2783results about "Resilient/clamping means" patented technology

An electronic apparatus that includes a housing, a holder provided in the housing and a light-emitting portion provided in the housing. The holder is made of a resin and supports components. The holder includes an optical guide that guides light emitted from the light-emitting portion to outside of the housing, and the optical guide is formed integral with the holder.

Portable electronic devices are provided. Each device may be formed from two parts. A first part may be provided with components such as a display, a touch screen, a cover glass, and a frame. A second part may be provided with a plastic housing, circuit boards containing electrical components, and a bezel. Engagement members may be connected to the first and second parts. The engagement members may be formed from metal clips with holes and springs with flexible spring prongs that mate with the holes in the clips. The metal clips may be welded to frame struts on the frame and the springs may be welded to the bezel. During assembly, the first part may be rotated into place within the second part. Retention clips attached to the frame may be used to secure the two parts together. Assembly instructions and associated connector numbers may be provided within the devices.

Disclosed is a LGA socket connector including an insulative housing (2), a stiffener (3), a clip (4), and a lever (5) defining thereof a driving portion (50) and a locking portion (52) linked thereto. The stiffener is configured to grasp a periphery of the housing. The clip and the locking portion of the lever are essentially pivotally moved about longitudinal ends of the housing respectively, but with the driving portion disposed adjacent one transverse side of the housing. At least one of the clip and the stiffener is provided with a recessed region (300) adjacent said transverse side of the housing, thereby preventing the whole connector from becoming inclined when the connector is horizontally locked and placed on the printed circuit board.

To reduce switching noise, the power supply terminals of an integrated circuit die are coupled to the respective terminals of at least one capacitor embedded in an interposer that lies between the die and a substrate. In an embodiment, the interposer is a multilayer ceramic structure that couples power and signal conductors on the die to corresponding conductors on the substrate. The capacitor is formed of at least one high permittivity layer and in an embodiment comprises several high permittivity layers interleaved with conductive layers. Alternatively, the capacitor can comprise at least one embedded discrete capacitor. Also described are an electronic system, a data processing system, and various methods of manufacture.

An exemplary housing mechanism (100) for an electronic device includes a front cover (10), a back cover (20), and an elastic sealing element (12). The front cover has a projecting edge (18) defined thereon. The back cover has a recessed edge (26) defined therein. The elastic sealing element has a tip portion (122) and is formed or sealed together with the front cover. The projecting edge of the front cover and the tip portion of the elastic sealing element are configured to be press fit into the recessed edge of the back cover.

A PCB mounting apparatus includes a supporting plate (20) defining a number of through holes, a number of standoffs (50) engaging in the through holes, and a number of grounding members (60) attached to the standoffs. The standoff each includes a head (52) having a holding portion, a flange (54), a post (56), and a base (58). The grounding member each includes a first ring (62) supported on the flange, a second ring (68) supported on the base, and a band (66) connecting therebetween. The PCB (80) defines a number of fixing apertures (82). The combined standoff and grounding member is disposed in the through hole. The PCB is placed upon the supporting plate with the fixing apertures engaging the holding portions of the standoffs and contacts the first rings of the grounding members. The standoffs and the grounding members are made of conductive materials.

A method of fabricating a package for a micro-electromechanical systems (MEMS) device. A flex circuit interconnect subassembly for the package is made by placing a flex circuit on a pad insert, attaching a carrier insert to the pad insert to deflect the lead portions of the flex circuit, and applying a cover insert to the pad insert, after the attachment of the carrier insert, to re-deflect the lead portions of the flex circuit toward the device bond sites. The flex circuit interconnect subassembly may be combined with an electronic device die / carrier subassembly to form a completed electronic device package. The flex circuit interconnect subassembly and the die / carrier subassembly are joined using mechanical interlocking layers. The invention is particularly suited for making such an electronic device die / carrier subassembly which has a MEMS die permanently affixed to a carrier. The carrier is advantageously utilized during the process of releasing a protective coating from the surface of the MEMS die which support the various MEMS components. The MEMS components on the MEMS die are hermetically sealed, such as by bonding a cover to the upper package body or the lower package body. The cover may have features such as ports which allow the MEMS components to interact with the external environment.