252results about "Negative temperature coefficient thermistors" patented technology

The invention discloses a power type negative temperature coefficient thermistor and method for suppressing surge current, and relates to the technical field of negative temperature coefficient thermistors, the thermistor comprises a core body and pins, the pins are respectively arranged on electrodes on two sides of the core body by adopting a multi-contact-surface structure, and the pins are arranged on the two sides of the core body. The core body is made of a Mn-Co-Ni-La oxide with a nano composite gradient structure; the Mn-Co-Ni-La oxide with the nano-composite gradient structure determines the upper limits of core capabilities such as surge suppression, wide temperature stability and low power consumption of the thermistor, and the redesign of the pin is the key of performance transfer, so that the electrical properties (low contact resistance and high surge tolerance) of the Mn-Co-Ni-La oxide with the nano-composite gradient structure are not counteracted by structural defects; the arrangement of the bracket prevents the Mn-Co-Ni-La oxide with the nano-composite gradient structure from losing the effect due to heat accumulation and physical damage through thermal management and mechanical protection, and the three components supplement one another and cooperate with one another, so that the performance of the thermistor of the Mn-Co-Ni-La oxide with the nano-composite gradient structure is guaranteed.

The utility model discloses an FPC, CCS subassembly, battery module and vehicle, said FPC includes FPC body and FPC branch, said FPC branch includes and at least one connecting portion, one end of said connecting arm is conductively connected with said FPC body, the other end of said connecting arm overhangs and is equipped with NTC fixed portion, said connecting arm is bent to form at least one bending portion, and said bending portion is equipped with the NTC fixed portion. The orthographic projection of the connecting part in the thickness direction of the FPC body covers the FPC body, and at least one bending part is connected with at least one connecting part. According to the FPC provided by the utility model, the orthographic projection in the thickness direction of the FPC body covers the FPC body, so that the connecting part can be connected with the FPC body, and the FPC body can be used for limiting the warping problem of the bending part. Therefore, the risk of warping of the FPC branches can be reduced, and the reliability of the battery module is improved.

Composite materials for simultaneous thermal management and electromagnetic interference screening of radiofrequency-based electronic systems are provided. The materials contain a phase change material and one or more electrically and thermally conductive filler particles. The materials provide a passive system for thermal management and EMI shielding that is lightweight, does not contain moving parts, and does not require an external power supply.

The application discloses a kind of thermistor material production methods, comprising the following steps: after Mn3O4, NiO, Co3O4, modified Al2O3, Fe2O3, polyvinyl pyrrolidone are mixed, first ball mill is obtained in ball mill;First ball mill is placed in tube furnace, under inert gas atmosphere, after heating to 950~1000 DEG C calcination 2.0~2.5h, after cooling, calcined powder is obtained;Second ball mill is obtained by placing calcined powder into ball mill;Second ball mill, 2,5-furandimethanol, casein are mixed and placed into forming mold and pressed into green compact;Green compact is placed into muffle furnace, first calcined at 750~800 DEG C for 1.0~1.5h, then heated to 1100~1150 DEG C and calcined for 2.5~3h to obtain thermistor material.The application mixes Al2O3, MgO, La2O3 uniformly in proportion, then places them in plasma equipment for processing and vacuum calcination to obtain modified Al2O3, which is added to thermistor material, thereby improving the sensitivity and stability of thermistor material, and having wide application prospect.

The present invention relates to a ceramic substrate (10) having at least one metallization layer (20) on at least one surface (11) and at least one feedline (30) in electrical contact with said metallization layer (20), and an encapsulation structure (40) surrounding said ceramic substrate (10), said at least one metallization layer (20), and a first segment (31) of said at least one feedline (30), said first segment (31) being directly adjacent to said metallization layer (20). a protective layer (50) surrounding the encapsulation structure (40) and a second segment (32) of the at least one supply line (30), the second segment (32) being directly adjacent to the first segment (31); and an insulating layer (60) surrounding the protective layer (50) and a third segment (33) of the supply line (30), the third segment (33) being directly adjacent to the second segment (32). The present invention further provides a method for manufacturing a ceramic element.

To provide a temperature sensor in which a thermistor is accurately determined with respect to a case.SOLUTION: A thermistor assembly body 110 includes a thermistor 111, rigid two lead members 112, and a first resin part 113. A first end part 1121 of the two lead members 112 is connected to the thermistor 111 and the thermistor 111 is sealed by the first resin part 113.SELECTED DRAWING: Figure 6

The utility model relates to the technical field of thermistors, and discloses a high-corrosion-resistance thermistor which comprises a resistor body, a lead is arranged on the lower surface of the resistor body, a protective shell is arranged on the side wall of the resistor body, a sealing cover is arranged on the lower surface of the resistor body, and a fixing assembly is arranged on the side wall of the sealing cover. A sealing assembly is arranged on the upper surface of the sealing cover, the fixing assembly comprises a fixing block, the side wall of the fixing block is fixedly connected to the side wall of the sealing cover, a clamping sleeve is fixedly connected to the side wall of the protective shell, a first clamping groove is formed in the clamping sleeve, an elastic plate is fixedly connected to the upper surface of the fixing block, and a clamping block is fixedly connected to the side wall of the elastic plate. The sealing assembly comprises a mounting block, and the side wall of the mounting block is fixedly connected to the upper surface of the sealing cover. According to the utility model, the elastic plate slides into the clamping sleeve, so that the clamping block is clamped with the clamping groove I, the fixing effect is achieved, and the practicability of the equipment is improved through the structure.

The invention relates to a ceramic component, comprising: a ceramic base body (10) having at least one metallization (20) on at least one surface (11) of the base body and at least one feed line (30) in electrical contact with the metallization (20); an encapsulation (40) surrounding the ceramic base body (10), the at least one metallization (20), and a first sub-section (31) of the at least one feed line (30), the first sub-section (31) directly adjoining the metallization (20); a protective layer (50) surrounding the encapsulation (40) and a second sub-section (32) of the at least one feed line (30), the second sub-section (32) directly adjoining the first sub-section (31); and an insulating layer (60) surrounding the protective layer (50) and the third sub-section (33) of the feed line (30), the third sub-section (33) directly adjoining the second sub-section (32). A method for producing a ceramic component is also described.

This negative-characteristic thermistor is provided with: a ceramic substrate formed from a ceramic composition containing Mn, Ni, and Fe; and an external electrode provided at an end portion of the ceramic substrate, in which the external electrode includes a base layer covering the end portion of the ceramic substrate and including Cu and glass, and a plating layer covering the base layer, and the Ni content, the Mn content, and the F content in the ceramic substrate satisfy the following formulae (1) and (2): 26.4 mol% < = [Ni] < = 29.5 mol%, 1.65 < = [Mn] / [Fe] < = 1.90 (2). Wherein [Ni], [Mn], and [Fe] are the contents (mol%) of Ni, Mn, and Fe, respectively, when the total content of Mn, Ni, and Fe contained in the ceramic matrix is 100 mol%.

A sensor device (1) for measuring the temperature of a surface (9A) is described, comprising: at least one sensor element (2); a ceramic housing (3) in which the sensor element (2) is at least partially disposed within the ceramic housing (3); a base (5) at least partially surrounding the ceramic housing (3); an external housing (8) connected to the base (5) in which the external housing (8) at least partially encloses the base (5) and the ceramic housing (3); and at least one mounting element (7) adapted and positioned to mount the sensor device (1) to a target application (9), wherein the ceramic housing (3) is adapted and positioned to be in direct mechanical contact with the surface (9A) whose temperature is to be measured. Furthermore, the use of the sensor device (1) is described.

The present invention relates to a sensor comprising a ceramic substrate (1) and two metallization layers (2) applied on opposite surfaces of the ceramic substrate (1), each having an adhesion layer (2A) applied directly onto the ceramic substrate (1) and a gold layer (2B) applied on each adhesion layer (2A). Furthermore, the present invention relates to a method for manufacturing the sensor.

An electronic component that includes: a base body; and an external electrode that covers a part of an outer surface of the base body, the external electrode including: an underlying electrode containing copper and silicon; and a metal layer that covers an outer surface of the underlying electrode, wherein at least some of the copper has copper particles with a flattening ratio of 0.5 or less, and when the underlying electrode is viewed in section, the silicon is distributed so as to fill gaps between the copper particles.

The application provides a high-B-value linear NTC thermistor material with good batch consistency, a preparation method thereof and a thermistor element, relates to the technical field of NTC thermistor materials, and is characterized in that a NiO-ZnO binary oxide system is selected, ZnO is used as a main crystal phase, the conductive behavior and resistance-temperature characteristics of the material are controlled through a small amount of NiO, a NiO-ZnO linear NTC thermistor material directly physically compounded by NiO and ZnO is formed, the system composition is more simplified, the composite path is shorter, the phase composition is more easily controlled, the composition fluctuation and the organization non-uniformity caused by the complex second phase generation process, the insufficient local reaction or the uneven phase distribution can be reduced, and therefore the performance dispersion between different batches is reduced, and the consistency and the repeatability of the material preparation are improved.

An electrical device is specified. According to one embodiment, an electrical device includes an electrical element including two electrodes and two wires connected to the electrodes, where each wire includes a flat region constituting a wire end, and where the flat region is configured for contacting the electrodes. The invention further relates to a method for producing an electrical device.

This multilayer electronic component comprises: a layered body in which an internal electrode and a dielectric layer are alternately layered; a base electrode; and an external electrode. The internal electrode has a first internal electrode and a second internal electrode. The base electrode has a first base electrode and a second base electrode. The external electrode has a first external electrode and a second external electrode. The first base electrode and the second base electrode each include a plurality of sintered bodies that are made of dielectric particles. At least some of the plurality of sintered bodies are positioned at an interface between a respective base electrode and the layered body.

Provided is a ceramic composition enabling a lower sintering temperature (or firing temperature), an electronic component, and a method for manufacturing the ceramic composition. A ceramic composition of the present disclosure comprises an oxide containing Mn and Ni elements, and contains all of Li, Na, and K elements.

Provided is a multilayer ceramic capacitor that can be reliably mounted on a wiring board and that can suppress the occurrence of squeal. A laminated ceramic electronic component is provided with: a laminated body (2) including an inner layer section (11) in which dielectric layers (14) and internal electrode layers (15) are alternately laminated, the laminated body (2) having two main surfaces (A) facing each other in a lamination direction (T) and two end surfaces (C) facing each other in a longitudinal direction (L); two external electrodes (3) which are respectively connected to the internal electrode layer (15) at the two end surfaces (C), and which cover the end surfaces (C) and a part of the two main surfaces (A) which are connected to the end surfaces and face each other; and two spacers (4) disposed on one of the two main surfaces (A) so as to sandwich the external electrode (3), the spacers (4) being disposed so as to sandwich the external electrode (3) between the two main surfaces (A), and the spacers (4) being disposed so as to sandwich the external electrode (3) between the two main surfaces (A), and the spacers (4) being disposed so as to sandwich the external electrode (3) between the two main surfaces (A) and the second main surface (SA2) when the surface that does not sandwich the external electrode is defined as the second main surface (SA2). The angle of the second main surface (SA2) of the spacer with respect to the main surface of the laminate (2) on which the spacer (4) is disposed is 5 degrees or less when viewed from the width direction.

An electronic component that includes: a base body; wiring inside the base body; a glass film covering an outer surface of the base body; an underlying electrode electrically connected to the wiring and covering a part of the glass film; and a metal layer covering the underlying electrode, wherein the glass film includes an uncovered portion that is not covered with the underlying electrode and separated from an outer edge of the underlying electrode by more than 10 μm, and a boundary portion that is not covered with the underlying electrode and not separated from the outer edge of the underlying electrode by more than 10 μm, and a thickness of the boundary portion is larger than a thickness of the uncovered portion.

A sensor element (1) for measuring a temperature is described, comprising - a carrier (2), - at least one functional layer (3) arranged on a top surface (2a) of the support, wherein the functional layer (3) has a material with a temperature-dependent electrical resistance, - at least one lower electrode (4), wherein a contact area (c2) is formed between the at least one lower electrode (4) and the functional layer (3), - at least one upper electrode (5), wherein a contact area (c1) is formed between the at least one upper electrode (5) and the functional layer (3), wherein the functional layer (3) is at least partially embedded between the at least one lower electrode (4) and the at least one upper electrode (5), and wherein the functional layer (3), the at least one upper electrode (5), and the at least one lower electrode (4) are designed and arranged such that a specific electrical resistance of the sensor element (1) is achieved. Furthermore, a use of the sensor element (1) is described.

Provided is an electronic component comprising: an element body (20); an inorganic oxide layer (30) that covers an outer surface (21) of the element body (20); and a glass layer (50) that covers an outer surface (31) of the inorganic oxide layer (30). The glass layer (50) contains one or more elements selected from alkali metals and alkaline earth metals. Voids (P) are present between the element body (20) and the inorganic oxide layer (30).

An aspect of the disclosure relates to a composite thermistor element (10). The element comprises a sensor material (1) disposed between a pair of electrodes (2a, 2b). The sensor material comprises particles (3) in a dielectric matrix (4). The particles (3) have a core (6) with a temperature dependent resistance and a coating layer (7) of an inorganic material. The particles form an electronic conduction path (5) between the electrodes (2a, 2b) with a temperature dependent resistance and a baseline resistance. Further aspects relate to methods of making thermistors, coated particles, compositions for use in making composite thermistors comprising the particles, and temperature sensors comprising the thermistors disclosed herein.

The invention discloses an NTC (Negative Temperature Coefficient) thermistor resistant to a low temperature of-100 DEG C and a preparation method thereof, and relates to the technical field of thermistors. The preparation method comprises the following steps: firstly, adding metal oxide mixed powder into a dispersing agent, and pressing into an NTC thermistor matrix by an isostatic pressing process; reacting silicon carbide, silver nitrate and sodium chloride to obtain silver-loaded silicon carbide, and reacting the silver-loaded silicon carbide and a silane coupling agent to obtain modified silicon carbide; the preparation method comprises the following steps: reacting polytetrafluoroethylene with acrylic acid under irradiation to obtain modified polytetrafluoroethylene; carrying out condensation reaction on the modified silicon carbide and the modified polytetrafluoroethylene to prepare conductive aerogel; and wrapping the outer layer of the NTC thermistor substrate with conductive aerogel, and then preparing the NTC thermistor by adopting a microwave sintering process. The low-temperature-resistant conductive aerogel is used for replacing conductive silver paste, and good performance stability can still be kept at the low temperature.

The present invention relates to a surface-mountable temperature sensor (1) in a flip-chip design for mounting on a circuit board (10), comprising a sensor element (2) that changes its electrical properties depending on the temperature, an outer metallization (3) for contacting the circuit board (10), wherein the outer metallization (3) extends on a surface (2A, 3A) that faces the circuit board (10) when installed, and in the form of a solder-wettable side flank (3B) on a side surface (2B) perpendicular to the surface (3A). The invention further relates to a sensor device comprising the sensor (1) and a circuit board (10) on which the sensor (1) is mounted using the flip-chip method.

The present invention provides a multilayer ceramic capacitor which has high adhesion strength between an external electrode and a spacer and exhibits excellent durability when mounted. A multilayer ceramic electronic component 1 according to the present invention is provided with: a capacitor main body 1A that is provided with a multilayer body 2 and two external electrodes 3 which are disposed on two end surfaces of the multilayer body 2, are connected to an internal electrode layer 15, and extend to two main surfaces of the multilayer body 2 so as to partially cover the main surfaces; and two spacers 4 that are disposed on both end surface sides of one main surface side of the capacitor main body 1A, sandwiching the external electrodes 3 partially covering the main surfaces. The spacers 4 are longer than the external electrodes 3 covering the main surfaces, in the length direction, and each contain an intermetallic compound which contains at least one of Cu and Ni as a high melting point metal and Sn as a low melting point metal, and a protective material 6. If each of the spacers 4 is divided into two parts in the length direction along a line extending in a stacking direction, the content ratio of the protective material 6 is higher in a region that is closer to a central part of the capacitor main body 1A in the length direction than in a region that is farther from the central part of the capacitor main body 1A.

The application discloses a recyclable NTC thermistor, which comprises a shell, a viscose cover plate, a sensitive element, a connecting end, a movable ring, a tray, an anti-explosion groove, a movable plate, a pressing plate, a wedge-shaped plate and a rotating plate; the installation assembly of the pressing plate pressing the sensitive element is formed through the wedge-shaped plate and the rotating plate; the cooperation assembly of the rotating plate being separated from the wedge-shaped plate and the pressing plate guarantees the pressing effect on the sensitive element and makes the tray separated from the shell; through pressing the movable ring, the movable plate and the wedge-shaped plate are moved downwards; on one hand, the wedge-shaped plate is moved downwards, the pressing plate is moved along the movable groove and is pressed on the outer surface of the sensitive element; on the other hand, the movable plate is moved downwards, the rotating plate is moved downwards and contacts the fixed plate, the rotating plate moving downwards is rotated, the pressing plate is pressed, the wedge-shaped plate and the rotating plate jointly act on the top and bottom of the pressing plate, so that the pressing plate is stably pressed on the outer surface of the sensitive element, and the sensitive element is fixed.

In a metal oxide sintered body for thermistors, a thermistor element, and a method for manufacturing a metal oxide sintered body for thermistors of the present invention, by having a protection layer other than an Y2O3 layer, a change in resistance value caused by reduction is minimized even at a high temperature and a change in resistance value occurring during formic acid reflow mounting is suppressed. A metal oxide sintered body 1 for thermistors according to the present invention has an (Ma, Y) oxide layer 3 formed on the surface of a complex oxide sintered body part 2 represented by a general formula: (1-z)(Ma1-yMby)(Cr1-xMnx)O3+zY2O3 (wherein Ma represents at least one trivalent metal element having an ion radius greater than that of Y, Mb represents at least one of Mg, Ca, Sr, and Ba, and 0.0≤x≤1.0, 0.0<y<0.5, and 0<z≤0.8 are satisfied).

A multilayer ceramic electronic component includes a ceramic element in which dielectric layers and internal electrodes are alternately laminated along a first axis direction, and a pair of external electrodes provided at end portions of the ceramic element in a third axis direction so as to be electrically connected to the internal electrodes led out to a different end surface of the ceramic element in the third axis direction. Each of the pair of external electrodes includes a first region and a second region in this order from the ceramic element. An average crystal grain size of crystal grains forming the first region is smaller than an average crystal grain size of crystal grains forming the second region.

The application discloses a method for precisely depositing an atomic BaTiO3 film on the surface of nickel powder. The method adopts a fluidized bed atomic layer deposition technology, and realizes self-limiting growth of the BaTiO3 film on the surface of the nickel powder by taking titanium-based and barium-based precursors and an oxidizing agent as reaction sources under the conditions of a deposition temperature of 200-400 DEG C and a reaction pressure in a range of 0.1 Torr to normal pressure, so as to form a nanoscale and thickness-controllable dense structure. The method can overcome defects such as poor film quality and fuzzy interface in traditional technologies, and the prepared core-shell structure Ni@BaTiO3 composite powder has the characteristics of uniform coating, strong bonding force, excellent oxidation resistance and the like, can significantly improve the sintering matching property and electrical property of a multilayer ceramic capacitor, and is suitable for the field of internal electrode materials of other electronic components.

The invention belongs to the technical field of electronic functional material and component manufacturing, and particularly relates to a high-performance thermistor and a rapid preparation method thereof.The rapid preparation method comprises the steps that (MnCoFeNi) 3O4 is designed as a basic high-entropy ceramic component, La2O3 and Ce2O3 are cooperatively doped, and the thermal stability and the electrical performance of the material are effectively improved. A high-temperature hot pressed sintering-programmed cooling annealing integrated process is adopted, the temperature is rapidly increased to 1050-1200 DEG C at the speed of 90-120 DEG C / min, meanwhile, the pressure of 10-15 MPa is applied, heat preservation is conducted for 20-30 min, the temperature is slowly reduced to 750-850 DEG C, annealing is conducted, heat preservation is conducted for 2-3 h, powder forming and sintering are completed synchronously, and the production period is shortened. The obtained thermistor has high density (greater than 95%), the B value is between 3756 and 4201 K, the linearity of the resistivity logarithm-temperature reciprocal relation in a wide temperature range of-20 to 150 DEG C is good, and the resistance drift rate is lower than 1.5% after the thermistor is aged at 125 DEG C for 240 hours. The preparation efficiency is improved while the performance is guaranteed, and the method is suitable for the high-end fields of industrial measurement and control, medical electronics and the like.

Open square grooves, namely a first square groove, a second square groove and a third square groove, are formed in the peripheral edge and the middle of a thermistor bearing part corresponding to a thermistor bearing area; the first square groove, the second square groove and the third square groove are all arranged in the direction, far away from the orthographic projection area of the thermistor piece on the bearing part, of the bearing part, so that the area of the bearing part is enlarged in a specific area, and the problem that the thermistor pieces with size differences around and in the middle of the bearing part cannot be placed into the bearing part can be effectively avoided; and the first square groove, the second square groove and the third square groove are formed in the edge of the bearing part for air leakage and providing operation space, so that the thermistor piece is convenient to load and unload, the main body size design of the bearing part can be closer to the product specification of the thermistor, and the problem of large electrode eccentricity during thermistor printing is avoided.