1093 results about "Solder paste" patented technology

The invention relates to the technical field of surface mounting control, and discloses an SMT surface mounting optimization control method and system based on multi-source data, and the method comprises the steps: collecting current surface mounting information, comparing the current surface mounting information with optimization judgment parameters, and judging whether to carry out surface mounting optimization control or not. When it is judged that optimization is carried out, historical SMT patch image data are collected, and defect feature vectors are obtained; and constructing an electrical attribute vector and a three-dimensional space distribution model of the soldering paste, executing thermal simulation calculation, and obtaining a thermal field distribution diagram of the component mounting area. And taking the defect feature vector, the electrical attribute vector and the thermal field distribution diagram as multi-source input, inputting the multi-source input into a multi-head attention neural network model, and outputting a patch optimization control parameter group. And driving the surface mounting equipment to execute surface mounting operation according to the surface mounting information and the surface mounting optimization control parameter group. According to the invention, the mounting reliability, customization capability and self-adaptability are improved, and precise and high-quality mounting control of complex special-shaped devices and high-temperature-sensitive elements can be realized.

The present application relates to the technical field of solder paste. The present application discloses a high-precision nano solder paste and a preparation method thereof. The high-precision nano solder paste comprises solder powder, flux, glucomannan and polyethylene glycol modified aliphatic epoxy resin; the raw material composition of the flux comprises: an active agent, a surfactant, a thixotropic agent, an antioxidant, a corrosion inhibitor, a film former and a solvent. The preparation method comprises the following steps: stirring and mixing the active agent and the solvent to prepare a premixed liquid; adding a surfactant, a thixotropic agent, an antioxidant, a film former and a corrosion inhibitor to the premixed liquid in sequence, stirring and mixing to prepare a flux; mixing and stirring the solder powder, flux, glucomannan and polyethylene glycol modified aliphatic epoxy resin, grinding and preparing a high-precision nano solder paste. The high-precision nano solder paste prepared in the present application has good storage stability, long service life, high expansion rate and good wetting performance.

The invention discloses low-silver lead-free tin-based solder paste and a preparation method thereof, and belongs to the field of welding materials. The soldering paste is composed of 85 wt%-87.5 wt% of tin-based powder brazing filler metal and 12.5 wt%-15 wt% of scaling powder, wherein the tin-based powder brazing filler metal comprises 0.35 wt%-0.6 wt% of Ag, 0.5 wt%-0.8 wt% of Cu, 1.0 wt%-4.0 wt% of Bi, 0.05 wt%-0.08 wt% of Ni and the balance Sn; the soldering flux is composed of rosin, a solvent, an active agent, a thixotropic agent, a film-forming agent, a PH regulator, a surfactant, a phenolic antioxidant and a corrosion inhibitor. The soldering paste has excellent low residue, good wettability and welding reliability, and is especially suitable for surface mount technology (SMT) in the electronic and electric appliance industry.

The invention discloses a heterojunction solar cell, a preparation method thereof and a photovoltaic module, and relates to the field of heterojunction solar cells. The heterojunction solar cell comprises a substrate; a front passivation layer and a front anti-reflection layer are sequentially arranged on the front surface of the substrate from inside to outside; the back surface of the substrate is provided with an N-type contact region and a P-type contact region; the N-type contact area is provided with a first passivation layer, a first conductive layer, a first mask layer, a seed layer, a copper gate electrode, insulation paste and a solder strip from inside to outside in sequence. The P-type contact area is provided with a second passivation layer, a second conductive layer, a third conductive layer, a seed layer, a copper gate electrode and a solder strip from inside to outside in sequence. Solder paste is arranged on the side wall of the copper gate electrode. The copper electroplating technology can accurately control the height and width, and is of a main-grid-free structure, so that the material cost is reduced, and the double-sided rate of the solar cell is improved; the conductivity of copper is superior to that of silver paste, so that the short-circuit current, the filling factor and the efficiency of the solar cell structure can be improved.

The invention relates to the technical field of image data processing, in particular to a PCB soldering paste printing quality detection method and system based on image processing, and the method comprises the steps: collecting a surface image of a to-be-detected PCB; performing filtering processing on the surface image of the PCB to be detected by using an improved anisotropic diffusion filtering algorithm to obtain a filtered surface image of the PCB, and performing solder paste offset defect identification on the filtered surface image of the PCB based on a convolutional neural network; wherein the improved anisotropic diffusion filtering algorithm comprises a K value, the K value is a product of an initial K value and a correction coefficient, and the correction coefficient is in positive correlation with the noise intensity and the importance degree of each pixel point in the PCB surface image. The problem that an existing filtering algorithm is not high in detection accuracy is solved.

The invention relates to the technical field of welding materials, and discloses washable semiconductor solder paste and a preparation method and application thereof. The washable semiconductor solder paste comprises scaling powder and tin powder, wherein the mass ratio of the scaling powder to the tin powder is 1: (8-9.6); the soldering flux comprises the following raw material components: a film-forming agent, composite organic acid, a thixotropic agent, a surfactant, an antioxidant and a solvent, wherein the composite organic acid is composed of succinic acid and glutaric acid according to the mass ratio of (1-3): (1-2.5). According to the washable semiconductor solder paste, the particle size, the melting point and the alloy components of the tin powder are controlled, composite organic acid composed of succinic acid and glutaric acid in a specific proportion is adopted in the soldering flux, and other components are matched with one another; the tin powder and the soldering flux in a specific mass ratio are combined, so that the prepared washable semiconductor solder paste is good in wettability, the expansion rate is larger than or equal to 85%, the storage life reaches 3 months, and the washable semiconductor solder paste can be directly cleaned with water after being welded and is high in corrosion resistance and oxidation resistance.

The invention discloses a thermistor mounting method and related equipment. The thermistor mounting method comprises the following steps: applying micro-power alternating bias excitation to a thermistor to obtain cold-state thermal resistance reference data; mounting a thermistor on the surface of the solder paste, collecting real-time resistance data in a temperature rise process, and performing normalized difference according to cold-state thermal resistance reference data to obtain a normalized dynamic resistance curve; performing derivative continuity and extreme value distribution analysis on the curve to obtain a wetting connectivity index; when the wetting connectivity index reaches a preset threshold value, executing second-order extreme value spacing analysis to obtain interface heat flux density distribution, calculating an interface thermal resistance dispersion vector field, and adjusting the transmission chain speed and furnace chamber airflow parameters according to the interface thermal resistance dispersion vector field; and a backtracking dynamic resistance curve is obtained in the cooling process, and the backtracking dynamic resistance curve and the standardized dynamic resistance curve are differentiated to obtain a curing quality factor. According to the invention, real-time identification in a defect germination stage and instant correction in a solder solidification window stage in a thermistor mounting process can be realized, and the mounting quality and reliability are improved.

The invention discloses water-soluble soldering paste and a preparation method thereof, and the water-soluble soldering paste comprises the following components in percentage by mass: 85-92% of soldering powder and 8-15% of C soldering flux, the soldering flux C comprises the following components in percentage by mass: 60-95% of soldering flux A and 40-5% of soldering flux B; the soldering flux A comprises a solvent A, a rosin derivative A, a thixotropic agent A, an active agent A and a surfactant; the rosin derivative A comprises at least one of rosin amine and tetrahydroabietinol; the solvent A is a hydrophobic solvent; the mass percent of the rosin derivative A in the soldering flux A is at least 29%; the soldering flux B comprises a solvent B, a rosin derivative B, an active agent B, a thixotropic agent B and a corrosion inhibitor; the solvent B is a hydrophilic solvent; the rosin derivative B comprises polyoxyethylene rosin amine; the soldering flux A and the soldering flux B are used for being compounded into a soldering flux C of an emulsion structure; and the soldering flux C is used for being mixed with soldering powder to form the water-soluble soldering paste.

The invention discloses a solder paste defect detection method based on machine vision, relates to the technical field of printed circuit board detection, and aims at the challenge of solder paste printing quality detection in superfine-pitch high-reliability manufacturing, high-precision three-dimensional point cloud data is collected and an attitude matrix is marked through laser triangle-grating interference dual-mode imaging and board micro-vibration sensing; constructing an adaptive reference surface based on the point cloud and real-time fitting warping curved surface parameters, executing local height remapping, and eliminating the influence of micro warping; calculating a warping composite slope index and a glare texture robust index by using the height matrix, and adjusting a confidence threshold of the boundary enhanced convolutional network to realize real contour segmentation of adjacent pads; dynamically updating imaging parameters, accumulating real scene samples, and optimizing the adaptive ability of the model; and cross-shift knowledge reuse is realized through the shared model library. According to the invention, the volume measurement consistency and the first pass yield of the ultra-fine pitch bonding pad can be improved, and the process debugging time is shortened.

The present invention belongs to the technical field of computer motherboard production, and specifically relates to a high-precision computer motherboard automatic patch processing device, the high-precision computer motherboard automatic patch processing device comprises a motherboard transport platform, the motherboard transport platform is provided with a jacking component, the jacking component is provided with a coating component, one side of the coating component is provided with an activation unit, one side of the activation unit is provided with a patch module, and the end of the motherboard transport platform away from the patch module is provided with a cleaning component; the coating component comprises a scraper moving unit and a solder paste replenishing unit, the scraper moving unit drives the ratchet and the angle wheel to rotate through the movement of the telescopic plate, so that the movable extrusion plates on both sides move and drive the scraper to move, and through the squeezing action of the scraper, it passes through the small holes on the silk screen template and is coated on the specified position of the circuit board, and at the same time drives the activation unit to regulate the temperature of the solder paste, to ensure that the solder paste enters the patch module at a suitable temperature for patching.

Pattern transfer source substrates and printing methods are described, providing multi-layer paste stack elements like conductor lines or bumps, so that each stack element is printed on a receiving substrate in a single illumination step. The paste is filled layer-by-layer, possibly having different materials in different layers, with layer thickness controlled by parameters of the filling elements, e.g., in case of blades, the pressure, angle, velocity and flexibility (material) of the blade. Specifically, a bottom layer of the stack may be configured to interface the receiving substrate while one or more top layers may be configured to optimize the quality of the printed features. For example, bottom layers may be configured to bind to the substrate, to modify the substrate and / or provide a barrier from top layer(s) which may not be compatible with the substrate. In case of bumps, different layers may include adhesive and soldering materials.

The invention discloses a PCB soldering paste printing three-dimensional defect detection system based on multispectral imaging, and relates to the field of machine vision detection, and the system comprises a multispectral image acquisition module, a four-channel industrial camera based on RGB and near infrared, and a tunable LED light source array; acquiring reflection characteristic data under different penetration depths through a wavelength switching mechanism; the motion control trigger module is used for realizing positioning based on an XYZ three-axis objective table driven by a servo motor in cooperation with feedback of an encoder; a pulse width modulation signal is adopted to coordinate the moving speed of a camera shutter and a platform; according to the method, RGB and NIR four-channel imaging is combined with Beer-Lambert law modeling, so that double verification of material component quantitative analysis and three-dimensional shape reconstruction is realized, and limitation of monocular vision is avoided; structured light projection and binocular stereo matching technologies are adopted, cross-frame data alignment is realized in cooperation with an ICP algorithm, and detail defects can be better detected.

The invention discloses water-soluble soldering paste and a preparation method thereof. A soldering flux A comprises a solvent A, a rosin-based material, a thixotropic agent A, an active agent A, a corrosion inhibitor and a surfactant; the rosin-based material comprises at least one of acrylic acid modified rosin, hydrogenated rosin or polyoxyethylene rosin; the soldering flux B comprises a solvent B, a rosin derivative, an active agent B and a thixotropic agent B; the solvent B is a hydrophobic solvent; the rosin derivative comprises at least one of polyoxyethylene rosin amine and polyoxyethylene polymerized rosin; and the soldering flux A and the soldering flux B are compounded into an emulsion structure. Refrigerating the soldering flux A, taking out the soldering flux B, returning to normal temperature, mixing, and emulsifying for 5-10 minutes at the stirring speed of more than 1000rpm to obtain the soldering flux C; and 85-92% of soldering powder is added into 8-15% of the soldering flux C, vacuum uniform mixing is carried out at the stirring speed of 20-40 rpm, and the water-soluble soldering paste is obtained.

The invention relates to the technical field of industrial control, in particular to an SMT production process quality control method and system. The SMT production process quality control system comprises a soldering paste distribution condition real-time acquisition module, an electromagnetic coil array parameter adjustment module and a reinforcement learning module. The electromagnetic coil array is arranged around the reflow soldering furnace, the infrared thermal imaging technology is combined, the thermal image of the PCB is obtained in real time and sent into the soldering paste segmentation model to be processed, the flowing state of the soldering paste is accurately represented, the system can dynamically adjust the control parameters of the electromagnetic coil array based on the soldering paste distribution thermodynamic diagram, and the stability of the reflow soldering system is improved. Comprise current intensity, current frequency, waveform and the like, so that the electromagnetic field is accurately adjusted, the flowability of the solder paste is optimized, excessive or too little solder paste accumulation is avoided, and the risks of solder bridge and insufficient solder are reduced.

The invention discloses a back contact battery assembly and a preparation method thereof, and belongs to the field of solar battery assemblies. The bus bars and the back contact battery pieces form a back contact battery string; the device is characterized in that the bus bar is arranged on the back surface of the back contact battery piece; solder paste is arranged on a solder strip of the back contact cell string in an area where circuit conduction with the bus bar is achieved. An insulating protective layer is arranged on the back surface of the back contact cell string in a region insulated from the bus bar. The bus bars are arranged on the back surfaces of the battery pieces, so that the light receiving area of the module is not occupied, the full laying rate of the battery pieces is improved, and the module power is improved; original reserved bus bar interval areas in the middle and on the periphery of the assembly are canceled, so that the whole assembly does not have blank areas, and the appearance is more attractive; welding is achieved in the laminating process, a traditional bus bar high-temperature welding technology is replaced, the problems of uneven thermal stress, hidden cracks and the like of the battery pieces caused by high-temperature welding are avoided, equipment investment can be saved, the technological process can be shortened, and production cost can be reduced.

The invention discloses a solder for a copper-clad ceramic substrate. The solder comprises mixed metal powder and an organic carrier, the mixed metal powder is composed of Cu powder, titanium powder, nickel powder and nano CeO2; the organic carrier is prepared from the following components in percentage by weight: 2 to 5 weight percent of organic thickening agent, 3 to 18 weight percent of organic mixed solvent and 0.2 to 3 weight percent of degreasing accelerant; the solder is formed by mixing mixed metal powder and an organic carrier according to the mass ratio of 85: 15-90: 10. An existing soldering paste formula is optimized, the degreasing accelerant is added, the degreasing capacity of the soldering paste is improved, and the porosity after brazing is reduced.

The invention discloses a continuous flame brazing machine, which belongs to the technical field of brazing and comprises a base and a turntable. The rotary table is installed on the base table in an intermittent rotating mode, six sets of tool assemblies are evenly installed on the outer edge of the rotary table at equal intervals in a circumferential array mode, and the tool assemblies comprise a tool table, a fixed type base tool assembly and a lifting type pipeline tool assembly. A feeding and discharging station, a welding ring assembling station, a welding paste smearing station, a preheating station, a brazing station and a cooling station are arranged on the portion, around the rotary disc, of the base table in the rotating direction of the rotary disc at equal intervals. After the base and the pipeline of the pipeline assembly are installed on the fixed base tool assembly and the lifting type pipeline tool assembly of the tool assembly respectively, the rotary disc drives the tool assembly to flow between different stations, automatic, high-efficiency and high-precision assembly brazing operation on the base and the pipeline is achieved, the labor intensity of workers is reduced, and the assembly efficiency is improved. The brazing forming efficiency of products is improved, and the consistency of the quality of finished products is effectively ensured.

A solder alloy consisting of Ag: 3.1 to 4.0% by mass, Cu: 0.6 to 0.8% by mass, Bi: 1.5 to 5.5% by mass, Sb: 1.0 to 6.0% by mass, Co: 0.001 to 0.030% by mass, Fe: 0.02 to 0.05% by mass, As: 0.002 to 0.250% by mass, and a balance Sn.

The invention relates to the technical field of parameter automatic configuration, and discloses a solder paste three-dimensional detection parameter automatic configuration method and system based on a Gerber file, and the method comprises the steps: analyzing a bonding pad attribute data set of the Gerber file, and building detection frame coordinate data under an equipment coordinate system; a Mark point image is collected and converted to an HSV color space, and a Mark point matching contour template is created; based on the Mark point matching contour template, substrate, solder paste and silk-screen area images are collected, and a color segmentation parameter set is calculated; generating a grouping allowable value configuration table according to the bonding pad attribute data set; the camera is controlled to collect the RGB image set of each bonding pad, the solder paste contour is extracted, the mass center offset is calculated, and the detection frame configuration file is output. According to the method, automatic generation and accurate positioning of the detection frame are achieved, accumulative errors are effectively compensated, and the position deviation of the detection frame is reduced.

The invention discloses a bridging defect visual detection method for a solder paste detection instrument, a storage medium and equipment, and belongs to the technical field of surface mounting defect detection. In order to solve the problems that an existing bridging defect visual detection algorithm in a solder paste detection instrument is high in complexity and the detection accuracy needs to be improved, a solder paste area binary image is obtained based on a binary image and a solder paste area binary image, and then a solder paste printing area in the solder paste detection area binary image is removed; obtaining a binary image of the solder paste overflowing the solder paste printing area; taking a pixel of a solder paste printing area in the solder paste detection area image as a target, taking other pixels as a background, and adopting a chessboard distance to measure the length of the solder paste overflowing from the solder paste printing area; obtaining the distance between each pixel in the overflowing solder paste and the solder paste printing area through the binary image and the distance transformation image of the solder paste overflowing from the solder paste printing area, searching the maximum value and the minimum value, taking the difference between the maximum value and the minimum value as the distance of the solder paste overflowing from the solder paste printing area, and judging that the bridging defect exists if the difference exceeds a length threshold value.

The invention discloses reflow soldering equipment and process for SMT patch production. The reflow soldering equipment comprises a furnace body base, a conveying unit, a hearth and a sealing top cover. A conveying unit is horizontally laid on the furnace body base, the hearth is installed on the upper end face of the furnace body base in a sealed mode, and the interior of the hearth is evenly divided into three independent working areas which are the preheating area, the backflow area and the cooling area in sequence from left to right. A visual inspection chamber is installed at the position, located at the feeding end of the hearth, of the upper portion of the furnace body base. A heating device is arranged in each working area of the hearth; in the heating device of the backflow area, each microplate is slidably provided with a vertically arranged hot spray pipe, and the hot spray pipes can perform hot air pulse direct blowing on large-size surface-mounted elements on a PCB, directly heat pin welding spots, realize micro-swing attachment of the elements in cooperation with surface tension of solder paste, and eliminate mechanical stress when the chip mounter is placed.

The invention relates to formic acid solder paste with the ultralow air hole rate and a preparation method and application of the formic acid solder paste. The solder paste is prepared from, by mass, 85%-90% of alloy welding powder and 10%-15% of scaling powder. The soldering flux comprises the following raw materials in parts by weight: 5-10 parts of an activating agent, 1-5 parts of a rheological agent, 30-40 parts of an organic solvent, 20-30 parts of a paste forming agent, 3-5 parts of a surfactant and 0.1-0.5 part of a corrosion inhibitor, and the surfactant is a composition of a lauryl amphoteric imidazoline surfactant, iso-tridecanol polyoxyethylene ether and N-vinyl caprolactam. The activating agent is a composition of ricinoleic acid, ethylenediaminetetraacetic acid and ammonium succinate. The surface active agent and the activating agent in the soldering flux have a synergistic effect, so that the cleanliness of the welding surface and the soldering flux is ensured, the wettability and the flowability are improved, cavities are reduced, the soldering flux is uniformly spread and filled, high-quality welding spots are formed, and the voidage of solder paste is remarkably reduced.

The invention relates to a lead-free and halogen-free soldering paste and a preparation process thereof, and belongs to the technical field of soldering paste production, through the combination of nano-silver-loaded carbon nanotubes, organically coated solder alloy powder and soldering flux, the surface tension of the lead-free and halogen-free soldering paste can be reduced by carbon nanotube surface carboxyl in the nano-silver-loaded carbon nanotubes, so that the lead-free and halogen-free soldering paste is obtained. Nano-silver and tin form an Ag3Sn strengthening phase which synergistically promotes wetting and spreading of the solder on a substrate, meanwhile, the carbon nanotubes loaded with the nano-silver are uniformly dispersed in the soldering paste to play a dispersion strengthening role, and the brittleness caused by bismuth segregation is effectively inhibited in cooperation with the grain refinement effect of copper and indium in the solder alloy powder; and the organic coating layer hydrogenated rosin-terpene resin and the soldering flux alcohol ether solvent form a slight dissolution-fusion effect, so that the welding flux alloy powder is prevented from being oxidized, an organic acid active agent can be released to remove a substrate oxidation film, the metallurgical bonding quality of a welding interface is further guaranteed, and the defects of pseudo soldering, cavities and the like are reduced.

The invention discloses a novel ball mounting method without a steel mesh and a substrate structure, and the method employs a pyrolysis film and laser drilling technology to replace a traditional steel mesh. The method comprises the core steps of pasting a pyrolysis film and a PET protective film, drilling a blind hole to a bonding pad through laser, cleaning glue residues through high-pressure water, blade-coating solder paste containing soldering flux, stripping the PET film, forming solder balls through reflow soldering, cleaning the soldering flux and flattening the solder balls. A steel mesh is replaced by the pyrolysis film and laser drilling, use of the steel mesh is eliminated, use of the steel mesh and customization of the steel mesh are not needed, the cost is saved, and the manufacturing period is shortened. The pyrolysis film is pasted on the substrate, the pattern is manufactured in a laser drilling mode, the expansion and contraction are completely consistent with those of the substrate, and the risk of solder ball deviation is reduced; in addition, the method does not need to change the design of the substrate, the ball mounting pattern is directly manufactured according to customer information, drilling is carried out, the process is simple, meanwhile, different types of substrates can be compatible, and compatibility is high.

The invention relates to the related technical field of four-chip bridge rectifier processing, in particular to double-end synchronous processing precision miniature MBL bridge rectifier production equipment and a production process, and the equipment comprises a chip combining mechanism, and a material placing table, a solder paste printing mechanism and a die bonding mechanism which are symmetrically arranged along the chip combining mechanism and are sequentially arranged towards the direction of the chip combining mechanism; the die bonding mechanism comprises a support frame body; two symmetrical connecting parts are formed on the connecting arm and used for connecting the swing arm, and two die bonding suction nozzles are installed at the end, away from the connecting arm, of the swing arm; the buffering shaft is connected with the connecting arm, and a buffering piece which elastically buffers in the circumferential direction is arranged between the buffering shaft and the telescopic shaft connected with the driving source; the lifting driving unit is arranged on the supporting frame body and is used for driving the buffer shaft to move axially so as to drive the die bonding suction nozzle to move downwards and reset; the buffer shaft can effectively slow down the initial rotation speed under the action of the buffer piece, so that the problem that crystal grains on the die bonding suction nozzle deviate or fall off due to the dual action of inertia force and centrifugal force is solved.

A printing result prediction device is configured to predict a volume of solder paste printed by a printer onto a substrate. The printer is configured to print the solder paste by filling the solder paste into a stencil aperture of a stencil disposed on the substrate. The printing result prediction device includes a calculation part. The calculation part is configured to input a printing condition to a prediction model trained by machine learning, and predict a volume of solder paste printed by the stencil aperture of the stencil in a next printing using the input printing condition. The printing condition includes stencil information related to the stencil used to print, solder paste information related to the solder paste used to print, substrate information including unevenness information related to a protrusion on the substrate used to print, and a printing parameter of an operation of the printer when printing.

The utility model relates to the technical field of welding jigs, and discloses a wave-soldering jig which comprises a jig body, the upper surface of the jig body is rotationally connected with two swing plates, the other ends of the two swing plates are fixedly connected with a heat dissipation plate, clamping grooves are formed between the two swing plates, a clamping column is clamped between the two clamping grooves, and the clamping column is fixedly connected with the heat dissipation plate. Two sliding grooves are formed in the inner bottom wall of the jig body. According to the wave-soldering jig, the welding effect of equipment can be improved through the cooperation of the installation tin dragging pins and external flux paste, the tin connection phenomenon is avoided, the one-time qualification rate is improved, the circuit board body can be conveniently disassembled through the cooperation of the installation supporting plate and the spring, the circuit board can be actively popped out after welding of the circuit board is completed, and the welding efficiency is improved. And through cooperation of the swing plate and the heat dissipation plate, the heat dissipation plate can make close contact with the circuit board, meanwhile, heat dissipation can be conducted on the circuit board body, and deformation of the circuit board due to high temperature is avoided.

The invention relates to the technical field of connector pin welding, and discloses multi-specification connector welding equipment capable of adjusting a pin positioning clamp, the multi-specification connector welding equipment comprises a supporting table, a lifting table is slidably connected to the upper end of the supporting table, and clamping seats are symmetrically slidably connected to the lifting table; the lower end of the lifting table is connected with a linkage part for driving the two clamping seats to approach synchronously, the two clamping seats are connected with an isolation part for preventing soldering tin from overflowing, and the isolation part comprises a moving plate. The multi-specification connector welding equipment capable of adjusting the pin positioning clamp can effectively solve the problems that in the prior art, in the welding process, if pressing force is too large, a bonding pad on a circuit board is likely to deform, tilt and even be separated from a substrate, and due to the fact that soldering paste is too large, a temperature curve is unreasonable, a Pin coating is poor or the bonding pad is improperly designed, the bonding pad is prone to deformation, upwarp and even be separated from the substrate. And fused soldering tin is easy to connect adjacent pins to cause short circuit, which may cause equipment failure or burning of components.

Solid powder and an organic carrier are matched according to the mass ratio of (82-86): (14-18), silver powder and titanium dihydride powder which form the solid powder are matched according to the mass ratio of 96: 4, and a solvent, a thickening agent and a dispersing agent which form the organic carrier are matched according to the mass ratio of (91-95): (2-6): (1-5). According to the Ag-Ti soldering paste, silver powder and titanium dihydride powder serve as solid phases and are matched with a specific organic carrier, by optimizing the rheological property and the vacuum brazing technology, TiH2 is decomposed to generate active Ti atoms, the active Ti atoms react with AlN ceramic to generate a continuous TiN reaction layer, and high-strength and low-defect connection of an AlN ceramic base material and an oxygen-free copper metal copper layer is achieved; a traditional Cu element is abandoned in a soldering paste system, generation of a brittle phase is avoided, and the reliability of a connector under the extreme working condition is improved; when applied to preparation of the ceramic copper-clad plate, the film has the advantages of strong silk-screen printing adaptability, uniform film thickness and low voidage.

The invention relates to silver-copper-titanium active soldering paste with a high recovery coefficient and a preparation method and application of the silver-copper-titanium active soldering paste, and belongs to the technical field of heterogeneous material connection and semiconductor packaging. The silver-copper-titanium active soldering paste is composed of, by mass, 70%-90% of brazing filler metal powder and 10%-30% of scaling powder. The brazing filler metal powder is mixed powder composed of silver-copper-based powder, titanium-containing powder and other metal powder. The soldering flux is composed of, by mass, 40%-70% of a solvent, 20%-40% of rosin, 5%-20% of an active agent, 1%-15% of a thixotropic agent, 1%-10% of an interface modifier and 1%-10% of a corrosion inhibitor, and the thixotropic agent is composed of a short-range agent and a long-range agent according to the mass ratio of 1: (1-4). The recovery coefficient of the obtained soldering paste is close to 1, and the soldering paste has excellent printability, sagging resistance and storage stability and has wide application prospects in the fields of semiconductor packaging, power electronic devices, aerospace and the like.