Full-automatic solder paste printer

Abstract

The invention discloses a full-automatic solder paste printer. The full-automatic solder paste printer comprises a rack subassembly, wherein a Z-axis lifting system is installed at the bottom end of the rack subassembly, and a platform correcting system is installed at the top end of the Z-axis lifting system and provided with a guide rail transporting system; the rack subassembly is provided with a steel screen frame clamping system, a scraper blade printing system and an automatic cleaning system; the Z-axis lifting system makes lifting movement stable and positioning fast and accurate and solves the problem that responding speed is low because large-inertia lifting control is low in positioning accuracy; the difficult problem that manual PCB correction is not accurate is solved through the platform correcting system, and printing quality is improved; a steel screen frame is cleaned in any combination mode of a drying cleaning mode, a wet cleaning mode and a vacuum cleaning mode, so that the cleaning effect of the steel screen frame is greatly improved, manual cleaning time is shortened, and labor intensity is relieved; through the scraper blade printing system, pressure of a scraper blade can be accurately controlled and regulated, and the problem that the scraper blade pressure of a traditional printer cannot be controlled is solved.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to an automatic solder paste printing machine. Background technique [0002] The application of electronic products has penetrated into all aspects of life, and people's requirements for the manufacture of electronic products are getting higher and higher, because electronic products are becoming smaller and more sophisticated, and the PCB production of electronic products must be completed by SMT equipment. The solder paste printing in the first process is done by the solder paste printing machine, so the processing of the first process largely determines the production quality of PCB. At present, in the known field, semi-automatic solder paste printing machines are mostly used for PCB solder paste printing. The printing needs to be manually corrected and aligned, and the stencil frame is completely cleaned manually. The production efficiency is low and automati...

AI Technical Summary

Problems solved by technology

At present, in the known field, semi-automatic solder paste printing machines are mostly used for PCB solder paste printing. The printing needs to be manually corrected and aligned, and the stencil frame is completely cleaned manually. The production efficiency is low and cannot be automated.

[0003]The traditional semi-automatic solder paste printing machine has the following disadvantages: the lifting system is driven by air pressure, the operation is unstable, and the positioning accuracy is poor; the circuit board and the stencil frame are manually corrected Alignment, the alignment accuracy is low, and it is time-consuming and laborious; the cleaning of the steel mesh frame is completely manual cleaning, the cleaning effect is not good and the labor intensity is increased; the pressure of the scraper cannot be adjusted

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