396results about "Printed circuit grounding" patented technology

A base station is disclosed for an unmanned aerial vehicle (UAV) that includes: an enclosure defining a window that is configured to receive the UAV to allow for entry of the UAV into the base station and exit of the UAV from the base station; a door that is movably connected to the enclosure such that the door is repositionable between a closed position and an open position; a sealing member that extends about the window and which is configured for engagement with the door so as to form a seal therewith in the closed position; and a heating system that is supported by the enclosure and which is configured to heat the door and / or the sealing member to support operation (e.g., opening and closure) of the door in a cold environment, wherein the heating system includes at least one light source and at least one heating element.

A base station is disclosed for an unmanned aerial vehicle (UAV). The base station includes: an enclosure; a slide mechanism that is connected to the enclosure and which is repositionable between a retracted position and an extended position; and a cradle that is connected to the slide mechanism and which defines a chamber that is configured to receive the UAV such that the UAV is movable into and out of the enclosure during repositioning of the slide mechanism between the retracted position and the extended position. The cradle includes: an upper shell; a lower shell that is connected to the upper shell; and at least one thermal insulator that is located between the upper shell and the lower shell.

A docking system is disclosed for an unmanned aerial vehicle (UAV). The docking system includes a base station that is configured to receive the UAV and a pedestal that is configured to support the base station in an elevated position. The pedestal defines an interior space that is configured in correspondence with an outer contour of the base station such that the base station is positionable within the pedestal to protect the base station during nonuse.

The embodiment of the invention provides electronic equipment. The electronic equipment comprises a charging interface, a first circuit board, a metal reinforcing piece and a support assembly. The first circuit board comprises a connecting end. The connecting end is provided with a grounding terminal. The connecting end is electrically connected with the charging interface. The metal reinforcing member and the connecting end are arranged in a stacked manner. The metal reinforcing member is electrically connected with the grounding terminal. The support assembly comprises a metal support and a conductive part. At least part of the connecting end is located in the metal support. The metal support comprises a main body part and a grounding part. The grounding part is electrically connected with the main body part. And the metal reinforcing piece and the main body part are electrically connected with the conductive piece respectively. The grounding part is used for grounding. According to the electronic equipment provided by the embodiment of the invention, the structural design difficulty is reduced, and the assembly difficulty and the production cost are reduced.

A board-to-board connector includes electrical leads to bridge from one board to another board, to interconnect pads on one surface of the boards. The boards can interconnect while aligned in substantially the same plane with an inline connector. The connector includes a lead frame having the electrical leads and the connector includes an alignment frame to hold the lead frame. The connector includes a conductive case to secure over the alignment frame. The connector includes screw holes to allow screws to secure the connector in place against the boards and ensure electrical connection between the pads on the two boards through the electrical leads of the connector. The alignment frame includes posts to mate with alignment holes in the boards.

A high-speed transmission circuit comprises, as part of a signal path, a connector pin disposed on a pad that comprises an unused pad region. The unused pad region is not considered part of the signal path but is part of a resonant sub-circuit. In various embodiments, by properly adjusting the dimensions of the pad region and other structures in the high-speed transmission circuit, resonant frequencies of the sub-circuit are shifted to a frequency range that is outside of the frequency range of interest in the signal path, thereby, reducing insertion loss and increasing signal integrity without compromising mechanical stability.

This application relates to a heat dissipation shielding structure and a processing method, a circuit board assembly, and an electronic device. The printed circuit board includes a mounting surface. Electronic components are mounted on the mounting surface. The electronic components include an active component and a passive component. The heat dissipation shielding structure includes an insulating layer. The insulating layer is covered on the mounting surface, and wraps at least a side surface of the active component, so that a side that is of the insulating layer and that faces away from the mounting surface forms a first surface together with a top surface of the active component. A shielding layer is covered on the first surface, a shape of the shielding layer matches a shape of the first surface, and the shielding layer is electrically connected to a ground network of the printed circuit board.

An electronic device may include a housing, a circuit board disposed in the housing, a camera assembly spaced apart from the circuit board, and a flexible circuit board including a first rigid portion connected to the camera assembly, a second rigid portion connected to the circuit board and a flexible portion connecting the first rigid portion and the second rigid portion. The flexible circuit board may include a base layer, a first conductive layer coupled to the base layer, a first shielding layer including a 1-1th shielding layer portion located in the first rigid portion, a 1-2th shielding layer portion located in the second rigid portion and a 1-3th shielding layer portion located in the flexible portion, and spaced apart from the first conductive portion, and a first ground layer, wherein at least a portion of the first ground layer extends along a circumference of the first rigid portion, and the first ground layer is connected to the first shielding layer. Other various embodiments are also available.

The invention discloses electronic equipment, and belongs to the technical field of charging. The electronic equipment comprises a frame body, a main circuit board and a battery are arranged in the frame body, a charging interface is formed in one side of the frame body, the battery is arranged between the charging interface and the main circuit board, and the charging interface is electrically connected with the main circuit board through an FPC; wherein the FPC comprises a main body part and a branch part, the branch part is arranged on one side of the main body part, the two ends of the main body part are electrically connected with the charging interface and the main circuit board respectively, the first end of the branch part is connected with the main body part, and the second end of the branch part is grounded.

There is provided a printed wiring board including an outermost conductive layer that includes a plurality of conductive pads, a first conductive layer that includes a first inner-layer wiring and is stacked on the conductive layer, a second conductive layer that includes a second inner-layer wiring and is stacked on the conductive layer and the first conductive layer, a first signal via that connects one of the conductive pads and the first inner-layer wiring with each other, a second signal via connecting another one of the conductive pads and the second inner-layer wiring with each other, and a stitching via that is connected to a ground. The first inner-layer wiring and the second inner-layer wiring form a common wiring route in which the first inner-layer wiring and the second inner-layer wiring are stacked and disposed in a connection area in which the conductive pads are arranged.

The present application relates to a flexible circuit board, a display panel, and a display apparatus. The flexible circuit board comprises: a substrate, an electronic element, and an adhesive layer. The substrate comprises a device region, the device region is located on an upper surface of the substrate, and the electronic element is fixed in the device region. The adhesive layer is fixed on a lower surface of the substrate. The adhesive layer comprises an adhesive portion and a cavity portion formed by hollowing out part of the adhesive portion, and the cavity portion is located below the device area. When the electronic element is fixed to the device area by means of surface mount technology, a concave-convex mark will be generated on the lower surface of the substrate, and the cavity portion is arranged below the device area in the present application, such that the concave-convex mark on the lower surface of the substrate can be prevented from being transferred to other film layers.

A paddle card includes a printed circuit board (PCB), a shielded cable, and an electromagnetic interference (EM) shield. The PCB includes a first metal layer on a top surface of the PCB, a second metal layer within the PCB, and a cavity in the top surface of the PC. The cavity exposes the second metal layer. The first metal layer includes a first ground pad. The second metal layer includes a signal pad located within the cavity. The shielded cable includes a signal conductor coupled to the first signal pad. The EMI shield is coupled to the ground pad and covers the cavity.

The invention discloses electronic equipment, and belongs to the technical field of electronic equipment. The electronic equipment comprises a circuit board, a camera module, a conductive layer, a conductive part and a mainboard bracket, the camera module comprises a first camera module and a second camera module, and the first camera module and the second camera module are both arranged on the circuit board; the first camera module comprises a first camera and a first connector, and the first connector is electrically connected with the first camera; the second camera module comprises a second camera and a second connector, and the second connector is electrically connected with the second camera; the conductive layer is arranged on the surface of the side, away from the circuit board, of the camera module, and the conductive layer covers and is electrically connected to the first camera, the first connector and the second connector; the mainboard support covers the side, away from the circuit board, of the conductive layer, the conductive layer is electrically connected with the mainboard support through a conductive piece, and the mainboard support is grounded.

Provided in the present application are an electrically conductive elastic connector and an electronic device. The electrically conductive elastic connector comprises a foam core. The foam core comprises a porous foam body and electrically conductive layers located on the porous foam body. Nanowires are attached to the interior and an outer surface of the porous foam body to form the electrically conductive layers. The electrically conductive elastic connector further comprises a first electrically conductive adhesion layer, a second electrically conductive adhesion layer, a first electrically conductive film and a second electrically conductive film, wherein the first electrically conductive adhesion layer is located on a first surface of the foam core; the second electrically conductive adhesion layer is located on a second surface of the foam core; the first electrically conductive film is stacked on the first electrically conductive adhesion layer; the first electrically conductive film is configured to be electrically connected to a first element; the second electrically conductive film is stacked on the second electrically conductive adhesion layer; and the second electrically conductive film is configured to be electrically connected to a second element. By adhering the electrically conductive films to the foam body to which the nanowires are attached, an electrically conductive elastomer with low pressure and low PIM can be formed, thus realizing the long-term stable low PIM performance.

The invention relates to the technical field of solid state disks, in particular to a bonding pad assembly, a circuit board, a memory card, a card seat and a starting judgment device. The bonding pad assembly is distributed on a substrate of the memory card; the bonding pad assembly comprises a plurality of rows of bonding pads; the plurality of rows of bonding pads comprise a first row of bonding pads; the first row of bonding pads comprise a first grounding bonding pad; the width of the first grounding bonding pad is greater than that of any bonding pad in the first row of bonding pads; the length of the first grounding bonding pad is greater than or equal to the length of any bonding pad of the first row of bonding pads; the distance from the central point of the first grounding bonding pad to a preset reference line on the substrate is smaller than the distance from the central point of any bonding pad in the first row of bonding pads to the reference line; wherein the linear direction parallel to the reference line is the width direction of each component of the bonding pad component. The bonding pad assembly is small in size and can support hot plug.

The present application relates to a cooling structure, and specifically relates to a cooling and shielding structure, a processing method, a circuit board assembly and an electronic apparatus. The cooling and shielding structure is applied to a circuit board. The circuit board comprises a mounting surface, electronic components being mounted on the mounting surface, and the electronic components comprising an active device and a passive device. The cooling and shielding structure comprises an insulating layer, the insulating layer covering the mounting surface, coating the side surface and the top surface of the passive device, and at least coating the side surface of the active device, so that the side of the insulating layer facing away from the mounting surface forms a first surface, or the side of the insulating layer facing away from the mounting surface and the top surface of the active device collectively form a first surface. A shielding layer covers the first surface, the shape of the shielding layer being matched with the shape of the first surface, and the shielding layer being electrically connected to a ground end of the circuit board. While achieving a shielding effect on electronic components on circuit boards, the cooling and shielding structure provided in the present application can also improve a cooling effect on the electronic components, thereby improving the working stability and safety of the circuit boards.

A base station for an unmanned aerial vehicle (UAV) is disclosed that includes: an enclosure defining an internal cavity that is configured to receive the UAV; a door that is movably connected to the enclosure; actuators that extend between the door and the enclosure to facilitate opening and closure of the door; a cradle that is configured to receive the UAV and which is movable in relation to the enclosure such that the cradle is repositionable between a retracted position and an extended position to facilitate movement of the UAV into and out of the enclosure; and engagement members that are secured to the actuators and which are configured for contact with propeller assemblies on the UAV to facilitate folding of the propeller assemblies during movement of the UAV into the enclosure.

A power module includes a power circuit board, a signal pin, a shielding substrate, and an electrically insulating component. The signal pin is disposed and stands on the power circuit board. The shielding substrate is located above the power circuit board and spaced apart from the power circuit board. The shielding substrate has a first through hole. The signal pin is disposed through the first through hole. The electrically insulating component surrounds the signal pin. The electrically insulating component has a second through hole. The signal pin is disposed through the second through hole. The signal pin is spaced apart from the shielding substrate by a distance by the electrically insulating component.

The invention discloses a printed circuit board, a solid state disk and electronic equipment. The printed circuit board comprises a plurality of stacked conducting layers, the conducting layers comprise a top conducting layer and a bottom conducting layer which are located on the outermost side in the direction perpendicular to the printed circuit board, and the printed circuit board comprises a top golden finger arranged on the top surface and a bottom golden finger arranged on the bottom surface. In the direction perpendicular to the printed circuit board, the distance between the opposite side surfaces of the top conductive layer and the bottom conductive layer is a first distance, the distance between the opposite side surfaces of the top golden finger and the bottom golden finger is a second distance, and the first distance is larger than the second distance.

The embodiment of the invention provides a circuit board assembly and electronic equipment, and relates to the technical field of electronics, the circuit board assembly comprises a first circuit board and a first elastic pin, a part of the first circuit board is located in a clearance area of an antenna of the electronic equipment, and the first elastic pin is located in the clearance area. And one end of the first elastic pin is electrically connected with the part of the first circuit board in the clearance area, and the other end is grounded. The first elastic pin is arranged in the circuit board assembly, and grounding is carried out through the first elastic pin, so that the current flows back. The first elastic pin has elasticity, so that the reliability and firmness of electric connection between the first elastic pin and the first circuit board can be effectively improved, and the grounding impedance of the circuit board assembly is effectively reduced. Moreover, the first elastic pin can effectively avoid the problems of poor contact and the like of the circuit board assembly in the grounding process, and avoids the PIM effect caused by poor contact, thereby effectively improving the working reliability and stability of the antenna, and improving the communication experience of a user.

Vehicle imaging device, comprising: • an image sensor (15), • a lens (1), • a printed circuit board (3), • a pin (21.1) comprising a ground connection and in electrical connection with the printed circuit board (3), • a housing (7, 8) comprising an inner cavity (12) enclosing at least the printed circuit board (3), the image sensor (15) and a portion of the pin (21.1) comprising a ground connection, • an electrically conductive element (30) located in electrical connection with the pin (21.1) comprising a ground connection, the electrically conductive element (30) being in electrical contact with the housing (7, 8) such that a closed electrical loop is formed among the printed circuit board (3), the pin (21.1) comprising a ground connection, the electrically conductive element (30), the housing (7, 8) and the printed circuit board (3).

The invention provides a PCB hole metallization method based on electric leakage influence suppression and a PCB. The PCB hole metallization method based on suppression of the electric leakage influence comprises the following steps: carrying out hole conditioning treatment for cleaning grease on the surface of a PCB; micro-etching treatment: removing oxides on the copper surface of the PCB and etching the copper surface of the PCB; wherein the micro-etching grounding conductor is arranged in the micro-etching cylinder, and if electric leakage occurs, the micro-etching grounding conductor is used for absorbing charges of liquid medicine in the micro-etching cylinder, so that the micro-etching grounding conductor is used for guiding the charges of the liquid medicine in the micro-etching cylinder to the floor stand; preimpregnation treatment: forming a protective film on the hole wall and the surface of the PCB; activating treatment is carried out to enable the palladium colloid to be attached to the hole wall of the PCB; acceleration processing: stripping the tin colloid layer on the surface of the PCB and in the hole to expose the palladium colloid layer; and carrying out chemical copper treatment for forming a copper layer on the hole wall of the PCB. Therefore, the part, immersed into the micro-etching cylinder, of the micro-etching grounding assembly has high corrosion resistance, and the service life of grounding treatment is prolonged.

An unshielded data connection is disposed on a first surface of a printed circuitry board having a major plane. The unshielded data connection is disposed within an imaginary plane, perpendicular to the surface of the printed circuit board, that includes the unshielded data connection as a line segment within the imaginary plane. A symmetrical arrangement of one or more ground connections is disposed around the unshielded data connection. The arrangement is symmetrical with respect to the imaginary plane.

A differential transmission board set includes a mounting board on which a compression connector is mounted and a contact board configured to come into contact with the compression connector. In the contact board, a second conductor layer is a ground layer and has a penetrating hole. The penetrating hole is formed in such a way that a first signal pad and a second signal pad are both located inside an inner edge of the penetrating hole. In the contact board, the penetrating hole is formed to overlap an outer region of the first ground pad and an outer region of the second ground pad.

The invention discloses a charger switch tube grounding structure and a vehicle-mounted charger, a switch tube is arranged on a substrate, the substrate is a vertical substrate, and a grounding device is arranged on the substrate. The grounding device comprises a first connecting end and a second connecting end, the first connecting end is used for being electrically connected with the grounding end of the switch tube, the second connecting end is used for being electrically connected with a charger shell, a buffer part is arranged between the first connecting end and the second connecting end, and the grounding device enables the switch tube and the charger shell to form an electrical path. According to the invention, the grounding of the switch tube is realized by using the specially designed grounding device. Compared with the prior art, the grounding path is shorter, and the loss of the grounding path can be effectively reduced. The grounding device is a sheet metal part, and the middle part of the sheet metal part is provided with a roundabout bending part to form a buffer part. The buffer part can buffer stress, and damage to the substrate and other parts caused by mechanical stress is avoided.

A wiring board includes a wiring layer, a shield layer, and an insulating layer. The wiring layer includes at least one signal line and at least one ground line. The shield layer overlaps the wiring layer in plan view. The insulating layer is provided between the wiring layer and the shield layer. The insulating layer includes at least one end portion surrounded by the insulating layer. The at least one end portion is located on at least the at least one ground line. A connection conductor line electrically connecting the shield layer to the at least one ground line is provided on part of the at least one end portion.

The invention discloses a circuit board, a grounding structure and interactive equipment. The circuit board is applied to the interactive equipment with the grounding structure. The grounding structure is provided with a clamping groove used for installing a circuit board. The circuit board comprises a base layer and a first GND network layer, the base layer comprises a main body part and two plugging parts located on the two opposite sides of the main body part in the first direction, the first GND network layer extends in the second direction forming an included angle with the first direction, at least one plugging part is provided with the first GND network layer, and the circuit board is matched with the clamping groove in a plugging mode. And the first GND network layer is in conductive contact with the groove wall of the clamping groove so as to be grounded. By means of the design, the stability of the circuit board installed in the clamping groove can be achieved, the grounding path of the circuit board can be shortened, impedance between a GND network in the circuit board and the ground of the whole machine is reduced, and stable transmission of analog signals in the circuit board is guaranteed.

An electronic device may include: a display; a conductive plate facing the display; a first circuit board including a first opening having an electronic component disposed thereon; a second circuit board having an integrated circuit disposed thereon, wherein the integrated circuit is disposed in the first opening; a shield can having a second opening and disposed on the first circuit board to surround the periphery of the electronic component; a shielding member covering the second opening; a vapor chamber disposed between the conductive plate and the shielding member when the display is viewed from a first direction; a first conductive member electrically connecting the conductive plate and the vapor chamber; and a second conductive member electrically connecting the vapor chamber and the shield can. The second conductive member may be disposed so as not to overlap the shielding member when viewed from the first direction.

The invention relates to an electronic device. The electronic device according to an embodiment of the present invention comprises: a housing; the circuit board is arranged in the shell; a camera assembly spaced apart from the circuit board; and a flexible circuit board including a first rigid portion connected to the camera assembly, a second rigid portion connected to the circuit board, and a flexible portion connecting the first rigid portion and the second rigid portion. The flexible circuit board may include: a substrate layer; a first conductive layer coupled to the substrate layer; a first shielding layer spaced apart from the first conductive layer and including a 1-1 shielding layer portion in the first rigid portion, a 1-2 shielding layer portion in the second rigid portion, and a 1-3 shielding layer portion in the flexible portion; and a first ground layer connected to the first shielding layer, and at least a portion of the first ground layer extends along a periphery of the first rigid portion. Various other embodiments are also possible.