2112 results about "Solder paste" patented technology

The invention provides an intelligent electronic assembly quality control system based on AOI (automatic optical inspection) and SPI (solder paste printing inspection) integration, and belongs to the field of electronic information equipment flexible production lines. Comprising an AOI module, an SPI module, a data integration module, a feedback control module and a data storage and transmission module. All the modules carry out high-frequency data transmission through an industrial Ethernet; according to the system provided by the invention, the precision of quality detection is improved, and the accurate recognition of defects is realized through the data association of the AOI and the SPI module and the anomaly detection of the SVM and the CNN algorithm. Real-time process optimization is achieved, the feedback control module automatically adjusts printing and mounting process parameters according to the quality data model, and the product consistency is remarkably improved. The method improves the traceability and safety of the data, achieves the efficient storage and safety access of the detection data through distributed cloud storage and data encryption transmission, and supports the quality problem traceability.

The invention relates to the technical field of intelligent temperature control, and discloses a solder paste stirring intelligent temperature control system and method based on temperature sensors, and the method comprises the steps: carrying out the preprocessing of temperature data collected by a plurality of temperature sensors in a solder paste stirring device, and obtaining a structured temperature data set; performing multi-scale feature extraction to obtain a temperature feature set; performing regression prediction on the temperature feature set to obtain temperature change features; performing temperature anomaly detection and positioning based on the temperature change characteristics to obtain a temperature anomaly score graph and an abnormal area mask; performing feature integration on the temperature change features and the abnormal region masks to obtain comprehensive feature representation; the temperature control parameters are subjected to staged differential optimization according to the comprehensive feature representation, an intelligent temperature control strategy in the solder paste stirring process is obtained, then multi-source sensing data are comprehensively utilized, the method has the self-adaptive learning capacity, accurate intelligent temperature control can be achieved, and the automation level of the solder paste stirring technology is improved.

The invention relates to the technical field of surface mounting control, and discloses an SMT surface mounting optimization control method and system based on multi-source data, and the method comprises the steps: collecting current surface mounting information, comparing the current surface mounting information with optimization judgment parameters, and judging whether to carry out surface mounting optimization control or not. When it is judged that optimization is carried out, historical SMT patch image data are collected, and defect feature vectors are obtained; and constructing an electrical attribute vector and a three-dimensional space distribution model of the soldering paste, executing thermal simulation calculation, and obtaining a thermal field distribution diagram of the component mounting area. And taking the defect feature vector, the electrical attribute vector and the thermal field distribution diagram as multi-source input, inputting the multi-source input into a multi-head attention neural network model, and outputting a patch optimization control parameter group. And driving the surface mounting equipment to execute surface mounting operation according to the surface mounting information and the surface mounting optimization control parameter group. According to the invention, the mounting reliability, customization capability and self-adaptability are improved, and precise and high-quality mounting control of complex special-shaped devices and high-temperature-sensitive elements can be realized.

According to the device and method for controlling the connection void rate of the large-area thermal interface of the power electronic device provided by the invention, the device part ensures that an organic solvent and water vapor in a soldering paste layer can be smoothly discharged by optimizing the grid structure shape design of a steel mesh printing module, so that the void rate in the welding process is effectively reduced; according to the method, through optimization of the reflow soldering technology, temperature control and vacuum degree optimization of all stages such as the heating process, the heat preservation process, the pre-reflow process and the reflow process are included, the gas escape time is properly prolonged, the voidage is controlled to be 1% or below, the interface thermal resistance is reduced, and the heat dissipation performance is improved. Through optimization design and process, the production process is simplified, the operation is more convenient, the cost is low, and the method is suitable for large-scale production; and meanwhile, the voidage is effectively controlled, so that the product quality consistency in the production process is guaranteed, the heat dissipation efficiency of the power electronic device is improved, and the service life of the power electronic device is prolonged.

The present application relates to the technical field of lead-free solder paste, and more specifically, to a lead-free solder paste with low voiding rate and precision welding and a preparation method thereof, which is prepared from the following raw materials in parts by weight: 70-90 parts of tin, 1-2 parts of silver, 3-6 parts of copper, 2-5 parts of magnesium fluorosilicate, 3-6 parts of nano-carbon powder, 4-5 parts of rare earth oxide and 20-30 parts of flux. The above formula can reduce the voiding rate in the welding process, improve the wettability of the lead-free solder paste, and improve the quality and reliability of the welding points.

The invention discloses an electronic component solder paste printing device, and belongs to the technical field of electronic component production and processing equipment. The device comprises a shell, a steel mesh is fixedly connected to the interior of the shell, a fixed sliding rod is fixedly connected to the top of the steel mesh, a sliding groove is formed in the side wall of the steel mesh, a feeding mechanism is arranged on the outer wall of the fixed sliding rod, solder paste is stirred and automatically fed during printing work, a scraper mechanism is arranged on the inner wall of the sliding groove, and the scraper mechanism is arranged on the inner wall of the sliding groove. According to the tin paste recycling device, the tin paste can be automatically recycled during printing work, a storage mechanism is arranged on the top of the steel mesh, and when the tin paste is recycled, the tin paste can be stored in a sealed mode. The feeding box slidably extrudes the sealing block to relieve sealing of the feeding groove, automatic feeding is achieved, it is avoided that a large amount of solder paste is placed in a machining area at a time, the oxidation or deterioration risk caused by the fact that the solder paste is exposed to air for a long time is reduced, and therefore the printing work effect of electronic components is guaranteed.

The invention relates to the technical field of electronic packaging, and discloses a method for controlling welding of a welding hole plug-in by using a prefabricated welding flux, and the method comprises the following steps: S1, dehumidifying and drying: drying a substrate by using a drying oven; s2, a solder column is manufactured, specifically, based on an original welding hole site in the substrate to be welded, the soldering tin amount Vt between the welding hole site and the plug-in is calculated, the size of the solder column is calculated according to the value of the soldering tin amount Vt, and the solder column is manufactured; s3, welding preparation is conducted, specifically, the plug-in, the substrate and the welding flux column are sequentially installed on the clamp body; and S4, reflow soldering. The soldering tin amount is calculated according to the size of a welding hole site needing to be welded and the size of a plug-in, a solid solder column of a fixed mass is manufactured in advance through the calculated soldering tin amount, the soldering tin amount is accurately controlled so as to accurately fill a weld joint, the situation that tin is too much or too little after welding is avoided, the welding quality is improved, and meanwhile the welding quality is improved. During welding, the amount of solder paste does not need to be controlled, and the efficiency can be greatly improved by directly using the solder column and placing the solder column on the plug-in.

The present application relates to the technical field of solder paste. The present application discloses a high-precision nano solder paste and a preparation method thereof. The high-precision nano solder paste comprises solder powder, flux, glucomannan and polyethylene glycol modified aliphatic epoxy resin; the raw material composition of the flux comprises: an active agent, a surfactant, a thixotropic agent, an antioxidant, a corrosion inhibitor, a film former and a solvent. The preparation method comprises the following steps: stirring and mixing the active agent and the solvent to prepare a premixed liquid; adding a surfactant, a thixotropic agent, an antioxidant, a film former and a corrosion inhibitor to the premixed liquid in sequence, stirring and mixing to prepare a flux; mixing and stirring the solder powder, flux, glucomannan and polyethylene glycol modified aliphatic epoxy resin, grinding and preparing a high-precision nano solder paste. The high-precision nano solder paste prepared in the present application has good storage stability, long service life, high expansion rate and good wetting performance.

The invention discloses a printing equipment real-time evaluation method and system based on simulation analysis, and the method comprises the steps: collecting the video data of a printing process, extracting a key frame to generate an image set, recognizing a printing region, carrying out the statistics of solder paste printing points, and dividing N image regions; a Sobel operator is utilized to extract contour features, color features are extracted through a color histogram, and a multi-dimensional feature set is constructed. A GAN model is adopted to simulate features, feature learning and dimension reduction are performed on the auto-encoder according to the simulated features, and recognition feature data are generated. Feature data similarity is analyzed and recognized based on Euclidean distance, and a prediction defect area deviating from the overall features is screened out. And identifying and evaluating the printing defect by predicting the corresponding characteristics of the defect area and combining the comparison characteristics, and generating equipment printing defect evaluation information. According to the invention, rapid defect positioning and defect area prediction can be realized, solder paste printing equipment parameters are optimized, and production benefits are improved.

The invention discloses a printing machine equipment operation optimization process and system based on multi-vision analysis, and the method comprises the steps: obtaining multiple groups of image data in a printing process through employing a multi-vision collection scheme in a preset production period; main feature data are obtained through texture and contour feature extraction and a PCA analysis method, the recognition rate of solder paste printing is calculated through the recognition model, the recognition rate is judged, and an acquisition scheme is adjusted. And fusing the multi-image feature set by adopting a DCA feature fusion algorithm to generate a plurality of groups of feature maps, and processing the feature maps through a convolutional neural network to obtain a plurality of groups of fused feature data. And meanwhile, equipment operation parameters are obtained, defect identification is conducted on the fused feature data through the identification model, operation evaluation and optimization are conducted on the real-time equipment operation parameters based on defect information, and the printing quality and the production efficiency are ensured. According to the invention, equipment operation analysis and printing defect evaluation can be effectively carried out from multiple visual features, the intelligence of equipment operation is realized, and the production benefit is improved.

The invention discloses low-silver lead-free tin-based solder paste and a preparation method thereof, and belongs to the field of welding materials. The soldering paste is composed of 85 wt%-87.5 wt% of tin-based powder brazing filler metal and 12.5 wt%-15 wt% of scaling powder, wherein the tin-based powder brazing filler metal comprises 0.35 wt%-0.6 wt% of Ag, 0.5 wt%-0.8 wt% of Cu, 1.0 wt%-4.0 wt% of Bi, 0.05 wt%-0.08 wt% of Ni and the balance Sn; the soldering flux is composed of rosin, a solvent, an active agent, a thixotropic agent, a film-forming agent, a PH regulator, a surfactant, a phenolic antioxidant and a corrosion inhibitor. The soldering paste has excellent low residue, good wettability and welding reliability, and is especially suitable for surface mount technology (SMT) in the electronic and electric appliance industry.

The invention discloses a heterojunction solar cell, a preparation method thereof and a photovoltaic module, and relates to the field of heterojunction solar cells. The heterojunction solar cell comprises a substrate; a front passivation layer and a front anti-reflection layer are sequentially arranged on the front surface of the substrate from inside to outside; the back surface of the substrate is provided with an N-type contact region and a P-type contact region; the N-type contact area is provided with a first passivation layer, a first conductive layer, a first mask layer, a seed layer, a copper gate electrode, insulation paste and a solder strip from inside to outside in sequence. The P-type contact area is provided with a second passivation layer, a second conductive layer, a third conductive layer, a seed layer, a copper gate electrode and a solder strip from inside to outside in sequence. Solder paste is arranged on the side wall of the copper gate electrode. The copper electroplating technology can accurately control the height and width, and is of a main-grid-free structure, so that the material cost is reduced, and the double-sided rate of the solar cell is improved; the conductivity of copper is superior to that of silver paste, so that the short-circuit current, the filling factor and the efficiency of the solar cell structure can be improved.

The invention relates to the technical field of semiconductor packaging, and provides a semiconductor packaging process which comprises the following steps: obtaining a circuit board, and preprocessing the circuit board; performing SMT assembly operation on the bottom surface of the circuit board; silk-screening solder paste on the top surface of the circuit board; a tin cap of the flip chip is dipped with a soldering flux; mounting a flip chip and other elements on the top surface of the circuit board; performing reflow soldering operation on the top surface of the circuit board; according to the semiconductor packaging process provided by the embodiment of the invention, the tin cap of the flip chip can be dipped with the soldering flux before confluence welding operation is carried out on the flip chip, so that in the reflow soldering process, the soldering flux can effectively protect the tin cap and a PCB bonding pad and prevent oxidation, the collapsed tin cap can recover the original state of the tin cap to the greatest extent during reflow soldering, and the reliability of the flip chip is improved. The tin cap can be in contact with the PCB bonding pad more effectively, good welding is formed, the wettability is improved, oxidation is reduced, the welding strength is enhanced, and the problems of pseudo soldering, open circuit and the like are reduced.

The invention discloses a defect prediction method and system for a solder paste printing process, and relates to the technical field of defect detection, and the method comprises the steps: obtaining a solder paste printing process flow of an SMT product, carrying out the process tracing through employing a historical solder paste printing defect instance, and carrying out the segmentation division of the solder paste printing process flow based on a defect process tracing result; high-incidence solder paste printing defect types in all the solder paste printing technological process sub-segments are obtained, and printing parameters related to the solder paste printing defect types are screened to generate key influence factors; normal printing parameter samples corresponding to the key influence factors are extracted to construct a normal printing behavior model; the real-time printing parameters are imported into the model for estimation, and the solder paste printing defects are predicted according to the deviation condition of the estimated printing parameters and the real-time printing parameters. According to the method, the defect key influence parameters are mined from the SMT production data, the normal printing behavior model is constructed to predict the solder paste printing defects in advance, and the solder paste printing quality is improved.

The invention relates to the technical field of image data processing, in particular to a PCB soldering paste printing quality detection method and system based on image processing, and the method comprises the steps: collecting a surface image of a to-be-detected PCB; performing filtering processing on the surface image of the PCB to be detected by using an improved anisotropic diffusion filtering algorithm to obtain a filtered surface image of the PCB, and performing solder paste offset defect identification on the filtered surface image of the PCB based on a convolutional neural network; wherein the improved anisotropic diffusion filtering algorithm comprises a K value, the K value is a product of an initial K value and a correction coefficient, and the correction coefficient is in positive correlation with the noise intensity and the importance degree of each pixel point in the PCB surface image. The problem that an existing filtering algorithm is not high in detection accuracy is solved.

The utility model provides LED lamp panel repairing equipment which is used for repairing an LED lamp panel, the LED lamp panel comprises a circuit board and at least one bad lamp bead located on the circuit board, and the LED lamp panel repairing equipment comprises a feeding assembly, a removing and die bonding assembly, a tin dispensing assembly, a surface mounting assembly and a lightening detection assembly. The feeding assembly is used for obtaining position information of bad lamp beads and bearing and conveying LED lamp panels. The rejecting and die bonding assembly is used for heating and desoldering the bad lamp beads and rejecting the bad lamp beads and the molten solder so as to expose the bonding pads corresponding to the bad lamp beads; the tin dispensing assembly is used for dispensing solder paste on the bonding pad; the surface mounting assembly is used for attaching good lamp beads to the solder paste; the laser is further used for heating and die bonding of the good lamp beads so that the good lamp beads can be installed on the circuit board. The lightening detection assembly is used for conducting lightening detection on the circuit board provided with the good lamp beads. The problem that the production efficiency of the lamp panel cannot be improved when the existing lamp panel repairing equipment is used for repairing the lamp panel is solved.

The invention belongs to the technical field of varnished wire welding, and particularly relates to a stator laser welding machine which comprises a base, a rotating part is connected to the upper end of the base, a plurality of clamps are connected to the upper end of the rotating part, and two conveying parts used for conveying the clamps are symmetrically connected to the upper end of the base. The upper end of the base is further connected with a material taking and placing unit used for taking out the workpiece from one conveying part and placing the workpiece in the clamp or taking out the workpiece in the clamp and placing the workpiece on the other conveying part, and the upper end of the base is further symmetrically connected with two laser welding units used for conducting laser welding on the workpiece in the clamp. The upper end of the base is connected with a solder paste dispensing unit used for dispensing solder paste on a workpiece in the clamp and a detection unit used for detecting the welding condition of the workpiece. The multiple unit modules including the material taking and placing unit, the solder paste dispensing unit, the laser welding unit and the detection unit are integrated, the occupied area can be effectively reduced through the compact design, and the device is more suitable for being used in the production environment with the limited space.

The invention relates to the technical field of welding materials, and discloses washable semiconductor solder paste and a preparation method and application thereof. The washable semiconductor solder paste comprises scaling powder and tin powder, wherein the mass ratio of the scaling powder to the tin powder is 1: (8-9.6); the soldering flux comprises the following raw material components: a film-forming agent, composite organic acid, a thixotropic agent, a surfactant, an antioxidant and a solvent, wherein the composite organic acid is composed of succinic acid and glutaric acid according to the mass ratio of (1-3): (1-2.5). According to the washable semiconductor solder paste, the particle size, the melting point and the alloy components of the tin powder are controlled, composite organic acid composed of succinic acid and glutaric acid in a specific proportion is adopted in the soldering flux, and other components are matched with one another; the tin powder and the soldering flux in a specific mass ratio are combined, so that the prepared washable semiconductor solder paste is good in wettability, the expansion rate is larger than or equal to 85%, the storage life reaches 3 months, and the washable semiconductor solder paste can be directly cleaned with water after being welded and is high in corrosion resistance and oxidation resistance.

The invention relates to the technical field of substrate production, in particular to a ceramic substrate convenient to weld, which comprises a substrate, a protection mechanism is arranged on the outer side of the substrate, the periphery and the upper end of the outer side of the substrate are protected through the protection mechanism, a cross rod is arranged on the upper side of the substrate, and the cross rod is connected with the protection mechanism. Two pushing assemblies are arranged in the upper end of the protection mechanism and connected with the solder paste coating mechanism. When a transverse rod is pushed to move along the upper surface of a base plate, in the moving process of the transverse rod, a material pushing assembly can be extruded to push solder paste stored in the material pushing assembly into a solder paste coating mechanism, meanwhile, in the moving process of the transverse rod, the solder paste coating mechanism can roll along the surface of the base plate, and the extruded solder paste enters the solder paste coating mechanism; and the surface of the substrate is uniformly coated with the solder paste by the rolling solder paste coating mechanism, so that the substrate is automatically coated with the solder paste after the package is removed, and the welding and production efficiency is improved.

Disclosed are a flip-chip light-emitting element and a light-emitting device. The flip-chip light-emitting element includes an epitaxial layer, a contact electrode, an insulating layer and a pad electrode. The epitaxial layer includes a first semiconductor layer, an active layer and a second semiconductor layer, and a contact electrode is formed on the surface of the epitaxial layer. An insulating layer is formed on the epitaxial layer, and covers the surface, the edge area and the sidewall of the epitaxial layer. A pad electrode is formed on the insulating layer and connected to the contact electrode, and the pad electrode at least covers part of the sidewall of the epitaxial layer. When the flip-chip light-emitting element of the present disclosure is solidified through solder paste, it is possible to prevent Sn and Ag from migrating and ascending into the active layer, thereby improving the reliability of the flip-chip light-emitting element.

Provided herein is a flux which contains a rosin, a rosin amine; one or more types of organic sulfonic acid selected from the group consisting of an alkane sulfonic acid, an alkanol sulfonic acid, and an aromatic sulfonic acid, a thixotropic agent, and a solvent, wherein: the rosin content is 5-50 mass %, inclusive, of the total amount (100 mass %) of the flux, the rosin content is 5-30 mass %, inclusive, of the total amount (100 mass %) of the flux, the organic sulfonic acid content is 0.2-10 mass %, inclusive, of the total amount (100 mass %) of the flux, and the proportion (mass ratio) of the rosin amine content to the organic sulfonic acid content is 3.33-10, inclusive.

The invention relates to the technical field of solder paste connecting surface detection, in particular to a solder paste connecting surface optical detection device applied to SMT surface mounting processing, which comprises a support plate and a conveying table used for conveying a PCB, the front side of the support plate is provided with a recess compensation detection mechanism and a position adjusting shooting mechanism, the recess compensation detection mechanism comprises a rectangular plate, and the rectangular plate is provided with a position adjusting shooting mechanism. A plurality of rectangular boxes with the bottoms open are fixedly connected to the right side of the rectangular plate, rectangular bases are slidably connected to the inner sides of the rectangular boxes, and circular blocks are fixedly connected to the bottoms of the rectangular bases. The device can effectively detect the thickness of the solder paste, can compensate and eliminate a recess formed at a probe entering position, improves the accuracy of detection through the probe, can sequence the infiltrated probes, avoids shielding and other conditions during observation, enables the plurality of infiltrated probes to be located at effective observation positions of a camera, and improves the detection accuracy. And the accuracy of solder paste detection is further improved.

According to the flatness detection device for the solder paste printing scraper, detection powder is uniformly laid on a movable bearing plane, then certain pressure is applied to the solder paste printing scraper, and the flatness of the solder paste printing scraper is judged by judging the amount of the detection powder passing through the bottom of the solder paste printing scraper.

The utility model provides an electrical connection structure of one or more sections of intelligent dimming films. The electrical connection structure specifically comprises a dimming film body, a flexible circuit board and a control unit. Wherein U-shaped long grooves are designed between independent circuits of the flexible circuit board, and air holes are formed in the conductive adhesive film layer connecting the dimming film body and the flexible circuit board. According to the design of the electrical conduction structure part of the dimming film, the ACF conductive adhesive lamination is used for replacing the solder paste welding technology, the risk of circuit pseudo soldering is avoided, special design is carried out on the FPC and the ACF conductive adhesive, the operation stability of the dimming film is improved, and the risks of short circuit and open circuit which are easily generated by circuit connection are avoided.

The invention relates to the technical field of solder paste, in particular to halogen-free soldering flux for solder paste and a preparation method of the halogen-free soldering flux. The halogen-free soldering flux for the solder paste comprises the following raw materials in parts by mass: 20-40 parts of hydrogenated rosin, 1-5 parts of maleic anhydride, 0.1-0.4 part of p-toluenesulfonic acid, 1-5 parts of activated mesoporous silica, 10-20 parts of a composite organic acid active agent, 5-10 parts of a thixotropic agent, 1-3 parts of a tackifier, 1-2 parts of a pH regulator, 1-2 parts of a surfactant, 1-2 parts of a chelating agent, 1-2 parts of an antioxidant and 50-80 parts of an organic solvent. Through the innovative component design and the preparation process, the technical contradiction existing in the field of halogen-free scaling powder for a long time is effectively solved, and an ideal material solution is provided for high-reliability electronic packaging.

The invention discloses SnCu alloy laser soldering paste and a preparation method thereof.The raw materials of the SnCu alloy laser soldering paste comprise soldering powder and flux paste, the soldering powder comprises Cu-coated Sn metal powder and silver metal powder, and the flux paste comprises Cu-coated Sn metal powder and silver metal powder; the flux paste comprises modified rosinyl carboxylic acid, a modified rosinyl acrylate polymer, a solvent, a wetting agent, organic amine, an anti-oxidation and anti-tarnishing agent and a thixotropic agent. According to the SnCu alloy laser soldering paste, wetting and diffusion of alloy powder can be effectively promoted through cooperation of all the components, and meanwhile oxidation and pollution in the welding process are reduced; the method can be widely applied to the fields of consumer electronics precision assembly, automotive electronics high-reliability welding, new energy equipment packaging, medical / aerospace extreme environment devices, optical communication core modules, industrial precision devices and the like, and micron-sized precise welding, high-reliability connection and the like are achieved.

The invention relates to the technical field of semiconductor processing, in particular to an optical detection and repair system and method for a MiniLED chip after tin brushing and die bonding. The manufacturing method comprises a Mini LED production line, and a die bonding process, a repairing process and a reflow soldering process which are arranged on the Mini LED production line, through an automatic and precise production process, including key technologies such as SPI solder paste detection, double automatic optical detection, ultra-precise intelligent solder paste printing and nanoscale positioning die bonding, the production quality and efficiency of the MiniLED chip are remarkably improved, and the high qualified rate of products is ensured; through the synergistic effect of the optical detection module and the intelligent analysis module, the defects of the MiniLED chip are recognized and positioned, the efficient positioning and removing module is combined, defective products can be removed in time, production interruption is avoided, meanwhile, the stability of the product quality is guaranteed through bonding pad cleaning, activating treatment and re-detection procedures, and follow-up tracking management is facilitated.

A solder composition includes a solder paste including a tin (Sn)-bismuth (Bi) alloy and / or a tin (Sn)-silver (Ag)-copper (Cu) alloy and a plurality of nanoparticles dispersed in the solder paste, wherein each of the nanoparticles includes a core that is spherical, the core includes a metal oxide, and the metal oxide has a density of 7 g / cm3 or more and a melting point of 2000° C. or higher.

Some embodiments of the present disclosure relate to lead-free solder pastes with mixed solder powders, which are particularly suitable for high temperature soldering applications involving multi-board reflow operations. In one embodiment, the solder paste is composed of: 10 wt% to 90 wt% of a first solder alloy powder, the first solder alloy powder consisting of a SnSbCuAg solder alloy having a Sn:Sb wt% ratio of 0.75 to 1.1; 10 wt% to 90 wt% of a second solder alloy powder, the second solder alloy powder consisting of a Sn solder alloy including at least 80 wt% Sn; and a balance of flux.

The invention relates to the technical field of semiconductor chip mounting equipment, in particular to a solder paste printing mechanism applied to a semiconductor die bonder and clamping and welding equipment, which comprises a jacking assembly, and the jacking assembly is responsible for jacking a lead frame to a certain height from a chip passing track mechanism; the printing assembly is responsible for completing the solder paste printing action on the jacked lead frame; through cooperation of the jacking assembly and the printing assembly, the jacking assembly is responsible for jacking the lead frame to a certain height from the inside of the sheet passing track mechanism, the printing assembly is responsible for completing the solder paste printing action on the jacked lead frame, and after the printing is completed, the lead frame is printed on the sheet passing track mechanism. The lead frame is lowered into the sheet passing track through the jacking assembly and is clamped and conveyed to the next working procedure through the clamping jaw, the precision of UPH and tin paste points on the lead frame is effectively improved, meanwhile, the device can be used for tin paste printing and can also be used for printing of conductive adhesive or silver paste, and the universality of the device is improved.