107results about "Printed circuit grounding" patented technology

A high-speed transmission circuit comprises, as part of a signal path, a connector pin disposed on a pad that comprises an unused pad region. The unused pad region is not considered part of the signal path but is part of a resonant sub-circuit. In various embodiments, by properly adjusting the dimensions of the pad region and other structures in the high-speed transmission circuit, resonant frequencies of the sub-circuit are shifted to a frequency range that is outside of the frequency range of interest in the signal path, thereby, reducing insertion loss and increasing signal integrity without compromising mechanical stability.

This application relates to a heat dissipation shielding structure and a processing method, a circuit board assembly, and an electronic device. The printed circuit board includes a mounting surface. Electronic components are mounted on the mounting surface. The electronic components include an active component and a passive component. The heat dissipation shielding structure includes an insulating layer. The insulating layer is covered on the mounting surface, and wraps at least a side surface of the active component, so that a side that is of the insulating layer and that faces away from the mounting surface forms a first surface together with a top surface of the active component. A shielding layer is covered on the first surface, a shape of the shielding layer matches a shape of the first surface, and the shielding layer is electrically connected to a ground network of the printed circuit board.

A paddle card includes a printed circuit board (PCB), a shielded cable, and an electromagnetic interference (EM) shield. The PCB includes a first metal layer on a top surface of the PCB, a second metal layer within the PCB, and a cavity in the top surface of the PC. The cavity exposes the second metal layer. The first metal layer includes a first ground pad. The second metal layer includes a signal pad located within the cavity. The shielded cable includes a signal conductor coupled to the first signal pad. The EMI shield is coupled to the ground pad and covers the cavity.

A differential transmission board set includes a mounting board on which a compression connector is mounted and a contact board configured to come into contact with the compression connector. In the contact board, a second conductor layer is a ground layer and has a penetrating hole. The penetrating hole is formed in such a way that a first signal pad and a second signal pad are both located inside an inner edge of the penetrating hole. In the contact board, the penetrating hole is formed to overlap an outer region of the first ground pad and an outer region of the second ground pad.

A wiring board includes a wiring layer, a shield layer, and an insulating layer. The wiring layer includes at least one signal line and at least one ground line. The shield layer overlaps the wiring layer in plan view. The insulating layer is provided between the wiring layer and the shield layer. The insulating layer includes at least one end portion surrounded by the insulating layer. The at least one end portion is located on at least the at least one ground line. A connection conductor line electrically connecting the shield layer to the at least one ground line is provided on part of the at least one end portion.

An electronic device may include: a display; a conductive plate facing the display; a first circuit board including a first opening having an electronic component disposed thereon; a second circuit board having an integrated circuit disposed thereon, wherein the integrated circuit is disposed in the first opening; a shield can having a second opening and disposed on the first circuit board to surround the periphery of the electronic component; a shielding member covering the second opening; a vapor chamber disposed between the conductive plate and the shielding member when the display is viewed from a first direction; a first conductive member electrically connecting the conductive plate and the vapor chamber; and a second conductive member electrically connecting the vapor chamber and the shield can. The second conductive member may be disposed so as not to overlap the shielding member when viewed from the first direction.

The invention relates to an electronic device. The electronic device according to an embodiment of the present invention comprises: a housing; the circuit board is arranged in the shell; a camera assembly spaced apart from the circuit board; and a flexible circuit board including a first rigid portion connected to the camera assembly, a second rigid portion connected to the circuit board, and a flexible portion connecting the first rigid portion and the second rigid portion. The flexible circuit board may include: a substrate layer; a first conductive layer coupled to the substrate layer; a first shielding layer spaced apart from the first conductive layer and including a 1-1 shielding layer portion in the first rigid portion, a 1-2 shielding layer portion in the second rigid portion, and a 1-3 shielding layer portion in the flexible portion; and a first ground layer connected to the first shielding layer, and at least a portion of the first ground layer extends along a periphery of the first rigid portion. Various other embodiments are also possible.

The present invention provides an electronic device which is provided with: a wiring board which has a mounting surface; a ground electrode which defines a ground region on the mounting surface; an electronic component which is arranged within the ground region on the mounting surface; a conductive component which is arranged adjacent to the outer edge of the ground electrode; an internal insulating protective layer which is arranged within the ground region and covers the electronic component; an external insulating protective layer which is arranged outside the ground region and covers the conductive component; and an electromagnetic shielding layer which is a solidified product of an ink for the electromagnetic shielding layer formation, and which is provided so as to extend across the internal insulating protective layer and the ground electrode, while covering the internal insulating protective layer and being electrically connected to the ground electrode. The present invention also provides a method for producing this electronic device.

Apparatus and methods for conductive memory module notch and connector-to-motherboard pins for power or ground. A memory module includes a conductive notch that is coupled to either one or more ground planes in respective layers in the memory module's PCB or to a power rail formed on one or more layers in the PCB. A memory module connector includes a notch pin that is configured to mate with the conductive notch when the memory module is installed in the connector. The connector is mounted to a motherboard or the like and the notch pin is coupled to either power (e.g., Vin) or ground in the motherboard. When coupled to power, Vin is supplied to the memory module via the notch pin / conductive notch. When coupled to ground on the motherboard, at least a portion of the ground planes in the PCB are coupled to ground via the notch pin / conductive notch.

A characteristic impedance control structure includes a first and a second transmission line, a ground pattern and a ground component. The first transmission line and the ground pattern extend along a plane. The ground pattern is spaced from the first transmission line by a first distance. The second transmission line extends along a direction and electrically connects to the first transmission line. An angle between the direction and the plane is greater than zero. The second transmission line has an outer diameter. The ground component extends along the direction and is electrically connected to the ground pattern. The ground component is next to and spaced from the second transmission line by a second distance. The ground component has a length along the direction. The first distance is less than or equal to twice the length. The second distance is less than or equal to five times the outer diameter.

The disclosure relates to an integral electronic stack and a multi-layer stack. Specifically, according to an embodiment of the disclosure, there is provided an integral electronic stack for grounding an electrically conductive component in which passive intermodulation (PIM) is reduced, wherein the integral electronic stack includes a first integral stack and a second integral stack, the first integral stack being bonded to the second integral stack, wherein the first integral stack includes: a first board which is substantially rigid; a first electrically conductive layer which is disposed on at least part of a first main surface of the first board; a first electrically conductive adhesive layer and a second electrically conductive adhesive layer; and a first electrically conductive film which is disposed between the first electrically conductive adhesive layer and the second electrically conductive adhesive layer, and is bonded to the first electrically conductive adhesive layer and the second electrically conductive adhesive layer, respectively, the first electrically conductive adhesive layer and the second electrically conductive adhesive layer including a plurality of electrically conductive elements substantially distributed in an electrically insulative material, wherein the first electrically conductive adhesive layer bonds the first electrically conductive film to the one or more first electrically conductive layer.

The invention provides a display module, a manufacturing method thereof and a display device, and the display module comprises a display panel which comprises a display area and a binding area bent to the back surface of the display area; the flexible circuit board is electrically connected with the binding area, and a copper exposing area is arranged on the side, away from the display area, of the flexible circuit board; one end of the covering belt is attached to the binding area, and the other end of the covering belt is attached to the side, away from the display area, of the flexible circuit board; the covering belt comprises a first insulating layer, a conductive layer and a second insulating layer which are sequentially arranged away from the display area; wherein a first via hole is formed in the thickness direction of the first insulating layer, and a second via hole is formed in the thickness direction of the second insulating layer; the to-be-grounded structure is located on the side, away from the display area, of the covering tape; wherein the to-be-grounded structure is electrically connected with the conductive layer through the second via hole, the copper exposed region is electrically connected with the conductive layer through the first via hole, and the copper exposed region is grounded.

To provide a bonded and sealed electronic control unit in which a plastic housing, a base and a printed circuit board are assembled at low cost.SOLUTION: An apparatus includes a housing (an upper housing 102 and a lower housing (or cover or baseplate)), a circuit board 110, a sealant 140 and a baseplate 104. The housing has a shelf 122 and a flange 124 along an open side. The circuit board is disposed on the shelf of the housing and inside the flange of the housing, and secured to the housing. The sealant is dispensed (i) through the open side of the housing and along a gap between the flange and the circuit board. The baseplate is compressed to the housing thereby causing the sealant to flow between the baseplate and the circuit board and between the baseplate and the flange.SELECTED DRAWING: Figure 7

An electronic package is provided. The electronic package comprises an electronic component, a substrate, a ground plane, a thermally conductive pathway and at least one thermally conductive member. The ground plane is enclosed in or supported by the substrate. The electronic component includes a non-groundable thermal output and is mounted to the substrate. The thermally conductive pathway extends within the substrate between an interface exposed on a surface of the substrate and the ground plane. The thermally conductive pathway is configured to electrically isolate the interface from the ground plane. The thermally conductive member couples the output to the interface. An electronic device comprising such an electronic package is also provided.

The invention provides a circuit board structure. The circuit board structure comprises a substrate, a first coaxial via hole, a second coaxial via hole and a plurality of grounding via holes, the substrate has a first surface and a second surface opposite to the first surface. The first coaxial via hole and the second coaxial via hole are arranged in the substrate, and the impedance of the first coaxial via hole and the impedance of the second coaxial via hole are respectively smaller than 50 ohms. The plurality of grounding through holes are arranged around the first coaxial via hole and the second coaxial via hole. The first coaxial via and the second coaxial via are configured to transmit a signal having a frequency in a range of 50 GHz to 68 GHz.

The embodiment of the invention discloses an electronic device which comprises a shell, a metal connecting piece, a main control board, a fixing support, a conductive layer, an elastic conductive connector and a flexible circuit board, the metal connecting piece is connected in an installation groove in the shell, and the fixing support and the main control board are arranged in the shell. The conductive layer is formed on the top face, the connecting face and the outer side face of the fixing support through the PDS technology, the two ends of the elastic conductive connector are electrically connected with the metal connecting piece and the conductive layer respectively, one end of the flexible circuit board is electrically connected with the conductive layer, and the other end of the flexible circuit board is electrically connected with the main control board. Therefore, static electricity generated on the metal connecting piece is discharged and conducted to a grounding point of the main control board through the flexible circuit board. The grounding mode of the metal connecting piece in the electronic equipment is simple, the number of parts is small, the assembly process is simplified, and the electrostatic protection effect is achieved.

The embodiment of the invention provides electronic equipment. The electronic equipment comprises a charging interface, a first circuit board, a metal reinforcing piece and a support assembly. The first circuit board comprises a connecting end. The connecting end is provided with a grounding terminal. The connecting end is electrically connected with the charging interface. The metal reinforcing member and the connecting end are arranged in a stacked manner. The metal reinforcing member is electrically connected with the grounding terminal. The support assembly comprises a metal support and a conductive part. At least part of the connecting end is located in the metal support. The metal support comprises a main body part and a grounding part. The grounding part is electrically connected with the main body part. And the metal reinforcing piece and the main body part are electrically connected with the conductive piece respectively. The grounding part is used for grounding. According to the electronic equipment provided by the embodiment of the invention, the structural design difficulty is reduced, and the assembly difficulty and the production cost are reduced.

The invention relates to an automation field device (1), having: - a housing (2) which encloses an interior (3); - a sensor and / or actuator element (4) arranged on or in the housing (2); - an electronic circuit (5) arranged in the housing (2) for operating the sensor and / or actuator element (4), wherein the electronic circuit (5) has at least one printed circuit board (5.1), wherein the at least one printed circuit board has at least two spring arms formed from the printed circuit board, wherein at least two of the spring arms are formed in a plane of the printed circuit board such that the two spring arms extend outwards at mutually opposite printed circuit board edges of the printed circuit board, and wherein the two opposite spring arms are designed and matched to the interior such that the spring arms generate a clamping force for the printed circuit board introduced into the interior and hold the printed circuit board in the interior, wherein at least one of the spring arms has an electrically conductive coating in order to achieve an electrically conductive connection between the printed circuit board and the housing.

A method for manufacturing an electronic package comprises providing at least one electronic component, the at least one electronic component including at least one non-groundable thermal output, providing a substrate in which a ground plane is enclosed in or supported by the substrate, defining at least one thermally conductive pathway extending between an interface exposed on the substrate and the ground plane such that the interface is electrically isolated from the ground plane, and mounting the electronic component to the substrate, the mounting including thermally coupling the output to the interface with at least one thermally conductive member.

The present application relates to the technical field of LED display, and discloses an LED module having through channels and conforming to certification standards of DCI and a display screen. The LED module includes a printed circuit board, the printed circuit board being provided with a plurality of first through channels, an inner peripheral side wall of the first through channel being provided with a first conductive layer, both sides of the printed circuit board being respectively provided with a conductive edge corresponding to the first through channel one to one, the conductive edge being disposed around a peripheral side of the first through channel and connected to the first conductive layer, and the first conductive layer being disposed in a grounding manner; and a supporting structure, which is disposed opposite to the printed circuit board and tightly connected to the printed circuit board, and has a plurality of second through channels, the supporting structure having a second conductive layer, and the second conductive layer being grounded and abutting against the conductive edge. The present application solves the problems for reducing blockage of the LED screen on sound and having a risk of data leakage.

An electronic apparatus includes: an electronic component; a substrate including a first layer at which the electronic component and a first ground pattern are disposed, and a second layer at which a second ground pattern is disposed; and a case which is in contact with the first ground pattern, covers the electronic component, reduces magnetic noise, and is fixed to the substrate, and plural conductors connecting the first ground pattern and the second ground pattern are disposed along a portion of the first ground pattern, the portion being in contact with the case.

A base station for an unmanned aerial vehicle (UAV) is disclosed. The base station includes: an enclosure; a slide mechanism that is connected to the enclosure and which is repositionable between a retracted position and an extended position; a cradle that is connected to the slide mechanism and which is configured for docking with the UAV such that the UAV is movable into and out of the enclosure during repositioning of the slide mechanism between the retracted position and the extended position; and a charging hub that is connected to the slide mechanism and which is configured for electrical connection to a power source of the UAV to charge the power source.

This application provides an electrical connection structure and an electronic device, and relates to the field of interconnection technologies of a circuit board, to reduce a size of a circuit board and increase sizes of other components around the circuit board. The electrical connection structure includes a circuit board, a first connector, a third group of terminals, and a fourth group of terminals. The circuit board includes a first group of signal traces, a second group of signal traces, a first reference ground, and a second reference ground. The first reference ground and the second reference ground are spaced apart from each other. The first connector is arranged on the circuit board. The first connector includes a first group of terminals and a second group of terminals. The third group of terminals are electrically connected to the first group of terminals by using the first group of signal traces and the first reference ground. The fourth group of terminals are electrically connected to the second group of terminals by using the second group of signal traces and the second reference ground. The electrical connection structure provided in this application is used for circuit board interconnection.

A transmission cable includes a transmission cable, a first circuit board having a first power layout area, a first ground layout area, and a first circuit trace, and a second circuit board having a second power layout area, a second ground layout area, and a second circuit trace. The transmission cable includes a power wire, a pair of signal wires, and a drain wire. When the first power layout area, the first circuit trace, the second power layout area, and the second circuit trace are connected via a resistor, respectively, the drain wire connected between the first circuit trace and the second circuit trace will act as another power wire. Thus, a voltage drop at both ends of the transmission cable can be reduced by increasing the power wires to improve signal transmission quality.

An electric compressor is provided that can suppress deformation in the circuit board caused by the fastening connection to the housing and busbar and effectively reduce noise components in the circuit board. The converter section includes a circuit board, a busbar fixed to the converter housing and electrically connecting an external power supply to the circuit board, a noise reduction circuit mounted on the circuit board, a first fastening connection member fastening the circuit board to the converter housing, and a second fastening connection member fastening the circuit board to the busbar. The circuit board has a first fastening connection hole through which the first fastening connection member is inserted, a second fastening connection hole disposed adjacent to the first fastening connection hole and through which the second fastening connection member is inserted, and a slit extending from the outer edge of the circuit board between the first fastening connection hole and the second fastening connection hole. Through the fastening connection of the first fastening connection hole, the circuit board is electrically connected to the converter housing as ground for the noise reduction circuit.

Embodiments described herein may be related to apparatuses, processes, and techniques related to EMI shielding and thermal conduction without using any surface area of a PCB. Embodiments of the EMI shield may include a planar top, with one or more walls extending from the planar top to a bottom surface of the PCB, the PCB having a top surface disposed between the bottom surface of the PCB and the planar top. A ground of the PCB may electrically couple with the one or more walls. The bottom of the walls may couple with an EMI gasket applied to a bottom chassis to increase the volume of EMI shielding. Other embodiments may be described and / or claimed.

The invention discloses an integrated structure of a PCB (Printed Circuit Board) and a pin heat dissipation substrate. The integrated structure comprises a PCB body and the pin heat dissipation substrate, the back surface of the PCB body is welded with the pin heat dissipation substrate, the PCB body is provided with a heat conduction through hole penetrating through the PCB body, one end of the heat conduction through hole is in contact with the pin heat dissipation substrate, and the other end of the heat conduction through hole extends to the front surface of the PCB body. According to the integrated structure, the back surface of the PCB body is directly welded with the pin heat dissipation substrate, and the heat conduction through holes are arranged, so that heat generated by a heating element on the PCB is quickly conducted to the pin heat dissipation substrate through the heat conduction through holes, and the pin unit is in full contact with a heat dissipation medium, so that the heat is quickly dissipated.

The invention provides a printed circuit board, a vehicle lamp control module and a vehicle lamp system, and belongs to the technical field of vehicle lamp control. The printed circuit board comprises a top layer, a first ground plane, a first wiring layer, a second wiring layer, a second ground plane and a bottom layer. Wherein the first ground plane is arranged between the top layer and the first wiring layer, the second ground plane is arranged between the bottom layer and the second wiring layer, and the first wiring layer is arranged on the side, opposite to the bottom layer, of the second wiring layer; a power line is arranged on the first wiring layer, and a signal line is arranged on the second wiring layer; the first ground plane and the second ground plane are grounded, the first ground plane is used for isolating interference of the top layer on the first wiring layer, and the second ground plane is used for isolating interference of the bottom layer on the second wiring layer. The electromagnetic compatibility of the vehicle lamp control module can be improved, and then the performance stability of the vehicle lamp system is improved.

The application discloses a circuit arrangement structure and a layout method thereof in the technical field of electrical engineering, and comprises the following: a negative electrode for providing grounding to form a circuit and not contacting a positive electrode; the positive electrode for supplying power and forming a circuit and not contacting the negative electrode; an electric connection plate A for contacting the positive electrode or the negative electrode and being communicated with an electric connection plate B, components and wires to form a power supply circuit; the electric connection plate B for contacting the negative electrode or the positive electrode and being communicated with the electric connection plate A, components and wires to form the power supply circuit; and the layout interval of the positive electrode is L, the side length a of the electric connection plate A and the side length b of the electric connection plate B satisfy the following relationship: L=(a+b) / 2. The power supply circuit can be realized in a very small range, no additional grounding wire is needed, and the power supply circuit can be formed at any position of the circuit, and the application has the characteristics of small space occupation, economy and safety.

A printed circuit board assembly according to an embodiment may comprise: a first printed circuit board; a second printed circuit board; a first interposer circuit at least partially surrounding a first space between the first printed circuit board and the second printed circuit board; and a thermally conductive material disposed in the first space. The first interposer circuit may form a first ventilation path through which air can move from the first space to the outside of the printed circuit board assembly when the thermally conductive material is injected into the first space through a first hole formed through the first printed circuit board. The first ventilation path may connect a first end portion formed on the outside of a first portion of the first interposer circuit facing the outside to a second end portion formed on the inside of the first portion facing the first space. The length of the first ventilation path may be greater than the width of a portion of the first interposer circuit in which the first ventilation path is formed.