected metal particles, which may be embedded in a substrate, for example in an epoxy. The continuous trace may be meandering, for example crenulated, coil or spiral signal path. At least a second continuous trace may be spaced from the first by the substrate, and conductively coupled by a via. The electronic filtering device may be used in one or more printed circuit boards (PCBs) that form stages of an input / output system.

Plated through holes pass through clearances in a ground plane of a circuit board. A conductive collar / spoke arrangement is constructed on the ground plane adjacent the clearance, to provide an inductive component to the coupling between a plated through hole and the ground plane. The inductive component impedes the transfer of high-frequency noise between the through hole and the ground plane. Other embodiments are also described and claimed.

To provide a configuration including a first sheet substrate, on which a first thin film electronic component is formed on at least one main face, and an external connection terminal for connecting to an external circuit is formed one main face or the other face; a second sheet substrate, on which a second thin film electronic component is formed on at least one face; an insulator connection resin layer for fixing the first sheet substrate and the second sheet substrate opposing the first thin film electronic component against the second thin film electronic component; and an interlayer connection conductor for electrically connecting electrode terminals, which have been set in advance, of the first thin film electronic component and the second thin film electronic component.

A multi-layer, multi-turn structure for an inductor having a plurality of conductor layers separated by layers of insulator is described. The inductor further comprises a connector electrically connected between the conductor layers. The structure of the inductor may comprise a cavity therewithin. The structure of the inductor constructed such that electrical resistance is reduced therewithin, thus increasing the efficiency of the inductor. The inductor is particularly useful at operating within the radio frequency range and greater.

A stacked integrated circuit includes a first tier IC and a second tier IC. Active faces of the first tier IC and the second tier IC face each other. An interconnect structure, such as microbumps, couples the first tier IC to the second tier IC. An active portion of a voltage regulator is integrated in the first semiconductor IC and coupled to passive components (for example a capacitor or an inductor) embedded in a packaging substrate on which the stacked IC is mounted. The passive components may be multiple through vias in the packaging substrate providing inductance to the active portion of the voltage regulator. The inductance provided to the active portion of the voltage regulator is increased by coupling the through via in the packaging substrate to through vias in a printed circuit board that the packaging substrate is mounted on.

A transformer has a primary winding made from a first conducting trace formed on a first multilayer printed circuit board, and a secondary winding made from a second conducting trace formed on a second multilayer printed circuit board. The primary winding is magnetically coupled to the secondary winding. The windings are etched as traces in copper layers of the PC boards as spirals. The spiral of one copper layer is connected to the spiral of a different copper layer by a via, or vias, formed through the insulating layer of the PC board. The vias are drilled, cleaned, and plated with conducting material, for example copper. By using multiple layers, and by connecting spiral windings of each layer to the windings of the next layer by use of vias, any number of turns can be built into a primary winding, or into a secondary winding.

An RFID tag which is provided with a coil-shaped antenna such that a conductor is placed on the periphery of a magnetic core, the RFID comprising: the magnetic core, an FPC wound on the periphery of the magnetic core, two or more linear conductor patterns formed in parallel with one another on the FPC, an IC that is connected to the linear conductor patterns and disposed on the FPC, a crossover pattern that electrically connects one end and the other end of outermost linear conductor patterns among the linear conductor patterns formed in parallel with one another, where in the two or more linear conductor patterns, adjacent linear conductor patterns in a joint portion in the wound FPC are electrically connected in respective start edges and end edges.

The invention relates to the manufacturing of a multilayer structure and especially it relates to the manufacturing of a three-dimensional structure and its use as an electronics assembly substrate and as a winding for transformers and inductors. When a multilayer structure is manufactured by folding a conductor-insulator-conductor laminate, where the conductor layers to be separated from each other follow each other on opposite sides of the conductor-insulator-conductor laminate in the sections following each other and where the insulator has been removed from the places where the conductor layers are to be connected together after folding, it is possible to manufacture a wide range of three-dimensional multilayer structures where the volume occupied by the windings over the total volume can be maximized. Alternatively, by using the method it is also possible to manufacture a multilayer structure where components have been buried inside. The method makes it also possible to make connections between layers in a flexible manner. Among other issues, the method can be easily automated for mass-production.

A multi-layer laminated circuit board 10A of the present invention is formed by laminating together a multi-layer transformer 10, a multi-layer part sheet 30 formed with a multi-layer part, and a wiring sheet 50 formed with a circuit pattern. The multi-layer transformer 10 is incorporated into the multi-layer laminated circuit board 10A, and therefore a package for the multi-layer transformer 10 is omitted, and the wiring between the multi-layer transformer 10 and other components is reduced to a minimum.

A method and apparatus is provided for use in an integrated circuit or printed circuit board for reducing or minimizing interference. An inductance is formed using two or more inductors coupled together and configured such that current flows through the inductors in different directions, thus at least partially canceling magnetic fields. When designing a circuit, the configuration of the inductors, as well as the relative positions of portions of the circuit, can be tweaked to provide optimal interference or noise control.