The invention discloses an
electronic component solder paste printing device, and belongs to the technical field of
electronic component production and
processing equipment. The device comprises a shell, a steel mesh is fixedly connected to the interior of the shell, a fixed sliding rod is fixedly connected to the top of the steel mesh, a sliding groove is formed in the side wall of the steel mesh, a feeding mechanism is arranged on the outer wall of the fixed sliding rod,
solder paste is stirred and automatically fed during printing work, a scraper mechanism is arranged on the inner wall of the sliding groove, and the scraper mechanism is arranged on the inner wall of the sliding groove. According to the
tin paste recycling device, the
tin paste can be automatically recycled during printing work, a storage mechanism is arranged on the top of the steel mesh, and when the
tin paste is recycled, the tin paste can be stored in a sealed mode. The feeding box slidably extrudes the sealing block to relieve sealing of the feeding groove, automatic feeding is achieved, it is avoided that a large amount of
solder paste is placed in a
machining area at a time, the oxidation or deterioration risk caused by the fact that the solder paste is exposed to air for a long time is reduced, and therefore the printing work effect of electronic components is guaranteed.