630 results about "Solder paste" patented technology

The invention discloses a heterojunction solar cell, a preparation method thereof and a photovoltaic module, and relates to the field of heterojunction solar cells. The heterojunction solar cell comprises a substrate; a front passivation layer and a front anti-reflection layer are sequentially arranged on the front surface of the substrate from inside to outside; the back surface of the substrate is provided with an N-type contact region and a P-type contact region; the N-type contact area is provided with a first passivation layer, a first conductive layer, a first mask layer, a seed layer, a copper gate electrode, insulation paste and a solder strip from inside to outside in sequence. The P-type contact area is provided with a second passivation layer, a second conductive layer, a third conductive layer, a seed layer, a copper gate electrode and a solder strip from inside to outside in sequence. Solder paste is arranged on the side wall of the copper gate electrode. The copper electroplating technology can accurately control the height and width, and is of a main-grid-free structure, so that the material cost is reduced, and the double-sided rate of the solar cell is improved; the conductivity of copper is superior to that of silver paste, so that the short-circuit current, the filling factor and the efficiency of the solar cell structure can be improved.

The invention discloses a PCB soldering paste printing three-dimensional defect detection system based on multispectral imaging, and relates to the field of machine vision detection, and the system comprises a multispectral image acquisition module, a four-channel industrial camera based on RGB and near infrared, and a tunable LED light source array; acquiring reflection characteristic data under different penetration depths through a wavelength switching mechanism; the motion control trigger module is used for realizing positioning based on an XYZ three-axis objective table driven by a servo motor in cooperation with feedback of an encoder; a pulse width modulation signal is adopted to coordinate the moving speed of a camera shutter and a platform; according to the method, RGB and NIR four-channel imaging is combined with Beer-Lambert law modeling, so that double verification of material component quantitative analysis and three-dimensional shape reconstruction is realized, and limitation of monocular vision is avoided; structured light projection and binocular stereo matching technologies are adopted, cross-frame data alignment is realized in cooperation with an ICP algorithm, and detail defects can be better detected.

A solder alloy consisting of Ag: 3.1 to 4.0% by mass, Cu: 0.6 to 0.8% by mass, Bi: 1.5 to 5.5% by mass, Sb: 1.0 to 6.0% by mass, Co: 0.001 to 0.030% by mass, Fe: 0.02 to 0.05% by mass, As: 0.002 to 0.250% by mass, and a balance Sn.

The invention relates to a lead-free and halogen-free soldering paste and a preparation process thereof, and belongs to the technical field of soldering paste production, through the combination of nano-silver-loaded carbon nanotubes, organically coated solder alloy powder and soldering flux, the surface tension of the lead-free and halogen-free soldering paste can be reduced by carbon nanotube surface carboxyl in the nano-silver-loaded carbon nanotubes, so that the lead-free and halogen-free soldering paste is obtained. Nano-silver and tin form an Ag3Sn strengthening phase which synergistically promotes wetting and spreading of the solder on a substrate, meanwhile, the carbon nanotubes loaded with the nano-silver are uniformly dispersed in the soldering paste to play a dispersion strengthening role, and the brittleness caused by bismuth segregation is effectively inhibited in cooperation with the grain refinement effect of copper and indium in the solder alloy powder; and the organic coating layer hydrogenated rosin-terpene resin and the soldering flux alcohol ether solvent form a slight dissolution-fusion effect, so that the welding flux alloy powder is prevented from being oxidized, an organic acid active agent can be released to remove a substrate oxidation film, the metallurgical bonding quality of a welding interface is further guaranteed, and the defects of pseudo soldering, cavities and the like are reduced.

The invention relates to silver-copper-titanium active soldering paste with a high recovery coefficient and a preparation method and application of the silver-copper-titanium active soldering paste, and belongs to the technical field of heterogeneous material connection and semiconductor packaging. The silver-copper-titanium active soldering paste is composed of, by mass, 70%-90% of brazing filler metal powder and 10%-30% of scaling powder. The brazing filler metal powder is mixed powder composed of silver-copper-based powder, titanium-containing powder and other metal powder. The soldering flux is composed of, by mass, 40%-70% of a solvent, 20%-40% of rosin, 5%-20% of an active agent, 1%-15% of a thixotropic agent, 1%-10% of an interface modifier and 1%-10% of a corrosion inhibitor, and the thixotropic agent is composed of a short-range agent and a long-range agent according to the mass ratio of 1: (1-4). The recovery coefficient of the obtained soldering paste is close to 1, and the soldering paste has excellent printability, sagging resistance and storage stability and has wide application prospects in the fields of semiconductor packaging, power electronic devices, aerospace and the like.

Disclosed in the present disclosure are a back contact cell, a back contact cell string, and a solar cell module. The back contact cell comprises grid lines arranged on the back surface; the grid lines include first busbars configured to be connected to solder ribbons, a plurality of first Pad points are arranged on each first busbar, a first preset region where solder paste is located is provided between adjacent first Pad points of the first busbar, and no pad point is provided in the first preset region. The present disclosure can shorten the transport distance and significantly reduce transport losses during carrier collection.

The invention belongs to the technical field of brazing, and particularly relates to a contact-shaped composite brazing filler metal and a preparation method and application thereof.The preparation method comprises the steps that a sheet made of a material A is obtained; stamping the sheet by using a stamping die so that the surface of the sheet is bent to form a plurality of trapezoidal grooves to obtain a honeycomb array structure sheet; solder paste is sprayed and printed in the trapezoidal grooves of the honeycomb array structure sheets, and the solder paste comprises brazing filler metal B and scaling powder; the honeycomb-shaped array structure sheet sprayed with the soldering paste is put into a reflow oven to be heated, the brazing filler metal B in each trapezoid-shaped groove is melted to form a protruding contact, and a contact-shaped composite brazing filler metal sheet is obtained; wherein the scaling powder is separated out in the heating process and flows to cover the outer surface of the contact-shaped composite brazing filler metal sheet; the high-strength composite welding spot can be prepared, and the characteristics of low-temperature welding and high-temperature application are achieved.

The utility model relates to the field of solder paste production, in particular to a precise and quantitative solder paste subpackaging device, which comprises a storage barrel, a three-way pipeline and a component component, a motor I is started to drive a driving dial to rotate to drive a cylindrical pin to rotate, so that the cylindrical pin is inserted into a groove of a grooved wheel to drive the grooved wheel to rotate by a certain angle; a cylindrical pin rotates to drive a grooved wheel to rotate intermittently, so that a three-way pipeline rotates intermittently, the flow and the flow direction of solder paste are controlled by controlling the rotating angle and time of the three-way pipeline, and the purpose of precise quantitative subpackaging is achieved; a second motor is started to drive a second gear to rotate, so that a first gear rotates, and the first gear rotates to drive a first threaded rod to rotate; the rotating plate rotates in the groove, the rotating plate rotates to drive the second threaded rod to rotate, the piston slides in the cylinder, and the position of the piston in the cylinder can be controlled, so that the size of the space in the cylinder is adjusted, solder paste is pushed or sucked, and the purpose of quantitatively controlling output of the solder paste is achieved.

Provided are a solder alloy, a solder paste, a solder ball, and a solder joint which have a low melting point, are excellent in ductility, shear strength, and heat cycle resistance, further suppress the occurrence of open defects, and in addition, have reduced residual voids even at the time of joining in a large area. A solder alloy has an alloy composition of, by mass %, Bi: 35.0 to 68.0%, Sb: 0.1 to 2.0%, Ni: 0.010 to 0.050%, Ge: 0.007 to 0.090%, with the balance being Sn. Preferably, the alloy composition further contains, by mass %, at least one of Co, Ti, Al, Mn, As, Fe, Pd, Zn, Zr, Pb, In, Ce, P, and Ga: 0.1% or less in total. Further, this solder alloy can be suitably used for solder pastes, solder balls, and solder joints.

This invention discloses a Mini-LED packaging device, a Mini-LED packaging method, an apparatus, and a computer-readable storage medium. The method, applied to a Mini-LED packaging device, involves adjusting the position of the Mini-LED chip to be fixed on a substrate to embed the electrodes of the Mini-LED chip into a groove. Solder paste is placed on a filter screen inside the groove. During the fixing of the Mini-LED chip, a height limiting plate restricts the upward displacement of the Mini-LED chip during the curing process of the solder paste, allowing the solder paste to pass through the filter screen and enter the gap during curing. This invention reduces the overly stringent requirements for solder paste usage and the process difficulty of Mini-LED chip die bonding by designing the substrate structure, thereby avoiding the adverse effects of inaccurate solder paste usage on Mini-LED chip die bonding and improving display performance.

This invention introduces an advanced method for manufacturing printed circuit boards (PCBs) featuring an embedded shield, enhancing the integrity and functionality of electronic devices. The process involves forming trenches on the PCB, filling them with solder paste, and seamlessly integrating a shield with a frame through a meticulous soldering procedure. This refined technique offers superior reliability and paves the way for more intricate and robust electronic designs.

This application discloses a contact-type chip soldering process, relating to the field of chip soldering technology. The process includes the following steps: printing solder paste dots at the contacts within the soldering area of ​​a circuit board; heating the solder paste dots to melt them; cooling the molten solder paste dots on the circuit board to form solder dots at the contacts; printing a solder paste layer at the contacts within the solder paste layer; attaching a chip to the soldering area of ​​the circuit board, such that the chip's contacts are in contact with the solder paste layer; heating the solder paste layer and solder dots to melt them; cooling the soldering area of ​​the circuit board to solidify the molten solder paste layer and solder dots, forming solder joints, and soldering the chip onto the circuit board. This application effectively reduces air bubbles generated within the solder joints and improves the quality of the solder joints.

The present invention is provided with a first step for applying a plurality of solder paste portions 90a to 90d to a land 64 of a flexible printed wiring board 60, a second step for bringing a metal piece 70 into contact with the plurality of solder paste portions applied to the land 64, and a third step for heating the solder paste portions to form a plurality of solder connection parts 80a to 80d for joining together the land 64 and the metal piece 70. A surface 641 of the land 64 is provided with a plurality of solder connection regions SR1 to SR4 partitioned by virtual boundary lines BL1 and BL2. The solder connection regions SR1 to SR4 positioned adjacent to each other are directly connected to each other on the boundary lines BL1 and BL2. The first step includes applying the plurality of solder paste portions 90a to 90d to the plurality of solder connection regions SR1 to SR4, respectively.

The invention relates to the technical field of chip mounting, and discloses a rail pressure sensor chip mounting device, which comprises a placement platform provided with a three-axis linear module and a conveying assembly; the connecting seat is fixedly mounted at the movable end of the three-axis linear module, a mounting seat is arranged at the bottom of the connecting seat, two clamping frames are fixedly mounted at the bottom of the mounting seat, and correcting grooves are formed in the opposite sides of the two clamping frames; the scraping assembly is arranged on the side edge of the mounting seat and is used for cleaning redundant soldering paste at the pin after reflow soldering; the cleaning assembly is arranged on the other side of the mounting base and used for cleaning and collecting the soldering paste left on the scraping assembly; according to the invention, through cooperation of a plurality of assemblies, the problem of dislocation of chip pins and bonding pads and the problem of connection of welding spots between the pins after welding can be effectively solved, the whole process is high in automation degree, the mounting precision and the production efficiency are greatly improved, and the welding quality of the rail pressure sensor chip is ensured.

The invention relates to the technical field of solder paste printing, and discloses an integrated circuit board solder paste printing defect detection method and system and a storage medium, and the method comprises the steps: obtaining bonding pad coordinate matrix data and solder paste coordinate matrix data; performing feature extraction according to the bonding pad coordinate matrix data and the solder paste coordinate matrix data to obtain bonding pad ideal features and solder paste actual features; function fitting is carried out according to the ideal features of the bonding pad and the actual features of the solder paste, and the offset between the bonding pad and the solder paste is obtained through calculation; inputting the offset into a pre-trained soldering tin defect analysis model, and outputting to obtain types of soldering tin printing defects and solder paste defects; according to the types of the soldering tin printing defects and the solder paste defects, an ideal distance between bonding pads and a soldering tin distance are obtained through calculation; and comparing the soldering tin distance with a preset soldering tin theoretical distance threshold value to obtain a solder paste defect type. The method can solve the problem that in the prior art, the tin soldering defect detection precision is low.

The utility model relates to an integrated circuit printing device in the technical field of integrated circuit printing, which comprises a body and an adsorption platform, the adsorption platform is provided with a plurality of vacuum holes, the side edge of the body is provided with side edge vacuum holes, and the body is internally provided with a limiting pin. According to the utility model, an optimization mode that the PCB units are in one-to-one correspondence with the vacuum holes is adopted, so that the adsorption effect is greatly enhanced, the phenomena of substrate warping, shaking and the like caused by vacuum adsorption weakness in the printing process are effectively avoided, the solder paste printing balling quality is greatly improved, the defective rate of products is remarkably reduced, and the production efficiency is improved. And the production efficiency is greatly improved, and considerable economic benefits are created for integrated circuit manufacturing enterprises.

The invention relates to an LED lamp with a heat dissipation structure, and belongs to the technical field of household lighting lamps. A heat dissipation block is arranged, and the peripheral side wall face of an LED lamp wick is attached to the heat dissipation block, so that heat generated by the LED lamp wick during working can be transmitted to an integrated circuit board through solder paste, and the heat dissipation effect of the LED lamp wick is improved; the solder paste can be transmitted to the integrated circuit board through the heat dissipation block, the heat dissipation path of the LED lamp wick is increased, the heat dissipation area of the LED lamp wick is increased, the heat dissipation speed and the heat dissipation efficiency of the LED lamp wick are improved, the temperature of the LED lamp wick is prevented from being too high, the viscosity quality of the connecting position between the solder paste and the LED lamp wick is guaranteed, and the service life of the LED lamp wick is prolonged. And finally, the circuit connection quality of the positive and negative electrodes of the LED lamp wick and the positive and negative electrodes of the potential of the integrated circuit board is ensured.

This invention discloses a circuit board surface mount correction method, apparatus, system, and medium. The circuit board surface mount correction method includes: acquiring basic accuracy data of the bare circuit board state and solder paste association data after solder paste has been printed on the circuit board; generating a D data stream based on the basic accuracy data, the solder paste association data, and corresponding component information, and sending the D data stream to a pick-and-place machine and a pre-reflow AOI (Automated Optical Inspection) unit; the pick-and-place machine completing component placement based on the D data stream; the pre-reflow AOI acquiring placement result information for each component on the circuit board after placement, and calculating offset data for each component based on the D data stream to generate an H data stream; and the pick-and-place machine performing surface mount correction based on the H data stream. This circuit board surface mount correction method achieves the effect of improving component placement correction accuracy and yield.

The application provides a flux for spot soldering of soldering paste; raw materials of the flux include, by total mass: 2-7% of acid modified rosin, 25-38% of disproportionated rosin, 1.3-4% of compound active agent, and solvent supplementing the rest to 100%; the compound active agent includes halogen-containing active agent and / or organic acid active agent; the organic acid active agent includes at least two of organic acid with normal pressure boiling point of 90-180 DEG C, organic acid with normal pressure boiling point of 200-300 DEG C, and organic acid with normal pressure boiling point of 305 DEG C or more; the solvent includes organic matter with at most 3 unsaturated structures and at least 1 polar group, and reduces post-soldering residue; the application effectively reduces the amount of acid modified rosin, and expands the soldering temperature range of the flux; the soldering paste of the flux is very suitable for spot soldering operation process due to excellent flow viscosity, wettability and expansion rate, and has high soldering reliability.

The invention discloses semiconductor chip multifunctional mounting equipment, which belongs to the technical field of semiconductor packaging, and comprises a base, a plate conveying track assembly is mounted on the base, the plate conveying track assembly comprises two groups of tracks, and the height and the width of each group of tracks can be adjusted; the wafer processing mechanism is located on one side of the plate conveying track assembly and used for pre-assembling multiple discs of wafers and completing automatic film expansion, calibration and wafer taking of the wafers; the automatic tin dispensing device with a suction nozzle is used for dispensing solder paste and glue and drawing lines; an upside-down mounting mechanism; visual systems are arranged on the wafer processing mechanism, the automatic tin dispensing device and the flip-chip mounting mechanism; according to the invention, the plate conveying track assembly, the wafer processing mechanism, the automatic tin dispensing device and the flip-chip mounting mechanism cooperate with the automatic feeding and discharging device for cooperative work, and are matched with a plurality of visual systems, so that a full-automatic, high-precision and multifunctional mounting process can be realized, and the production efficiency and consistency are greatly improved.

The utility model relates to the technical field of nanometer soldering paste processing, and particularly discloses a vacuum heating device for assisting nanometer soldering paste processing, which comprises a heating box, and a feed port and a discharge port are respectively arranged at the top and the bottom end of the heating box; the stirring mechanism comprises a rotating cylinder rotationally connected to the top of the heating box through a rotating shaft, the top end of the rotating cylinder penetrates through the heating box, the interior of the rotating cylinder is rotationally connected with a rotating rod through a bearing, and due to the fact that a driving source is independent, the rotating directions of the stirring rod and an upper inclined rod, a side rod and a lower inclined rod on the outer ring can be controlled to be opposite; an electromagnetic valve is started, a vacuum pump is started after short time delay, so that a vacuum environment is formed in the heating box, the oxygen content is reduced, oxidative deterioration of the nano soldering paste is avoided, meanwhile, vacuum defoaming is utilized, bubbles are reduced, and a molecular sieve filter can intercept raw material splashing particles in the process; meanwhile, steam is effectively filtered, and the product quality is improved.

The utility model relates to the technical field of circuit board printing, and provides an electronic component circuit board printing machine. The hydraulic cylinder is arranged on the surface of the workbench; the two notches are formed in the surface of the symmetrical position of the workbench, positioning shafts are fixedly arranged on the inner walls of the two notches, the outer surfaces of the two positioning shafts are movably sleeved with moving frames, and the surface of one side of each moving frame is fixedly arranged on the surface of a hydraulic cylinder. According to the utility model, when the bolt is rotated, the mounting panel connected with the bolt is driven to move downwards and is matched with the sliding rod for auxiliary positioning, and when the bolt is not connected, the spring is used for providing reset work, so that the scraper is in contact with a soldering paste material on the surface of a circuit board; and a concentric-square-shaped frame on the surface of a third output end threaded rod is driven to move along a guide rod, soldering paste on the surface of the circuit board is scraped, and later machining and flattening are facilitated.

The invention provides a solder paste tube assembling device, a printing machine comprising the solder paste tube assembling device and a solder paste tube assembling method. The solder paste tube assembling device is used for fixing and sealing a solder paste tube, a nozzle is arranged at the bottom of the solder paste tube, the solder paste tube provides solder paste through the nozzle, and the solder paste tube assembling device comprises a support, a top sealing device and a bottom supporting device. The top sealing device is arranged to controllably conduct lifting motion so as to be connected to the tops of the solder paste pipes of different heights in a sealed mode. According to the solder paste tube assembling device, through the top sealing device capable of automatically ascending and descending, the solder paste tubes can be automatically disassembled and replaced, and the solder paste tubes with different heights can be automatically replaced.

The application discloses a kind of SMT production line deviation screening method, device, equipment, medium and product.The method comprises: obtaining pad actual coordinate data in incoming material circuit board;According to pad actual coordinate data and the pad reference coordinate data in the preset Gerber data of incoming material circuit board, determine target translation and target rotation angle;According to pad reference coordinate data, target translation and target rotation angle generate solder paste printing coordinate simulation data;Solder paste printing coordinate simulation data and pad actual coordinate data are compared one by one, and pad deviation data is obtained;According to pad deviation data, whether incoming material circuit board is qualified is determined.The technical scheme provided by the application realizes accurate incoming printing risk determination, avoids printing defects caused by incoming deviation from the source, improves production line yield and production efficiency, thereby adapting to the production demand of high-speed high-precision SMT production line.

The present application provides a solder paste dispensing feedback system (10) for a circuit board printer. The system (10) comprises a solder paste container (101), a solder paste extruding device, a first sensor, a second sensor and a control device. The solder paste container (101) is used to contain solder paste and has an outlet. The solder paste extruding device is used to extrude the solder paste from the outlet of the solder paste container (101). The first sensor is used to detect solder paste in the solder paste container (101), and generate a first signal to indicate whether the solder paste container (101) still contains solder paste. The second sensor is used to detect an operating state of the solder paste container (101), and generate a second signal to indicate whether solder paste is extruded from the outlet of the solder paste container (101). The control device is used to receive the first signal and the second signal, and control the operation of the circuit board printer according to the indications of the first signal and the second signal.

The invention discloses high-temperature halogen-free soldering flux, solder paste and a preparation method. The high-temperature halogen-free soldering flux comprises 30%-50% of a high-boiling-point solvent, 30%-40% of rosin, 1%-8% of modified thermoplastic resin, 5%-10% of an active agent, 0.5%-1.0% of a modified surfactant, 4%-8% of a thixotropic agent, 0.5%-3% of metal salt and 3%-5% of an antioxidant. The solder paste comprises 85%-88% of lead-free metal alloy powder and 12%-15% of high-temperature halogen-free scaling powder. Weighing an organic solvent, adding into a container, and heating to 80-95 DEG C; adding the thixotropic agent and uniformly stirring; the temperature is reduced to 60-70 DEG C, rosin, modified thermoplastic resin, an active agent, metal salt, an antioxidant and a modified surfactant are weighed and added, constant-temperature stirring is conducted till dissolution is achieved, bubbles in the scaling powder are discharged, the scaling powder is taken out and cooled into paste, the materials are ground, and the high-temperature halogen-free scaling powder is obtained.

The utility model discloses a high -efficient mixer for solder paste production, including the cabinet, be equipped with the rectangular opening on the right side inner wall of cabinet, the upper end of left side of cabinet is equipped with the rectangular slot, and the rectangular opening is equipped with the stirring barrel and is inserted, and the bottom of cabinet is equipped with the shift mechanism, and the stirring barrel is placed on the shift mechanism. The utility model discloses through the stirring barrel cooperation shift mechanism and is inserted in the cabinet after the rectangular opening, and the stirring mechanism is driven by the cylinder cooperation horizontal fixed frame and is inserted in the stirring barrel, and the stirring barrel and the stirring mechanism butt joint conveniently and quickly, and the operation is convenient and the material taking is quick and convenient, and the spiral stirring rod and the annular connecting block on the strip support block of driving motor drive the rotation, so that the strip support block drives the arc scraping board and the fixed rod on a plurality of conical crushing teeth rotate, and the spiral stirring rod, arc scraping board and conical crushing tooth carry out the full mixing of the tin paste and the auxiliary material in the stirring barrel, improve the effect of mixing.

The invention provides a general solder paste printing tool and method for SMT patch production, and the tool comprises a steel sheet fixing frame and a printed board fixing support body, the steel sheet fixing frame comprises a lower frame, a steel sheet and an upper frame, the lower frame comprises a lower frame body and a fixed column, the lower frame body is provided with a first through hole accommodating cavity, and the fixed column is provided with a second through hole accommodating cavity; a first positioning notch is formed in the joint of the cavity wall of the first through hole accommodating cavity of the lower frame body; the upper frame is provided with a second through hole containing cavity and a first fixing hole, and a second positioning notch is formed in the cavity wall connecting position of the second through hole containing cavity. The steel sheet is arranged between the lower frame and the upper frame, the first positioning notch and the second positioning notch are oppositely arranged, a printed pattern is arranged on the steel sheet, the printed board fixing and supporting body comprises a supporting body and a supporting base, and the supporting body is provided with a printed board mounting groove. According to the technical scheme, the technical problems that in the prior art, due to the fact that manual printing precision is poor, solder paste and a bonding pad are deviated in position after printing, and time and labor are wasted are solved.

The invention discloses a soldering flux, a low-void-rate high-lead soldering paste and a preparation method of the soldering paste, and belongs to the technical field of electronic circuit surface mounting. The soldering flux is composed of 40%-50% by weight of rosin, 0.5%-2% by weight of a defoaming agent, 6%-12% by weight of organic acid, 0.05%-0.2% by weight of haloid, 5%-8% by weight of a thixotropic agent, 1%-2% by weight of a corrosion inhibitor and the balance solvent. The soldering flux and the solder alloy powder are mixed according to the mass ratio of 1: 10 to prepare the high-lead soldering paste. The high-lead solder paste has extremely low voidage, shows good weldability in welding under the condition of meeting the halogen-free standard, is full and bright in welding spots after welding, and is particularly suitable for packaging and welding of electronic components with high voidage requirements.