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1944 results about "Solder paste" patented technology

Solder paste (or solder cream) is a material used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through hole pin in paste components by printing solder paste in/over the holes. The paste initially adheres components in place by being sticky, it is then heated (along with the rest of the board) melting the paste and forming a mechanical bond as well as an electrical connection. The paste is applied to the board by jet printing, stencil printing or syringe and then the components are put in place by a pick-and-place machine or by hand.

Surface mounting process for flexible circuit board and used magnetic tool and steel mesh

The invention relates to the manufacturing technology of printed wiring board, in particular to a flexible printed circuit (FPC) surface mount technology (SMT) as well as a magnetic tool and a steel mesh which are used for the FPCSMT. The magnetic tool comprises a buckle cover board and a magnetic carrying tray, wherein the magnetic carrying tray is a magnetic baseplate, the buckle cover board is a metal sheet which can be attracted by the magnetic baseplate, and the buckle cover board is provided with a slotted hole used for the solder paste printing and the surface mounting of a FPC. The invention is characterized in that the buckle cover board is a steel sheet which can be attracted by the magnetic baseplate, the step layer which is the same as the buckle cover board in shape is etched on the magnetic carrying tray, the depth of the step layer is the same as the thickness of the steel sheet; before the circuit board printing, the magnetic carrying tray is fixed on a positioning base, and then the FPC and the buckle cover board are arranged on the magnetic carrying tray; after the accurate positioning, the FPC and the magnetic tool are taken down the positioning base to conduct the solder paste printing process, the surface mounting process and the reflow soldering process.
Owner:东莞市贞观盛智控科技有限公司

LED lamp filament illuminating strip and preparation method therefor

The invention discloses an LED lamp filament illuminating strip and a preparation method therefor. The illuminating strip comprises LED chips in upper and lower rows, wherein all LED chips in the lower row are distributed at intervals, and all LED chips in the upper row are respectively connected between two adjacent LED chips in the lower row in a lap joint manner. The illuminating surfaces of the LED chips in the upper and lower rows are opposite to each other. The positive and negative electrodes of all LED chips in the upper row are respectively welded with the negative and positive electrodes of two adjacent LED chips, in lap joint connection with the LED chips in the upper row, in the lower row. The preparation method comprises the steps: coating solder paste on the positive and negative electrodes of all LED chips in the lower row; heating the solder paste and enabling the solder paste to be melted, welding the corresponding electrodes, coating the front and back surfaces of chip strips in series connection with fluorescent glue, and solidifying the fluorescent glue. The illuminating strip employs the chips which are not overlapped with each other, and the illuminating surfaces of the chips are arranged oppositely, thereby improving the light-emitting uniformity and facilitating heat dissipation. The wire crossing and tandem among chips is avoided, the packaging cost is reduced, and the yield of finished products is improved.
Owner:SHANDONG INSPUR HUAGUANG OPTOELECTRONICS
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