305results about How to "Excellent reworkability" patented technology

The invention relates to a method for preparing high heat-resisting polyethylene composite materials. The method takes advantage of the feature that thermosetting resin has sound rigidity and strength under high temperature after curing, and by adding reaction compatibilizing agent to act with thermosetting resin to form a semi-interpenetrating network of polyethylene and thermosetting resin, and thereby preparing novel polyethylene composite materials. The polyethylene, thermosetting resin, curing agent, accelerating agent, reaction compatibilizing agent and antioxidant which are premixed evenly in a high-speed agitator are added into a double screw extruder, and reactively blended at a proper temperature and rotation speed, the produced granules are extruded out, and the desired high heat-resisting polyethylene composite materials are achieved. Compared with the common polyethylene, the heat resistance and the strength of the materials under normal temperature and high temperature are improved remarkably, and the materials can be applied to the fields of civil buildings, auto parts, household electrical appliances as well as wires and cables, and the like.

An adhesive composition for optical films, which inhibits contamination in the re-release process and peeling under severe conditions while favorably maintaining its durability and light leakage prevention properties. The adhesive composition includes: (A) an acrylic-based polymer which is obtained by copolymerizing at least the following monomer components: (a1) a (meth)acrylic acid alkyl ester and/or a (meth)acrylic acid alkoxyalkyl ester, (a2) an aromatic ring-containing monomer, (a3) a hydroxyl group-containing monomer, and optionally, (a4) a carboxyl group- or amino group-containing monomer, and which has a weight-average molecular weight of 800,000 to 1,600,000 and a value (Mw/Mn), as obtained by dividing the weight-average molecular weight of the copolymer by the number-average molecular weight thereof of 10 to 50, (B) an isocyanate-based crosslinking agent, (C) a silane coupling agent, and optionally, (D) a crosslinking accelerator.

The invention relates to the field of thermal interface materials, and more particularly, provides a thermal grease composition, which contains the following components: (A) 100.0 parts by weight of thermally conductive filler, (B) 0.1 to 8.0 parts by weight of active solid silicone resin, (C) 0.1 to 15.0 parts by weight of active silicone oil, (D) 0.1 to 9.0 parts by weight of macromolecular polysiloxane, (E) 0.1 to 3.0 parts by weight of nano catalyst, and (F) 0.1 to 3.0 parts by weight of additive. The thermal grease composition provided by the invention has good thermal conductivity and using weatherability, can effectively solve the technical difficulty that the thermal grease composition in the prior art is pulverized and crushed and the thermal conductivity is therefore reduced as the service time increases. The manufacturing process has simple, convenient and easy steps and the thermal grease composition is suitable for large-scale match production.

The invention relates to the field of new materials, in particular to a self-repairing reprocessable polyurea material as well as a preparation method and application. The self-repairing reprocessablepolyurea material comprises the following raw materials in parts by weight: 3 to 13 parts of a cross-linking agent, 79 parts of amino-terminated polyetheramine, 8 to 18 parts of diisocyanate, and 1 to 5 parts of a catalyst. The polyurea material is obtained by reacting an amino group with isocyanate, and is a novel heat-responsive dynamic bond under the action of high temperature or the catalyst,so that the material can be self-repaired at 80 DEG C, and the interaction of hydrogen bonds between urea bonds can improve the mechanical strength of the material; and the polyurea material is excellent in mechanical properties, endowed with certain transparency, good in reworking properties, high in self-repairing efficiency, relatively low in repair temperature, simple in preparation technology, and low in relative cost.

A pressure-sensitive adhesive composition can form an pressure-sensitive adhesive layer that has satisfactory reworkability such that optical films can be easily peeled from liquid crystal panels with no adhesive residue and also has satisfactory processability such that it can be worked without pressure-sensitive adhesive fouling or dropout. The pressure-sensitive adhesive composition for an optical film of the present invention comprises 100 parts by weight of a (meth)acrylic polymer comprising 45 to 99.99% by weight of an alkyl (meth)acrylate monomer unit and 0.01 to 2% by weight of a tertiary amino group-containing monomer unit; and 0.01 to 2 parts by weight of a peroxide as a crosslinking agent.

A method and apparatus enables easy removal of a first substrate (e.g., a label, EMC gasket, etc.) from a second substrate (e.g., a cover of a computer enclosure) for enhanced reworkability or recyclability. An adhesive layer affixes the substrates to each other. A coating that includes a dewetting agent (DA) is interposed between the second substrate and the adhesive layer. Removal is facilitated by applying heat and/or pressure to activate the DA. Preferably, the DA thermally decomposes to form gaseous products at a predefined temperature. Heat may be applied through one or more of the substrates to drive the DA to decomposition, which forms bubbles that lift the first substrate relative to the second substrate. Optionally, the DA may be encapsulated in microspheres. For example, the DA may be silicone oil and/or an adhesive solvent encapsulated in microspheres and may be activated by applying pressure sufficient to crush the microspheres.

There is provided an optical film pressure-sensitive adhesive composition capable of forming a pressure-sensitive adhesive layer that has reworkability such that optical films therewith can be easily separated from liquid crystal panels with no adhesive residue and also has satisfactory processability such that it can be processed without causing adhesive stain or dropout after it is formed on an optical film. The optical film pressure-sensitive adhesive composition includes 100 parts by weight of a (meth)acrylic polymer including, as monomer units, (a) 50 to 99.79% by weight of an alkyl (meth)acrylate monomer, (b) 0.01 to 0.45% by weight of a tertiary amino group-containing monomer, and (c) 0.1 to 3% by weight of a hydroxyl group-containing monomer; and 0.01 to 2 parts by weight of a crosslinking agent that is at least one selected from the group consisting of hexamethylene diisocyanate, hydrogenated xylylene diisocyanate, and isophorone diisocyanate, or a polyisocyanate compound derived therefrom.

A pressure-sensitive adhesive composition for an optical film of the present invention comprises 100 parts by weight of a (meth)acrylic polymer comprising 45 to 99.99% by weight of an alkyl (meth)acrylate monomer unit and 0.01 to 2% by weight of a tertiary amino group-containing monomer unit; and 0.01 to 2 parts by weight of a peroxide as a crosslinking agent. The pressure-sensitive adhesive composition can form an pressure-sensitive adhesive layer that has satisfactory reworkability such that optical films can be easily peeled from liquid crystal panels with no adhesive residue and also has satisfactory processability such that it can be worked without pressure-sensitive adhesive fouling or dropout.

The present invention provides an adhesive composition for optical components that is capable of achieving both reworkability and durability and that is capable of inhibiting unevenness in color and light leakage when applied to image display devices such as liquid crystal display panels. The present invention relates to an adhesive composition for optical components that contains an acrylic resin (A) obtained by copolymerizing a copolymerization component [I] containing, as the principal component thereof, an alkyl (meth)acrylate ester monomer (a1), wherein the adhesive composition is characterized by containing a N-(alkoxyalkyl)(meth)acrylamide monomer (a2) as the copolymerization component [I].

The liquid crystal display device includes one liquid crystal panel, one back light assembly, one outer frame and one light inducing adhering layer. The back light assembly and the outer frame are set on two sides of the liquid crystal panel separately; the outer frame covers the liquid crystal panel and the back light assembly; and the light inducing adhering layer is set between the liquid crystal panel and the outer frame to adhere the liquid crystal panel and the outer frame. When being irradiated with specific light, the light inducing adhering layer will lose its adhesiveness and the liquid crystal panel may be separated from the outer frame.

The invention belongs to the technical field of epoxy resin based chemical crosslinking material preparation, and particularly relates to a diamine addition crosslinking agent and a preparation method thereof, as well as a composition for preparing thermal reversible crosslinking epoxy resin and a composite material of the thermal reversible crosslinking epoxy resin. The structure of the diamine addition crosslinking agent is as shown in the formula (I), wherein R1 is methyl or H, and n is 1-3; and R is non-aromatic radical. The epoxy resin and the composite material prepared from the composition containing the crosslinking agent have all excellent performance of traditional chemical crosslinking epoxy resin at a low temperature, have re-processing forming performance of thermoplastic materials at a high temperature, restore crosslinking characteristics after being cooled, and are called 'thermosetting-thermoplastic' materials. The reversible crosslinking epoxy resin and the composite material thereof have a self-recovery capability, and the performance of the re-processing forming material can be regulated by means of thermal treatment, so that the diamine addition crosslinking agent is applicable to preparation of self-restoring paint, electronic packaging materials, thermal reversible adhesives and the like.

The present invention relates to a heat-conductive laminated material and a manufacturing method thereof. The heat-conductive laminated material which comprises a first solidified product layer that is obtained through solidifying a silicone composition 1 and a second solidified product layer that is obtained through solidifying a silicone composition 2 and is formed on the first solidified product layer. The silicone composition 1 comprises the following components: (a) organopolysiloxane with alkenyl, (b) heat-conductive filler, (c) organic hydrogen polysiloxane, (d) platinum group metal base catalyst, (e) reaction retarder and (f) organosilicon resin. The silicone composition 2 comprises the components (a) to (f) but has a formula different from that of the silicone composition 1. The heat-conductive sheet of the invention has satisfactory viscosity and can be fixed to a heat-generating electronic component or heat-dissipating component by means of the self viscosity. The heat-conductive laminated material represents advantageous reprocessing property.

An optical device is provided. The optical device according to one embodiment may be a light-dividing device, for example, a device that can divide incident light into at least two kinds of light having different polarization states. For example, the optical device can be used to realize a stereoscopic image.

An adhesive seal material for an end portion a solar cell panel is an adhesive seal material which is bonded to an end portion of a solar cell panel. The adhesive seal material includes a rubber-based adhesive layer, and a non-adhesive layer partially covering a surface of the rubber-based adhesive layer.

An adhesive includes a polymer matrix, and a plurality of adhesive capsules in the polymer matrix, wherein each of the adhesive capsules includes a shell, configured to shatter under pressure, and an adhesive polymer in the shell.

The invention relates to a flip chip bottom filling adhesive with normal temperature rapid capillary flowing property and rapid repairability. The flip chip bottom filling adhesive is prepared from the following raw materials in percentage by weight: 10-60% of epoxy resin, 10-20% of polyether modified epoxy resin, 5-20% of bismaleimide modified toughening resin, 5-20% of furan alkyl glycidyl ether, 5-30% of a curing agent, 5-20% of a curing accelerator, 0.5-3% of a coupling agent, 0-40% of spherical silica powder and 0-6% of pigments. The bottom filling adhesive provided by the invention is mainly applied to bottom filling of flip chips so as to improve the connection reliability and has the characteristics of high Tg, good normal-temperature rapid flowing property, good connection reliability and good rapid curing property.