224 results about "Reflow oven" patented technology

The invention discloses a welding device and method for a microwave chip packaging device, relates to the technical field of microwave chip welding, and aims to solve the technical problem that the quality of a welding point is affected as the temperature of the bottom of a circuit board is inconsistent with that of the top of the circuit board due to the fact that the circuit board is easily affected by the temperature of a conveying track. The reflow soldering furnace body comprises a conveying mechanism, the conveying mechanism comprises a conveying belt, a fixed side plate is arranged on the side of the conveying belt, multiple sets of device bearing frames are arranged on the conveying belt, a forward guide plate and a reverse guide plate are arranged on the side wall of the fixed side plate, and each set of device bearing frame is composed of a front frame and a rear frame. The front frame comprises a first lifting positioning frame and a plurality of clamping assemblies. The device has the advantages that it can be guaranteed that the position of the circuit board in the reflow soldering furnace is stable, the circuit board body is lifted and kept above the conveying belt, it is guaranteed that all angles of the circuit board body are evenly heated, and the soldering quality is improved.

The invention relates to the technical field of circuit board conveying devices, and particularly discloses a controller circuit board feeding device which comprises a reflow soldering furnace, two conveying assemblies and a limiting mechanism, each conveying assembly comprises two first conveying belts rotating reversely, and the two conveying assemblies are installed in the reflow soldering furnace and at the front end of the reflow soldering furnace correspondingly; the limiting mechanism comprises a plurality of limiting plates, the multiple limiting plates are evenly installed on the peripheral side of the first conveying belt in an oval ring shape, each limiting plate comprises a clamping part and a supporting part, the clamping parts are prepared and formed by elastic materials, and in the initial state, the supporting parts are arranged on the supporting parts. The clamping part inclines in the direction away from the first conveying belt from top to bottom. The supporting part is horizontally connected to the lower end of the clamping part. Through cooperation of the first conveying belt and the limiting plate, clamping and automatic conveying of the circuit board are achieved, the stability of the circuit board is ensured, displacement of elements is avoided, and the welding quality is ensured.

The invention discloses a computer mainboard welding temperature correction control method based on machine learning, which relates to the technical field of intelligent control, and comprises the following steps: predicting a reference welding temperature curve by using a machine learning model based on historical operation data of reflow welding of a computer mainboard; dividing a thermal management area based on the thermal characteristics of the component; determining an optimal welding temperature curve; on the basis of the divided heat management areas, regionalization adjustment is conducted on the optimal welding temperature curve, and temperature area parameter fine adjustment strategies for the different heat management areas are generated; and based on the optimal welding temperature curve and the fine adjustment strategy, a final temperature control instruction set is synthesized, and the reflow soldering furnace is controlled for batch production. The method has the advantages that through fusion of machine learning and real-time data driving optimization, on the premise that the welding reliability is guaranteed, the production efficiency and energy consumption are intelligently balanced, and the adaptability and the intelligent level of a production line are remarkably improved.

The present application discloses an oxygen concentration detection system for detecting the oxygen concentration in a furnace chamber of a reflow oven, comprising: a cooling device, a filter device, and a detection device. The oxygen concentration detection system of the present application utilizes a semiconductor cooler to condense sample gas within the furnace chamber, thereby removing most of the VOC contaminants in the sample gas. Subsequently, by employing activated carbon adsorption filtration, all contaminants in the gas are basically eliminated, resulting in a more accurate detection result from the detection device. Furthermore, due to the rapid cooling capabilities of the semiconductor cooler and the relatively short sample gas flow distance, the oxygen concentration detection system of the present application is also capable of reducing the required detection time, enabling more timely detection from the detection device. Therefore, the oxygen concentration detection system of the present application is capable of timely and accurately detecting the oxygen concentration in a gas within a reflow oven furnace chamber and adjusting the oxygen content therein according to the detection result, thereby enhancing the soldering quality.

The utility model discloses a conveying device. And the conveying equipment is used for conveying the circuit board assemblies processed by the plurality of chip mounters to the reflow oven for processing. The conveying equipment comprises a case, a conveying device and a driving assembly. A feeding port and a discharging port are formed in the two opposite side walls of the machine box correspondingly. The conveying device is arranged in the machine box, and the circuit board assembly is conveyed to the conveying device through the feeding port and conveyed to the reflow oven through the discharging port. The driving assembly is arranged in the machine box and connected with the conveying device. The driving assembly is configured to drive the conveying device to move between the feeding port and the discharging port in the first direction of the machine box. According to the conveying equipment, the circuit board assembly is conveyed to the conveying device through the feeding port, and the driving assembly can drive the conveying device to move between the feeding port and the discharging port in the first direction of the machine box, so that the conveying device can convey the circuit board assembly to the discharging port, and then the circuit board assembly can be conveyed to a reflow oven through the discharging port to be machined; labor cost is saved, and production efficiency is improved.

The invention belongs to the technical field of brazing, and particularly relates to a contact-shaped composite brazing filler metal and a preparation method and application thereof.The preparation method comprises the steps that a sheet made of a material A is obtained; stamping the sheet by using a stamping die so that the surface of the sheet is bent to form a plurality of trapezoidal grooves to obtain a honeycomb array structure sheet; solder paste is sprayed and printed in the trapezoidal grooves of the honeycomb array structure sheets, and the solder paste comprises brazing filler metal B and scaling powder; the honeycomb-shaped array structure sheet sprayed with the soldering paste is put into a reflow oven to be heated, the brazing filler metal B in each trapezoid-shaped groove is melted to form a protruding contact, and a contact-shaped composite brazing filler metal sheet is obtained; wherein the scaling powder is separated out in the heating process and flows to cover the outer surface of the contact-shaped composite brazing filler metal sheet; the high-strength composite welding spot can be prepared, and the characteristics of low-temperature welding and high-temperature application are achieved.

The invention provides a temperature monitoring method of a reflow soldering furnace, electronic equipment and a storage medium. The method comprises the following steps: acquiring a standard furnace temperature curve of the reflow soldering furnace; acquiring a plurality of historical furnace temperature curves of the reflow soldering furnace, wherein the historical furnace temperature curves comprise furnace temperature curves when the reflow soldering furnace is used for processing to obtain normal products; determining a similarity threshold value between the standard furnace temperature curve and the plurality of historical furnace temperature curves; and the similarity between the real-time furnace temperature curve and the standard furnace temperature curve is determined, and if the similarity is smaller than the similarity threshold value, it is determined that the furnace temperature of the reflow oven is abnormal. The method can assist in monitoring the temperature of the reflow soldering furnace, and improves the temperature monitoring accuracy of the reflow soldering furnace.

The invention discloses a circuit board manufacturing method, a circuit board, electronic equipment and a circuit board production line. The circuit board manufacturing method comprises the following steps: mounting a soldering lug in a to-be-mounted chip area of a PCB (Printed Circuit Board); mounting a chip in the to-be-mounted chip area where the soldering lug is mounted; the PCB is arranged in the jig, and the chip is pressed and held; and feeding the jig provided with the PCB into a reflow oven so as to carry out reflow soldering on the PCB. According to the technical scheme provided by the invention, the stability of the chip mounted on the PCB is effectively improved, defective products of insufficient soldering or tin connection of the chip are greatly reduced, and the yield is improved.

The invention discloses a PCB reflow soldering temperature field prediction method and device and computing equipment. The method comprises the following steps: acquiring the temperature and environmental parameters of a key position of a PCB in a reflow oven to obtain real-time data; constructing a mechanism model according to the real-time data; solving the mechanism model to obtain a prediction result; and outputting a prediction result. By implementing the method provided by the invention, efficient prediction and optimization of the temperature field in the PCB reflow soldering process can be realized, and the efficiency and accuracy of soldering quality control are improved.

The invention discloses a Kovar process of a 3DDPC metal tube shell. The Kovar process is characterized by comprising the following steps: completing circuit metal copper processing of a bottom plate; electroplating processing is carried out on the metal copper of the bottom plate, and thickening processing is carried out on a metal area used for signal transmission wiring; after the bottom plate and the thickened area are electroplated, the bottom plate is subjected to film removal and bottom layer etching treatment; an enclosure frame is manufactured, and an inner cavity of the enclosure frame is removed in a laser cutting mode; electroplating the enclosure frame, wherein the total plate thickness of the enclosure frame is equal to or slightly higher than the thickened height of the bottom plate; and cutting the electroplated enclosure frame into single pieces, fixing the single pieces on a bottom plate in an aligned manner by using gold-tin solder, and putting the single pieces into a reflow soldering furnace to complete welding to obtain the metal tube shell. The method has the beneficial effects that Kovar process development of the metal tube shell is achieved, 300 DEG C high-temperature welding is carried out under the Kovar process condition, the stress between the bottom plate and the enclosure frame is low, and the problem that the reliability of the metal tube shell is poor is solved.

The present invention discloses a heating device for a continuous vacuum reflow soldering furnace, belonging to the field of semiconductor processing, aiming to solve the problem of thermal efficiency during the heating of the soldering furnace. The key technical points of its technical solution are as follows: It includes an upper heating furnace body assembly arranged on a frame and a lower heating plate assembly arranged on the frame. The lower heating plate assembly is located below the upper heating furnace body assembly. The upper heating furnace body assembly includes a top seat, a top cover is fixed to the bottom of the top seat, a homogenizing impeller is rotatably connected in the top cover, a servo motor for driving the homogenizing impeller is fixed on the top seat. The bottom of the top cover is connected to a bottom cover through two vertical covers. A top heating plate is arranged in the bottom cover, and a horizontal cross-flow suppression structure for suppressing horizontal cross-flow is arranged in the bottom cover. The heating device of the continuous vacuum reflow soldering furnace has a good effect of suppressing cross-flow, can ensure that the hot air flow maintains a vertical flow state as much as possible, and can improve the heating efficiency.

The utility model discloses a reflow soldering furnace for producing electronic circuit boards, and relates to the technical field of producing electronic circuit boards. The reflow soldering furnace for producing electronic circuit boards comprises a reflow soldering furnace body, a controller body is fixedly mounted on the surface of the reflow soldering furnace body, a fixed protective frame is fixedly mounted on the surface of the reflow soldering furnace body, the fixed protective frame is located outside the controller body, the fixed protective frame is rotatably connected to a rotating shaft inside, a protective cover is fixedly sleeved on the rotating shaft, the protective cover is pushed to drive the rotating shaft to rotate, and then the pawl is continuously meshed with the ratchet on the ratchet, thereby fixing the rotating shaft and the protective cover, making it easy to open or close the protective cover, improving the convenience of opening or closing the protective cover, minimizing the difficulty of closing and opening the protective cover, and facilitating operation by users.

The utility model relates to the technical field of soldering tin reflow furnaces, in particular to a soldering tin reflow furnace for electronic component production. According to the technical scheme, the furnace comprises a furnace body, chain wheel rollers, chains, bases, a first motor and a second motor, the bases are symmetrically distributed in the furnace body, the chain wheel rollers distributed at equal intervals are rotationally installed at the upper ends of the bases, the outer walls of the chain wheel rollers are sleeved with the chains, and multiple sets of clamping blocks symmetrically distributed are arranged on the outer sides of the chains; a first motor is arranged on one side of the furnace body, the output end of the first motor is provided with a screw, outer wall threads of the screw are oppositely distributed, the outer wall threads of the screw are sleeved with nuts which are symmetrically distributed and connected with the base, and a second motor is arranged on one side of the furnace body, and the output end of the second motor is connected with the upper end of the chain wheel roller. According to the utility model, through the two groups of chain wheel rollers with adjustable spacing, the clamping and conveying of circuit boards with different specifications are adapted, the welding processing of the circuit boards with different specifications and electronic components is coped, and the use flexibility of the soldering reflow oven is improved.

The invention relates to a circuit board processing method, in particular to a manufacturing method for improving foaming and layering of an electromagnetic shielding film, which comprises the following steps of: after the circuit board is pretreated, pasting a protective film on the surface of the circuit board, and baking the protective film, so that the protective film is cured on the surface of the circuit board; a filler is arranged with the through hole of the circuit board as the center, and the filler is pre-baked; the pre-baked filler is exposed and developed, so that the filler is only reserved in a preset range with the through hole as the center; an electromagnetic shielding film is arranged on the surface of the circuit board, the electromagnetic shielding film covers at least part of the protective film and all the filler, and post-baking is conducted on the filler; and post-processing the circuit board. According to the method provided by the invention, the filler is arranged in the through hole of the circuit board before the electromagnetic shielding film is pasted, so that the bad defect of bubble layering of the electromagnetic shielding film in the subsequent process of reflow oven and the like is avoided.

The application discloses a fuse tinning device and method, wherein the fuse tinning device comprises a fuse melting substrate placing rack for placing a fuse melting substrate; a tin strip placing rack for placing a tin strip; the tin strip placing rack is arranged above the fuse melting substrate placing rack; a flux pool for storing flux; a flux roller is further arranged above the flux pool, and the flux roller applies flux to one side of the tin strip which faces the fuse melting substrate when the tin strip passes through the surface of the flux roller; a pressing roller is further arranged behind the flux pool, and the pressing roller presses the tin strip coated with flux and the fuse melting substrate; a reflow oven is further arranged behind the pressing roller, and the reflow oven fuses the tin strip and the fuse melting substrate by adjusting temperature; and a winding device is further arranged behind the reflow oven, and the winding device winds the tin strip and the fuse melting substrate after fusion.

The invention provides an optical inspection machine for a carrier plate in a carrier and an inspection method. The optical inspection machine is characterized in that a flow channel is connected to a movable end of an X-Y transplanting device; the X-Y transplanting driving flow channel moves in the X direction and the Y direction on the horizontal plane; the Y transplanting fixed end is arranged on the rack; the X transplanting fixed end is arranged above the Y transplanting movable end, and the X transplanting movable end can move in the X-axis direction of the horizontal plane; the conveying flow channel is installed at the movable end of the X transplanting part and driven by the X transplanting part and the Y transplanting part to move in the horizontal direction, and the vacuum adsorption jacking mechanism, the Y-direction arraying mechanism, the X-direction arraying mechanism and the stopping mechanism are all installed on the conveying flow channel. A product is accommodated in the carrier and is adsorbed and positioned by the vacuum adsorption jacking mechanism; the Y-direction arraying mechanism and the X-direction arraying mechanism are arranged on the two sides of the vacuum adsorption jacking mechanism in the vertical direction. And the stopping mechanism is mounted in front of the product inlet side of the conveying runner. According to the invention, the AOI visual inspection effect can be completed in front of the reflow oven under the condition that the carrier is not dismounted.

The hot air convection carrier of the chip reflow oven comprises a rectangular body, and carrier fixing holes are formed in the two ends of the body respectively so that the carrier can be positioned on a conveying chain. A sunken groove is formed between the two carrier fixing holes, a plurality of chip fixing positions which are arranged side by side are arranged in the sunken groove, a transversely-arranged chip bearing table is arranged in the middle of each chip fixing position, and air holes allowing airflow to pass through are formed in the two sides of each chip bearing table; the sum of the areas of the two air holes is more than five times of the area of the chip bearing table, upper supporting protrusions are arranged on the two sides of the air hole in the upper end respectively, and lower supporting protrusions are arranged on the two sides of the air hole in the lower end respectively. According to the hot air convection carrier of the chip reflow oven, the chip can be supported, the surfaces of the two sides of the chip can bear the effect of hot air, and therefore the convection effect of hot air flow on the surfaces of the two sides is achieved.

The present disclosure discloses a reflow oven for processing a circuit board, the reflow oven comprising a heating zone having a plurality of heating sub-zones, in which the plurality of heating devices are arranged in corresponding heating sub-zones of the plurality of heating sub-zones, and each of the plurality of heating devices is configured such that a working temperature of the corresponding heating sub-zone is in a predetermined temperature interval; a start-stop device configured to activate or deactivate the plurality of heating devices, and configured to activate and deactivate the plurality of heating devices according to predetermined time intervals in a process during which the circuit board sequentially passes through the plurality of heating sub-zones, such that a working temperature of each of the plurality of heating sub-zones is in a corresponding predetermined temperature interval.

The utility model discloses a ceramic light source blanking device which comprises a jig box arranged on a table top and placed on the side face of a belt track part. The tail end of the belt track part is symmetrically provided with needle inserting belt tracks, and the needle inserting belt tracks are connected with a pushing discharging part; the other side face, symmetrical to the jig box, of the belt track part is provided with a jig clamping jaw part, the jig clamping jaw part comprises a Z-direction module and a Y-direction module which are sequentially connected, and the Z-direction module is connected with a clamping jaw. The stable movement of the ceramic light source inserted with the PINs between the two conveying belts and the jig box is realized, and the ceramic light source is prevented from being damaged; the ceramic light source is rapidly and stably moved into the reflow soldering furnace, multiple workpieces are discharged at the same time, the efficiency is improved, and the product quality is guaranteed.

The utility model provides an LED substrate and a reflow oven using the same, the LED substrate comprises a substrate body, the top of the substrate body is provided with a plurality of pedestals used for attaching LED lamp beads and glue containing grooves arranged around the pedestals, the pedestals are provided with power supply terminals used for electrically connecting the LED lamp beads and notches used for prying the LED lamp beads, and the power supply terminals are connected with the power supply terminals. A power terminal is arranged on the substrate body, notches are formed in the two sides of the power terminal, one end of the substrate body is provided with a socket structure which is electrically connected with the power terminal and used for being connected with a power source, a cover plate is movably arranged at the top of the substrate body, a plurality of first grooves corresponding to the bases are formed in the cover plate, and bottom frames matched with the glue containing grooves are arranged at the bottoms of the first grooves. The hollowed-out part of the bottom frame is matched with the base, prying structures used for prying the LED lamp beads are hinged to the two sides, close to the notch, of the first groove, and the prying structures are movably arranged in the notch.

The invention discloses a tin soldering and glue dispensing integrated device for inductance pins, and relates to the technical field of robots, the tin soldering and glue dispensing integrated device comprises a reflow soldering furnace, a circuit board and a glue dispenser, and a combined flow guide structure is arranged between the glue dispenser and the reflow soldering furnace; the combined flow guide structure comprises a metal box arranged at the bottom of the dispenser, two first water guide connectors fixedly communicated with one side of the metal box, a mechanical arm installed on one side of the reflow soldering furnace, an eighth supporting frame supported by the mechanical arm, a metal pipe rotationally arranged on the eighth supporting frame in a penetrating mode and two flow dividing containers communicated with one end of the metal pipe. A waste gas pipe, a mechanical arm, a combined flow guide structure, an eighth supporting frame, a metal pipe, two flow dividing containers, a second forward and reverse motor and other structures are arranged on the outer side of the reflow soldering furnace, inductance pin welding and dispensing of a circuit board are integrally carried out, the circuit board does not need to be clamped, transported and positioned many times, the processing period of the circuit board is shortened, and the processing and production speed of the circuit board is increased.

This invention relates to a predictive maintenance method for power module packaging reflow oven equipment, comprising: collecting multi-physics operating status data of the reflow oven; aligning the multi-physics operating status data with quality inspection data in a manufacturing execution system in a time series, and classifying and labeling product quality based on a fuzzy membership function to construct training samples; extracting features from the multi-physics operating status data, filtering the extracted features in conjunction with an equipment physical degradation model, and constructing a degradation feature vector; inputting the degradation feature vector into a multi-level diagnostic model for processing, and outputting fault warning information and process compensation parameters; determining the equipment health level based on the fault warning information, and executing a corresponding graded response strategy based on the equipment health level. This method enables predictive maintenance of the reflow oven through multi-physics fusion monitoring, dual-drive diagnosis, and closed-loop linkage.

To provide a production system capable of effectively utilizing an idle time which is generated in an entire production line of a mounting substrate due to a difference in work time of work devices constituting the production line.SOLUTION: A production system comprises: a production line in which a plurality of work devices including a printing machine, a mounting machine, a reflow furnace, and an inspection machine is disposed; and a management apparatus. The management apparatus performs: acquisition processing of acquiring a standard work time of each of the plurality of work devices when producing one mounting substrate; extraction processing of extracting a specific work device of a longest work time that is longest in a standard work time; and work setting processing of setting an operation mode of the work devices other than the specific work device to a power saving mode in which power consumption can be reduced more than a standard mode or a high accuracy mode in which work accuracy can be improved more than the standard mode within such a range that the work time does not exceed the longest work time.SELECTED DRAWING: Figure 4

The invention provides a reflow soldering temperature control method and system, and is suitable for the technical field of data processing. The method comprises the following steps: according to industrial wireless frequency band information, temperature control signal retransmission frequency information, a temperature control information retransmission frequency threshold value, furnace temperature, reflow soldering temperature control node position information, temperature information in a reflow soldering furnace and wireless signal interference intensity information in the reflow soldering furnace, controlling the temperature of the reflow soldering furnace; generating target industrial wireless frequency information, target industrial wireless signal transmitting power information and target temperature control signal retransmission time information; and according to the target industrial wireless frequency information, the target industrial wireless signal transmitting power information and the target temperature control signal retransmission frequency information, transmitting the reflow soldering temperature control signal so as to perform reflow soldering temperature control through the reflow soldering temperature control signal. The packet loss rate and transmission delay of the temperature control signal in the high-temperature strong-interference environment are reduced, and efficient transmission of the temperature control instruction is guaranteed.

Provided is a reflow soldering discharging device. Relates to semiconductor processing equipment. The head end of the first belt conveyor is arranged at a discharge port of the reflow oven; the second belt conveyor is arranged at the tail end of the first belt conveyor; the ejection linear driving mechanism and the cylinder body are vertically and fixedly arranged on the rack; the lifting seat is detachably and fixedly arranged at the top end of a piston rod of the ejection linear driving mechanism through a supporting frame; the lifting base is of an L-shaped structure, and an opening faces the feeding direction. And the multiple material turning plates are arranged in the lifting base in a turnover mode, and horizontal materials are arranged in a vertical state through turnover of the material turning plates. The device has the advantages that the structure is exquisite, and the copper frame and batch number plate conveying and overturning efficiency is improved.

The utility model relates to the technical field of reflow soldering furnaces, and discloses a reflow soldering furnace cleaning device which comprises a reflow soldering furnace body, the top of the reflow soldering furnace body is fixedly connected with a gas collecting box, the front face of the reflow soldering furnace body is fixedly connected with a filtering box, and the inner surface of the reflow soldering furnace body is provided with a conveying belt. A first scraping block is movably connected to one side of the conveying belt, a second scraping block is movably connected to one side of the first scraping block, a fixing plate is fixedly connected to supporting legs at the bottom of the conveying belt, a transmission shaft is movably connected to the inner surface of the fixing plate, and a connecting plate is fixedly connected to the front face of the fixing plate. A motor is fixedly connected to the other side of the connecting plate, a second scraping block is made to move left and right on the conveying belt, the surface of the conveying belt can be covered more comprehensively through left-right movement of the second scraping block, various impurities and residues are effectively removed, and the cleaning efficiency and quality are improved.

The present disclosure discloses a transport device and a reflow oven comprising the same. The transport device includes a first rail device. The first rail device includes a first guide rail and a first conveying belt. The first conveying belt includes a chain and a plurality of support bars, with the plurality of support bars arranged in a length direction, and each of the support bars rotatably connected to the chain, where each of the support bars is rotatable to a first state and a second state, and a distance from the top of the support bar in the second state to the chain is less than that from the top of the support bar in the first state to the chain. The support bars in the first state can support an element to be processed, and the support bars in the second state do not support the element to be processed, thereby reducing the occupied space. With the arrangement of the rotatable support bars, the first conveying belt of the first rail device can always travel in the length direction, enabling a lifting function of the support bars, without the need to move the position of the first conveying belt.

The invention relates to the technical field of semiconductor integrated circuit manufacturing, in particular to a method for solving the ball height of double-sided packaging ball mounting, which comprises the following steps of: S1, mounting a component and a chip on the upper surface of a carrier plate, mounting a functional device on the lower surface of the carrier plate, and performing ball mounting on the lower surface of the carrier plate to form tin balls which are arranged in order; s2, carrying out epoxy resin plastic package on the upper and lower surfaces of the carrier plate, wherein the epoxy resin is cured into an upper plastic package body and a lower plastic package body; s3, grinding the lower plastic package body through a grinding part to expose a circular planar solder ball flush with the surface of the lower plastic package body, performing laser on the periphery of the solder ball through a laser punching part, eliminating the lower plastic package body around the solder ball, and exposing a hemispherical solder ball; and S4, the carrier plate after laser processing is sent into a reflow oven, the hemispherical solder balls are reshaped to be spherical through the high temperature condition in the reflow oven, the height of the solder balls is set by controlling the width of the retaining walls between the solder balls, the requirement for the height of the balls is met without secondary ball mounting, and the packaging operation process is reduced.

The utility model discloses a PCB board guiding correction connection device, comprising a cabinet, a transmission mechanism and a cooling mechanism, the cabinet is provided with a controller, the transmission mechanism is installed on the cabinet and is located at a side portion of the controller, the transmission mechanism is provided with a correction stop lever, the cooling mechanism is erected at a top portion of the transmission mechanism, and the cooling mechanism is arranged at a bottom portion of the transmission mechanism. The controller is in control connection with the transmission mechanism and the cooling mechanism, and a plate receiving mechanism is further arranged on one side of the transmission mechanism. According to the guiding, correcting and connecting equipment for the PCBs, the board connecting mechanism on one side of the transmission mechanism is connected with the reflow soldering furnace, the reflow soldering furnace conveys the PCBs to the transmission mechanism through the board connecting mechanism, the PCBs are sequentially conveyed by the transmission mechanism, and when the PCBs deviate in the conveying process, the PCBs are conveyed to the reflow soldering furnace through the board connecting mechanism. When the PCB is conveyed, the correction stop levers on the transmission mechanism can stop the corners of the PCB, so that the PCB is rotated to realize guiding correction of the PCB, the PCB can be smoothly conveyed through guiding correction, and the production efficiency of the PCB is further ensured.

This invention relates to a vacuum reflow oven feeding device applied in the field of reflow oven technology. It includes a tray conveying mechanism, a product conveying mechanism, a stacking and feeding mechanism, a tray stacking box, a feeding tray, a product stacking box, workpieces to be produced, and a product stacking robot, all fixedly installed on the top of the machine body. The tray conveying mechanism and the product conveying mechanism push the tray stacking box and the product stacking box, where the feeding tray and workpieces to be produced are stacked in an orderly manner, achieving batch feeding and conveying of the feeding tray and workpieces to be produced, effectively reducing the workload of feeding. The product stacking robot then grabs the workpieces to be produced and places them orderly into the feeding tray. Finally, the feeding tray is pushed into the vacuum reflow oven. The feeding process is fully automatic, effectively avoiding safety accidents caused by manual feeding and significantly improving feeding efficiency.