1605 results about "Solder paste" patented technology

The invention provides an intelligent electronic assembly quality control system based on AOI (automatic optical inspection) and SPI (solder paste printing inspection) integration, and belongs to the field of electronic information equipment flexible production lines. Comprising an AOI module, an SPI module, a data integration module, a feedback control module and a data storage and transmission module. All the modules carry out high-frequency data transmission through an industrial Ethernet; according to the system provided by the invention, the precision of quality detection is improved, and the accurate recognition of defects is realized through the data association of the AOI and the SPI module and the anomaly detection of the SVM and the CNN algorithm. Real-time process optimization is achieved, the feedback control module automatically adjusts printing and mounting process parameters according to the quality data model, and the product consistency is remarkably improved. The method improves the traceability and safety of the data, achieves the efficient storage and safety access of the detection data through distributed cloud storage and data encryption transmission, and supports the quality problem traceability.

The invention relates to the technical field of surface mounting control, and discloses an SMT surface mounting optimization control method and system based on multi-source data, and the method comprises the steps: collecting current surface mounting information, comparing the current surface mounting information with optimization judgment parameters, and judging whether to carry out surface mounting optimization control or not. When it is judged that optimization is carried out, historical SMT patch image data are collected, and defect feature vectors are obtained; and constructing an electrical attribute vector and a three-dimensional space distribution model of the soldering paste, executing thermal simulation calculation, and obtaining a thermal field distribution diagram of the component mounting area. And taking the defect feature vector, the electrical attribute vector and the thermal field distribution diagram as multi-source input, inputting the multi-source input into a multi-head attention neural network model, and outputting a patch optimization control parameter group. And driving the surface mounting equipment to execute surface mounting operation according to the surface mounting information and the surface mounting optimization control parameter group. According to the invention, the mounting reliability, customization capability and self-adaptability are improved, and precise and high-quality mounting control of complex special-shaped devices and high-temperature-sensitive elements can be realized.

According to the device and method for controlling the connection void rate of the large-area thermal interface of the power electronic device provided by the invention, the device part ensures that an organic solvent and water vapor in a soldering paste layer can be smoothly discharged by optimizing the grid structure shape design of a steel mesh printing module, so that the void rate in the welding process is effectively reduced; according to the method, through optimization of the reflow soldering technology, temperature control and vacuum degree optimization of all stages such as the heating process, the heat preservation process, the pre-reflow process and the reflow process are included, the gas escape time is properly prolonged, the voidage is controlled to be 1% or below, the interface thermal resistance is reduced, and the heat dissipation performance is improved. Through optimization design and process, the production process is simplified, the operation is more convenient, the cost is low, and the method is suitable for large-scale production; and meanwhile, the voidage is effectively controlled, so that the product quality consistency in the production process is guaranteed, the heat dissipation efficiency of the power electronic device is improved, and the service life of the power electronic device is prolonged.

The invention discloses an electronic component solder paste printing device, and belongs to the technical field of electronic component production and processing equipment. The device comprises a shell, a steel mesh is fixedly connected to the interior of the shell, a fixed sliding rod is fixedly connected to the top of the steel mesh, a sliding groove is formed in the side wall of the steel mesh, a feeding mechanism is arranged on the outer wall of the fixed sliding rod, solder paste is stirred and automatically fed during printing work, a scraper mechanism is arranged on the inner wall of the sliding groove, and the scraper mechanism is arranged on the inner wall of the sliding groove. According to the tin paste recycling device, the tin paste can be automatically recycled during printing work, a storage mechanism is arranged on the top of the steel mesh, and when the tin paste is recycled, the tin paste can be stored in a sealed mode. The feeding box slidably extrudes the sealing block to relieve sealing of the feeding groove, automatic feeding is achieved, it is avoided that a large amount of solder paste is placed in a machining area at a time, the oxidation or deterioration risk caused by the fact that the solder paste is exposed to air for a long time is reduced, and therefore the printing work effect of electronic components is guaranteed.

The present application relates to the technical field of solder paste. The present application discloses a high-precision nano solder paste and a preparation method thereof. The high-precision nano solder paste comprises solder powder, flux, glucomannan and polyethylene glycol modified aliphatic epoxy resin; the raw material composition of the flux comprises: an active agent, a surfactant, a thixotropic agent, an antioxidant, a corrosion inhibitor, a film former and a solvent. The preparation method comprises the following steps: stirring and mixing the active agent and the solvent to prepare a premixed liquid; adding a surfactant, a thixotropic agent, an antioxidant, a film former and a corrosion inhibitor to the premixed liquid in sequence, stirring and mixing to prepare a flux; mixing and stirring the solder powder, flux, glucomannan and polyethylene glycol modified aliphatic epoxy resin, grinding and preparing a high-precision nano solder paste. The high-precision nano solder paste prepared in the present application has good storage stability, long service life, high expansion rate and good wetting performance.

The invention discloses low-silver lead-free tin-based solder paste and a preparation method thereof, and belongs to the field of welding materials. The soldering paste is composed of 85 wt%-87.5 wt% of tin-based powder brazing filler metal and 12.5 wt%-15 wt% of scaling powder, wherein the tin-based powder brazing filler metal comprises 0.35 wt%-0.6 wt% of Ag, 0.5 wt%-0.8 wt% of Cu, 1.0 wt%-4.0 wt% of Bi, 0.05 wt%-0.08 wt% of Ni and the balance Sn; the soldering flux is composed of rosin, a solvent, an active agent, a thixotropic agent, a film-forming agent, a PH regulator, a surfactant, a phenolic antioxidant and a corrosion inhibitor. The soldering paste has excellent low residue, good wettability and welding reliability, and is especially suitable for surface mount technology (SMT) in the electronic and electric appliance industry.

The invention discloses a heterojunction solar cell, a preparation method thereof and a photovoltaic module, and relates to the field of heterojunction solar cells. The heterojunction solar cell comprises a substrate; a front passivation layer and a front anti-reflection layer are sequentially arranged on the front surface of the substrate from inside to outside; the back surface of the substrate is provided with an N-type contact region and a P-type contact region; the N-type contact area is provided with a first passivation layer, a first conductive layer, a first mask layer, a seed layer, a copper gate electrode, insulation paste and a solder strip from inside to outside in sequence. The P-type contact area is provided with a second passivation layer, a second conductive layer, a third conductive layer, a seed layer, a copper gate electrode and a solder strip from inside to outside in sequence. Solder paste is arranged on the side wall of the copper gate electrode. The copper electroplating technology can accurately control the height and width, and is of a main-grid-free structure, so that the material cost is reduced, and the double-sided rate of the solar cell is improved; the conductivity of copper is superior to that of silver paste, so that the short-circuit current, the filling factor and the efficiency of the solar cell structure can be improved.

The invention relates to the technical field of semiconductor packaging, and provides a semiconductor packaging process which comprises the following steps: obtaining a circuit board, and preprocessing the circuit board; performing SMT assembly operation on the bottom surface of the circuit board; silk-screening solder paste on the top surface of the circuit board; a tin cap of the flip chip is dipped with a soldering flux; mounting a flip chip and other elements on the top surface of the circuit board; performing reflow soldering operation on the top surface of the circuit board; according to the semiconductor packaging process provided by the embodiment of the invention, the tin cap of the flip chip can be dipped with the soldering flux before confluence welding operation is carried out on the flip chip, so that in the reflow soldering process, the soldering flux can effectively protect the tin cap and a PCB bonding pad and prevent oxidation, the collapsed tin cap can recover the original state of the tin cap to the greatest extent during reflow soldering, and the reliability of the flip chip is improved. The tin cap can be in contact with the PCB bonding pad more effectively, good welding is formed, the wettability is improved, oxidation is reduced, the welding strength is enhanced, and the problems of pseudo soldering, open circuit and the like are reduced.

The invention relates to the technical field of image data processing, in particular to a PCB soldering paste printing quality detection method and system based on image processing, and the method comprises the steps: collecting a surface image of a to-be-detected PCB; performing filtering processing on the surface image of the PCB to be detected by using an improved anisotropic diffusion filtering algorithm to obtain a filtered surface image of the PCB, and performing solder paste offset defect identification on the filtered surface image of the PCB based on a convolutional neural network; wherein the improved anisotropic diffusion filtering algorithm comprises a K value, the K value is a product of an initial K value and a correction coefficient, and the correction coefficient is in positive correlation with the noise intensity and the importance degree of each pixel point in the PCB surface image. The problem that an existing filtering algorithm is not high in detection accuracy is solved.

The invention relates to the technical field of welding materials, and discloses washable semiconductor solder paste and a preparation method and application thereof. The washable semiconductor solder paste comprises scaling powder and tin powder, wherein the mass ratio of the scaling powder to the tin powder is 1: (8-9.6); the soldering flux comprises the following raw material components: a film-forming agent, composite organic acid, a thixotropic agent, a surfactant, an antioxidant and a solvent, wherein the composite organic acid is composed of succinic acid and glutaric acid according to the mass ratio of (1-3): (1-2.5). According to the washable semiconductor solder paste, the particle size, the melting point and the alloy components of the tin powder are controlled, composite organic acid composed of succinic acid and glutaric acid in a specific proportion is adopted in the soldering flux, and other components are matched with one another; the tin powder and the soldering flux in a specific mass ratio are combined, so that the prepared washable semiconductor solder paste is good in wettability, the expansion rate is larger than or equal to 85%, the storage life reaches 3 months, and the washable semiconductor solder paste can be directly cleaned with water after being welded and is high in corrosion resistance and oxidation resistance.

The utility model provides an electrical connection structure of one or more sections of intelligent dimming films. The electrical connection structure specifically comprises a dimming film body, a flexible circuit board and a control unit. Wherein U-shaped long grooves are designed between independent circuits of the flexible circuit board, and air holes are formed in the conductive adhesive film layer connecting the dimming film body and the flexible circuit board. According to the design of the electrical conduction structure part of the dimming film, the ACF conductive adhesive lamination is used for replacing the solder paste welding technology, the risk of circuit pseudo soldering is avoided, special design is carried out on the FPC and the ACF conductive adhesive, the operation stability of the dimming film is improved, and the risks of short circuit and open circuit which are easily generated by circuit connection are avoided.

The invention relates to the technical field of solder paste, in particular to halogen-free soldering flux for solder paste and a preparation method of the halogen-free soldering flux. The halogen-free soldering flux for the solder paste comprises the following raw materials in parts by mass: 20-40 parts of hydrogenated rosin, 1-5 parts of maleic anhydride, 0.1-0.4 part of p-toluenesulfonic acid, 1-5 parts of activated mesoporous silica, 10-20 parts of a composite organic acid active agent, 5-10 parts of a thixotropic agent, 1-3 parts of a tackifier, 1-2 parts of a pH regulator, 1-2 parts of a surfactant, 1-2 parts of a chelating agent, 1-2 parts of an antioxidant and 50-80 parts of an organic solvent. Through the innovative component design and the preparation process, the technical contradiction existing in the field of halogen-free scaling powder for a long time is effectively solved, and an ideal material solution is provided for high-reliability electronic packaging.

The invention discloses SnCu alloy laser soldering paste and a preparation method thereof.The raw materials of the SnCu alloy laser soldering paste comprise soldering powder and flux paste, the soldering powder comprises Cu-coated Sn metal powder and silver metal powder, and the flux paste comprises Cu-coated Sn metal powder and silver metal powder; the flux paste comprises modified rosinyl carboxylic acid, a modified rosinyl acrylate polymer, a solvent, a wetting agent, organic amine, an anti-oxidation and anti-tarnishing agent and a thixotropic agent. According to the SnCu alloy laser soldering paste, wetting and diffusion of alloy powder can be effectively promoted through cooperation of all the components, and meanwhile oxidation and pollution in the welding process are reduced; the method can be widely applied to the fields of consumer electronics precision assembly, automotive electronics high-reliability welding, new energy equipment packaging, medical / aerospace extreme environment devices, optical communication core modules, industrial precision devices and the like, and micron-sized precise welding, high-reliability connection and the like are achieved.

The invention relates to the technical field of semiconductor processing, in particular to an optical detection and repair system and method for a MiniLED chip after tin brushing and die bonding. The manufacturing method comprises a Mini LED production line, and a die bonding process, a repairing process and a reflow soldering process which are arranged on the Mini LED production line, through an automatic and precise production process, including key technologies such as SPI solder paste detection, double automatic optical detection, ultra-precise intelligent solder paste printing and nanoscale positioning die bonding, the production quality and efficiency of the MiniLED chip are remarkably improved, and the high qualified rate of products is ensured; through the synergistic effect of the optical detection module and the intelligent analysis module, the defects of the MiniLED chip are recognized and positioned, the efficient positioning and removing module is combined, defective products can be removed in time, production interruption is avoided, meanwhile, the stability of the product quality is guaranteed through bonding pad cleaning, activating treatment and re-detection procedures, and follow-up tracking management is facilitated.

A solder composition includes a solder paste including a tin (Sn)-bismuth (Bi) alloy and / or a tin (Sn)-silver (Ag)-copper (Cu) alloy and a plurality of nanoparticles dispersed in the solder paste, wherein each of the nanoparticles includes a core that is spherical, the core includes a metal oxide, and the metal oxide has a density of 7 g / cm3 or more and a melting point of 2000° C. or higher.

The invention relates to low-temperature lead-free formic acid solder paste and a preparation method and application thereof, and belongs to the technical field of welding materials. The low-temperature lead-free formic acid solder paste is prepared from the following raw materials in percentage by mass: 85-90% of alloy welding powder and 10-15% of scaling powder, the soldering flux comprises the following raw materials in parts by weight: 10-15 parts of an activating agent, 1-5 parts of a rheological agent, 20-30 parts of an organic solvent, 20-30 parts of a paste forming agent, 3-5 parts of a surfactant and 0.1-0.5 part of a corrosion inhibitor, the activating agent is a composition of hydrogenated dimer acid, glycollic acid and ethylenediaminetetraacetic acid, and the organic solvent is a composition of tetrahydrofurfuryl alcohol and cyclohexanol. The paste forming agent is polyethylene glycol. The solder paste is suitable for a low-temperature welding process at the temperature of 120-150 DEG C, welding energy consumption can be reduced, the residual rate after welding is low, follow-up cleaning is not needed, the production environment can be improved, and the production cost can be reduced.

The invention discloses a preparation method of an inverted LED packaging device, and relates to the technical field of semiconductor devices.The inverted preparation method comprises the steps that stamping, electroplating and injection molding are conducted on a tape-winding type metal plate, and a tape-winding type LED support is formed; bonding the flip LED chip on the tape winding type LED bracket through soldering paste to complete die bonding; the bonding pad of the flip LED chip is connected with the conductive area on the winding type LED support through the soldering paste in a reflow soldering mode; packaging glue is filled in the groove of the tape type LED support in a glue brushing mode, and baking and curing are carried out; according to the flip LED packaging device and the manufacturing method of the flip LED packaging device, the technical problem that in the prior art, a sheet type LED support is adopted for packaging, and the process efficiency is low can be solved.

The invention discloses a thermistor mounting method and related equipment. The thermistor mounting method comprises the following steps: applying micro-power alternating bias excitation to a thermistor to obtain cold-state thermal resistance reference data; mounting a thermistor on the surface of the solder paste, collecting real-time resistance data in a temperature rise process, and performing normalized difference according to cold-state thermal resistance reference data to obtain a normalized dynamic resistance curve; performing derivative continuity and extreme value distribution analysis on the curve to obtain a wetting connectivity index; when the wetting connectivity index reaches a preset threshold value, executing second-order extreme value spacing analysis to obtain interface heat flux density distribution, calculating an interface thermal resistance dispersion vector field, and adjusting the transmission chain speed and furnace chamber airflow parameters according to the interface thermal resistance dispersion vector field; and a backtracking dynamic resistance curve is obtained in the cooling process, and the backtracking dynamic resistance curve and the standardized dynamic resistance curve are differentiated to obtain a curing quality factor. According to the invention, real-time identification in a defect germination stage and instant correction in a solder solidification window stage in a thermistor mounting process can be realized, and the mounting quality and reliability are improved.

The invention relates to the field of building materials, in particular to nano-silver solder paste with high welding strength and a preparation method of the nano-silver solder paste. The nano-silver tin paste with high welding strength comprises the following raw materials: nano-silver powder, nano-tin powder, composite resin, a dispersing agent, an activating agent, a film-forming agent, a thixotropic agent, silicon-titanium particles, a stabilizing agent and the like. According to the nano-silver solder paste with the high welding strength and the preparation method thereof, uniform dispersion of an internal system is achieved, the welding effect and the welding performance are further optimized, the oxidation resistance can be greatly improved, the probability that high surface energy of nano-silver is prone to being oxidized to generate silver oxide is greatly reduced, and the welding quality of the nano-silver solder paste is improved. The silver solder paste prepared by the method further balances the balance between the preparation process and the high strength of the silver solder paste, and has excellent stability and mechanical strength, thereby meeting the requirements of high-reliability packaging in the prior art, and having wide application potential.

The invention provides an electrode structure of a solar cell, and relates to the technical field of solar cells, the electrode structure comprises an aluminum grid line and a silver electrode, the inner ring edge of the aluminum grid line covers the outer ring edge of the silver electrode, the aluminum grid line and the silver electrode form silver-aluminum lap joint, solder paste is printed above the silver electrode, and the solder paste is printed above the silver electrode. The solder paste serves as a welding spot and is in lap joint with silver and aluminum to form an electric connection point, and the silver electrode reacts with the solder paste to generate an intermetallic compound; an isolation component is arranged between the silver electrode and the aluminum gate line, is positioned on the outer side of the solder paste, and is used for limiting the intermetallic compound from permeating towards the aluminum gate line; in the solder paste printing process, the isolation assembly is printed between the silver electrode and the aluminum grid line to the periphery of the solder paste to form the isolation layer to isolate the solder paste from permeating the surrounding silver paste, so that the solder paste can be effectively prevented from permeating towards the aluminum grid line, the safety of the silver-aluminum lap joint of the battery is improved, and the resistance at the lap joint is prevented from increasing and heating.

The invention discloses water-soluble soldering paste and a preparation method thereof, and the water-soluble soldering paste comprises the following components in percentage by mass: 85-92% of soldering powder and 8-15% of C soldering flux, the soldering flux C comprises the following components in percentage by mass: 60-95% of soldering flux A and 40-5% of soldering flux B; the soldering flux A comprises a solvent A, a rosin derivative A, a thixotropic agent A, an active agent A and a surfactant; the rosin derivative A comprises at least one of rosin amine and tetrahydroabietinol; the solvent A is a hydrophobic solvent; the mass percent of the rosin derivative A in the soldering flux A is at least 29%; the soldering flux B comprises a solvent B, a rosin derivative B, an active agent B, a thixotropic agent B and a corrosion inhibitor; the solvent B is a hydrophilic solvent; the rosin derivative B comprises polyoxyethylene rosin amine; the soldering flux A and the soldering flux B are used for being compounded into a soldering flux C of an emulsion structure; and the soldering flux C is used for being mixed with soldering powder to form the water-soluble soldering paste.

A method for normalizing the solder interconnects (e.g., normalizing the height of the solder ball interconnects) in a circuit package module (e.g., dual-sided mold grid array package module) after removal from a test board includes receiving in a fixture the circuit package module upside down and removably coupling a stencil to the fixture and over the circuit package module. The stencil has a pattern of apertures that coincides with the pattern of solder interconnects of the circuit package module. The method also includes applying solder paste over the stencil to pass through the apertures to add solder paste to the solder interconnects. The method also includes removing the stencil from over the fixture, and removing the circuit package module from the fixture. The circuit package module can be heated to reflow the solder interconnects with the added solder paste.

The invention discloses AgCuSnTi-based composite brazing filler metal. Raw materials of the AgCuSnTi-based composite brazing filler metal comprise alloy powder and yttrium tungstate powder. The volume of the yttrium tungstate powder accounts for 0.5-5% of the total volume of the powder; and the alloy powder comprises the following raw materials in percentage by weight: 8.5 to 9.5 percent of Sn, 1.2 to 1.5 percent of TiH2 and 89.1 to 90.3 percent of AgCu eutectic powder. The invention further discloses a preparation method of the AgCuSnTi-based composite brazing filler metal. The invention further discloses the AgCuSnTi based composite brazing filler metal soldering paste. The invention further discloses the application of the AgCuSnTi-based composite brazing filler metal and the application of the AgCuSnTi-based composite brazing filler metal soldering paste in welding of diamond and copper. The invention further discloses a diamond and copper welding method. According to the brazing filler metal and the soldering paste, the residual stress of a diamond and copper welding joint can be greatly relieved, and the service stability of a welding assembly is improved.

The invention discloses a solder paste defect detection method based on machine vision, relates to the technical field of printed circuit board detection, and aims at the challenge of solder paste printing quality detection in superfine-pitch high-reliability manufacturing, high-precision three-dimensional point cloud data is collected and an attitude matrix is marked through laser triangle-grating interference dual-mode imaging and board micro-vibration sensing; constructing an adaptive reference surface based on the point cloud and real-time fitting warping curved surface parameters, executing local height remapping, and eliminating the influence of micro warping; calculating a warping composite slope index and a glare texture robust index by using the height matrix, and adjusting a confidence threshold of the boundary enhanced convolutional network to realize real contour segmentation of adjacent pads; dynamically updating imaging parameters, accumulating real scene samples, and optimizing the adaptive ability of the model; and cross-shift knowledge reuse is realized through the shared model library. According to the invention, the volume measurement consistency and the first pass yield of the ultra-fine pitch bonding pad can be improved, and the process debugging time is shortened.

The invention discloses an AMB copper-clad ceramic substrate and a welding method thereof.The welding method comprises the steps that metal powder containing inactive elements Ag and Cu and an active element Ti is mixed with an organic carrier, and active soldering paste is obtained; and coating the active soldering paste on the surface of a ceramic substrate, stacking copper foils on the surface, coated with the active soldering paste, of the ceramic substrate, and performing vacuum sintering to obtain the AMB copper-clad ceramic substrate. According to the AMB copper-clad ceramic substrate and the welding method thereof provided by the invention, the process is improved when the AMB realizes metallization of the ceramic substrate, so that the obtained AMB copper-clad ceramic substrate has the characteristics of high interface bonding force, low warping degree and voidage, excellent cold and hot impact resistance and the like.

The invention relates to the technical field of semiconductor packaging materials, and particularly discloses a water-soluble solder paste for a semiconductor chip, and the solder paste comprises the following components by taking the total mass of the solder paste as 100%: 60-70% of alloy powder, the mass content of tin powder is not less than 37.8%, and the alloy powder contains metal elements for improving the heat-conducting property; the conductive adhesive is used for enhancing the conductivity and the bonding strength of the solder paste; the solder paste comprises the following components in percentage by weight: 20%-30% of soldering flux which comprises an organic acid chelating agent, a surfactant, a corrosion inhibitor, an organic solvent and deionized water and is used for promoting the welding process and reducing residues after welding, and 0%-5% of other additives which comprise an antioxidant, a thixotropic agent and a flatting agent and are used for improving the storage stability and construction performance of the solder paste. According to the water-soluble solder paste, the high-purity alloy powder is adopted, the mass content of the tin powder is not lower than 37.8%, metal elements for improving the heat conduction performance are introduced, and high heat conduction performance and low resistivity of a welding material are guaranteed.

The ceramic copper-clad plate comprises a welding layer, the welding layer is made of welding paste, the welding paste comprises a high-entropy alloy compound, the chemical formula of the high-entropy alloy compound is CuaAlbSncNidPeMofTig, g is larger than or equal to 7 and smaller than or equal to 25 wt%, and a + b + c + d + e + f + g is equal to 100%; the ceramic matrix comprises zirconium oxide with the mass fraction of 6%-12%. According to the scheme provided by the invention, the conditions of plate breakage in the preparation process of the ceramic copper-clad plate and blackening of the etched ceramic can be avoided, and the reliability of the ceramic copper-clad plate can be improved.

The present invention belongs to the technical field of computer motherboard production, and specifically relates to a high-precision computer motherboard automatic patch processing device, the high-precision computer motherboard automatic patch processing device comprises a motherboard transport platform, the motherboard transport platform is provided with a jacking component, the jacking component is provided with a coating component, one side of the coating component is provided with an activation unit, one side of the activation unit is provided with a patch module, and the end of the motherboard transport platform away from the patch module is provided with a cleaning component; the coating component comprises a scraper moving unit and a solder paste replenishing unit, the scraper moving unit drives the ratchet and the angle wheel to rotate through the movement of the telescopic plate, so that the movable extrusion plates on both sides move and drive the scraper to move, and through the squeezing action of the scraper, it passes through the small holes on the silk screen template and is coated on the specified position of the circuit board, and at the same time drives the activation unit to regulate the temperature of the solder paste, to ensure that the solder paste enters the patch module at a suitable temperature for patching.

The utility model relates to the technical field of solder paste printing, and particularly discloses a steel mesh cleaning device which comprises a driving platform, a glue scraping plate installed on the driving platform and used for scraping sundries on a silk screen steel mesh, and a glue removing assembly used for removing the sundries on the glue scraping plate. The steel mesh cleaning equipment provided by the utility model can effectively solve the problem of higher production cost caused by higher consumable consumption speed of the existing cleaning equipment.

Pattern transfer source substrates and printing methods are described, providing multi-layer paste stack elements like conductor lines or bumps, so that each stack element is printed on a receiving substrate in a single illumination step. The paste is filled layer-by-layer, possibly having different materials in different layers, with layer thickness controlled by parameters of the filling elements, e.g., in case of blades, the pressure, angle, velocity and flexibility (material) of the blade. Specifically, a bottom layer of the stack may be configured to interface the receiving substrate while one or more top layers may be configured to optimize the quality of the printed features. For example, bottom layers may be configured to bind to the substrate, to modify the substrate and / or provide a barrier from top layer(s) which may not be compatible with the substrate. In case of bumps, different layers may include adhesive and soldering materials.