615results about "Electrical connection between head and arm" patented technology

A disk drive includes a disk having a recording surface, a head stack assembly that includes a body portion, an actuator arm cantilevered from the body portion and a head gimbal assembly supported at the actuator arm. The head gimbal assembly includes a suspension having a first end and a second end, the first end being attached to the actuator arm, a slider coupled to the second end of the suspension, the slider comprising a transducer for reading from and writing to the recording surface. A gimbal is coupled to the second end of the suspension and to the slider. An array of diodes is attached to the suspension to protect the transducer from electrostatic discharge or electrical overstress events.

A method of connecting a plurality of probe pins to a plurality of first external connection pads, which are provided on a head gimbal assembly and are electrically connected to a plurality of terminal electrodes of a write magnetic head element, respectively, and a plurality of second external connection pads, which are provided on the head gimbal assembly and are electrically connected to a plurality of terminal electrodes of a read magnetic head element. In the connection method, an approach direction of the probe pins to the first external connection pads and an approach direction of the probe pins to the second external connection pads are made different from each other.

A method for forming an electrical interconnect on an integrated lead suspension or suspension component of the type formed from a laminated sheet of material having a stainless steel layer, a conductive lead layer and an insulating layer separating the stainless steel and conductive lead layers. An aperture is formed through at least the insulating layer to expose the stainless steel layer at an interconnect site. An interconnect mask is applied around the interconnect site. Conductive material is electroplated onto the stainless steel layer at the interconnect site to form a plated interconnect. The mask is then removed. The method is used to form an interconnect bond pad on the same side of the stainless steel layer as the conductive lead layer in one embodiment. In another embodiment the aperture is formed through the insulator layer and the stainless steel layer, and conductive material is built up on the stainless steel layer during the electroplating step until it meets and plates onto the conductive lead layer to form a stainless steel side interconnect. In yet another embodiment the aperture is formed through the insulator layer and the conductive lead layer, and conductive material is built up on the stainless steel layer during the electroplating step until it meets and plates onto the conductive lead layer to form a conductive lead side interconnect.

Stable, low resistance conductive adhesive ground connections between motor contacts and a gold-plated contact area on a stainless steel component of a dual stage actuated suspension. The stainless steel component can be a baseplate, load beam, hinge, motor plate, add-on feature or flexure.

A disk drive comprises a housing including a base; a disk rotatably attached to the base; a printed circuit board coupled to the base and including a plurality of circuit board pads; a head stack assembly pivotally coupled to the base about a pivot axis and a flex-to-board connector. The head stack assembly includes a head for reading and writing to the disk and a flex cable assembly that includes a flexible film including a plurality of conductive traces that are electrically coupled to the head. The flexible film includes a connecting portion in which each of the plurality of conductive traces defines a trace pad. Each trace pad is disposed on a surface of the flexible film that is generally parallel to the pivot axis. The flex-to-board connector is attached to the base and is configured to couple to the connecting portion of the flexible film and to maintain the surface of the flexible film on which the trace pads are disposed in an orientation that is generally parallel to the pivot axis. The flex-to-board connector includes a plurality of conductive fingers, each configured to electrically connect one of the trace pads to a corresponding one of the plurality of circuit board pads.

A suspension assembly includes a load beam, a mount plate, first and second piezoelectric microactuators, and a flex circuit segment. The first piezoelectric microactuator is electrically non-conductively attached to the load beam and the mount plate. The first piezoelectric microactuator includes a first piezoelectric element, a first top electrode, and a first bottom electrode. The second piezoelectric microactuator is electrically non-conductively attached to the load beam and the mount plate. The second piezoelectric microactuator includes a second piezoelectric element, a second top electrode, and a second bottom electrode. The flex circuit segment is disposed folded about the first and second piezoelectric microactuators. The flex circuit segment is in electrical communication with the first top electrode, the first bottom electrode, the second top electrode, and the second bottom electrode.

Apertures are formed in the portion of a flexure adjacent to the soldered portions between the bonding pads of the slider and the lead pads of lead end portions. With this, an adhesive agent for bonding the slider to a flexure tongue is moved downward from the apertures so there is no fear that the adhesive agent will contact the lead pads and the bonding pads. This design prevents the protrusion of an adhesive agent from short-circuiting the flexure, and absorbs a warp produced by shrinkage of a soldered portion by decreasing rigidity of the flexure. When both the bonding pad formed on the slider and the lead pad of a lead fixed to the platform of the flexure are disposed and soldered, the quality of the soldered portion is improved by locating the pads as close to each other as possible.

A head gimbal assembly for a disk drive. The head gimbal assembly includes a trace suspension assembly backing layer including a gimbal. The trace suspension assembly backing layer is formed of a conductive material having a first oxidation rate. The head gimbal assembly further includes a gimbal conductive layer disposed upon the gimbal and formed of a conductive material having a second oxidation rate lower than the first oxidation rate. The head gimbal assembly further includes a slider supported by the gimbal. The head gimbal assembly further includes a conductive compound disposed between the gimbal conductive layer and the slider for electrically grounding the slider to the trace suspension assembly backing layer.

A gimbal assembly of a dual-stage microactuator is provided with a remotely-located piezoelectric transducer (PZT) and at least one actuation strut connecting an asymmetrical amplification structure supporting the PZT to a tongue supporting a slider, such that the movement of the PZT over the asymmetrical amplification structure is amplified by the asymmetrical amplification structure and at least one actuation strut into rotation of the tongue and slider. A plurality of actuation struts connect opposing sides of the asymmetrical amplification structure with opposing sides of the tongue, which causes the tongue to rotate about a central portion of the tongue upon which a dimple of a supporting loadbeam contacts the tongue.

A novel suspension assembly includes a suspension assembly mounting plate, a microactuator mounting structure extending from the suspension assembly mounting plate, a load beam extending from the microactuator mounting structure, and a laminated flexure attached to the load beam. The laminated flexure includes a tongue that has a read head bonding surface. The suspension assembly includes a stainless steel surface having a gold coating, and a piezoelectric microactuator attached to the microactuator mounting structure and electrically connected to the gold coating.

Method and apparatus are presented for electrically coupling a slider to ground. In one embodiment, a bonding pad is provided on a side of the slider body separate from the bonding pad(s) used for read / write signals. This separate bonding pad is electrically coupled within the slider body to components that are to be coupled to ground. A separate conductor provided on the suspension (e.g., a trace, a flex circuit, etc.) may be electrically coupled to the separate bonding pad via gold ball bonding. The conductor is also coupled to ground in the hard-disk drive device (e.g., via the preamplifier). The use of the separated bonding pad and trace may negate the need to use a conductive adhesive to electrically ground the slider via its attachment to the tongue of a slider.

An electrical connection structure connects a piezoelectric element to a flexure with a conductive adhesive. An electrode surface is formed on the piezoelectric element, and a terminal surface is formed on the wiring member and is smoother than the electrode surface. A the gold plate layer is formed on the terminal surface and is connected to the electrode surface with the conductive adhesive. At least one recess is formed by laser processing on the conductive terminal surface layer. The electrical connection structure substantially equalizes the surface roughness of the terminal surface with the gold plate layer to that of the electrode surface, improves a bonding strength on the terminal surface nearly to that on the electrode surface, enhances the reliability of electrical connection between the electrode surface and the terminal surface, maintains electrical characteristics of the terminal surface, and prevents contamination around the terminal surface.

A suspension for a disk drive includes a mount plate adapted to mount to a primary actuator, a functional end portion adapted to carry a slider, and a hinge disposed between the mount plate and the functional end portion. A mounting configuration is provided on the mount plate for mounting the suspension to the primary actuator. A pair of secondary actuators are mounted in longitudinally overlapping relationship with the mounting configuration so as to minimize the impact of the secondary actuators on suspension length. The secondary actuators are operatively connected to the hinge for producing sway displacement of the slider.

A Head Gimbal Assembly (HGA) for use in a disk drive and comprising an ESD-protected slider comprising a head formed on a slider substrate. The slider may comprise an electrical-isolation circuit; an electrically-resistive path between head input connections and the slider; or both isolation circuits and resistive paths for reducing electrostatic charge on the slider while remaining connected during disk drive operations.

A substrate for suspension which is produced at low costs and can sufficiently attain the prevention of damage by electrostatic discharge and restraint of noises. The substrate for suspension includes: a metallic substrate, an insulating layer formed on the metallic substrate and having an opening from which the metallic substrate is exposed, a grounding-wiring layer formed on the insulating layer and arranged near the opening, and a ground terminal formed in the opening and contacting the metallic substrate and the grounding-wiring layer. The ground terminal is made of a metal having a melting point of 450° C. or lower.

An HGA has a head slider including at least one write head element with terminal electrodes and at least one read head element with terminal electrodes, a suspension for supporting the head slider at a top end section thereof, and a lead conductor member including first trace conductors and second trace conductors. One ends of the first trace conductors are electrically connected to the terminal electrodes of the at least one write head element, and one ends of the second trace conductors are electrically connected to the terminal electrodes of the at least one read head element. At least part of the lead conductor member is fixed to the suspension. The lead conductor member further includes a ground (GND) or source voltage (Vcc) conductor inserted between the first and second trace conductors.

A method for forming an electrical interconnect on an integrated lead suspension or suspension component of the type having a stainless steel layer, a conductive lead layer and an insulator layer separating the stainless steel and conductive lead layers. An aperture is formed through only the insulator layer to expose the stainless steel layer at an interconnect site. An interconnect mask is applied around the interconnect site. A first conductive material is electroplated onto the stainless steel layer at the interconnect site to form a plated interconnect between the spring metal layer and the conductive lead layer. The mask is then removed. An electrical interconnect between the stainless steel and conductive lead layers including an aperture only through the insulator layer and an electroplated conductive material interconnect extending between both the spring metal layer and the conductive lead layer.

A HGA of the invention includes a slider; a micro-actuator to adjust the position of the slider; and a suspension to support the slider and the micro-actuator. The micro-actuator includes two side arms; a load plate for supporting the slider, which is connected with at least one of the side arms; a pair of piezoelectric (PZT) elements connected with the side arms; and a support shaft coupled with the suspension, the support shaft being connected with the side arms and positioned between the PZT elements. The invention also discloses a disk drive unit using such a HGA.

In a junction flexible wiring circuit board used for performing junction between a suspension board for mounting a magnetic head of a hard disk drive thereon and a control circuit board for operating the magnetic head, a metal layer is formed on at least one of a surface of an electrically insulating base layer and a surface of an electrically insulating cover layer.

Examples of a magnetic recording head slider, a head gimbal assembly and methods of manufacturing each are disclosed. The magnetic recording head slider may comprise a slider body and a plurality of bond pads formed on a trailing edge of the slider body. Each of the plurality of bond pads may include a probe contact area and a soldering contact area. The probe contact area may be larger than the soldering contact area. The head gimbal assembly may include a suspension arm with conductive leads. A plurality of bond pads may be formed on the suspension arm in contact with the ends of the conductive leads. A width of a proximal portion of each of the bond pads may be greater than a width of a distal portion of each of the plurality of bond pads. The methods may include forming the above-described structures.

A disk drive includes a disk, and a head stack assembly (HSA). The HSA includes a preamplifier; an actuator assembly that defines an actuator arm; a load beam supported by the actuator arm, the load beam defining a registration feature. A flexure is coupled to the load beam, the flexure defining an opening that is centered on the registration feature and including a plurality of conductive formations. The conductive formations include a plurality of conductive flexure connection pads that collectively define a center point; a plurality of conductive traces to electrically couple the plurality of flexure connection pads to the preamplifier, and a conductive feature disposed away from and aligned with the center point, the conductive feature at least partially surrounding the opening within the flexure. A slider is coupled to the plurality of flexure connection pads for reading and writing to the disk.

A HGA of the invention includes a slider; a micro-actuator to adjust the position of the slider; and a suspension to load the slider and the micro-actuator. The micro-actuator includes two side arms; a load plate for supporting the slider, which is connected with at least one of the side arms; a piezoelectric element connected with the side arms; and a base shaft to couple with the suspension, which is connected with the side arms and positioned between the load plate and the piezoelectric element. The invention also discloses a disk drive unit using such a HGA.