207results about "Printed circuit grounding" patented technology

A high-speed transmission circuit comprises, as part of a signal path, a connector pin disposed on a pad that comprises an unused pad region. The unused pad region is not considered part of the signal path but is part of a resonant sub-circuit. In various embodiments, by properly adjusting the dimensions of the pad region and other structures in the high-speed transmission circuit, resonant frequencies of the sub-circuit are shifted to a frequency range that is outside of the frequency range of interest in the signal path, thereby, reducing insertion loss and increasing signal integrity without compromising mechanical stability.

This application relates to a heat dissipation shielding structure and a processing method, a circuit board assembly, and an electronic device. The printed circuit board includes a mounting surface. Electronic components are mounted on the mounting surface. The electronic components include an active component and a passive component. The heat dissipation shielding structure includes an insulating layer. The insulating layer is covered on the mounting surface, and wraps at least a side surface of the active component, so that a side that is of the insulating layer and that faces away from the mounting surface forms a first surface together with a top surface of the active component. A shielding layer is covered on the first surface, a shape of the shielding layer matches a shape of the first surface, and the shielding layer is electrically connected to a ground network of the printed circuit board.

There is provided a printed wiring board including an outermost conductive layer that includes a plurality of conductive pads, a first conductive layer that includes a first inner-layer wiring and is stacked on the conductive layer, a second conductive layer that includes a second inner-layer wiring and is stacked on the conductive layer and the first conductive layer, a first signal via that connects one of the conductive pads and the first inner-layer wiring with each other, a second signal via connecting another one of the conductive pads and the second inner-layer wiring with each other, and a stitching via that is connected to a ground. The first inner-layer wiring and the second inner-layer wiring form a common wiring route in which the first inner-layer wiring and the second inner-layer wiring are stacked and disposed in a connection area in which the conductive pads are arranged.

A paddle card includes a printed circuit board (PCB), a shielded cable, and an electromagnetic interference (EM) shield. The PCB includes a first metal layer on a top surface of the PCB, a second metal layer within the PCB, and a cavity in the top surface of the PC. The cavity exposes the second metal layer. The first metal layer includes a first ground pad. The second metal layer includes a signal pad located within the cavity. The shielded cable includes a signal conductor coupled to the first signal pad. The EMI shield is coupled to the ground pad and covers the cavity.

A base station for an unmanned aerial vehicle (UAV) is disclosed that includes: an enclosure defining an internal cavity that is configured to receive the UAV; a door that is movably connected to the enclosure; actuators that extend between the door and the enclosure to facilitate opening and closure of the door; a cradle that is configured to receive the UAV and which is movable in relation to the enclosure such that the cradle is repositionable between a retracted position and an extended position to facilitate movement of the UAV into and out of the enclosure; and engagement members that are secured to the actuators and which are configured for contact with propeller assemblies on the UAV to facilitate folding of the propeller assemblies during movement of the UAV into the enclosure.

A power module includes a power circuit board, a signal pin, a shielding substrate, and an electrically insulating component. The signal pin is disposed and stands on the power circuit board. The shielding substrate is located above the power circuit board and spaced apart from the power circuit board. The shielding substrate has a first through hole. The signal pin is disposed through the first through hole. The electrically insulating component surrounds the signal pin. The electrically insulating component has a second through hole. The signal pin is disposed through the second through hole. The signal pin is spaced apart from the shielding substrate by a distance by the electrically insulating component.

Vehicle imaging device, comprising: • an image sensor (15), • a lens (1), • a printed circuit board (3), • a pin (21.1) comprising a ground connection and in electrical connection with the printed circuit board (3), • a housing (7, 8) comprising an inner cavity (12) enclosing at least the printed circuit board (3), the image sensor (15) and a portion of the pin (21.1) comprising a ground connection, • an electrically conductive element (30) located in electrical connection with the pin (21.1) comprising a ground connection, the electrically conductive element (30) being in electrical contact with the housing (7, 8) such that a closed electrical loop is formed among the printed circuit board (3), the pin (21.1) comprising a ground connection, the electrically conductive element (30), the housing (7, 8) and the printed circuit board (3).

A differential transmission board set includes a mounting board on which a compression connector is mounted and a contact board configured to come into contact with the compression connector. In the contact board, a second conductor layer is a ground layer and has a penetrating hole. The penetrating hole is formed in such a way that a first signal pad and a second signal pad are both located inside an inner edge of the penetrating hole. In the contact board, the penetrating hole is formed to overlap an outer region of the first ground pad and an outer region of the second ground pad.

A wiring board includes a wiring layer, a shield layer, and an insulating layer. The wiring layer includes at least one signal line and at least one ground line. The shield layer overlaps the wiring layer in plan view. The insulating layer is provided between the wiring layer and the shield layer. The insulating layer includes at least one end portion surrounded by the insulating layer. The at least one end portion is located on at least the at least one ground line. A connection conductor line electrically connecting the shield layer to the at least one ground line is provided on part of the at least one end portion.

The invention discloses a circuit board, a grounding structure and interactive equipment. The circuit board is applied to the interactive equipment with the grounding structure. The grounding structure is provided with a clamping groove used for installing a circuit board. The circuit board comprises a base layer and a first GND network layer, the base layer comprises a main body part and two plugging parts located on the two opposite sides of the main body part in the first direction, the first GND network layer extends in the second direction forming an included angle with the first direction, at least one plugging part is provided with the first GND network layer, and the circuit board is matched with the clamping groove in a plugging mode. And the first GND network layer is in conductive contact with the groove wall of the clamping groove so as to be grounded. By means of the design, the stability of the circuit board installed in the clamping groove can be achieved, the grounding path of the circuit board can be shortened, impedance between a GND network in the circuit board and the ground of the whole machine is reduced, and stable transmission of analog signals in the circuit board is guaranteed.

An electronic device may include: a display; a conductive plate facing the display; a first circuit board including a first opening having an electronic component disposed thereon; a second circuit board having an integrated circuit disposed thereon, wherein the integrated circuit is disposed in the first opening; a shield can having a second opening and disposed on the first circuit board to surround the periphery of the electronic component; a shielding member covering the second opening; a vapor chamber disposed between the conductive plate and the shielding member when the display is viewed from a first direction; a first conductive member electrically connecting the conductive plate and the vapor chamber; and a second conductive member electrically connecting the vapor chamber and the shield can. The second conductive member may be disposed so as not to overlap the shielding member when viewed from the first direction.

The invention relates to an electronic device. The electronic device according to an embodiment of the present invention comprises: a housing; the circuit board is arranged in the shell; a camera assembly spaced apart from the circuit board; and a flexible circuit board including a first rigid portion connected to the camera assembly, a second rigid portion connected to the circuit board, and a flexible portion connecting the first rigid portion and the second rigid portion. The flexible circuit board may include: a substrate layer; a first conductive layer coupled to the substrate layer; a first shielding layer spaced apart from the first conductive layer and including a 1-1 shielding layer portion in the first rigid portion, a 1-2 shielding layer portion in the second rigid portion, and a 1-3 shielding layer portion in the flexible portion; and a first ground layer connected to the first shielding layer, and at least a portion of the first ground layer extends along a periphery of the first rigid portion. Various other embodiments are also possible.

The present invention provides an electronic device which is provided with: a wiring board which has a mounting surface; a ground electrode which defines a ground region on the mounting surface; an electronic component which is arranged within the ground region on the mounting surface; a conductive component which is arranged adjacent to the outer edge of the ground electrode; an internal insulating protective layer which is arranged within the ground region and covers the electronic component; an external insulating protective layer which is arranged outside the ground region and covers the conductive component; and an electromagnetic shielding layer which is a solidified product of an ink for the electromagnetic shielding layer formation, and which is provided so as to extend across the internal insulating protective layer and the ground electrode, while covering the internal insulating protective layer and being electrically connected to the ground electrode. The present invention also provides a method for producing this electronic device.

A network communication device has a circuit board, a network communication chip, an antenna, and a metal cover. The circuit board has a first surface and a second surface opposite to each other. An interior of the circuit board has a ground layer. An edge of the first surface has a ground ring. The ground ring surrounds the first surface and is electrically connected to the ground layer. The network communication chip is disposed on the first surface. The antenna is electrically connected to the circuit board. The metal cover has an annular support rib. The circuit board is disposed on the annular support rib with the first surface facing the metal cover. The ground ring is in physical contact with and electrically connected to the annular support rib.

Apparatus and methods for conductive memory module notch and connector-to-motherboard pins for power or ground. A memory module includes a conductive notch that is coupled to either one or more ground planes in respective layers in the memory module's PCB or to a power rail formed on one or more layers in the PCB. A memory module connector includes a notch pin that is configured to mate with the conductive notch when the memory module is installed in the connector. The connector is mounted to a motherboard or the like and the notch pin is coupled to either power (e.g., Vin) or ground in the motherboard. When coupled to power, Vin is supplied to the memory module via the notch pin / conductive notch. When coupled to ground on the motherboard, at least a portion of the ground planes in the PCB are coupled to ground via the notch pin / conductive notch.

The present invention discloses a multi-channel ion transmission device for mass spectrometry and ion mobility spectrometry instruments; the device is mainly used in instruments such as ion mobility mass spectrometry to realize the effective transmission of ions in various groups of components and various levels of vacuum environment. The device includes two parts: a connecting fixture and an ion transmission component. The fixture is used to fix the ion transmission component, and the ion transmission component is a circuit board used to assemble an ion transmission channel. The circuit board includes components such as an ion gate, a traveling wave electrode, a DC protection electrode, and has been integrated on a circuit board. When in use, it is only necessary to place the two circuit boards in a mirror image and install them with fixtures. The present invention can realize functions such as multi-channel ion transmission, diversion, and guidance, and requires few parts and is simple to install, which greatly avoids the problems of system error amplification, difficult disassembly and assembly, long maintenance time, and high cost caused by multiple parts combination.

A characteristic impedance control structure includes a first and a second transmission line, a ground pattern and a ground component. The first transmission line and the ground pattern extend along a plane. The ground pattern is spaced from the first transmission line by a first distance. The second transmission line extends along a direction and electrically connects to the first transmission line. An angle between the direction and the plane is greater than zero. The second transmission line has an outer diameter. The ground component extends along the direction and is electrically connected to the ground pattern. The ground component is next to and spaced from the second transmission line by a second distance. The ground component has a length along the direction. The first distance is less than or equal to twice the length. The second distance is less than or equal to five times the outer diameter.

A flexible circuit assembly and a cover for a traction inverter system of an electric vehicle are provided. The flexible circuit assembly includes a flexible printed circuit body, a first connector, and a second connector. The flexible printed circuit body forms an angled shape having an inner side and an outer side. The cover includes an outer surface, an inner surface including ribs, and a perimeter configured to be attached to a housing. The outer surface includes a central region, a first lateral region, and a second lateral region, and a constrained layer damping material. The central region, the first lateral region, and the second lateral region form contours, and the constrained layer damping material conforms to the contours.

The disclosure relates to an integral electronic stack and a multi-layer stack. Specifically, according to an embodiment of the disclosure, there is provided an integral electronic stack for grounding an electrically conductive component in which passive intermodulation (PIM) is reduced, wherein the integral electronic stack includes a first integral stack and a second integral stack, the first integral stack being bonded to the second integral stack, wherein the first integral stack includes: a first board which is substantially rigid; a first electrically conductive layer which is disposed on at least part of a first main surface of the first board; a first electrically conductive adhesive layer and a second electrically conductive adhesive layer; and a first electrically conductive film which is disposed between the first electrically conductive adhesive layer and the second electrically conductive adhesive layer, and is bonded to the first electrically conductive adhesive layer and the second electrically conductive adhesive layer, respectively, the first electrically conductive adhesive layer and the second electrically conductive adhesive layer including a plurality of electrically conductive elements substantially distributed in an electrically insulative material, wherein the first electrically conductive adhesive layer bonds the first electrically conductive film to the one or more first electrically conductive layer.

Disclosed in the present application are a PCB and a terminal device using the PCB. At least one electric conductor is added on an exposed section of the PCB, so that the exposed section is divided into at least two sections, thereby the problem of noise interference can be solved without extensively changing the original circuit of the PCB. In this way, the project cycle and test resource can be greatly saved, and the problem of radiation noise generated by the exposed section can be completely solved.

The invention provides a display module, a manufacturing method thereof and a display device, and the display module comprises a display panel which comprises a display area and a binding area bent to the back surface of the display area; the flexible circuit board is electrically connected with the binding area, and a copper exposing area is arranged on the side, away from the display area, of the flexible circuit board; one end of the covering belt is attached to the binding area, and the other end of the covering belt is attached to the side, away from the display area, of the flexible circuit board; the covering belt comprises a first insulating layer, a conductive layer and a second insulating layer which are sequentially arranged away from the display area; wherein a first via hole is formed in the thickness direction of the first insulating layer, and a second via hole is formed in the thickness direction of the second insulating layer; the to-be-grounded structure is located on the side, away from the display area, of the covering tape; wherein the to-be-grounded structure is electrically connected with the conductive layer through the second via hole, the copper exposed region is electrically connected with the conductive layer through the first via hole, and the copper exposed region is grounded.

To provide a bonded and sealed electronic control unit in which a plastic housing, a base and a printed circuit board are assembled at low cost.SOLUTION: An apparatus includes a housing (an upper housing 102 and a lower housing (or cover or baseplate)), a circuit board 110, a sealant 140 and a baseplate 104. The housing has a shelf 122 and a flange 124 along an open side. The circuit board is disposed on the shelf of the housing and inside the flange of the housing, and secured to the housing. The sealant is dispensed (i) through the open side of the housing and along a gap between the flange and the circuit board. The baseplate is compressed to the housing thereby causing the sealant to flow between the baseplate and the circuit board and between the baseplate and the flange.SELECTED DRAWING: Figure 7

An electronic package is provided. The electronic package comprises an electronic component, a substrate, a ground plane, a thermally conductive pathway and at least one thermally conductive member. The ground plane is enclosed in or supported by the substrate. The electronic component includes a non-groundable thermal output and is mounted to the substrate. The thermally conductive pathway extends within the substrate between an interface exposed on a surface of the substrate and the ground plane. The thermally conductive pathway is configured to electrically isolate the interface from the ground plane. The thermally conductive member couples the output to the interface. An electronic device comprising such an electronic package is also provided.

The invention provides a circuit board structure. The circuit board structure comprises a substrate, a first coaxial via hole, a second coaxial via hole and a plurality of grounding via holes, the substrate has a first surface and a second surface opposite to the first surface. The first coaxial via hole and the second coaxial via hole are arranged in the substrate, and the impedance of the first coaxial via hole and the impedance of the second coaxial via hole are respectively smaller than 50 ohms. The plurality of grounding through holes are arranged around the first coaxial via hole and the second coaxial via hole. The first coaxial via and the second coaxial via are configured to transmit a signal having a frequency in a range of 50 GHz to 68 GHz.

An audio kill switch provides a noiseless passive cessation of an audio signal. A printed circuit board is joined to an upper shell and has a plurality of interlaced three mil copper signal and ground traces from a center signal trace and outer grounding ring respectively, with three mil spaces between traces interlaced in a way to gradually shunt the signal to ground over several milliseconds when contact between them is made by the conductive rubber button. A target pad is arranged on the center of the printed circuit board. An outer shell is surrounding the printed circuit board. A conductive rubber button is joined to a spring. A nylon outer sleeve is arranged against the conductive rubber button. A spring-loaded connector is arranged against the target pad and joined to a rubber sleeve.

The invention relates to a device for providing a ground path, used for shielding, between a printed circuit board (8) and an electrically conductive housing component (2) having a ground plate (10) which has radially resilient contact elements (14). The device according to the invention is characterised in that the printed circuit board (8) is electrically connected to the ground plate (10) via a screw connection or rivet connection (13), wherein the electrically conductive connection between the ground plate (10) and the housing component (2) is established via the resilient contact elements (14) of the ground plate (10). The device can in particular be used in a high-voltage battery.

The embodiment of the invention discloses an electronic device which comprises a shell, a metal connecting piece, a main control board, a fixing support, a conductive layer, an elastic conductive connector and a flexible circuit board, the metal connecting piece is connected in an installation groove in the shell, and the fixing support and the main control board are arranged in the shell. The conductive layer is formed on the top face, the connecting face and the outer side face of the fixing support through the PDS technology, the two ends of the elastic conductive connector are electrically connected with the metal connecting piece and the conductive layer respectively, one end of the flexible circuit board is electrically connected with the conductive layer, and the other end of the flexible circuit board is electrically connected with the main control board. Therefore, static electricity generated on the metal connecting piece is discharged and conducted to a grounding point of the main control board through the flexible circuit board. The grounding mode of the metal connecting piece in the electronic equipment is simple, the number of parts is small, the assembly process is simplified, and the electrostatic protection effect is achieved.

A circuit board includes a dielectric substrate, a signal line, and a ground line pair. The dielectric substrate has a base and a protruding platform, wherein the protruding platform protrudes from the upper surface of the base. The signal line is conformally arranged on the dielectric substrate and includes a first section, a second section, and a third section. The first section is arranged on the upper surface of the protruding platform. The second section extends on the upper surface of the base. The third section is arranged on the side wall of the protruding platform and connects the first section and the second section. The ground line pair is arranged on the dielectric substrate. The ground line pair is located on both sides of the first section and is spaced apart from the first section. The orthographic projection of the second section on the upper surface of the base partially overlaps the orthographic projection of the ground line pair on the upper surface of the base. This improves the signal transmission performance of the circuit board. The present application also provides a method for manufacturing a circuit board.