703results about "Resistor housing/enclosing/embedding" patented technology

A method of making resistors includes providing a sacrificial layer. Conductive material is then formed over a region of the sacrificial layer. Resistive material is then deposited over the first surface of the sacrificial layer such that the resistive material covers the sacrificial layer and the conductive material. A portion of the sacrificial layer is then removed to expose the conductive material. A method of making resistors includes the steps of providing a sacrificial layer, removing at least a portion of the sacrificial layer from regions of the sacrificial layer so as to create a plurality of cavities within the sacrificial layer, plating said cavities with a conductive material, disposing resistive material over the first surface of the sacrificial layer such that resistive material covers the sacrificial layer and said conductive material, and removing at least a portion of said sacrificial layer to expose the conductive material. In another embodiment, a method of making resistors includes the steps of providing a sacrificial layer having a roughened first surface and a second surface, depositing resistive material over the first surface of the sacrificial layer such that the resistive material covers the first surface of the sacrificial layer, and selectively etching the sacrificial layer to form electrodes.

The present invention relates to a novel thermal-sensitive resistive apparatus, such as PTC and NTC, which allocates planar electrode films on the top and bottom surfaces of a prior art thermal-sensitive resistive apparatus, such as a PTC apparatus, to laminate with an outer electrode layer. A plurality of interconnection vias are electroplated with conductive material to connect to any plane. It is convenient to surface mount the apparatus of the present invention on a printed circuit board. The present invention can largely increase the dimensional stability of components and overcome the disadvantage that thermal diffusion of the prior are surface mounted resistive apparatus is affected easily by line width and environments.

An improved IDC trim resistor connector assembly made up of a generally open top cup shape connector with side wall slots and an interior first array of terminal posts arranged for passage therethrough of a first lead wire of sensor circuitry. A first stamped metal IDC terminal is push-on mounted on the terminal posts for IDC cradling and electrically and mechanically receiving and connecting to the first lead wire. A conventional trim resistor substrate is loose mounted but accurately positioned on the connector bottom wall and has an "E" pattern of resistive material adapted for center leg laser trimming to calibrate the associated sensor circuitry. A first IDC terminal spring leg overlap contacts one side leg of the trim resistor E-pattern and thereby spring clamps the resistor substrate. A cover is snap-latch mounted on the connector and has an access opening to enable laser trimming of the trim resistor after cover installation. One end of a second lead wire is received in a second IDC metal terminal in turn mounted on a second array of connector-interior terminal posts and also having a spring leg overlap electrically contacting and clamping the other E-pattern side leg. Spring barbs on the terminals anchor the same once fully inserted downwardly onto the terminal posts. Connector locking tangs and cover locking ears provide snap-on retention of the cover on the connector, and press-in/keeper internal cover projections cause push-down assembly of the lead wires as the cover is latched onto the connector. Cover locking tangs and cap latching ears provide snap-together locking of a cap on the cover when the cap is pushed down on the cover to seal the access opening after completion of laser trimming and in-filling of the covered container with sealant. In a second embodiment a crimp-type terminal, also provided with a spring clamping leg, is fastened to the second lead wire and has a barbed mounting strap clasping a modified second terminal post array when fully installed thereon.

A method for making an integrated circuit substrate having embedded passive components provides a reduced cost and compact package for a die and one or more passive components. An insulating layer of the substrate is embossed or laser-ablated to generate apertures for insertion of a paste forming the body of the passive component. A resistive paste is used to form resistors and a dielectric paste is used for forming capacitors. A capacitor plate may be deposited at a bottom of the aperture by using a doped substrate material and activating only the bottom wall of the aperture, enabling plating of the bottom wall without depositing conductive material on the side walls of the aperture. Vias may be formed to the bottom plate by using a disjoint structure and conductive paste technology. Connection to the passive components may be made by conductive paste-filled channels forming conductive patterns on the substrate.

The invention is directed to a method to embed a thick film resistor composition into a printed wiring board comprising the steps of applying a reinforcing composition onto a resistor composition disposed on a metallic substrate forming an assembly wherein the resistor composition is at least partially coated with the reinforcing composition; processing the assembly; and applying the assembly onto at least one side of an organic substrate forming a component wherein the organic substrate is at least partially coated with an adhesive layer and wherein the reinforcing composition side of the assembly is embedded into the adhesive layer. The reinforcing composition allows laser trimming of the fired resistor and also eliminates cracking during lamination steps of the invention.

A method and apparatus for aspirating a liquid (e.g., blood) from a container uses an electrically biased thermistor element, mounted proximate the tip of a liquid-aspirating probe, to determine that the probe is safely submerged within a body of liquid to be aspirated at all times during the aspiration process. Also disclosed are different aspiration probe assemblies that are useful in the method and apparatus of the invention.

Disclosed is a method of producing a printed circuit board (PCB) with an embedded resistor, in which a resistor with a desired shape and volume is precisely formed using a resistor paste so that resistance values according to a position of the PCB are uniform, thereby a laser trimming process is omitted or minimally utilized. The method has advantages in that a production time of the PCB is shortened and productivity is improved because an operation condition is rapidly set without being greatly affected by the position precision of a printing device. Other advantages of the method are that the resistor paste with a relatively uniform thickness is secured through a screen printing process, thereby easily forming the resistor and improving resistance tolerance.

A 12kv resistance divider includes wire terminal, signal terminal, earthing terminal, ceramic wafer, resistance wire, and a green color protection layer covered by a black protection layer then rubber.

In a chip-type electronic component of the present invention, at least one surface of a ceramic body is a convexly curved surface. Specifically, at least one surface in a thickness direction of the ceramic body may be convexly curved, and the side surface of the ceramic body may be concavely curved. Alternatively, only one surface may be a convexly curved surface. This chip-type electronic component has a high visibility and a high mechanical strength, though it is small. Moreover, in a chip-type electronic component comprising a ceramic body that is formed by alternately laminating insulating layers and conductor layers, and a pair of external electrodes, the thickness in a laminate direction at the central part between external electrodes of the ceramic body is made greater than the thickness of the end surface. This prevents breakage of the external electrodes and also enlarges the ceramic body.

A sensor is disclosed that fits in a compact package. This compact sensor is ideal for sensing rotary positions and for accommodating one or more potentiometers. The resistor track is parallel and opposed to the collector track, and the wiper is placed between the two tracks to swipe both of them in one embodiment. This allows a short package, because the tracks are opposed to each other rather than being in a line, and a narrow package, because the tracks are not placed side by side. Another advantage of the invention is that putting the resistor track on a larger radius and the collector track on a smaller radius allows the resistor track to be longer. Having a longer resistor track allows a higher resolution, yet a package containing the potentiometer will still be relatively small. Several potentiometers may be placed in the sensor to provide redundancy yet retain compactness.

In a method of manufacturing a cartridge of an electronic vaping device, wherein the cartridge includes a pre-vapor formulation storage element, an electrical resistor is physically manipulated to change a resistance of the electrical resistor from a first resistance value to a second resistance value, the second resistance value indicative of a pre-vapor formulation substrate contained in the pre-vapor formulation storage element. The electrical resistor is then mounted to a portion of the cartridge.

A wrist-wearable detection device 2 for detecting a electrical potential of a pre-set magnitude within a certain proximity to the detection device. Detective circuitry 1 has a detection coil 3 that detects an electrical potential field generated by an electrically active field. The electrical potential is analyzed and compared by control circuit 20 against pre-set levels such as 60 Hz frequency, which in turn activates audible, visual (LED light) and for a vibratory indicator when in the presence of an electrical potential of a pre-set magnitude. The detector 2 is preferably incorporated into a wrist watch with controls (16, 17 and 18) which can be easily worn and thus always available for use.

A method for fabricating the embedded thin film resistors of a printed circuit board is provided. The embedded thin film resistors are formed using a resistor layer built in the printed circuit board. Compared with conventional discrete resistors, embedded thin film resistors contribute to a smaller printed circuit board as the space for installing conventional resistors is saved, and better signal transmission speed and quality as the capacitive reactance effect caused by two connectors of the conventional resistors is avoided. The method for fabricating the embedded thin film resistors provided by the invention can be conducted using the process and equipment for conventional printed circuit boards and thereby saving the investment on new types of equipment. The method can be applied in the mass production of printed circuit boards and thereby reduce the manufacturing cost significantly.

The resistor device is provided with a resistive plate (11) of metal plate material, which is used as a resistance body; a radiative plate (15) of metal plate material, which is spaced from the resistive plate and intercrossed on the resistive plate; a molded resin body (19), which encloses an intercrossing portion of the resistive plate and the radiative plate; terminal portions of the resistive plate (11a), which comprises so that both ends of the resistive plate extending from the molded resin body are bent along an end face and a bottom face of the molded resin body; and terminal portions of the radiative plate (15a), which comprises so that both ends of the radiative plate extending from the molded resin body are bent along an end face and a bottom face of the molded resin body. Accordingly, the surface-mountable resin-sealed metal plate resistor device is enabled to increase the power capacity drastically and to improve the reliability without changing most of the size.

This invention relates to resin sizing material used in sheet resistors including an adhesive and a filler, among which, the adhesive is a mixture of bakelite and epoxy resin formed in an organic solution, the filler is one of white, black fillers or a noble metal powder. The said sizing material is used in a secondary enveloper, markers and end electrodes of the resistor and completely solidified under 160-250deg.C not influencing the sheet resistors.

An organopolysiloxane composition comprising 0.01% to less than 0.5% by weight of a sulfidable metal powder is provided. When a silver-containing precision electronic part is encapsulated or sealed with the cured composition, the metal powder in the cured composition is sulfided with sulfur-containing gas for thereby preventing or retarding the corrosion of the electronic part with the sulfur-containing gas.

The invention discloses a thick-film anti-vulcanization paster resistor and a manufacturing method thereof. A second front side electrode is added to a first front side electrode so as to form an overlapped and intersected structure of the second front side electrode and a resistor layer as well as the second front side electrode and a first protecting layer; and the expansion coefficient of a second protecting layer is matched with that of the second front side electrode. Due to the structural method design, a vulcanization route is greatly prolonged, so that the anti-vulcanization property of the paster resistor is improved, and moreover, the phenomenon that the electrode is corroded by vulcanization gas from cracks caused in wave peak soldering or reflow soldering of a PCB (Printed Circuit Board) of the resistor because of the difference of expansion coefficients of an electro-nickelling layer, an electro-tinning layer and the second protecting layer. Therefore, the production cost of the thick-film anti-vulcanization paster resistor is greatly lowered, and the thick-film anti-vulcanization paster resistor can be widely applied to ordinary electronic products.

A method for manufacturing ultralow-resistance current sensors of size 0402 to 4518 of IEEE specifications includes the steps of: a raw metallic strip being pressed to roll over a first tension roller, a cutting tool over the first tension roller being fed to cut the raw metallic strip so as to form a deep groove thereof along the moving metallic strip, an insulating material being filled into and along the deep groove so as to form an lengthwise insulating portion of the metallic strip, and the metallic strip with the insulating portion being segmented into a plurality of ultralow-resistance current sensors.

The low resistance value resistor 11 has two electrodes 12,13 of metal strips having a high electrical conductivity. The metal strips are affixed on the resistor body by means of rolling and/or thermal diffusion bonding. A fused solder layer is formed on a surface of each electrode comprised by the metal strip. Thus, sufficient bonding strength and superior current distribution in the resistor body is obtained. Further, a portion of the resistor body is trimmed by removing a portion of the body material along a direction of current flow between the electrodes to adjust a resistance value. Thus, a precise resistor value and superior characteristics of temperature coefficient of resistance (TCR) can be obtained.

A resistor R1 formed by forming a first resistor layer 5a of 20 nm thickness including a tantalum nitride film at a concentration of nitrogen of less than 30 at % and a second resistor layer of 5 nm thickness including a tantalum nitride film at a concentration of nitrogen of 30 at % or more successively by a reactive DC sputtering method using tantalum as a sputtering target material and using a gas mixture of argon and nitrogen as a sputtering gas, and then fabricating the first and the second resistor layers, in which the resistance change ratio of the resistor can be suppressed to less than 1% even when a thermal load is applied in the interconnection step, by the provision of the upper region at a concentration of nitrogen of 30 at % or more.

A chip resistor includes an upper electrode provided on a substrate, a resistor element connected to the upper electrode, and a side electrode connected to the upper electrode. The side electrode, arranged on a side surface of the substrate, has two portions overlapping with the obverse surface and reverse surface of the substrate, respectively. An intermediate electrode covers the side electrode, and an external electrode covers the intermediate electrode. A first protective layer is disposed between the upper electrode and the intermediate electrode, and held in contact with the upper electrode and the side electrode. The first protective layer is more resistant to sulfurization than the upper electrode. A second protective layer is disposed between the first protective layer and intermediate electrode, and held in contact with the first protective layer, side electrode and intermediate electrode.