448results about "Non-adjustable resistors" patented technology

An overvoltage protection device having a casing with an internal space, an earth branch, a positive branch, and a negative branch that join. The device also has an earth connector, n1 positive connectors, n1 being greater or equal to 3, and n2 negative connectors, n2 being greater than or equal to 3.

The utility model provides a leveled resistor element, which comprises a substrate, a resistor layer and an electrode layer, solves the problems of impedance increase and abnormal product characteristics caused by improper joint of an interface between the electrode layer and the resistor layer, and comprises the following steps of: after the electrode layer process is finished, forming the resistor layer on the substrate; and laser or grinding is utilized to eliminate the height difference of the interface and process the discontinuous structure of the outline of the electrode layer.

A frame terminal 8 is bent so that its cross-sectional shape is an S-shape, and such that separation distances L1, L2 and L3 in a horizontal direction between an uppermost portion and a lowermost portion, in the vertical direction, of an end portion side face 21a of a resistance element 8 built into a mold divider 1, and a part substantially midway between an uppermost point and a lowermost point thereof, and the parts of the surface of the frame terminal 6 that correspond to these parts in the horizontal direction satisfy the relation L1>L2≥L3. As a result, in the mold divider 1, a space which is to be filled with a joining material and which has a non-uniform separation distance is formed between the frame terminal 6 and the end portion side face 21a, thereby making it possible to ensure the bonding strength between the resistance element 8 and the frame terminal 6.

The invention discloses a film platinum resistor temperature sensor, which comprises an aluminum oxide insulating substrate, a titanium film, a platinum film resistor layer, a protective layer, a platinum metal lead and encapsulating slurry, the titanium thin film is deposited on the surface of the aluminum oxide insulating substrate, the platinum thin film resistance layer is deposited on the surface of the titanium thin film, the protection layer is deposited on the surface of the platinum thin film resistance layer, the platinum metal lead is welded on a bonding pad on the platinum thin film resistance layer, and the packaging slurry is coated on the protection layer and the platinum thin film resistance layer. According to the invention, the platinum film temperature sensor with high precision, good consistency, wide temperature measurement range and strong stability is obtained through arrangement and allocation of a multi-layer structure.

An apparatus is provided. The apparatus includes a first resistor stack having a first temperature coefficient. The apparatus also includes a second resistor stack coupled to the first resistor stack having a second temperature coefficient different than the first temperature coefficient. The apparatus further includes a measurement circuit associated configured to determine a temperature of the apparatus based on a differential between a first voltage across the first resistor stack and a second voltage across the second resistor stack and determine a set of resistances of a field-effect transistor (FET) that is coupled to the apparatus based on additional differentials between additional voltages across the first resistor stack and the second resistor stack.

The utility model relates to a high-power box-type liquid-cooled brake resistor, the resistor takes away heat through cooling liquid, the resistor comprises a shell, a resistor unit and a mounting plate, the mounting plate is mounted in the shell, the resistor unit is mounted on the mounting plate, the resistor further comprises a water inlet, a water outlet, a water passing plate and a water channel, the water inlet and the water outlet are installed on the shell, the water passing plate and the water channel are installed inside the shell, the water channel is connected with the water passing plate, one end of the resistor unit is placed in the water channel, and the cooling liquid sequentially passes through the water inlet, the water passing plate, the water channel and the water outlet. According to the utility model, the water channel is arranged, the integrated flow guide (anti-backflow design) design is adopted in the shell, the cooling liquid passes through the tubular resistor from bottom to top, and the temperature controller and the pressure monitoring instrument are arranged, so that the heat dissipation function is exerted to the utmost extent; by arranging the reinforcing ribs, the pressure bearing capacity of the shell can be enhanced, and the deformation amount of the shell in the working pressure bearing process is reduced.

The invention relates to the technical field of resistance paste, and provides resistance paste and a preparation method thereof. Wherein the resistance paste comprises 75-105 parts of a conductive filler, 0.5-5 parts of a high-temperature heat-resistant agent, 5-15 parts of glass powder and 15-33 parts of an organic carrier; the conductive filler contains nano silver powder. According to the resistance paste provided by the invention, the added conductive filler serves as a core component of the resistance paste and is used for forming a continuous and compact conductive network, and the contained nano silver powder can remarkably reduce the sintering temperature of the resistance paste, promote the sintering compactness and enhance the adhesive force, so that the stability and reliability of a resistor are improved; the high-temperature heat-resistant agent has an extremely high heat-resistant temperature, so that the heat stability, the service life and the reliability of the resistor can be remarkably improved; the glass powder can improve the compatibility of the slurry and a base material, effectively prevents cracking and layering caused by sintering, and can form a more compact protection layer, thereby inhibiting silver oxidation and improving the corrosion resistance of the resistor.

The invention relates to a carbon composite ceramic linear resistor and a preparation method and application thereof. The preparation method of the carbon composite ceramic linear resistor provided by the invention comprises the following steps: uniformly mixing aluminum oxide, clay and nano carbon black to obtain mixed powder; determining the mass of the powder based on the volume of a mold cavity of a mold and the target density of the carbon composite ceramic linear resistor, accurately weighing the mixed powder according to the calculated mass of the powder, filling the mixed powder into the mold, and carrying out hot pressed sintering to obtain a sample; and carrying out surface treatment on the sample to obtain the carbon composite ceramic linear resistor. Compared with a carbon ceramic resistor disc sintered at normal pressure, the density and porosity of the resistor disc are accurately controlled through fixed mold hot pressing, the resistivity is accurately controlled, the preparation method is simple, the cost is low, the yield is remarkably increased, and the carbon ceramic resistor disc is favorably put into actual industrial production.

This chip resistor is provided with a ceramic substrate, two electrodes that are disposed on the ceramic substrate, and a resistor that electrically connects the two electrodes. The ceramic substrate comprises a base material that contains a sintered body of ceramic particles (A) and a covering that contains a sintered body of α-alumina particles (B). The covering covers at least a part of the surface of the base material. The average particle diameter of the α-alumina particles (B) is smaller than the average particle diameter of the ceramic particles (A). The ceramic substrate has a support surface, the support surface-side surface of the base material is covered with the covering, and the resistor overlaps the support surface.

A temperature measuring device according to an embodiment of the present invention comprises: a power input unit; a thermistor electrically connected to the power input unit; a first resistor connected in series with the thermistor; and a second resistor connected in parallel with the thermistor.

A resistor includes a substrate, a first electrode, a resistive layer, a second electrode, and an insulating layer. The substrate surface has a first side and a second side opposite to each other in a first direction. The first electrode is arranged on the surface of the substrate and comprises a first end portion located on the first side and a first extending portion which is connected with the first end portion and extends towards the second side. The resistive layer is disposed on the first electrode. The second electrode is arranged on the resistance layer and comprises a second end portion located on the second side and a second extending portion which is connected with the second end portion and extends towards the first side. The insulating layer is disposed on the second electrode and covers the first extension portion, the resistive layer and the second extension portion. The resistor has a trench pattern extending in a first direction, the trench pattern extending through the insulating layer, the second electrode, and the resistive layer on a normal to the substrate. The resistor can help to control the resistance value and improve the yield.

This application relates to the field of thermistor materials technology, specifically disclosing a high resistivity, low B-value thermistor material, a chip resistor, and a method for preparing the same. The high resistivity, low B-value thermistor material provided in this application comprises a base material and 2-10% by weight of additives; the base material comprises Mn3O4, Co3O4, SrO, ZnO, and TiO2 in a weight ratio of (10-40):(5-15):(20-60):(5-10):(1-15); the additives comprise CaO, Fe2O3, and SiC in a weight ratio of (5-20):(10-50):(9-35); this application also provides a chip resistor made using the above-mentioned thermistor material. The chip resistor obtained in this application has high resistivity and a low B-value, which can meet the requirements for use in negative temperature coefficient thermistors.

To provide a multilayer ceramic electronic component that reduces the possibility of having interlayer peeling, while satisfying requests for a reduction in size and an increase in capacitance.SOLUTION: A multilayer ceramic capacitor 1 comprises: a laminate 2 having two outer layer parts 7 arranged on both sides in a lamination direction T of an inner layer part 6, a first side gap part 8A located on a side of a first side face B1 of the inner layer part 6, and a second side gap part 8B located on a side of a second side face B2; and external electrodes 3 arranged respectively on a first end face C1 and a second end face C2. The dimensions in a width direction W of the inner layer part 6 on a side of a first principal surface A1 and on a side of a second principal surface A2 in the lamination direction T are substantially equal to each other. On a cross section passing through the lamination direction T and the width direction W at the center in a lengthwise direction L, the dimensions in the width direction W of the first side gap part 8A on a side of the first principal surface A1 and on a side of the second principal surface A2 in the lamination direction T are substantially equal to each other, and the dimension in the width direction W of the second side gap part 8B gradually increases from the center in the lamination direction T toward the second principal surface.SELECTED DRAWING: Figure 3

To provide a chip resistor having lower electric resistance and more stable quality.SOLUTION: The chip resistor 1 includes a metallic resistor 10, a first plated electrode 21, and a second plated electrode 22. The metal resistor 10 includes a first bottom plate portion 11, a second bottom plate portion 12, a top plate portion 13, a first inclined leg portion 14, and a second inclined leg portion 15. The first plating electrode 21 is disposed on the bottom surface of the first bottom plate portion 11, the bottom surface of the first inclined leg portion 14, and the bottom surface of the top plate portion 13. The second plating electrode 22 is disposed on the bottom surface of the second bottom plate portion 12, the bottom surface of the second inclined leg portion 15, and the bottom surface of the top plate portion 13.SELECTED DRAWING: Figure 3

The invention discloses a semiconductor piezoresistive device and a preparation method thereof. The preparation method comprises the following steps: cleaning an SOI wafer and depositing a silicon dioxide layer; forming an ohmic contact region and a rectangular piezoresistive region structure through photoetching, etching and heavy doping processes; performing wet etching on the exposed rectangular window part of the piezoresistive region by using a corrosive liquid after photoetching, and forming a hole structure with a trapezoidal longitudinal section in the silicon nano-film; metal is sputtered after photoetching, and annealing is carried out to form ohmic contact; etching the buried oxide layer, performing wet etching on a part of the buried oxide layer, filling photoresist as a supporting structure, and performing undercutting on the residual buried oxide layer to form a large-size hollow silicon nano film; transferring the large-size hollow silicon nano film to a flexible substrate by adopting a double transfer printing method; and finally, printing an electrode and completing packaging. According to the method, the sensitivity and the transfer printing success rate of the silicon nano film are effectively improved through the design of the large-size hollow structure and the photoresist supporting transfer printing process.

This utility model discloses a stable and reliable surface mount resistor, belonging to the field of surface mount resistor technology. It includes a surface mount resistor body, with an upper mounting plate and a lower mounting plate respectively positioned above and below the body. Two sets of support rods are fixedly connected to the upper surface of the lower mounting plate, with the top of each set of support rods contacting the bottom surface of the upper mounting plate. Each set of support rods has a snap-fit ​​groove at its top. Two sets of snap-fit ​​blocks are fixedly connected to the bottom surface of the upper mounting plate. This stable and reliable surface mount resistor, through the coordination of the surface mount resistor body, upper mounting plate, lower mounting plate, support rods, snap-fit ​​grooves, snap-fit ​​blocks, and limiting frame, conveniently and stably utilizes heat dissipation and heating structures to improve the working environment of the surface mount resistor body. Furthermore, by utilizing a heating element, a semiconductor cooling element, and a temperature sensor, it strives to ensure that the surface mount resistor is in a constant temperature environment, thus enabling stable and reliable use of the surface mount resistor.

To provide a multilayer ceramic electronic component capable of improving bias characteristics while maintaining ferroelectricity.SOLUTION: A multilayer ceramic electronic component includes: a dielectric layer that has barium titanate as a main component, and has a core portion and a shell portion covering the core portion, in which calcium is solid dissolved in the shell portion, and includes a plurality of crystal grains in which a calcium concentration in the shell portion is 10 times or more a calcium concentration in the core portion; an internal electrode that is provided with the dielectric layer interposed therebetween, and has nickel or copper as a main component; and an external electrode that is electrically connected to the internal electrode.SELECTED DRAWING: Figure 1

This conductive paste contains: a conductive powder containing copper as the main ingredient; a glass frit; a binder resin; and an organic solvent. The glass frit contains substantially no elemental Zn, and contains, in mass% in terms of the oxides, 40.0-65.0 BaO, 15.0-23.0% B2O3, 2.0-12.0% Al2O3, 4.0-8.0% SiO2, 3.0-7.5% CaO, 2.5-5.0% MnO2, and 10.0-14.0% CuO. The total content of MnO2 and CuO contained in the glass frit is 12.5-17.5%, and the mass ratio of CuO contained in the glass frit with respect to MnO2 contained in the glass frit is 2.0-4.0. The use of this conductive paste makes it possible to manufacture an electronic component that is provided with a highly dense terminal electrode and that has excellent flexural strength.

To provide a multilayer ceramic electronic component that can increase reliability, and a method for manufacturing the same.SOLUTION: A multilayer ceramic electronic component is provided with: a functional part that has internal electrodes stacked in a first direction; a cover part that covers the functional part from the first direction; and a side margin part that covers the functional part from a second direction orthogonal to the first direction. The functional part has, on a predetermined cross section, first straight line parts in contact with the cover part and extending in the second direction, second straight line parts in contact with the side margin part and extending in the first direction, and corner parts connecting the first straight line parts and the second straight line parts. When the distance along the first direction between a first virtual line obtained by extending the first straight line part in the second direction and an end point of the second straight line part on a side of the first virtual line is defined as a, and the distance along the second direction between a second virtual line obtained by extending the second straight line part in the first direction and an end point of the first straight line part on a side of the second virtual line is defined as b, the corner part is curved so as to satisfy the conditions of a≥1 μm and 0.1≤a / b≤0.4.SELECTED DRAWING: Figure 10

The invention relates to a protective device (11) for an electronic component (10), wherein the protective device (11) can be arranged to at least partially encompass the at least one electronic component (10) and an electronic component (10) with such a protective device (11).

The present application provides a resistor for detecting current and a power supply device.SOLUTION: The resistor for detecting current comprises a middle portion, and a first end portion and a second end portion respectively connected to the middle portion, wherein the middle portion comprises a middle portion body including a first side surface and a second side surface opposite to each other, the first end portion and the second end portion are respectively connected to a first extension portion and a second extension portion extending from the middle portion body, the first testing end portion is connected to the first extension portion, and the second testing end portion is connected to the second extension portion. The resistor according to embodiments of the present application reduces the influence of the test contact position on the resistor, and improves the test accuracy while ensuring the connection between the resistor and the voltage testing device.SELECTED DRAWING: Figure 1

Provided is a copper-manganese-nickel based alloy having characteristics (in particular, specific resistance) close to those of a nickel-chromium based alloy. It is also an objective to provide an alloy having high processability compared to a nickel-chromium based alloy. An alloy for a resistive body includes copper, manganese, and nickel, wherein the manganese is 33 to 38% by mass, and the nickel is 8 to 15% by mass.

The invention discloses a pi-shaped chip high-voltage pulse attenuation network resistor and a manufacturing method thereof, and belongs to the technical field of electronic components. The network resistor structure comprises a ceramic substrate, a resistive layer, a resistive layer R1, a resistive layer R2, a resistive layer R3, a surface electrode, a back electrode, a side electrode, an electrode nickel-plated layer, an electrode lead-tin-plated layer, a glass protection layer and an epoxy resin layer. The manufacturing method comprises the following steps: printing a surface electrode on the upper surface of a ceramic substrate, printing a back electrode on the lower surface of the ceramic substrate, printing a resistive layer bridged on the surface electrode, printing protective glass on the resistive layer, carrying out laser resistance trimming on the resistive layer, printing an epoxy resin protective layer and a mark on the protective glass, and sputtering a metal layer on the end surface. And preparing an electrode nickel-plated layer and a lead-tin-plated layer on the end surface. The problems that in the prior art, overheat burnout is likely to occur, electrodes are likely to be eroded in a humid or sulfur-containing environment, and the manufacturing precision and stability are difficult to improve and control are solved. The resistor is widely applied to the technical field of attenuation network resistors.

To provide a multilayer electronic component with reduced size, and an electronic device including the same.SOLUTION: A multilayer ceramic component according to the present invention includes: a capacitor body including first internal electrodes and second internal electrodes that are stacked alternately, first side surfaces that face each other in a first direction, second side surfaces that face each other in a second direction that is orthogonal to the first direction, third side surfaces that face each other in a third direction that intersects with the first direction and the second direction, and fourth side surfaces that face each other in a fourth direction that is orthogonal to the third direction; and an external electrode disposed on each of the first to fourth side surfaces of the capacitor body. Each of the first internal electrodes includes a first extraction part that is exposed onto the first side surface, and a second extraction part that is exposed onto the second side surface. Each of the second internal electrodes includes a third extraction part that is exposed onto the third side surface, and a fourth extraction part that is exposed onto the fourth side surface.SELECTED DRAWING: Figure 1

This application relates to the technical field of resistor pastes, and provides a resistor paste and a preparation method thereof, including: 70 - 112 parts of conductive phase material, 0.1 - 3 parts of temperature coefficient regulator, 0.1 - 2 parts of thermal expansion coefficient regulator, 0.1 - 5 parts of sintering activator, 2 - 5 parts of glass powder, and 14 - 41 parts of organic carrier. For the resistor paste provided in this application, the conductive phase material is the core component, which is used to form a continuous and dense conductive network; the temperature coefficient regulator controls the resistance temperature coefficient of the resistor paste, enabling the resistor paste to maintain a stable resistance value within a wider temperature range; the thermal expansion coefficient regulator reduces the thermal expansion coefficient of the resistor paste, making it compatible with the substrate and avoiding the cracking problem after sintering caused by an excessive thermal expansion coefficient; the sintering activator reduces the sintering temperature of the resistor paste, promotes the diffusion and rearrangement between particles, increases the sintering density, improves the bonding between the paste and the substrate, and enhances the stability and reliability of the resistor body.

To provide a resistor chip capable of improving dielectric strength.SOLUTION: A resistor chip 10 includes an insulating member 20 and a resistive element 30 provided on the insulating member 20. The resistive element 30 includes an insulator 31 and a resistive layer 40 provided within the insulator 31. The insulating member 20 includes an insulating substrate 21 made of glass or sapphire.SELECTED DRAWING: Figure 5

The present invention comprises a sensor array (100, 110, 120) comprising: at least one grid of nanogranular sensor elements (20) deposited on a substrate (10, 12, 14); and at least one grid of electrodes (30) electrically connected to the nanogranular sensor elements (20) to enable the measurement of conductivity changes of each individual nanogranular sensor element (20), and a corresponding manufacturing process.

The utility model provides a chip resistor. The chip resistor comprises a substrate, a back electrode, a front electrode, a resistive layer, a protective layer and a side electrode, the protective layer comprises a first protective layer and a second protective layer; the first protective layer is made of a glass material, and the second protective layer is made of at least two layers of epoxy resin materials; a third protective layer is formed on the left electrode and the right electrode which are not covered, and the third protective layer is made of a resin silver material; through a multi-layer protection structure formed by the first protection layer made of the glass material and the second protection layer made of the epoxy resin material, invasion of moisture, chemical corrosion and mechanical damage is effectively prevented, the service life of the resistor in a severe environment is remarkably prolonged, and particularly, through the third protection layer made of the resin silver material, the service life of the resistor is prolonged. The anti-corrosion performance of the electrode part is enhanced, so that the resistor can keep stable electrical performance during long-time work.

To provide: a thick film resistor paste for resistors, which is excellent in surge resistance with a smaller resistance change rate for an electronic component that is reduced in size furthermore; a thick film resistor using the thick film resistor paste; and an electronic component including the thick film resistor.SOLUTION: Provided is a thick film resistor paste containing a conductive particle, glass powder, an organic vehicle, and an additive. The additive contains at least one of zinc oxide or silicon oxide, and the content of the zinc oxide and the content of the silicon oxide which are added as the additive each are 1 mass% or more and 19 mass% or less with respect to 100 mass% of the glass powder.SELECTED DRAWING: None

To provide a laminated resistor that is low in height and suppresses a short circuit caused by solder wetting.SOLUTION: A multilayer resistor includes a thin plate-shaped resistor having a first plane and a second plane in the thickness direction, a first electrode formed on the first plane, and a second electrode formed on the second plane, the resistor contains a nickel-chromium or iron-chromium metal material, the second electrode faces a circuit pattern when mounted on a circuit board, and the thickness of the resistor is configured to be between three and eight times the thickness of the second electrode.SELECTED DRAWING: Figure 1