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160results about How to "Excellent productivity" patented technology

Method for manufacturing multilayer wiring substrate with cable

The invention provides a method for inexpensively and stably manufacturing a multilayer wiring board having a cable section with a high integration degree capable of loading narrow pitch CSP. The manufacturing method of the multilayer flexible wiring board having the cable section in at least an outer layer, includes a) a process for manufacturing an inner layer core substrate (8, 58); b) a process for forming an opening of copper foil in a conduction hole forming part on an outer layer side in a double sided copper clad laminate having flexibility, and forming a circuit pattern (10, 60) comprising an opening of a conduction hole forming part on an inner layer side of the double sided copper clad laminate; c) a process for forming a cover ray (22, 70) on the circuit pattern to make it to be an outer layer built-up layer (23, 67); d) a process for laminating the outer layer built-up layer by turning a side where the cover ray is formed to a side of the inner layer core substrate, and forming the lamination circuit substrate (25, 73); e) a process for performing laser processing on the conduction hole forming part of the outer layer side through the opening of copper foil, and forming a conduction hole (26, 27, 28, 74, 75, 76) in the lamination circuit substrate; f) a process for performing laser processing on the conduction hole forming part of the outer layer side by acting the opening of the copper foil and the opening of the conduction hole forming part as a mask for shielding laser, and forming the conduction hole in the lamination circuit substrate; and g) a process for performing a conduction processing on the conduction hole, and forming a via hole (29, 30, 31, 77, 78, 79) with electrolytic plating. The double sided copper clad laminate can be replaced by a single sided copper clad laminate.
Owner:NIPPON MEKTRON LTD

Mold, mold temperature regulation method, mold temperature regulation device, injection molding method, injection molding machine, and thermoplastic resin sheet

The present invention provides a mold, mold temperature regulation method, mold temperature regulation device, injection molding method, injection molding machine, and thermoplastic resin sheet, the mold made of by certain material can enhance the transferability of the surface of a molded product and can allow the molded product to be taken out immediately after the solidification, whereby molding cycle can be accelerated. In the mold, both a stationary side mold and a movable side mold are mounted within masters, and a cavity face is formed on a release side. A plurality of heating medium passages are bored at a position distant by a given distance from the cavity face. The mold comprises a 15 to 30 mm-thick rectangular bushes formed of a metal having a coefficient of thermal conductivity of 20 to 40 W/(m K), heat insulating plates having a coefficient of thermal conductivity of not more than 5 W/(m K) and held between the masters and the bushes, a pair of heating medium manifolds (mounted on both ends of the anticavity face of the bushes so as to be led to the heating medium passages of the bushes, and a plurality of pressing members for pressing four edges of the bushes to fix the bushes to the masters.
Owner:MITSUBISHI HEAVY IND LTD +1
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