231 results about "Mems sensors" patented technology

The invention relates to the technical field of energy storage cabinet safety monitoring, in particular to an energy storage cabinet multi-parameter intelligent monitoring device based on an MEMS sensor array, a sensor array unit in the energy storage cabinet multi-parameter intelligent monitoring device comprises distributed MEMS temperature and vibration sensors, the temperature sensors are installed in a non-vertical mode, detection deviation caused by direct blowing of airflow is avoided, and the energy storage cabinet multi-parameter intelligent monitoring device based on the MEMS sensor array is obtained. The airflow disturbance correction unit corrects temperature original data in real time and eliminates interference of airflow on module body temperature detection by means of a heat dissipation airflow vector field dynamic model and a compensation algorithm, and the multi-parameter coupling analysis unit processes vibration and temperature signals in a double-channel mode, extracts tab loosening high-frequency micro-vibration characteristics and correlates the temperature rising rate. Early fault logic is triggered through two-stage judgment, the fault decision and output unit fuses the correction temperature, the coupling strength coefficient and the speed-up ratio, graded early warning is generated through a fault tree model and transmitted to an external monitoring system, and accurate monitoring of early faults of the energy storage cabinet is achieved.

The invention discloses a deep learning correction system for an MEMS sensor, and relates to the technical field of sensor correction, and the system comprises a multi-source data collection module which collects various data in real time, verifies and caches the data, and transmits the data; the feature extraction and analysis module processes the data and extracts features, and transmits the features to the drift detection modeling and motion impact discrimination module; modeling, calculating, monitoring sudden change and synchronizing information; the event type output result is judged; the correction decision execution module executes correction accordingly, and is internally provided with self-checking and fine tuning functions to guarantee the stability of the system; according to the invention, technologies of multi-source data acquisition, multi-dimensional feature analysis, coupling dynamic regression, deep convolutional neural network and the like are fused, so that comprehensive sensing and accurate drift detection of the sensor are realized; and through collaborative operation of an attention fusion joint discrimination algorithm and the like, event types are accurately distinguished and targeted correction is performed, the system stability is maintained, and the measurement precision and the practical value are improved.

An assembly is provided which includes a package and a printed circuit board. The package includes a housing bounding a region and an acoustic sensor within the region. The housing includes a base with a first hole. The sensor is configured to generate signals indicative of sound received by the sensor through the first hole. The printed circuit board is in mechanical communication with the base and includes a second hole aligned with the first hole such that sound received by the second hole propagates through the first hole to the sensor. The printed circuit board further includes an electrically conductive layer, at least a portion of which extends across the second hole and is configured to allow the sound to propagate through the second hole and to at least partially shield the region containing the sensor from electromagnetic interference.

The invention discloses an outdoor static measurement MEMS sensor sensitivity calibration method, and relates to the technical field of sensor calibration, and the method comprises the specific steps: firstly constructing dual references including a factory reference and a field relation; synchronously collecting multi-source data according to a set period, and preprocessing to obtain an effective sequence; then double check chain fitting key indexes are started in parallel; if a collaborative judgment result is conflicted, high-grade diagnosis is triggered; after diagnosis, the acquisition period of sensitivity drift is prolonged, and parameters are recalculated; and finally, if the conditions are met, solidifying calibration parameters, installing a fault output alarm, and uploading whole-process data records to the cloud. According to the method, the sensitivity calibration of the sensor is guaranteed by constructing double references, multi-source data are synchronously acquired, and the performance is evaluated through double check chains. The efficiency is improved through round-robin scheduling of time slices, effective data are reserved through data preprocessing, differential processing is carried out after fault diagnosis, whole-process data recording and uploading are carried out, calibration parameters are solidified, it is guaranteed that the result is effective, and the application range is widened.

The invention belongs to the technical field of MEMS sensor signal processing, and discloses an MEMS sensor signal processing method and system based on an RLS-VMD fusion algorithm, and the method comprises the steps: continuously collecting an original acceleration signal at a preset sampling frequency through an MEMS sensor; offset in the original acceleration signal is eliminated through iterative calculation based on an RLS algorithm, and an offset correction signal and a residual error are obtained; a dynamic energy threshold value is obtained based on residual calculation, and frequency characteristic secondary verification is carried out on each screened modal component; carrying out superposition reconstruction to obtain an acceleration signal; and taking the purified acceleration signal as input, performing two times of integral operation based on the Newton's law of motion to realize displacement calculation, and finally outputting a displacement signal. According to the method, a correlation mechanism of RLS offset correction and VMD screening parameters is established, deep collaboration is achieved, and finally the acceleration signal processing quality and the displacement calculation precision of the MEMS sensor are improved.

A manometric catheter probe includes a flexible printed circuit, one or more pressure sensor assemblies coupled to the flexible printed circuit along a length of the flexible printed circuit, and a first flexible sleeve. Each pressure sensor assembly includes a body. The body includes a central cavity configured to receive the flexible printed circuit and an annular recess of the body. Each pressure sensor assembly further includes a microelectromechanical systems (MEMS) sensor disposed in the annular recess, an electrical connector configured to electrically couple the MEMS sensor and the flexible printed circuit, and a first flexible sleeve disposed over the annular recess of the body. The first flexible sleeve includes a fluid configured to communicate pressure to the MEMS sensor, and a second sleeve is disposed over the pressure sensor assembly.

The invention relates to the technical field of MEMS sensor calibration, and discloses a humidity drift correction method and system of an MEMS sensor. The method comprises the steps of tracking and identifying an external humidity source, extracting features of the external humidity source, and establishing a time-varying model to predict a humidity drift value; meanwhile, the internal running state of the sensor is monitored to obtain internal characteristic parameters. And fusing the predicted value with the internal parameter, constructing a drift influence quantity and generating an initial compensation quantity. And then, a sensor output feedback sequence is introduced to carry out dynamic iterative optimization on the initial compensation amount, an optimized drift compensation control sequence is generated, and finally the drift compensation control sequence acts on sensor output to complete correction. According to the method, through feature fusion modeling of the external environment and the internal state and a closed-loop dynamic optimization mechanism based on output feedback, the humidity drift correction precision and the adaptive capacity to the time-varying environment are improved.

Disclosed herein is a MEMS sensor package that includes a substrate, an annular-shaped first dry film pattern stuck to one surface of the substrate, and a MEMS sensor chip including a tubular support and a detection part which is supported on the support so as to overlap a cavity of the support. The MEMS sensor chip is fixed to the substrate by sticking an annular mounting surface of the support to the first dry film pattern.

This invention provides a MEMS sensor testing device and a MEMS sensor production line, belonging to the field of sensor testing. The MEMS sensor testing device includes a carrier disk and a driving assembly. The carrier disk includes a disk body and a mounting part. The disk body can rotate around its own axis. The mounting part is used to accommodate the sensor to be tested and can move along the diameter direction of the disk body. The driving disk is located on the side of the disk body away from the mounting part, coaxial with the disk body and capable of rotating around its own axis. The driving disk is located on the side of the disk body away from the mounting part, and the side of the driving disk facing the disk body has a driving strip that slides and adapts to the mounting part. As the carrier disk rotates, the mounting part moves along the diameter direction of the disk body. Compared with the prior art, this invention solves the technical problem that existing sensor testing devices cannot simulate sensors under different linear velocity conditions at a constant rotational speed.

The invention discloses a forming method of an MEMS sensor and the MEMS sensor. The forming method comprises the following steps: providing a first wafer; forming a first insulating layer on the first wafer; providing a device wafer, and bonding the device wafer with the first insulating layer; forming a through hole penetrating through the device wafer and extending into the first wafer; filling polycrystalline silicon in the through hole to form an electric connection structure; forming a sensitive structure and a signal transmission structure which are independent from each other on the device wafer, wherein the projection of the through hole is located in the projection range of the signal transmission structure; providing a second wafer; bonding the sensitive structure and the signal transmission structure with a second wafer; removing part of the first wafer on the side where the second surface is located so as to expose the electric connection structure in the through hole on the second surface; and forming at least one signal lead-out structure on the second surface. According to the MEMS sensor, the detection precision and stability of the MEMS sensor can be improved, the manufacturing cost of the MEMS sensor can be reduced, and batch production is facilitated.

The utility model relates to the technical field of MEMS device packaging, and particularly discloses a strip-shaped clamp for an MEMS device, and the MEMS device comprises an MEMS sensor and a special integrated circuit needing to be subjected to an injection molding process; the strip-shaped clamp comprises a frame part and a central part; the central part comprises a plurality of parallel long strip parts which are arranged at intervals; the two ends of each long strip part in the plurality of long strip parts are respectively connected with the frame part so as to form a plurality of strip-shaped openings; the corners of the strip-shaped opening are arranged to be fillets; and under the condition that the MEMS device is arranged below the strip-shaped clamp, the strip-shaped opening is used for exposing an application-specific integrated circuit of the MEMS device so as to carry out an injection molding process, and the strip-shaped part is used for covering an MEMS sensor of the MEMS device. According to the strip-shaped clamp, the cleaning difficulty can be reduced, the manufacturing cost can be reduced, the influence of sputtered resin points in the injection molding process on the performance of the MEMS device can be effectively prevented, and the packaging yield of the MEMS device is effectively improved.

The invention requests to protect an MEMS IMU sensor anti-interference method based on an auto-encoder. The method relates to the technical field of MEMS IMU sensor anti-interference, and comprises the following steps: acquiring normal working data of an MEMS IMU sensor and interference data of different types and different intensities, preprocessing the data to construct a data set, and training an AE self-encoding model fusing feature extraction and classification evaluation functions; in practical application, the model receives sensor output data in real time, judges whether interference exists or not through reconstruction errors, outputs interference types and interference intensity levels through a built-in classification head and an intensity evaluation head, and provides an accurate decision basis for subsequent anti-interference coping strategies. According to the method, the features do not need to be manually designed, rapid identification, accurate classification and intensity quantification of interference are realized by virtue of the deep feature automatic extraction capability of AE self-coding, the method has the characteristics of strong real-time performance, excellent generalization capability and wide adaptability, and the technical problems of weak pertinence and low identification precision of an existing MEMS sensor anti-interference method are effectively solved.

More than two chips are installed on a substrate, at least one chip is an MEMS chip sensitive to stress, the MEMS chip and other chips needing to be packaged are pre-bonded into a whole, one of the other chips is bonded to the substrate, and the bottom of the MEMS chip is arranged in a non-glue-distribution mode and is opposite to the substrate in a spaced mode. According to the packaging structure provided by the utility model, the bridging silicon chip or a chip with a larger breadth is used as a suspension carrier to bond the MEMS chip in an inverted manner, and the MEMS chip and the substrate are not contacted and are not coated with glue in a chip packaging state, so that the thermal stress deformation of the substrate is effectively isolated, and the performance of the MEMS sensor is improved.

Procedure (100; 300), comprising: Providing (110) a machined substrate arrangement (10; 70) comprising a machined semiconductor substrate (12) and a metallization layer structure (14) on a major surface (16) of the machined semiconductor substrate (12), and Release etching (120) from an area of ​​the metallization layer structure (14) towards the processed semiconductor substrate (12) to create a cut (22) in the metallization layer structure (14) at a separation region (25) in the processed semiconductor substrate (12), wherein the separation region (25) defines a boundary between a die region (27; 34a-b) of the processed substrate arrangement (10; 70) and at least a second region of the processed substrate arrangement (10; 70); where the release etching (120) further includes: Exposure of a MEMS functional element (18) arranged on the machined semiconductor substrate (12), wherein the MEMS functional element is a MEMS sensor and / or comprises a silicon material.

Disclosed herein are electronic sensor systems and methods of their operation. The electronic sensor systems contain a micro-electromechanical system (MEMS) for measuring a physical parameter such as rotation, pressure, acceleration, or another physical parameter. The electronic sensor systems also contain an integrated circuit linked with the MEMS. The integrated circuit contains a MEMS sensing circuit that receives outputs from the MEMS through conductors, such as wire bonds or ball joints, at least partially encapsulated in a dielectric. The dielectric may experience environmentally-induced changes to its dielectric constant that may affect a capacitance between a pair of the conductors, which can affect a measurement provided by the MEMS. The integrated circuit contains a compensation circuit that measures a capacitance between a pair of the conductors and provides an adjustment to a measurement provided by the MEMS.

The invention relates to the field of MEMS sensors, and discloses an MEMS sensor air pressure drift pre-calibration method based on an outdoor cold environment, and the method comprises the following steps: S1, low air pressure environment construction and natural recovery, and S2, dynamic data synchronous acquisition. Pollution of vibration of the low-pressure box to calibration data of the sensor is fundamentally eliminated, the purity of the calibration data is ensured, the air pressure drift correction coefficient obtained through fitting truly reflects the physical relation between air pressure and sensor output, and the authenticity and accuracy of the calibration coefficient are remarkably improved. Aiming at the problem that the calibration process in the prior art is not natural, the air pressure natural recovery process is closer to the air pressure change scene experienced by the sensor during actual outdoor application, so that the generalization ability and the compensation effect of the calibrated air pressure coefficient in the actual environment are better, and the applicability problems that the precision required by a laboratory is high and the field error is large are effectively solved.

Provided is an MEMS sensor module, comprising a side wall (1) enclosing a cavity, a first circuit board (2), a second circuit board (3), a partition wall (4) dividing the cavity into a first cavity (11) and a second cavity (12), a first MEMS sensor assembly (5) arranged in the first cavity (11) and encapsulated by glue (6), a second MEMS sensor assembly (7) arranged in the second cavity, a first gold finger layer (8) arranged between the side wall (1) and the partition wall (4) and the first circuit board (2), and a second gold finger layer (9) arranged between the side wall (1) and the partition wall (4) and the second circuit board (3), wherein the first gold finger layer (8) surrounds both the first cavity (11) and the second cavity (12), the second gold finger layer (9) surrounds both the first cavity (11) and the second cavity (12), and the first gold finger layer (8) at the partition wall (4) is provided with a slot (80) communicating the first cavity (11) with the second cavity (12). The MEMS sensor module can prevent a large amount of heat generated by an ASIC chip of one MEMS sensor assembly during operation from affecting the other MEMS sensor assembly.

This invention relates to the field of MEMS sensors and discloses a method and system for correcting single-axis abrupt changes in MEMS sensors, including the following steps: S1, obtaining the local gravitational acceleration reference value g at the deployment location of the target MEMS sensor; In this invention, through a dual judgment mechanism of modulus deviation and inter-axis correlation coefficient, it is possible to accurately distinguish between interference abrupt changes and real motion. Modulus deviation is used to initially screen abnormal data, while inter-axis correlation coefficient further verifies the authenticity of the abrupt change, effectively avoiding the problem of incorrect correction caused by relying on only a single indicator in the prior art. Furthermore, based on the physical law of conservation of the three-axis acceleration vector sum under static measurement, the abrupt axis is corrected using stable data of the other two axes, and an inter-axis coupling correction factor is introduced to compensate for manufacturing process deviations. The corrected data has high accuracy, and the total modulus deviation can be stably controlled within a preset threshold range, significantly improving the data accuracy of MEMS sensors in outdoor static measurement scenarios.

The invention relates to a mechanical fault detection method and device for GIS equipment and computer equipment, and the method comprises the steps: collecting vibration original waveform data of target GIS equipment under a target working condition for each MEMS sensor in an MEMS sensor array, and extracting original voiceprint features from the vibration original waveform data; extracting a target voiceprint feature corresponding to the target working condition from a preset voiceprint feature library; obtaining the similarity corresponding to each original voiceprint feature according to the original voiceprint feature and the target voiceprint feature of each MEMS sensor and a trained similarity measurement model; and obtaining a mechanical fault detection result of the target GIS equipment according to the similarity and a preset similarity threshold, thereby improving the accuracy of the mechanical fault detection result of the target GIS equipment.

The invention relates to the field of MEMS sensors, and discloses an MEMS sensor single-axis abrupt change correction method and system, and the method comprises the following steps: S1, obtaining a local gravitational acceleration reference value g of a target MEMS sensor deployment position; according to the method, the interference sudden change and the real motion can be accurately distinguished through a dual judgment mechanism of the die length deviation and the inter-axis correlation coefficient, the die length deviation is used for preliminarily screening abnormal data, the inter-axis correlation coefficient further verifies the authenticity of the sudden change, the problem of error correction caused by dependence on a single index in the prior art is effectively avoided, and the accuracy of the error correction is improved. And based on the physical law of three-axis acceleration vector and conservation under static measurement, the abrupt change axis is corrected by utilizing stable data of other two axes, and an inter-axis coupling correction factor is introduced to compensate the manufacturing process deviation, so that the corrected data is high in precision, and the total mold length deviation can be stably controlled within a preset threshold range. And the data accuracy of the MEMS sensor in an outdoor static measurement scene is obviously improved.

The application discloses a MEMS sensor and an electronic atomization device. The MEMS sensor comprises a substrate, a passivation layer, a substrate, a first force applying element, a second force applying element and a conductive contact. The first surface of the substrate has a groove, and the second surface has a Wheatstone bridge circuit. The passivation layer covers the second surface of the substrate. The substrate covers the groove to form a sealed cavity with the substrate. At least part of the first force applying element is arranged on the side of the passivation layer away from the substrate. At least part of the second force applying element is arranged on the bottom wall of the groove. The conductive contact is arranged on the substrate and / or the substrate. The first force applying element and the second force applying element are both configured to apply a force close to or away from the substrate to the bottom wall of the groove under the condition of being powered on. In this way, the substrate can always be in a flat initial state, thereby improving the problem that the deformation of the substrate does not change linearly with the pressure, and improving the detection accuracy of the MEMS sensor.

The wireless test method for the MEMS sensor comprises the following steps: pre-processing voltage data by a mobile terminal, and calculating the sensitivity of the currently tested sensor: pre-processing the sensor data: performing moving average filtering processing on the sensor data, determining a voltage reference value, and calculating the sensitivity of the currently tested sensor; in the process of testing the sensitivity of the sensor, when the sensor is subjected to external excitation, the output voltage of the sensor changes, the variable quantity of the voltage of the sensor relative to the reference value is calculated, and the ratio of the variable quantity to the reference value is calculated as the sensitivity of the sensor; presetting a maximum threshold value and a minimum threshold value of the sensitivity; if the sensitivity of the sensor is between the sensitivity minimum threshold value and the sensitivity maximum threshold value, the sensitivity of the sensor meets the requirement, and if the sensitivity of the sensor is not between the sensitivity minimum threshold value and the sensitivity maximum threshold value, the sensitivity of the sensor does not meet the requirement; and displaying the sensitivity data of the sensor meeting the threshold requirement.

The invention provides a double-cavity MEMS (Micro Electro Mechanical System) device and a manufacturing method thereof. The double-cavity MEMS device comprises an MEMS semiconductor part; the cover plate and the MEMS semiconductor part are bonded together; the first cavity is located between the MEMS semiconductor part and the cover plate, and a first MEMS sensor is formed based on the first cavity; the second cavity is located between the MEMS semiconductor part and the cover plate, a second MEMS sensor is formed based on the second cavity, the first cavity and the second cavity are both sealed cavities, and the pressure in the first cavity and the pressure in the second cavity are different; the vent hole extends into the MEMS semiconductor part from the bottom of the second cavity and forms an opening in the back surface of the MEMS semiconductor part; and an orifice sealing part for sealing an opening of the vent hole in the back surface of the MEMS semiconductor part. Therefore, the first cavity and the second cavity with different pressures can be obtained.

A smart-sensing radio frequency identification (RFID) patch for assessing a status of an inaccessible asset includes a flexible substrate operable to bend or flex to be secured about an exterior surface of the inaccessible asset, an integrated circuit embedded within the flexible substrate and communicably coupled to a plurality of electrical connections, a plurality of micro-electromechanical systems (MEMS) sensors communicably coupled to one or more of the electrical connections, the MEMS sensors operable to output signals denoting the status of the inaccessible asset, and one or more antennae communicably coupled to one or more of the electrical connections, wherein the antennae are operable to receive a high-power signal from an external source and emit a backscattering signal including the signals output by the MEMS sensors.

The application relates to the field of micro-electro-mechanical systems, and specifically discloses a micro-cantilever beam deformation correction method and system for MEMS sensor output errors, which comprises the following steps: exciting a composite vibration mode of a micro-cantilever beam through a multi-mode active excitation signal, collecting a dynamic response signal and identifying a deformation state parameter by using a deep learning model, generating laser micro-processing parameters based on the identification result to perform selective material removal or annealing treatment, establishing a deformation trend prediction model to perform pre-compensation adjustment, and ensuring the correction effect through a closed-loop verification mechanism; the system comprises a multi-mode active excitation control module, a dynamic response collection and processing module, a deformation identification and state evaluation module, a laser micro-processing control module, a deformation trend prediction and pre-compensation module, a correction effect verification and iterative control module, and a system integration and data management module. The application solves the problem of sensor errors caused by physical deformation of a micro-cantilever beam, and significantly improves the precision and long-term stability of a MEMS sensor.

The invention discloses a high-precision GNSS slope displacement monitoring system and method suitable for loess collapsibility characteristics, and the system comprises a GNSS monitoring module which comprises at least one monitoring point and a reference point; the monitoring point is welded and fixed on an existing protective steel pipe on site through the L-shaped mounting base; the data acquisition and transmission module is integrated in a waterproof box and comprises a data acquisition instrument, an MEMS sensor, a communication module and a power supply system which are electrically connected with the monitoring points; the cloud platform early warning center is used for receiving the data transmitted by the communication module and carrying out data fusion calculation and graded early warning; according to the invention, through data fusion of the GNSS and the MEMS sensor, limitation of a single technology is made up, and high-precision and continuous displacement monitoring under all-weather and all-working conditions is realized.

A MEMS sensor (100) and an electronic atomization device (1000). The MEMS sensor (100) comprises a substrate (10), a base plate (20), a temperature measurement element (31), and an electrically conductive contact (40), wherein the substrate (10) has a first surface (11) and a second surface (12) opposite to each other, the first surface (11) being provided with a recess (13), the second surface (12) being provided with a Wheatstone bridge circuit (14), and a bridge arm of the Wheatstone bridge circuit (14) comprising a varistor (140); the base plate (20) covers the recess (13) to form a sealed cavity; the temperature measurement element (31) is arranged on the inner surface of the sealed cavity; the electrically conductive contact (40) is arranged on the substrate (10) and / or the base plate (20), and is electrically connected to the temperature measurement element (31); and the temperature measurement element (31) has a temperature coefficient of resistance.

The invention belongs to the technical field of energy storage systems, and particularly relates to a compensation system and method for sensor aging drift in an energy storage system. The compensation system comprises a plurality of working battery units, and a first MEMS sensor is integrated on a shell of each working battery unit; each reference compensation unit comprises an aluminum shell, a positive pole and a negative pole, the positive pole and the negative pole are connected to the upper end of the aluminum shell, inert gas is filled in the aluminum shell, a second MEMS sensor is integrated in the aluminum shell, and a resistor is connected between the positive pole and the negative pole; the data acquisition and processing module is used for acquiring data of the first MEMS sensor and the second MEMS sensor and executing a compensation algorithm; according to the invention, by introducing the reference compensation unit, the internal aging drift of the sensor can be accurately quantified and separated, and then the environment-induced drift is decoupled from the total drift of the actual sensor, so that the dual, dynamic and high-precision compensation of the zero point and the sensitivity is realized.

It is planned that, at least in certain areas, electrode structures will be inserted between deformable membrane regions of membrane structures and a central electrode structure or a counter electrode structure located between two membrane structures. These additional electrode structures, i.e., the first and second electrode structures, will be attached to the support structures that mechanically connect the membrane structures and freely penetrate the central electrode structure, specifically at a distance from the deformable membrane regions of the membrane structures (i.e., the first and second membranes) and at a distance from the central electrode structure.

A microelectromechanical sensor (100) is described comprising a substrate (110), a stationary electrode arrangement (120) relative to the substrate (110) with several stationary finger electrodes (122, 124) arranged one behind the other in a detection direction (y), and a mass arrangement (130) with a first seismic mass (140) that is elastically deflectable relative to the substrate (110) in the detection direction (y) and that comprises a first movable electrode arrangement (150) of several movable finger electrodes (151), and a second seismic mass (160) that is elastically deflectable relative to the substrate (110) in the detection direction (y) and that comprises a second movable electrode arrangement (170) of several movable finger electrodes (171). wherein the finger electrodes (151) of the first movable electrode arrangement (150) and the finger electrodes (171) of the second movable electrode arrangement (170) are each alternately in combing engagement with the finger electrodes (122, 124) of the stationary electrode arrangement (120), wherein the mass arrangement (130) further comprises a coupling device (180) mechanically connecting the first seismic mass (140) with the second seismic mass (160) in a manner capable of movement, which is configured to cause a deflection of the first seismic mass (140) in a corresponding deflection of the second seismic mass (160) in the respective opposite direction.