59results about "Current collector arrangements" patented technology

A microelectronic assembly, including a microelectronic element such as a semiconductor chip and a dielectric material covering the chip and forming a body having a bottom surface. The assembly includes conductive units having portions exposed at the bottom surface, posts extending upwardly from said exposed portions and top flanges spaced above the bottom surface.

The resistance of a thin-film resistor is substantially increased by forming the thin-film resistor to line one or more non-conductive trenches. By lining the one or more non-conductive trenches, the overall length of the resistor is increased while still consuming approximately the same surface area as a conventional resistor.

Provided are: a chip resistor which is capable of adjusting the resistance with high accuracy, while maintaining high sulfurization resistance of an electrode thereof, even in cases where the resistance of the chip resistor is low; and a method for manufacturing this chip resistor. This chip resistor (1) comprises an insulating film which covers a resistor (4) that is formed so as to be in contact with both of a pair of electrodes (3, 3) formed on the upper surface (2A) of an insulating substrate (2). Each of the pair of electrodes (3, 3) comprises: (1) a main electrode layer (3B) that contains silver as a main metal component, while containing 10% by weight or more of palladium, and an auxiliary electrode layer (3A) that has a lower specific resistance than the main electrode layer (3B); (2) a multilayer portion wherein the auxiliary electrode layer (3A) and the main electrode layer (3B) are sequentially laminated in this order on one surface of the insulating substrate (2); and (3) an exposed part (3A1) of the auxiliary electrode layer (3A) on the far side from the resistor (4), where the main electrode layer (3B) does not cover a part of the auxiliary electrode layer (3A), and an extending part (3B1) that extends from the near side to the far side from the resistor (4).

The present invention is to provide a heating substrate equipped with a conductive thin film and electrodes. The heating substrate includes a transparent substrate, a plurality of electrodes formed on a first face of the substrate, and a conductive thin film formed on the first face of the substrate and including a plurality of regions electrically connected each other in parallel by the plurality of electrodes. Furthermore, a method of manufacturing a heating substrate equipped with a conductive thin film and electrodes according to an exemplary embodiment of the present invention includes forming the conductive thin film on a substrate, forming main electrodes so as to extend on the substrate while being adjacent to edges of the conductive thin film, and forming branched electrodes that are extended from the conductive thin film across one side of the conductive thin film while coming in contact with the conductive thin film.

A resistor device includes a resistor plate and an electrode structure. The electrode structure includes an electrode layer and an auxiliary layer. The electrode layer is disposed at a first face of the resistor plate and includes a first portion and a second portion overlying a first side and a second side of the resistor plate, respectively, and a current path is conducted between the first portion and the second portion through the resistor plate. The auxiliary layer is disposed at a second face of the resistor plate and includes at least a first block and a second block overlying the first side of the resistor plate, and at least a third block overlying the second side of the resistor plate, wherein the first, second and third blocks of the auxiliary layer are separated from one another so that any current flow among the blocks is blocked.

A semiconductor device according to the present invention includes: a lower-surface oxidation preventing insulating film formed on a lower surface of a metal resistor element; an upper-surface oxidation preventing insulating film formed on an upper surface of the metal resistor element; and a side-surface oxidation preventing insulating film formed only near a side surface of the metal resistor element by performing anisotropic etching after being deposited on a whole surface of a wafer in a process separated from the lower-surface oxidation preventing insulating film and the upper-surface oxidation preventing insulating film. According to the present invention, it is possible to prevent the increase of the resistance value due to the oxidation of the metal resistor element and also to prevent the increase of the parasitic capacitance between metal wiring layers without complicating the fabrication process.

There is provided a chip resistor including a ceramic substrate; a first resistance layer formed on the ceramic substrate and including a first conductive metal and a first glass; and a second resistance layer formed on the first resistance layer, including a second conductive metal and a second glass, and having a smaller content of glass than the first resistance layer, thereby obtaining relatively low resistance and a relatively small temperature coefficient of resistance (TCR).

Disclosed is a device for the remote operation of the variable audio controls of floor-mounted audio effects devices, such devices typical of those used by performing artists on stage. The vast majority of devices of this type are operated by a foot pedal-controlled on / off switch and rotary operated potentiometer switch(es) to vary the audio output. The present inventive concept uses a variety of mechanical connectors, which couple the rotary switches of the floor device to a hand-operated controller mounted on a microphone or accessory stand. In this manner a performer is able to operate the effects device, with his / her hand, from a more natural standing position during a musical performance, rather than having to crouch down during said performance.

A copper foil with an electric resistance film in which a film with higher electrical resistivity than the metal foil is provided on the metal foil, wherein a plurality of electric resistance films with different electric resistance is arranged in parallel on the same metal foil. With conventionally used built-in resistor elements, one resistor element is configured of one type of substance on the copper foil. Nevertheless, when actually mounting the resistor elements, the circuit design tolerance can be increased and the number of man-hours can be reduced with two resistor elements and further with a plurality of resistor elements compared to a case with one resistor element. This invention aims to provide a metal foil with a built-in resistor element comprising two or more types of resistor elements on one metal foil.

A chip resistor including an insulating film covering a resistor making contact with a pair of electrodes formed on an upper surface of an insulating substrate and a method for manufacturing same are provided. Both electrodes include a main electrode layer that contains silver as a main metal component an 10 weight % or more of palladium as another metal component, and an auxiliary electrode layer lower in specific resistance than the main electrode layer, a laminate part where the auxiliary electrode layer and the main electrode layer are laminated in order on a single surface of the insulating substrate; and an exposed part of the auxiliary electrode layer where a part of the auxiliary electrode layer is not covered with the main electrode layer on a far side from the resistor, and part that extend from a near side to the far side with respect to the resistor.