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3059 results about "Bond strength" patented technology
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In chemistry, bond strength is the degree to which each atom is joined to another in a chemical bond contributes to the valency of this other atom. Bond strength is intimately linked to bond order and can be quantified by: bond energy: requires lengthy calculations, even for the simplest bonds. bond-dissociation energy Another criterion of bond strength is the qualitative relation between bond energies and the overlap of atomic orbitals of the bonds. The more these overlap, the more the bonding electrons are to be found between the nuclei and hence stronger will be the bond. Overlap is necessary for the formation of molecular orbitals. This overlap can be calculated and is called the overlap integral.
Method for forming dielectric SiOCH film having chemical stability
ActiveUS7807566B2Good chemical stabilityLow dielectric constantSemiconductor/solid-state device testing/measurementSemiconductor/solid-state device manufacturingDielectricSusceptor
A method for determining conditions for forming a dielectric SiOCH film, includes: (i) forming a dielectric SiOCH film on a substrate under conditions; (ii) evaluating the conditions using a ratio of Si—CH3 bonding strength to Si—O bonding strength of the film as formed in step (i); (iii) if the ratio is 2.50 % or higher, confirming the conditions, and if the ratio is less than 2.50 %, changing the conditions by changing at least one of the susceptor temperature, the distance between upper and lower electrodes, the RF power, and the curing time; and (iv) repeating steps (i) to (iii) until the ratio is 2.50 % or higher.
Owner:ASM JAPAN
Thermoformed platform
Owner:NEXTREME
Microwave-induced localized heating of cnt filled polymer composites for enhanced inter-bead diffusive bonding of fused filament fabricated parts
ActiveUS20160325491A1Increase inter-bead bond strengthImprove mechanical propertiesMaterial nanotechnologyElectroconductive/antistatic filament manufacture3d printCarbon nanotube
A microwave-induced heating of CNT filled (or coated) polymer composites for enhancing inter-bead diffusive bonding of fused filament fabricated parts. The technique incorporates microwave absorbing nanomaterials (carbon nanotubes (CNTs)) onto the surface or throughout the volume of 3D printer polymer filament to increase the inter-bead bond strength following a post microwave irradiation treatment and / or in-situ focused microwave beam during printing. The overall strength of the final 3D printed part will be dramatically increased and the isotropic mechanical properties of fused filament part will approach or exceed conventionally manufactured counterparts.
Owner:TEXAS TECH UNIV SYST
Furcation tubing and fanout furcation kit
ActiveUS20080138026A1Reduced longitudinal shrinkageIncreased tensile bond strengthCoupling light guidesOptical light guidesFiberUltrasound attenuation
Furcation tubing is made of glass-filled Teflon (PTFE) that provides reduced longitudinal shrinkage and increased tensile bond strength in the standard colors utilized for fiber identification. The furcation tubing experiences no more longitudinal shrinkage than furcation tubing made of polyvinylidene fluoride (PVDF) and has a tensile bond strength no less than furcation tubing made of clear, etched Teflon (PTFE). A fanout furcation kit prevents movement of the separated optical fibers in a funnel area of a lower furcation body. The funnel area is bathtub shaped with an increasing depth in the direction of an insert block having at least two rows of passageways in a staggered array. Guide walls defining the funnel area form a seal with an upper furcation body. Use of the furcation tubing and fanout furcation kit significantly reduces unacceptable attenuation and micro-damage to optical fibers deployed in an outdoor fiber optic network.
Owner:CORNING OPTICAL COMM LLC
Method for improved bond strength in an elastomeric material
ActiveUS7108759B2High strengthIncreasing ultrasonic bond strengthPersonal careLayered product treatmentElastomerUltimate tensile strength
Owner:KIMBERLY-CLARK WORLDWIDE INC
Thermally conductive cementitious grout for geothermal heat pump systems
A thermally conductive cement-sand grout for use with a geothermal heat pump system. The cement sand grout contains cement, silica sand, a superplasticizer, water and optionally bentonite. The present invention also includes a method of filling boreholes used for geothermal heat pump systems with the thermally conductive cement-sand grout. The cement-sand grout has improved thermal conductivity over neat cement and bentonite grouts, which allows shallower bore holes to be used to provide an equivalent heat transfer capacity. In addition, the cement-sand grouts of the present invention also provide improved bond strengths and decreased permeabilities. The cement-sand grouts can also contain blast furnace slag, fly ash, a thermoplastic air entraining agent, latex, a shrinkage reducing admixture, calcium oxide and combinations thereof.
Owner:THE UNITED STATES AS REPRESENTED BY THE DEPARTMENT OF ENERGY
Laminated structures
InactiveUS6887941B2High bonding strengthImproved performance characteristicsControlling laminationSynthetic resin layered productsHot meltAlpha-olefin
Hot-melt, pressure-sensitive adhesive compositions of amorphous polyalphaolefin and crystalline polypropylene have improved bond strength over the amorphous polyalphaolefin alone. The adhesive compositions improve dynamic shear strength, dynamic peel strength, as well as static peel strength. The adhesive compositions are particularly suitable for use in absorbent articles.
Owner:KIMBERLY-CLARK WORLDWIDE INC
Furcation tubing and fanout furcation kit
ActiveUS7461981B2Reduced longitudinal shrinkageIncreased tensile bond strengthCoupling light guidesFiberUltrasound attenuation
Furcation tubing is made of glass-filled Teflon (PTFE) that provides reduced longitudinal shrinkage and increased tensile bond strength in the standard colors utilized for fiber identification. The furcation tubing experiences no more longitudinal shrinkage than furcation tubing made of polyvinylidene fluoride (PVDF) and has a tensile bond strength no less than furcation tubing made of clear, etched Teflon (PTFE). A fanout furcation kit prevents movement of the separated optical fibers in a funnel area of a lower furcation body. The funnel area is bathtub shaped with an increasing depth in the direction of an insert block having at least two rows of passageways in a staggered array. Guide walls defining the funnel area form a seal with an upper furcation body. Use of the furcation tubing and fanout furcation kit significantly reduces unacceptable attenuation and micro-damage to optical fibers deployed in an outdoor fiber optic network.
Owner:CORNING OPTICAL COMM LLC
Methods of cementing pipe in well bores and low density cement compositions therefor
The present invention provides methods of cementing pipe in well bores and low density cement compositions having enhanced compressive, tensile and bond strengths upon setting. The composition of the invention are basically comprised of a hydraulic cement, sufficient water to form a slurry and hollow glass microspheres surface treated with a mixture of organosilane coupling agents present in an amount sufficient to produce a cement composition density in the range of from about 6 to about 12 pounds per gallon.
Owner:HALLIBURTON ENERGY SERVICES INC
Ultra-hard and metallic constructions comprising improved braze joint
An ultra-hard and metallic construction comprises an ultra-hard component that is attached to a metallic component via a braze joint. The braze joint is interposed between the ultra-hard component and the metallic component, and comprises a first braze material bonded to a surface of the ultra-hard component. The braze joint includes an intervening layer in direct contact with the first braze material, and that is formed from a rigid material. The braze joint further comprises a second braze material that is interposed between the intervening layer and the metallic component, and that is different from the first braze material. Configured in this manner, the use of the braze joint operates to provide an optimum level of bond strength within the construction to enable its use in certain demanding wear and / or cutting applications.
Owner:SMITH INT INC
Proppant with composite coating
ActiveUS20140162911A1Improve crush resistanceEnhanced level of hardnessFluid removalFlushingParticulatesChemical Linkage
Proppants for hydraulic fracturing of oil and gas wells have a polymeric coating that is strengthened with reinforcing particulates that are reactive with, or chemically bonded to, the polymeric proppant coating. Preferably, these particulates are added into the coating during the coating process. In one embodiment, functionalized particulates are used that become grafted into the polymer of the proppant coating through the chemical functionality imparted to the particulates. If non-functionalized particulates are used, a coupling agent is preferably added to enhance the bond strength between the added particulates and the polymeric matrix of the proppant coating.
Owner:PREFERRED TECH
Bonding wire for semiconductor device
ActiveUS20090188696A1Economical in material costSuperior in ball bondability bondabilityNon-insulated conductorsSolid-state devicesConcentration gradientControllability
The present invention provides a bonding wire improved in formability of a ball part, improved in bondability, good in loop controllability, improved in bonding strength of a wedge connection, securing industrial production ability as well, and mainly comprised of copper which is more inexpensive than gold wire, that is, provides a bonding wire for a semiconductor device comprised of a bonding wire having a core material having copper as its main ingredient and a surface covering layer over the core material and of a conductive metal of a composition different from the core material, characterized in that the surface covering layer has as its main ingredients two or more types of metals selected from gold, palladium, platinum, rhodium, silver, and nickel and the surface covering layer has a concentration gradient of one or both of a main ingredient metal or copper in the wire radial direction.
Owner:NIPPON STEEL CHEMICAL CO LTD
Adhesiveless microfluidic device fabrication
InactiveUS6848462B2High bonding strength between layersEasy to prepareVolume/mass flow measurementFluid pressure measurement by electric/magnetic elementsInter layerEngineering
A method for fabricating a microfluidic device where first and second substantially flat platens are provided. Multiple substantially planar, substantially metal-free, adhesiveless polymer device layers, the device layers including a first cover layer, second cover layer, and at least one stencil layer defining a microfluidic channel penetrating through the entire thickness of the stencil layer also are provided. Each stencil layer is disposed between other device layers such that the channel is bounded laterally by a stencil layer, and bounded from above and below by surrounding device layers to define an upper channel surface and a lower channel surface. The device layers are stacked between the first platen and the second platen. The stacked device layers are controllably heated according to a heating profile adapted to form a substantially sealed adhesiveless microfluidic device wherein each upper channel surface remains distinct from its corresponding lower channel surface. The resulting microfluidic device has high inter-layer bond strength while preserving the integrity of the channel(s) defined in the stencil layer(s).
Owner:AGILENT TECH INC
Bonding pad with high bonding strength to solder ball and bump
InactiveUS20070108619A1High bonding strengthBonding strengthSemiconductor/solid-state device detailsPrinted circuit aspectsSolder maskSolder ball
A bonding pad with high bonding strength to a solder ball and a bump includes a carrier, a wiring layer formed on the carrier, a protection layer formed on top of the wiring layer and a solder mask layer surrounded around the protection layer and the wiring layer to form a bonding pad opening. The protection layer is extended outside the bonding pad opening such that when solder are extended into the bonding pad opening, the solder balls engage with side faces defining the bump pad opening as well as the protection layer outside the bump pad opening and a bonding strength between the bonding pad and the solder performance is increased.
Owner:KINSUS INTERCONNECT TECH
RTV silicone composition offering rapid bond strength
InactiveUS20050192387A1High strengthDevelop green strengthOther chemical processesSpecial tyresRoom temperatureUltimate tensile strength
The present invention provides for a room temperature vulcanizable silicone sealant composition that rapidly achieves a usable green strength shortly after application. Such a composition that develops a usable green strength is useful in the manufacture of architectural elements employing glazing such as windows and doors and when such a composition is used in a manufacturing process, the manufacturing process can be accelerated relative to a process that uses a silicone sealant that does not rapidly achieve a usable green strength.
Owner:GENERAL ELECTRIC CO
Use of bioactive glass compositions to stimulate osteoblast production
InactiveUS20040009598A1Expand the populationRapid apoptosisSkeletal/connective tissue cellsCell culture supports/coatingOsteoblastMammal
Compositions comprising bioactive glass compositions or extracts thereof which include ions in an appropriate concentration and ratio that they enhance osteoblast production, and methods of preparation and use thereof, are disclosed. The compositions can be included in implantable devices that are capable of inducing tissue formation in autogeneic, allogeneic and xenogeneic implants, for example as coatings and / or matrix materials. Examples of such devices include prosthetic implants, sutures, stents, screws, plates, tubes, and the like. Aqueous extracts of the bioactive glass compositions, which extracts are capable of stimulating osteoblast production, are also disclosed. The compositions can be used, for example, to induce local tissue formation from a progenitor cell in a mammal, for accelerating allograft repair in a mammal, for promoting in vivo integration of an implantable prosthetic device to enhance the bond strength between the prosthesis and the existing target tissue at the joining site, and for treating tissue degenerative conditions.
Owner:NOVATHERA
Dental compositions including thermally responsive additives, and the use thereof
InactiveUS20070142498A1Reduce bond strengthLess forceImpression capsOther chemical processesUltimate tensile strengthBond strength
Owner:3M INNOVATIVE PROPERTIES CO
Method of hydrolytically stable bonding of elastomers to substrates
ActiveUS20110195260A1Hydrolytic stabilityAdhesive processesLaboratory glasswaresElastomerPeristaltic pump
Active devices such as pumps and mixers have been fabricated in plastic-PDMS hybrid devices. By utilizing functionalized bis-silane primers, bond strength between Polycarbonate or PMMA and PDMS improved in dry and aqueous environments. Plastic-primer-PDMS layers exposed to acid and base solutions at 70° C. for 2 hours showed no signs of delamination at 30 psi for pH −1 to 15 and 60 psi for pH 0 to 15. A peristaltic pump fabricated in polycarbonate achieved consistent flow rates up to peristaltic cycle frequencies of 10 Hz in water, 1OM HCl, and 1OM NaOH solutions.
Owner:MASSACHUSETTS INST OF TECH
Method for direct attachment of a chip to a cooling member
InactiveUS6413353B2High bonding strengthAdequate flowSemiconductor/solid-state device detailsAdhesive processes with surface pretreatmentHeat flowSilanes
A semiconductor chip module uses a silicone adhesive between the semiconductor chip and a cap, said adhesive having sufficient bond strength to secure said cap to said chip without additional mechanical constraint while providing a direct thermally conductive path and permitting sufficient heat flow from said chip to said cap to maintain steady state operation of said semiconductor chip. The preferred silicone adhesive comprises a primerless, two-part polysiloxane-based adhesive made by reacting polydimethyl siloxane, an organosilicon compound, a polysiloxane, and a silane, in the presence of a catalyst.
Owner:IBM CORP
Stretchable hot-melt adhesive composition with temperature resistance
InactiveUS20050054779A1Improve tensile propertiesHigh bonding strengthPersonal careSynthetic resin layered productsPolymer sciencePlasticizer
An adhesive composition including an atactic polymer, an isotactic polymer, and an elastomeric base polymer. The composition may also include a high softening point tackifier resin, a low softening point additive and / or other additives, such as an antioxidizing agent, a plasticizer, mineral oil, color pigment, filler, polymer compatibilizer, or a combination of any of these additives. Facing layers, particularly stretchable and / or elastomeric substrates, can be bonded with the adhesive composition. The adhesive composition maintains high bond strength, even at body temperature and after initial stretching. Such adhesive compositions and laminates can be made according to a method of the invention.
Owner:KIMBERLY-CLARK WORLDWIDE INC
Enhancements for adhesive attachment of piezoelectric motor elements to a disk drive suspension
InactiveUS6856075B1High bonding strengthEasy to fillPiezoelectric/electrostriction/magnetostriction machinesSemiconductor/solid-state device manufacturingTransducerEngineering
Adhesive attachment features for bonding piezoelectric motors to a load beam substrate. The attachment features have one or more reliefs under or partially under or adjacent to a piezoelectric transducer to control the flow of adhesive by limiting or influencing adhesive travel or flow and simultaneously preventing excessive adhesive fillet height adjacent the piezoelectric motor while simultaneously providing for improved bond strength between the piezoelectric element and the load beam.
Owner:HUTCHINSON TECH
Low temperature sputter target/backing plate method and assembly
InactiveUS7146703B2Firmly connectedSolve the lack of resistanceCellsElectric discharge tubesBond interfaceBond strength
A sputtering target and a backing plate are diffusion-bonded with or without an insert or inserts interposed there-between so as to have a solid phase diffusion-bonded interface. The sputtering target substantially maintains its metallurgical characteristic and properties even though it has been diffusion-bonded to the backing plate. The solid-diffusion bonding of the target and backing plate, is achieved at a low temperature and pressure and results in interdiffusion of constituent atoms to attain high adhesion and bond strength without attendant deterioration or large deformation of the target material, while inhibiting the crystal growth in the target material. The bond undergoes no abrupt decrease in bond strength upon elevation of the service temperature. One hundred percent bonding is achieved with non-bonded portions such as pores left along the interface.
Owner:TOSOH SMD
Bonding a non-metal body to a metal surface using inductive heating
InactiveUS7452800B2Change propertiesQuickly and effectively bondSolid-state devicesForce measurementMechanical componentsMems sensors
Owner:RGT UNIV OF CALIFORNIA
Oil-resistant elastic attachment adhesive and laminates containing it
InactiveUS20070142801A1Excellent bonding and oil resistanceBaby linensAdhesivesPersonal carePolyolefin
A polyolefin-based elastic hot melt adhesive composition having oil resistance, creep resistance and excellent bond strength is provided. The adhesive composition is useful in elastic laminates used in personal care absorbent articles and other garments.
Owner:KIMBERLY-CLARK WORLDWIDE INC
Lighter than air balloon made from a biaxially oriented polyester film
ActiveUS20090022919A1Low densityEnvelopes/bags making machineryVacuum evaporation coatingCopolyesterLighter than air
A long life balloon formed from a lamination. The lamination includes a polyester film with a total thickness of 4 μm to 12 μm. The polyester film includes a biaxially oriented polyester core layer and at least one amorphous copolyester skin layer. The lamination also includes a sealant layer and a gas barrier layer on an opposite side of the polyester film from the sealant layer. The oxygen transmission rate of the balloon is less than 0.1 cc / 100 sqin / day, a bonding strength of the gas barrier layer to the surface of the polyester film is more than 300 g / in at dry conditions, a sealing strength of the balloon is more than 3.5 kg / in, and a floating time of the balloon is more than 20 days.
Owner:TORAY PLASTICS AMERICA +1
Electrical connection structure for piezoelectric element and head suspension
ActiveUS20110279929A1Reliable electrical connectionReliably movedElectrical connection between head and armTrack finding/aligningLaser processingSurface layer
An electrical connection structure connects a piezoelectric element to a flexure with a conductive adhesive. An electrode surface is formed on the piezoelectric element, and a terminal surface is formed on the wiring member and is smoother than the electrode surface. A the gold plate layer is formed on the terminal surface and is connected to the electrode surface with the conductive adhesive. At least one recess is formed by laser processing on the conductive terminal surface layer. The electrical connection structure substantially equalizes the surface roughness of the terminal surface with the gold plate layer to that of the electrode surface, improves a bonding strength on the terminal surface nearly to that on the electrode surface, enhances the reliability of electrical connection between the electrode surface and the terminal surface, maintains electrical characteristics of the terminal surface, and prevents contamination around the terminal surface.
Owner:NHK SPRING CO LTD
Multi-lumen catheter with separate distal tips
ActiveUS20080021417A1Reduce deliveryImprove flow characteristicsMulti-lumen catheterOther blood circulation devicesDistal portionUltimate tensile strength
A multi-lumen catheter including tip sections distal to a dividing point, the tip sections releasably joined by a method that produces a variable separation force between the tip sections along a length thereof. An increasing separation force may be imparted to the tip sections by providing an increasing bond strength in fusion zones from a distal portion of the tip sections toward the dividing point.
Owner:CR BARD INC
Gas turbine seal
InactiveUS6652227B2High bonding strengthHigh overheatPump componentsReaction enginesCeramic coatingTangential force
The invention relates to a gas turbine seal, comprising a metallic component (1) with a durable or erosion-resistant ceramic coating (2) and an abradable ceramic layer (18) which is arranged thereon in locally delimited fashion, a bond layer (5) being arranged on the surface (4) of the metallic component (1), to which bond layer the durable or erosion-resistant ceramic coating (2) is applied as a covering layer. The invention is characterized in that the bond layer (5) comprises separate, adjacent spherical rivets (6) or mushroom-shaped rivets (6) which have a web (7) and a head (8). These rivets form individual metal islands with numerous undercuts (12), around which there is a continuous ceramic network. It is possible to produce very thick layers which have a good bond strength, the ceramic not being flaked away even in the event of introduction of radial / tangential forces, sickle-shaped contact or locally high overheating / frictional heat, and a good sealing action being achieved.
Owner:GENERAL ELECTRIC TECH GMBH
Preparation method for high strength solventless epoxy adhesive
InactiveCN101544879AConvenient sourceSimple preparation processModified epoxy resin adhesivesDiluentHigh intensity
The invention relates to a preparation method for a high strength solventless epoxy adhesive. The preparation method comprises the following steps: carrying out reaction on an aromatic primary diamine and an epoxy resin for 0.5 to 2 hours at 60 to 100 DEG C, adding an active flexibilizer, and carrying out reaction for 1 to 3 hours at 80 to 110 DEG C to obtain a modified sticky epoxy resin system; and adding an active diluent and a curing agent in the modified epoxy resin system, and stirring the mixture evenly to obtain the high strength solventless epoxy adhesive. The preparation method has a simple process, low cost, convenient operation and convenient reaction raw material sources, and is capable of completing the preparation process in a general device and facilitates realization of the industrialized production. In addition, the viscosity of the high strength solventless epoxy adhesive reaches 15 to 1,000 Pa.s at 25 DEG C; the bond strength maximally reaches 35 MPa; and the high strength solventless epoxy adhesive has bright application prospect.
Owner:DONGHUA UNIV
Microcapsules adapted to rupture in a magnetic field to enable easy removal of one substrate from another for enhanced reworkability
ActiveUS20130034739A1Excellent reworkabilityReduce bond strengthLamination ancillary operationsMagnetic paintsIn situ polymerizationMagnetite Nanoparticles
An enhanced thermal interface material (TIM) gap filler for filling a gap between two substrates (e.g., between a coldplate and an electronics module) includes microcapsules adapted to rupture in a magnetic field. The microcapsules, which are distributed in a TIM gap filler, each have a shell that encapsulates a solvent. One or more organosilane-coated magnetic nanoparticles is / are covalently bound into the shell of each microcapsule. In one embodiment, (3-aminopropyl) trimethylsilane-coated magnetite nanoparticles are incorporated into the shell of a urea-formaldehyde (UF) microcapsule during in situ polymerization. To enable easy removal of one substrate affixed to another substrate by the enhanced TIM gap filler, the substrates are positioned within a magnetic field sufficient to rupture the microcapsule shells through magnetic stimulation of the organosilane-coated magnetic nanoparticles. The ruptured microcapsule shells release the solvent, which dissolves and / or swells the TIM gap filler, thereby reducing the bond strength between the substrates.
Owner:IBM CORP
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