4449 results about "Solder paste" patented technology

A bump connection structure and a method of attachment to integrated circuits or packages is provided which comprises a prefabricated core structure coated with solderable metal layers to form a composite bump. Said composite bump is aligned to contact pads of the chip or package which have been coated with solder paste, and the assembly heated to form a metallurgical bond. The prefabricated core structures are comprised of metal, plastic or ceramic of the size and dictated by package standards. The connection structure is preferably lead free.

A thermal interface material is described for thermal coupling of an electronic component to a thermally conductive member. The thermal interface material includes a viscoelastic polymer matrix material, fusible solder particles in the matrix material, and filler particles in the matrix material. The solder particles have a melting temperature below a selected temperature (e.g. 157° C. for indium) and the filler particles have a melting temperature substantially above the selected temperature (e.g. 961° C. for silver). The filler particles keep the thermal interface material intact under adverse thermal and stress conditions.

An optical reader in one embodiment can include a substrate defining an opening and solder pads coupled to the substrate proximate the opening. A laser diode including first, second, and third electrical leads can also be coupled to the substrate. First, second and third solder pads can be provided on the substrate and the first, second, and third electrical leads of the laser diode can be coupled to the first, second, and third solder pads. An optical reader in another embodiment can include a substrate having a first surface and a second surface. A laser diode assembly configured to emit a laser beam can be coupled to the first surface and an illumination assembly that can include light emitting diodes can be coupled to the second surface.

A stacked die package includes a substrate or interposer board that includes a contact area on a top surface and landing pads surrounding the contact area. Solder pads are disposed on an opposite side of the substrate. The solder pads are electrically connected with the landing pads by inner board wiring. A reconstituted die, which includes a die surrounded by a frame, is mounted over the substrate. A top die is mounted over the reconstituted die. Both the reconstituted die and the top die are electrically connected to the substrate, e.g., by wire bonds.

An integrated circuit solder bumping system provides a substrate and forms a redistribution layer on the substrate. An insulation layer is formed on the redistribution layer. The insulation layer has a plurality of openings therethrough. A first UBM layer of titanium is deposited on the insulation layer and in the openings therethrough. A second UBM layer of chromium/copper alloy is deposited on the first UBM layer. A third UBM layer of copper is deposited on the second UBM layer. UBM pads of at least two different sizes are formed from the UBM layers. Solder paste is printed over at least some of the UBM pads. The solder paste is reflowed to form at least smaller solder bumps on at least some of the UBM pads. Bigger solder bumps are formed on at least some of the UBM pads.

The invention relates to the manufacturing technology of printed wiring board, in particular to a flexible printed circuit (FPC) surface mount technology (SMT) as well as a magnetic tool and a steel mesh which are used for the FPCSMT. The magnetic tool comprises a buckle cover board and a magnetic carrying tray, wherein the magnetic carrying tray is a magnetic baseplate, the buckle cover board is a metal sheet which can be attracted by the magnetic baseplate, and the buckle cover board is provided with a slotted hole used for the solder paste printing and the surface mounting of a FPC. The invention is characterized in that the buckle cover board is a steel sheet which can be attracted by the magnetic baseplate, the step layer which is the same as the buckle cover board in shape is etched on the magnetic carrying tray, the depth of the step layer is the same as the thickness of the steel sheet; before the circuit board printing, the magnetic carrying tray is fixed on a positioning base, and then the FPC and the buckle cover board are arranged on the magnetic carrying tray; after the accurate positioning, the FPC and the magnetic tool are taken down the positioning base to conduct the solder paste printing process, the surface mounting process and the reflow soldering process.

A method of analyzing an image of a substance deposited onto a substrate, the image comprising a plurality of pixels, includes defining a region of interest in the image, associating the region of interest with first and second perpendicular axis, wherein a set of pixels in the image lie along the first axis, converting the pixels in the region of interest to a single dimensional array aligned with the first axis and projecting along the second axis, and applying at least one threshold to the single dimensional array, the threshold based at least in part on a predetermined limit.

The invention discloses an LED lamp filament illuminating strip and a preparation method therefor. The illuminating strip comprises LED chips in upper and lower rows, wherein all LED chips in the lower row are distributed at intervals, and all LED chips in the upper row are respectively connected between two adjacent LED chips in the lower row in a lap joint manner. The illuminating surfaces of the LED chips in the upper and lower rows are opposite to each other. The positive and negative electrodes of all LED chips in the upper row are respectively welded with the negative and positive electrodes of two adjacent LED chips, in lap joint connection with the LED chips in the upper row, in the lower row. The preparation method comprises the steps: coating solder paste on the positive and negative electrodes of all LED chips in the lower row; heating the solder paste and enabling the solder paste to be melted, welding the corresponding electrodes, coating the front and back surfaces of chip strips in series connection with fluorescent glue, and solidifying the fluorescent glue. The illuminating strip employs the chips which are not overlapped with each other, and the illuminating surfaces of the chips are arranged oppositely, thereby improving the light-emitting uniformity and facilitating heat dissipation. The wire crossing and tandem among chips is avoided, the packaging cost is reduced, and the yield of finished products is improved.

A method of manufacturing a semiconductor device includes a first step of forming solder film on metal posts of a mother chip, a second step of forming solder balls after the first step by printing a solder paste on the mother chip and heating the mother chip so that the solder paste is ref lowed, a third step of bonding the metal posts of the mother chip and metal posts of a daughter chip to each other in a thermocompression bonding manner by means of the solder film after the second step, and a fourth step of flip-chip-connecting the mother chip on a circuit substrate by using the solder balls. In the second step, the mother chip is heated in a nitrogen atmosphere in which the oxygen concentration is 500 ppm or less.

The invention is concerned with low rosin type halogen-free and cleaning-free flux using for lead-free solder paste, belonging to flux field. About the existing rosin type flux, the leftover after welding is high and the leavings with halogen has cauterization. The matter of this invention is 5 to 20 wt percent of organic acid activator, 10 to 29 wt percent of modified rosin, 1 to 10 wt percent of binder, 0.5 to 6 wt percent of stabilizer, 1 to 6 wt percent of surfactant, 1 to 8 wt percent of corrosion inhibitor, 1 to 10 wt percent of thickener, and the rest is solvent with high boiling point. The copper mirror after welding is not penetration, and this invention without halogen has high insulation resistance and good assistant jointing capability. The viscosity of matched solder paste is advisable to solve the high content of rosin in the flux and great smoke. The leftover after welding is colorless and transparent film and it dose not absorb water with the normal temperature without clearing to fit for the welding demand of common production.

A method for making an integrated circuit substrate having embedded passive components provides a reduced cost and compact package for a die and one or more passive components. An insulating layer of the substrate is embossed or laser-ablated to generate apertures for insertion of a paste forming the body of the passive component. A resistive paste is used to form resistors and a dielectric paste is used for forming capacitors. A capacitor plate may be deposited at a bottom of the aperture by using a doped substrate material and activating only the bottom wall of the aperture, enabling plating of the bottom wall without depositing conductive material on the side walls of the aperture. Vias may be formed to the bottom plate by using a disjoint structure and conductive paste technology. Connection to the passive components may be made by conductive paste-filled channels forming conductive patterns on the substrate.

An inspection station (6) has a ring of 370 nm LEDs (24) for low-angle diffuse illumination of flux. This stimulates inherent fluorescent emission of the flux without the need for flux additives or pre-treatment. A CCD sensor (20) detects the emission. An image processor generates output data indicating flux volume according to a relationship between emission intensity and volume over the surface of the flux. Intensity non-uniformity indicates either height non-uniformity or hidden voids, both of which give rise to defects after application of solder paste and reflow. The inspection is particularly effective for pre solder application flux inspection.

Systems and methods for implementing hybrid, closed-loop control that generates control values for processes defined by a limited number of function evaluations and large amounts of process and measurement noise. The described control system is applied to a stencil printing process for applying solder paste to an electronic medium such as a printed circuit board or semiconductor wafer. The control system is defined by a hybrid approach. A first, coarse algorithm is used to rapidly produce the value of a stencil printer control value resulting in a solder paste deposit having a volume within predetermined acceptable limits. After the coarse algorithm no longer produces solder paste deposits closer to a desired volume, a second, more refined estimator is used to fine tune the process. An additional transitional algorithm may be added between the coarse algorithm and refined estimator. The coarse algorithm may be implemented with a constrained-conjugated gradient search, and the refined search may be a implemented using a least-squares affine estimator or a quadratic estimator. The transitional algorithm may be implemented using a block version of a least-squares affine estimator.

A method for assembling a whole semiconductor wafer (101) with a plurality of device units (120) having metal contact pads. Each contact pad has a patterned barrier metal layer and a metal stud (103, preferably copper or nickel) with an outer surface suitable to form metallurgical bonds without melting. A leadframe suitable for the whole wafer is provided, which has a plurality of segments groups (102), each group suitable for one device unit; each segment has first (102a) and second ends (102b) covered by solderable metal. A predetermined amount of solder paste (104) is placed on each of the first segment ends. The leadframe is then aligned with the wafer so that each of the paste-covered segment ends is aligned with the corresponding metal stud of the respective device unit. The leadframe is connected to the wafer and the whole wafer is encapsulated (105) so that the device units and the first segment ends are covered, while the second segment ends remain exposed. The encapsulated wafer is separated (110) into individual device units (120).

The present invention discloses an electronic package to contain and protect an integrated circuit (IC) chip. The electronic package further includes a leadframe, a flexible circuit or PCB type of substrate. The leadframe, flexible circuit or PCB type substrate further includes solder contacts, which are aligned with via holes in the molding layers on the top and bottom sides of the package. These via holes are for placing solder paste or solder balls from above and below for electrical access to the IC chip. These solder balls provide access for electrical testing after the package is mounted on a motherboard. They also provide the connection points for stacking multiple packages vertically.

The present invention offers a method of welding FPC board and PCB board, and the special fixture for this method which includes an upper-template and an under-template. The method includes the following steps: the first step, printing solder paste onto a big-piece PCB board composed of several small-piece PCB boards; the second step, using SMT to compose components onto the PCB board; the third step, fixing the PCB board in the slot of under-template of the fixture for locating; the fourth step, aligning the solder pad zones of FPC board and PCB board; the fifth step, covering the upper-template of the fixture to the upper-surface of the PCB board, and the overlapped area of solder-pad zone is 50%-80%, the under-surface of the upper-template should must maintain horizontal, rotating the block button on the under-template to fasten the upper-template; the sixth step, sending the fastened fixture into enclosed reflow oven for refluxing weld; the seventh step, taking off the template, checking the welding state between FPC board and PCB board. As the said welding method is less in steps and simple in its special fixture, the productive efficiency is high, and the cost is low.

The invention aims to provide a thermosetting flux suitable for solder bonding of a semiconductor element and an electronic part and making solder bonding with a high bonding strength and a high heat resistant strength at a high temperature possible and a paste containing the flux and a non-lead type solder paste and with respect to the thermosetting flux, an epoxy resin, a hardening agent, and at least one of rosin derivatives having functional groups reactive on the epoxy resin and selected from maleic acid-modified rosin, a fumaric acid-modified rosin, and acrylic acid-modified rosin are used. The flux can be used in form of a solder paste while being mixed and kneaded with the non-lead type solder alloy powder.