298results about "Printed circuit grounding" patented technology

A docking system is disclosed for an unmanned aerial vehicle (UAV). The docking system includes a base station that is configured to receive the UAV and a pedestal that is configured to support the base station in an elevated position. The pedestal defines an interior space that is configured in correspondence with an outer contour of the base station such that the base station is positionable within the pedestal to protect the base station during nonuse.

The embodiment of the invention provides electronic equipment. The electronic equipment comprises a charging interface, a first circuit board, a metal reinforcing piece and a support assembly. The first circuit board comprises a connecting end. The connecting end is provided with a grounding terminal. The connecting end is electrically connected with the charging interface. The metal reinforcing member and the connecting end are arranged in a stacked manner. The metal reinforcing member is electrically connected with the grounding terminal. The support assembly comprises a metal support and a conductive part. At least part of the connecting end is located in the metal support. The metal support comprises a main body part and a grounding part. The grounding part is electrically connected with the main body part. And the metal reinforcing piece and the main body part are electrically connected with the conductive piece respectively. The grounding part is used for grounding. According to the electronic equipment provided by the embodiment of the invention, the structural design difficulty is reduced, and the assembly difficulty and the production cost are reduced.

A high-speed transmission circuit comprises, as part of a signal path, a connector pin disposed on a pad that comprises an unused pad region. The unused pad region is not considered part of the signal path but is part of a resonant sub-circuit. In various embodiments, by properly adjusting the dimensions of the pad region and other structures in the high-speed transmission circuit, resonant frequencies of the sub-circuit are shifted to a frequency range that is outside of the frequency range of interest in the signal path, thereby, reducing insertion loss and increasing signal integrity without compromising mechanical stability.

This application relates to a heat dissipation shielding structure and a processing method, a circuit board assembly, and an electronic device. The printed circuit board includes a mounting surface. Electronic components are mounted on the mounting surface. The electronic components include an active component and a passive component. The heat dissipation shielding structure includes an insulating layer. The insulating layer is covered on the mounting surface, and wraps at least a side surface of the active component, so that a side that is of the insulating layer and that faces away from the mounting surface forms a first surface together with a top surface of the active component. A shielding layer is covered on the first surface, a shape of the shielding layer matches a shape of the first surface, and the shielding layer is electrically connected to a ground network of the printed circuit board.

There is provided a printed wiring board including an outermost conductive layer that includes a plurality of conductive pads, a first conductive layer that includes a first inner-layer wiring and is stacked on the conductive layer, a second conductive layer that includes a second inner-layer wiring and is stacked on the conductive layer and the first conductive layer, a first signal via that connects one of the conductive pads and the first inner-layer wiring with each other, a second signal via connecting another one of the conductive pads and the second inner-layer wiring with each other, and a stitching via that is connected to a ground. The first inner-layer wiring and the second inner-layer wiring form a common wiring route in which the first inner-layer wiring and the second inner-layer wiring are stacked and disposed in a connection area in which the conductive pads are arranged.

A paddle card includes a printed circuit board (PCB), a shielded cable, and an electromagnetic interference (EM) shield. The PCB includes a first metal layer on a top surface of the PCB, a second metal layer within the PCB, and a cavity in the top surface of the PC. The cavity exposes the second metal layer. The first metal layer includes a first ground pad. The second metal layer includes a signal pad located within the cavity. The shielded cable includes a signal conductor coupled to the first signal pad. The EMI shield is coupled to the ground pad and covers the cavity.

The invention discloses electronic equipment, and belongs to the technical field of electronic equipment. The electronic equipment comprises a circuit board, a camera module, a conductive layer, a conductive part and a mainboard bracket, the camera module comprises a first camera module and a second camera module, and the first camera module and the second camera module are both arranged on the circuit board; the first camera module comprises a first camera and a first connector, and the first connector is electrically connected with the first camera; the second camera module comprises a second camera and a second connector, and the second connector is electrically connected with the second camera; the conductive layer is arranged on the surface of the side, away from the circuit board, of the camera module, and the conductive layer covers and is electrically connected to the first camera, the first connector and the second connector; the mainboard support covers the side, away from the circuit board, of the conductive layer, the conductive layer is electrically connected with the mainboard support through a conductive piece, and the mainboard support is grounded.

A base station for an unmanned aerial vehicle (UAV) is disclosed that includes: an enclosure defining an internal cavity that is configured to receive the UAV; a door that is movably connected to the enclosure; actuators that extend between the door and the enclosure to facilitate opening and closure of the door; a cradle that is configured to receive the UAV and which is movable in relation to the enclosure such that the cradle is repositionable between a retracted position and an extended position to facilitate movement of the UAV into and out of the enclosure; and engagement members that are secured to the actuators and which are configured for contact with propeller assemblies on the UAV to facilitate folding of the propeller assemblies during movement of the UAV into the enclosure.

A power module includes a power circuit board, a signal pin, a shielding substrate, and an electrically insulating component. The signal pin is disposed and stands on the power circuit board. The shielding substrate is located above the power circuit board and spaced apart from the power circuit board. The shielding substrate has a first through hole. The signal pin is disposed through the first through hole. The electrically insulating component surrounds the signal pin. The electrically insulating component has a second through hole. The signal pin is disposed through the second through hole. The signal pin is spaced apart from the shielding substrate by a distance by the electrically insulating component.

The embodiment of the invention provides a circuit board assembly and electronic equipment, and relates to the technical field of electronics, the circuit board assembly comprises a first circuit board and a first elastic pin, a part of the first circuit board is located in a clearance area of an antenna of the electronic equipment, and the first elastic pin is located in the clearance area. And one end of the first elastic pin is electrically connected with the part of the first circuit board in the clearance area, and the other end is grounded. The first elastic pin is arranged in the circuit board assembly, and grounding is carried out through the first elastic pin, so that the current flows back. The first elastic pin has elasticity, so that the reliability and firmness of electric connection between the first elastic pin and the first circuit board can be effectively improved, and the grounding impedance of the circuit board assembly is effectively reduced. Moreover, the first elastic pin can effectively avoid the problems of poor contact and the like of the circuit board assembly in the grounding process, and avoids the PIM effect caused by poor contact, thereby effectively improving the working reliability and stability of the antenna, and improving the communication experience of a user.

Vehicle imaging device, comprising: • an image sensor (15), • a lens (1), • a printed circuit board (3), • a pin (21.1) comprising a ground connection and in electrical connection with the printed circuit board (3), • a housing (7, 8) comprising an inner cavity (12) enclosing at least the printed circuit board (3), the image sensor (15) and a portion of the pin (21.1) comprising a ground connection, • an electrically conductive element (30) located in electrical connection with the pin (21.1) comprising a ground connection, the electrically conductive element (30) being in electrical contact with the housing (7, 8) such that a closed electrical loop is formed among the printed circuit board (3), the pin (21.1) comprising a ground connection, the electrically conductive element (30), the housing (7, 8) and the printed circuit board (3).

An unshielded data connection is disposed on a first surface of a printed circuitry board having a major plane. The unshielded data connection is disposed within an imaginary plane, perpendicular to the surface of the printed circuit board, that includes the unshielded data connection as a line segment within the imaginary plane. A symmetrical arrangement of one or more ground connections is disposed around the unshielded data connection. The arrangement is symmetrical with respect to the imaginary plane.

A differential transmission board set includes a mounting board on which a compression connector is mounted and a contact board configured to come into contact with the compression connector. In the contact board, a second conductor layer is a ground layer and has a penetrating hole. The penetrating hole is formed in such a way that a first signal pad and a second signal pad are both located inside an inner edge of the penetrating hole. In the contact board, the penetrating hole is formed to overlap an outer region of the first ground pad and an outer region of the second ground pad.

The invention discloses a charger switch tube grounding structure and a vehicle-mounted charger, a switch tube is arranged on a substrate, the substrate is a vertical substrate, and a grounding device is arranged on the substrate. The grounding device comprises a first connecting end and a second connecting end, the first connecting end is used for being electrically connected with the grounding end of the switch tube, the second connecting end is used for being electrically connected with a charger shell, a buffer part is arranged between the first connecting end and the second connecting end, and the grounding device enables the switch tube and the charger shell to form an electrical path. According to the invention, the grounding of the switch tube is realized by using the specially designed grounding device. Compared with the prior art, the grounding path is shorter, and the loss of the grounding path can be effectively reduced. The grounding device is a sheet metal part, and the middle part of the sheet metal part is provided with a roundabout bending part to form a buffer part. The buffer part can buffer stress, and damage to the substrate and other parts caused by mechanical stress is avoided.

A wiring board includes a wiring layer, a shield layer, and an insulating layer. The wiring layer includes at least one signal line and at least one ground line. The shield layer overlaps the wiring layer in plan view. The insulating layer is provided between the wiring layer and the shield layer. The insulating layer includes at least one end portion surrounded by the insulating layer. The at least one end portion is located on at least the at least one ground line. A connection conductor line electrically connecting the shield layer to the at least one ground line is provided on part of the at least one end portion.

The invention discloses a circuit board, a grounding structure and interactive equipment. The circuit board is applied to the interactive equipment with the grounding structure. The grounding structure is provided with a clamping groove used for installing a circuit board. The circuit board comprises a base layer and a first GND network layer, the base layer comprises a main body part and two plugging parts located on the two opposite sides of the main body part in the first direction, the first GND network layer extends in the second direction forming an included angle with the first direction, at least one plugging part is provided with the first GND network layer, and the circuit board is matched with the clamping groove in a plugging mode. And the first GND network layer is in conductive contact with the groove wall of the clamping groove so as to be grounded. By means of the design, the stability of the circuit board installed in the clamping groove can be achieved, the grounding path of the circuit board can be shortened, impedance between a GND network in the circuit board and the ground of the whole machine is reduced, and stable transmission of analog signals in the circuit board is guaranteed.

An electronic device may include: a display; a conductive plate facing the display; a first circuit board including a first opening having an electronic component disposed thereon; a second circuit board having an integrated circuit disposed thereon, wherein the integrated circuit is disposed in the first opening; a shield can having a second opening and disposed on the first circuit board to surround the periphery of the electronic component; a shielding member covering the second opening; a vapor chamber disposed between the conductive plate and the shielding member when the display is viewed from a first direction; a first conductive member electrically connecting the conductive plate and the vapor chamber; and a second conductive member electrically connecting the vapor chamber and the shield can. The second conductive member may be disposed so as not to overlap the shielding member when viewed from the first direction.

The invention relates to an electronic device. The electronic device according to an embodiment of the present invention comprises: a housing; the circuit board is arranged in the shell; a camera assembly spaced apart from the circuit board; and a flexible circuit board including a first rigid portion connected to the camera assembly, a second rigid portion connected to the circuit board, and a flexible portion connecting the first rigid portion and the second rigid portion. The flexible circuit board may include: a substrate layer; a first conductive layer coupled to the substrate layer; a first shielding layer spaced apart from the first conductive layer and including a 1-1 shielding layer portion in the first rigid portion, a 1-2 shielding layer portion in the second rigid portion, and a 1-3 shielding layer portion in the flexible portion; and a first ground layer connected to the first shielding layer, and at least a portion of the first ground layer extends along a periphery of the first rigid portion. Various other embodiments are also possible.

The present invention provides an electronic device which is provided with: a wiring board which has a mounting surface; a ground electrode which defines a ground region on the mounting surface; an electronic component which is arranged within the ground region on the mounting surface; a conductive component which is arranged adjacent to the outer edge of the ground electrode; an internal insulating protective layer which is arranged within the ground region and covers the electronic component; an external insulating protective layer which is arranged outside the ground region and covers the conductive component; and an electromagnetic shielding layer which is a solidified product of an ink for the electromagnetic shielding layer formation, and which is provided so as to extend across the internal insulating protective layer and the ground electrode, while covering the internal insulating protective layer and being electrically connected to the ground electrode. The present invention also provides a method for producing this electronic device.

The present invention relates to the field of radio frequency circuits, in particular to a radio frequency device which comprises a plurality of dielectric plates; functional modules are respectively arranged on the dielectric plates; the functional modules comprise integrated circuits and electronic components; the dielectric plates are sequentially stacked; the dielectric plates at middle layers are partially hollowed out to form closed spaces, the closed spaces being used for placing the integrated circuits and electronic components. The design of the present invention can improve the isolation degree while maintaining the advantages of high integration level and small size of systems on chip.

A network communication device has a circuit board, a network communication chip, an antenna, and a metal cover. The circuit board has a first surface and a second surface opposite to each other. An interior of the circuit board has a ground layer. An edge of the first surface has a ground ring. The ground ring surrounds the first surface and is electrically connected to the ground layer. The network communication chip is disposed on the first surface. The antenna is electrically connected to the circuit board. The metal cover has an annular support rib. The circuit board is disposed on the annular support rib with the first surface facing the metal cover. The ground ring is in physical contact with and electrically connected to the annular support rib.

The invention provides a circuit board assembly, a radio frequency module, a transceiver and a base station. The circuit board assembly comprises a circuit board, conductive adhesive and an electronic device which are sequentially stacked, the first surface, facing the circuit board, of the electronic device comprises a grounding area, and the projection, on the circuit board, of the conductive adhesive and the projection, on the circuit board, of the grounding area are overlapped. The connection structure between the circuit board and the electronic device can be prevented from cracking, and the electronic device can be prevented from cracking.

A structure includes a main substrate including a first surface and a second surface opposite to the first surface, a power supply module on the main substrate, a socket in the main substrate, and one or more power supply wirings and one or more signal wirings extending in a thickness direction of the main substrate and penetrating the socket. Each of the one or more power supply wirings includes a first end on the first surface side and a second end on a side opposite to the first end. Each of the one or more signal wirings includes a third end to be electrically connected to an electronic component and a fourth end on a side opposite to the third end. The fourth end is electrically connected to a conductor pattern on the first surface.

Apparatus and methods for conductive memory module notch and connector-to-motherboard pins for power or ground. A memory module includes a conductive notch that is coupled to either one or more ground planes in respective layers in the memory module's PCB or to a power rail formed on one or more layers in the PCB. A memory module connector includes a notch pin that is configured to mate with the conductive notch when the memory module is installed in the connector. The connector is mounted to a motherboard or the like and the notch pin is coupled to either power (e.g., Vin) or ground in the motherboard. When coupled to power, Vin is supplied to the memory module via the notch pin / conductive notch. When coupled to ground on the motherboard, at least a portion of the ground planes in the PCB are coupled to ground via the notch pin / conductive notch.

The present invention discloses a multi-channel ion transmission device for mass spectrometry and ion mobility spectrometry instruments; the device is mainly used in instruments such as ion mobility mass spectrometry to realize the effective transmission of ions in various groups of components and various levels of vacuum environment. The device includes two parts: a connecting fixture and an ion transmission component. The fixture is used to fix the ion transmission component, and the ion transmission component is a circuit board used to assemble an ion transmission channel. The circuit board includes components such as an ion gate, a traveling wave electrode, a DC protection electrode, and has been integrated on a circuit board. When in use, it is only necessary to place the two circuit boards in a mirror image and install them with fixtures. The present invention can realize functions such as multi-channel ion transmission, diversion, and guidance, and requires few parts and is simple to install, which greatly avoids the problems of system error amplification, difficult disassembly and assembly, long maintenance time, and high cost caused by multiple parts combination.

An electronic component includes a circuit board and a metal casing. The circuit board includes at least one opening and at least one pad. The circuit board is detachably connected to the metal casing. The metal casing includes a plate, a first connecting member and a second connecting member. The plate is connected to the first connecting member and the second connecting member. The first connecting member and the second connecting member partially pass through the at least one opening and are connected to the circuit board. The first connecting member and the second connecting member contact the at least one pad, so that the circuit board is electrically connected to the plate.

A characteristic impedance control structure includes a first and a second transmission line, a ground pattern and a ground component. The first transmission line and the ground pattern extend along a plane. The ground pattern is spaced from the first transmission line by a first distance. The second transmission line extends along a direction and electrically connects to the first transmission line. An angle between the direction and the plane is greater than zero. The second transmission line has an outer diameter. The ground component extends along the direction and is electrically connected to the ground pattern. The ground component is next to and spaced from the second transmission line by a second distance. The ground component has a length along the direction. The first distance is less than or equal to twice the length. The second distance is less than or equal to five times the outer diameter.

A flexible circuit assembly and a cover for a traction inverter system of an electric vehicle are provided. The flexible circuit assembly includes a flexible printed circuit body, a first connector, and a second connector. The flexible printed circuit body forms an angled shape having an inner side and an outer side. The cover includes an outer surface, an inner surface including ribs, and a perimeter configured to be attached to a housing. The outer surface includes a central region, a first lateral region, and a second lateral region, and a constrained layer damping material. The central region, the first lateral region, and the second lateral region form contours, and the constrained layer damping material conforms to the contours.