49 results about "Bond strength" patented technology

The invention relates to a preparation, regulation and control method of a thermoplastic elastomer encapsulating material in the technical field of new materials, which comprises the following steps: realizing an in-situ reaction process by controlling the concentration and reaction temperature of reactive functional groups in the encapsulating material according to an interface reaction rate constant and active group distribution density; if the reaction conversion rate reaches a preset value, a chemically bonded interface bonding layer is formed; monitoring the stress distribution state in the rubber coating layer by adopting a stress analysis algorithm, and when detecting that local stress concentration exceeds the yield strength of the material, dispersing a stress concentration area by adjusting the length of a flexible chain segment and the density of a rigid cross-linking point in a cross-linking network; and deformation data and a bonding strength change trend of the interface bonding layer in the temperature cycling process are obtained, if the bonding strength attenuation rate exceeds a preset threshold value, a dynamic cross-linking mechanism is activated, and the dynamic equilibrium state of interface bonding is maintained through fracture and recombination of a reversible covalent bond.

The invention discloses a method and a device for detecting the bonding strength of a coating, and belongs to the technical field of coating detection. The method for detecting the bonding strength of the coating comprises the following steps: respectively bombarding test areas of a plurality of samples to be detected by adopting first laser according to different control parameters; the method comprises the following steps: detecting the falling degree of a coating in a test area of each to-be-tested sample from a substrate, and judging whether the falling degree reaches a set degree or not; taking the control parameter of the first laser corresponding to the to-be-detected sample with the falling degree reaching the set degree as a critical control parameter; and controlling the first laser to bombard a coating area of a to-be-tested product with the same model as the to-be-tested sample according to the critical control parameter, and evaluating the coating bonding strength of the to-be-tested product according to the surface appearance of the to-be-tested product. The coating bonding strength can be measured without contact with the coating, matrix damage is avoided, detection precision and detection efficiency can be improved, manual intervention is reduced, cost is reduced, and environmental pollution is avoided.

A method for manufacturing a metal solid-to-metal solid bonded body, capable of improving a bond strength on a bonding face, and a composite member. A solid metal body containing a first component is brought into contact with a solid metal material composed of a compound, an alloy, or a non-equilibrium alloy, which contains both a second component and a third component having positive and negative heats of mixing respectively relative to the first component, and heated at a predetermined temperature for a predetermined time while applying a predetermined pressure to between the metal body and the metal material. Thereby, the first component and the third component are interdiffused with each other, and a liquid alloy containing the first component and the third component, which has been generated in a region where the first component and the third component have interdiffused with each other, is discharged.

The application provides a preparation method of a high-temperature-resistant and anti-aging cable sheath material, comprising the following steps: obtaining molecular chain distribution data of a polymer matrix and inorganic fillers, and establishing a bonding strength distribution graph; obtaining regional non-uniform points, and optimizing filler distribution parameters; calculating a crosslinking temperature gradient model based on a compatibility improvement coefficient; predicting crosslinking density and correcting reaction parameters according to the model; evaluating an aging rate distribution and optimizing a modifier dosage. The application controls filler dispersion through molecular-level bonding strength, makes the crosslinking temperature field self-adapt to the filler distribution, and optimizes the formula in combination with aging behavior prediction, so that the structural uniformity, heat resistance and service life of the material are significantly improved. The method solves the problems of uneven filler dispersion, mismatched crosslinking thermal field and inaccurate aging evaluation in the traditional process.

This invention discloses a method for measuring the bonding strength of a casting repair process, solving the problem in the prior art where the bonding strength of the casting repair process cannot be quantitatively obtained. It has the beneficial effect of accurately obtaining the bonding strength between the casting substrate and the repair layer, achieving quantitative strength measurement. The specific solution is as follows: A method for measuring the bonding strength of a casting repair process includes: preparing a specimen; cutting a groove in the specimen; cutting the specimen at the groove to obtain the substrate; repairing the cut specimen, with the repair layer covering the groove; breaking the repaired specimen and recording the maximum tensile force; and calculating the bonding strength between the substrate and the repair layer based on the maximum tensile force.

A bonding strength evaluation method may include preparing bonded wafers, separating the bonded wafers by applying a force to one surface of the bonded wafers in a direction perpendicular to the one surface of the bonded wafers, measuring at least one of the force applied to the one surface of the bonded wafers, a time when the force is applied, a separation distance between the bonded wafers, a length of an area where the bonded wafers are separated, and determining a bonding strength based on at least one of the force, the time during which the force is applied, the separation distance between the bonded wafers, and the length of the area where the bonded wafers are separated.

This invention relates to a high-temperature resistant adhesive suitable for bonding inert metals and its preparation method. It addresses the problems of low bond strength, poor bonding reliability under impact, and insufficient heat resistance in existing polyimide adhesives used for bonding titanium alloys or stainless steel. The high-temperature resistant adhesive is prepared from a polyimide precursor resin containing active metal complexes, a phthalate coupling agent, an inorganic filler, and solvent I. The preparation method includes: 1. Preparing the polyimide precursor resin containing active metal complexes; 2. Weighing; 3. Preparing the adhesive. This invention relates to a high-temperature resistant adhesive suitable for bonding inert metals and its preparation method.

The application provides a nondestructive testing method for the bonding strength of a coating of a semiconductor device shell, and belongs to the technical field of semiconductor device testing. The method solves the problem that the bonding strength of a coating and a substrate cannot be nondestructively evaluated in the prior art. The method comprises the following steps: arranging an acoustic wave coupling medium and an acoustic wave sensor on the surface of the coating, selecting at least three laser impact points, focusing a laser beam generated by a pulsed laser on the impact points, collecting a longitudinal wave signal after laser impact, reading a first echo signal peak voltage and a second echo signal peak voltage, calculating an acoustic pressure reflection coefficient R , performing laser impact on the same impact points for a second time at the same energy density, obtaining a reflection coefficient change amount R , calculating an average value R of the reflection coefficient change amounts R of the multiple impact points, and determining whether the bonding strength of the coating and the substrate meets a requirement according to the average value R avg When the average value R avg is greater than 0.05, it is determined that the bonding strength of the coating and the substrate does not meet the requirement, otherwise, the bonding strength of the coating and the substrate meets the requirement. The application can be used for the rapid and nondestructive evaluation of the bonding strength of a coating of a semiconductor device shell.

The purpose of this disclosure is to provide an adhesive suitable for bonding aluminum substrates to other substrates, without a primer, and that balances high bond strength, adhesion breaking, and long-term resistance to damp heat. By combining a polyol base comprising a polyol, a phosphate compound, and a monohydric alcohol with a polyisocyanate curing agent, the adhesion of the phosphate compound to aluminum is ensured during adhesive application, thus improving bond strength. Furthermore, by utilizing a monohydric alcohol to adjust the degree of crosslinking in the coating film and establishing the initiation point for adhesion breaking, stable bond strength can be achieved.

The present application relates to the technical field of intelligent sensing system, in particular to a mortar bonding strength detection method and device. The present application firstly carries out multi-dimensional synchronous sampling on displacement, pulling force and pulling force growth rate in the pulling process, eliminates the misjudgment risk of single threshold being easily disturbed, and provides reliable data basis for subsequent analysis; secondly, through analyzing the cooperative fluctuation characteristics of displacement and pulling force, a nonlinear discrete index is determined to accurately distinguish the gap free state and the effective loading state, and the sensing accuracy under complex working conditions is significantly improved; then, the pulling force growth rate and the nonlinear discrete index are fused to quantize the impact risk caused by the coupling of high speed and free in real time, and the active accumulation and sensitive control of the risk are realized; finally, according to different pulling contact stages, the control strategy is adaptively switched, the overshoot risk is eliminated from the physical root, the detection process is stable and reliable, the accuracy of mortar bonding strength detection is effectively improved, and the possibility of low strength detection is reduced.

The invention relates to a wafer bonding strength prediction method based on photoelectron spectroscopy. The method comprises the following steps: S1, carrying out surface cleaning pretreatment on a wafer sample; s2, cleaning and activating the surface of the wafer sample through plasma, and modifying the surface of the wafer sample; s3, acquiring an X-ray photoelectron spectroscopy; s4, carrying out translation correction on the X-ray photoelectron spectroscopy based on the C1s energy spectrum; and S5, obtaining the bonding strength based on the N1s energy spectrum after translation correction. Compared with the prior art, the method has the advantages that the bonding strength before bonding is predicted, and the problem that destructive experiments need to be carried out in a traditional bonding strength measuring means is effectively solved through nearly lossless photoelectron spectroscopy detection.

The invention relates to the technical field of welding, and particularly provides a performance evaluation method of an alloy for a flux core of a high-temperature titanium alloy laser welding wire. The performance evaluation method comprises the following steps: S1, carrying out multiphase stabilization theoretical calculation on key alloy elements in a to-be-evaluated alloy based on critical equivalents of the alloy elements to obtain strength equivalents; s2, calculating an average covalent bond strength Bo value and an average d orbital energy level Md value of the to-be-evaluated alloy; s3, calculating the electron concentration Ne of the alloy to be evaluated; s4, carrying out geometric optimization on the crystal structure calculation model of the to-be-evaluated alloy to obtain an optimized calculation model; according to the optimization calculation model, calculating an elastic constant of the to-be-evaluated alloy through a stress-strain method; and S5, the ductility and brittleness of the to-be-evaluated alloy are judged, and composition design of the flux core of the welding wire is completed. The evaluation method provided by the invention can predict the high-temperature strength, plasticity, thermal stability and precipitation behavior of the alloy based on the alloy components.

The utility model discloses an auxiliary tool for testing the bonding strength of a metal layered composite material, which comprises a cylindrical sample locking mechanism, and an upper pull rod is connected to the central position of the upper part of the cylindrical sample locking mechanism; a T-shaped sample groove penetrating through the cylindrical side face of the sample locking mechanism is formed in the center of the lower portion of the sample locking mechanism and used for being connected with the upper portion of a sample. The auxiliary tool further comprises a lower pull rod, the upper portion of the lower pull rod is provided with a T-shaped through hole penetrating through the radial direction of the lower pull rod, and the T-shaped through hole is used for being connected with the lower portion of the sample. The auxiliary tool disclosed by the utility model is used for clamping a sample in the bonding strength testing process of a metal material and can prevent a metal composite layer of the material from being deformed or torn in the testing process.

This invention provides an Al bonding material that offers excellent temperature cycling reliability and good initial bond strength. It is an Al bonding material containing 4.0% to 12.0% by mass of Si, with a resistivity Ra of 2.6 × 10⁻⁶. ‑8 Ωm or more 3.6×10 ‑8 When measuring the crystal orientation of the Al phase in the L-section (including the section along the central axis) of the Al-bonded material with an Ωm or less, the angle difference relative to the central axis is 15° or less. <110> Crystal orientation and <111> When the total orientation ratio of the crystal orientation is between 20% and 70%, and the total orientation ratio is less than 25%, the angular difference relative to the central axis is less than 15°. <110> The orientation ratio of the crystal orientation is above 5%.

A method of forming a patterned metal layer on a substrate includes identifying at least one distortion zone in a design pattern of metal structures causing a Z-direction displacement of the substrate, inserting metal fill shapes as a fill pattern into the design pattern to reduce the Z-direction displacement in the at least one distortion zone, and forming the metal structures and the metal fill shapes on the substrate as the patterned metal layer. The method may further include calculating bond strength of the substrate based on the design pattern and the fill pattern and adjusting surface area of the metal fill shapes to increase the bond strength. A bonded substrate structure may then be formed by directly bonding a dielectric material of the patterned metal layer of the substrate to an additional substrate.

The invention discloses a method for testing the bonding strength of secondary particles, a graphite material and a preparation method and application of the graphite material. According to the testing method, the secondary particles are subjected to pre-shaping treatment under the condition that the crushing frequency is smaller than 20 Hz, the particle size distribution of the pre-shaped material is tested, and the bonding strength of the secondary particles can be simply, conveniently and accurately researched and judged according to the valley-to-peak ratio I1 / I2 in a particle size distribution curve. According to the preparation method of the graphite material, on the basis of the testing method, the secondary particles with the bonding strength meeting the requirement are directly subjected to subsequent shaping, granulation and graphitization treatment, and when the bonding strength of the secondary particles is poor, the bonding strength of the secondary particles is improved through fusion treatment of a fusion machine; further, the graphite material with high secondary particle structure integrity is prepared. The method can avoid the problem of poor structural integrity of the secondary particles of the final graphite material due to poor bonding strength of the secondary particles, and is beneficial to preparation of the graphite material with high structural integrity of the secondary particles.

The present invention relates to a light-curing, reactive, pressure-sensitive adhesive film of adhesive. With the film of adhesive of the invention, structural bond strengths can be achieved. The film of adhesive comprises (a) at least one reactive monomer or reactive resin, (b) an initiator, (c) a photoredox catalyst, (d) a polymer of monomers comprising N-vinyl compounds and (e) a film-forming polymer.

The present disclosure relates to a bonding strength inspection apparatus and a bonding system capable of inspecting the bonding strength of a bonding portion without destroying an inspection target. The present disclosure provides a bond strength inspection apparatus including: a roughness measuring portion configured to measure a roughness of a bonding portion where a base member and a bonding member are bonded to each other; and a processor configured to determine a bonding strength of the bonding portion based on the roughness.

This invention discloses a method for testing the bonding strength between fiberglass cloth and resin, belonging to the field of PCB material inspection technology. The method includes: pre-treating a substrate to obtain an inner copper-free substrate; stacking a release film of a predetermined width on each of the upper and lower edges of the inner copper-free substrate, and then sequentially stacking a layer of PP and a layer of copper foil on the upper and lower surfaces; pressing the stacked parts together to obtain a sample; retrieving a sample strip of a predetermined size from the pressed sample; testing the tensile strength of the sample strip using a tensile tester, with the test result representing the bonding strength between the fiberglass cloth and resin. This method intercepts delamination, board bursting, and other problems at the incoming material inspection stage, preventing these issues from flowing into the PCB board and causing PCB board scrapping. It also allows for rapid identification of high-risk incoming batches, demonstrating high timeliness.

The application discloses a method for controlling the interlayer bonding strength of paper, which comprises the following steps: step S1, pretreatment, the multi-layer paper is pretreated, the fiber layer which does not need to be detected is peeled off, and only the detection layer to be detected is left; step S2, the detection layer is detected by an interlayer bonding strength tester; step S3, step S2 is repeated, the detection layer paper samples of different layers are detected respectively, the bonding strength of the corresponding detection layer of the paper is obtained, and the bonding strength present situation and problems of each layer are analyzed; and step S4, the content of the additive or the type of the fiber in one or more detection layers of the paper is adjusted, the bonding of the one detection layer or the different detection layers is controlled, the Z-direction strength of the paper after the adjustment is adjusted, and the single-layer detection or the interlayer detection of the multi-layer paper and the control of the bonding strength are realized.

The invention relates to the technical field of testing of bonding strength of a bonding process, in particular to a method for testing the bonding strength of a hybrid bonding process. The method comprises the following steps: adjusting the position of a pressure head on a horizontal plane so as to enable the pressure head to be positioned at a to-be-indented position of a to-be-detected sample; driving the pressure head to move downwards at a micro-nano level, so that the pressure head is pressed at the to-be-indented position of the to-be-detected sample and generates a nano-scale indentation; measuring the size of the indentation; and calculating the bonding strength at the indentation. By measuring the sizes of the indentations at different positions, the bonding strength of the to-be-tested sample at different positions can be calculated, the test range is not limited, and the test requirement is met.

The application provides a method for testing the bonding strength of a hard coating composite material, comprising the steps of: first, using a laser to heat the hard coating on the surface of the hard coating composite material to form a laser heating area; then, moving a stylus of a scratch tester along the laser heating area to form a scratch line on the hard coating; the laser heating area comprises a heating apex and a heating center line, the heating apex is the contact point between the stylus and the hard coating, and the heating center line is aligned with the extension line of the scratch line and intersects with the heating apex. The above method can simulate the environment that causes wear to the hard coating during the testing process, so that the bonding strength testing environment of the hard coating composite material is closer to the actual working environment, thereby improving the accuracy of the bonding strength testing data and better reflecting the anti-peeling performance of the hard coating composite material in actual use. The application also provides a device for testing the bonding strength of a hard coating composite material.

The invention discloses a preparation method of polymer repair mortar with high bonding strength, and belongs to the technical field of building materials. Amino groups of aminated burr-shaped silicon dioxide and biphenyl tetramine are condensed with carboxyl groups of a binder and isophthalic acid to generate a functional modified binder containing a triazole ring structure; a triazole ring structure endows the repair mortar with mildew resistance, and mould breeding in a humid environment can be avoided; under the condensation action of amino and carboxyl, the aminated burr-shaped silicon dioxide can be inserted into a polymerization network of the functional modified binder, and a special burr structure of the aminated burr-shaped silicon dioxide can be fixed in the polymerization network through mechanical interlocking, so that the aminated burr-shaped silicon dioxide as a reinforcing phase is not easy to fall off.

The application provides a WGAN-based FRP sheet and concrete interface bonding slip model generation method, which can automatically, quickly and accurately obtain the bonding slip model and has a wide application prospect. After the automatic and rapid acquisition of the bonding slip model, the bonding performance between the FRP sheet and the concrete can be accurately reflected, and a safe and reliable reinforcement component design calculation method can be established. The WGAN is used to predict the strain, so that the training process can be simplified and the training can be stable. The WGAN can replace the traditional experimental analysis to quickly and accurately establish a bonding strength model. The LSTM is used as the generator of the WGAN model, so that the gradient disappearance and explosion problems of the RNN are solved, and the strain data related to time can be more accurately predicted. The CNN is used as the discriminator of the WGAN model, so that the quality and convergence speed of the generated samples are improved.

This application discloses a battery, a method for preparing the same, and an electrical device thereof. The battery includes an electrode, each electrode comprising a current collector and an active material layer located on at least one side of the current collector. The active material layer includes an adhesive, which comprises an acrylate polymer with a number-average molecular weight of 1 million to 1.6 million. Acrylate polymers with a number-average molecular weight within this range exhibit good adhesive properties, thereby improving the bond strength between the active material layer and the current collector.

The invention discloses a rapid evaluation and selection method for the bonding strength of a battery sealant, which comprises the following steps of: 1) bonding two staggered and superposed nylon sheets together by using different sealants to form a plurality of samples to be tested; 2) placing a sample to be detected on the strength detection tool; (3) the lifting rod is started, the lifting rod drives the ejector rod to move downwards at a constant speed until the two nylon pieces are separated, and at the moment, the testing instrument displays the maximum force value occurring in the nylon piece separation process; and 4) replacing the to-be-tested sample, repeating the steps 1) to 3), recording the maximum force value for separating the nylon sheets bonded by the different sealants in each group, comparing the data of the maximum force values, and selecting the sealant used by the to-be-tested sample with the maximum force value. Compared with the prior art, the test and verification period of the alkaline battery sealant can be remarkably shortened, the bonding performance of the sealant is represented by peel strength detection data between nylon sheets, and the sealant is rapidly screened.

The invention discloses a bi-component acrylic structural adhesive for structural bonding and a preparation method thereof. Through an optimized formula system and a preparation process, excellent storage stability, high bonding strength, good toughness, rapid curing at room temperature and wide substrate bonding adaptability are realized. Stable bonding can be realized on metals such as aluminum and stainless steel and high polymer materials such as ABS (Acrylonitrile Butadiene Styrene) and PC (Polycarbonate), and the tensile shear strength of an aluminum-stainless steel heterogeneous interface reaches 17-19MPa. The structural adhesive has excellent storage stability (70 DEG C / 24h viscosity change is less than 10%), high bonding strength (aluminum-aluminum shear strength is greater than or equal to 18MPa), good toughness, rapid curing at room temperature (7-12min) and wide substrate adaptability, and is especially suitable for structural bonding of metal and high polymer materials in the fields of loudspeakers, automobiles, electronics and the like.

Integrated circuit (“IC”) structures and electronic packages that utilized an inorganic-convertible polymer to improve bond strength and thermal conductivity are described. In one embodiment, the inorganic-convertible polymer acts as a side fill material to seal a die periphery and improve direct bonding strength. In another embodiment, the inorganic-convertible polymer acts as a thermal bonding layer to increase the thermal conductivity between a die and a thermal solution.

The present invention relates to a method for producing a copper particle dispersion that has excellent bond strength retention after storage, said method comprising a step for mixing copper nanoparticles A, copper microparticles B, and a dispersion medium C, wherein: the copper nanoparticles A contain copper particles a and a coating agent D; the average particle size of the copper nanoparticles A is 50-300 nm; the copper microparticles B either contain copper particles b and a coating agent E, or contain the copper particles b but do not contain the coating agent E; the average particle size of the copper microparticles B is 0.5-10 μm; and the distance Ra(A-B) of the Hansen solubility parameters of the copper nanoparticles A and the copper microparticles B is not more than 9.0 MPa1 / 2.

Semiconductor devices and corresponding methods of manufacture are disclosed. The methods include forming a first layer on a first substrate, treating the first layer with a nitrogen-based plasma to form a first type of dangling bonds, treating the first layer with an oxygen-based plasma to transform the first type of dangling bonds into a second type of dangling bonds, and treating the first layer with water to transform the second type of dangling bonds into a third type of dangling bonds.