91 results about "Reflow oven" patented technology

The invention discloses a computer mainboard welding temperature correction control method based on machine learning, which relates to the technical field of intelligent control, and comprises the following steps: predicting a reference welding temperature curve by using a machine learning model based on historical operation data of reflow welding of a computer mainboard; dividing a thermal management area based on the thermal characteristics of the component; determining an optimal welding temperature curve; on the basis of the divided heat management areas, regionalization adjustment is conducted on the optimal welding temperature curve, and temperature area parameter fine adjustment strategies for the different heat management areas are generated; and based on the optimal welding temperature curve and the fine adjustment strategy, a final temperature control instruction set is synthesized, and the reflow soldering furnace is controlled for batch production. The method has the advantages that through fusion of machine learning and real-time data driving optimization, on the premise that the welding reliability is guaranteed, the production efficiency and energy consumption are intelligently balanced, and the adaptability and the intelligent level of a production line are remarkably improved.

The present application discloses an oxygen concentration detection system for detecting the oxygen concentration in a furnace chamber of a reflow oven, comprising: a cooling device, a filter device, and a detection device. The oxygen concentration detection system of the present application utilizes a semiconductor cooler to condense sample gas within the furnace chamber, thereby removing most of the VOC contaminants in the sample gas. Subsequently, by employing activated carbon adsorption filtration, all contaminants in the gas are basically eliminated, resulting in a more accurate detection result from the detection device. Furthermore, due to the rapid cooling capabilities of the semiconductor cooler and the relatively short sample gas flow distance, the oxygen concentration detection system of the present application is also capable of reducing the required detection time, enabling more timely detection from the detection device. Therefore, the oxygen concentration detection system of the present application is capable of timely and accurately detecting the oxygen concentration in a gas within a reflow oven furnace chamber and adjusting the oxygen content therein according to the detection result, thereby enhancing the soldering quality.

The invention belongs to the technical field of brazing, and particularly relates to a contact-shaped composite brazing filler metal and a preparation method and application thereof.The preparation method comprises the steps that a sheet made of a material A is obtained; stamping the sheet by using a stamping die so that the surface of the sheet is bent to form a plurality of trapezoidal grooves to obtain a honeycomb array structure sheet; solder paste is sprayed and printed in the trapezoidal grooves of the honeycomb array structure sheets, and the solder paste comprises brazing filler metal B and scaling powder; the honeycomb-shaped array structure sheet sprayed with the soldering paste is put into a reflow oven to be heated, the brazing filler metal B in each trapezoid-shaped groove is melted to form a protruding contact, and a contact-shaped composite brazing filler metal sheet is obtained; wherein the scaling powder is separated out in the heating process and flows to cover the outer surface of the contact-shaped composite brazing filler metal sheet; the high-strength composite welding spot can be prepared, and the characteristics of low-temperature welding and high-temperature application are achieved.

The utility model relates to the technical field of soldering tin reflow furnaces, in particular to a soldering tin reflow furnace for electronic component production. According to the technical scheme, the furnace comprises a furnace body, chain wheel rollers, chains, bases, a first motor and a second motor, the bases are symmetrically distributed in the furnace body, the chain wheel rollers distributed at equal intervals are rotationally installed at the upper ends of the bases, the outer walls of the chain wheel rollers are sleeved with the chains, and multiple sets of clamping blocks symmetrically distributed are arranged on the outer sides of the chains; a first motor is arranged on one side of the furnace body, the output end of the first motor is provided with a screw, outer wall threads of the screw are oppositely distributed, the outer wall threads of the screw are sleeved with nuts which are symmetrically distributed and connected with the base, and a second motor is arranged on one side of the furnace body, and the output end of the second motor is connected with the upper end of the chain wheel roller. According to the utility model, through the two groups of chain wheel rollers with adjustable spacing, the clamping and conveying of circuit boards with different specifications are adapted, the welding processing of the circuit boards with different specifications and electronic components is coped, and the use flexibility of the soldering reflow oven is improved.

The application discloses a fuse tinning device and method, wherein the fuse tinning device comprises a fuse melting substrate placing rack for placing a fuse melting substrate; a tin strip placing rack for placing a tin strip; the tin strip placing rack is arranged above the fuse melting substrate placing rack; a flux pool for storing flux; a flux roller is further arranged above the flux pool, and the flux roller applies flux to one side of the tin strip which faces the fuse melting substrate when the tin strip passes through the surface of the flux roller; a pressing roller is further arranged behind the flux pool, and the pressing roller presses the tin strip coated with flux and the fuse melting substrate; a reflow oven is further arranged behind the pressing roller, and the reflow oven fuses the tin strip and the fuse melting substrate by adjusting temperature; and a winding device is further arranged behind the reflow oven, and the winding device winds the tin strip and the fuse melting substrate after fusion.

The present disclosure discloses a reflow oven for processing a circuit board, the reflow oven comprising a heating zone having a plurality of heating sub-zones, in which the plurality of heating devices are arranged in corresponding heating sub-zones of the plurality of heating sub-zones, and each of the plurality of heating devices is configured such that a working temperature of the corresponding heating sub-zone is in a predetermined temperature interval; a start-stop device configured to activate or deactivate the plurality of heating devices, and configured to activate and deactivate the plurality of heating devices according to predetermined time intervals in a process during which the circuit board sequentially passes through the plurality of heating sub-zones, such that a working temperature of each of the plurality of heating sub-zones is in a corresponding predetermined temperature interval.

This invention relates to a predictive maintenance method for power module packaging reflow oven equipment, comprising: collecting multi-physics operating status data of the reflow oven; aligning the multi-physics operating status data with quality inspection data in a manufacturing execution system in a time series, and classifying and labeling product quality based on a fuzzy membership function to construct training samples; extracting features from the multi-physics operating status data, filtering the extracted features in conjunction with an equipment physical degradation model, and constructing a degradation feature vector; inputting the degradation feature vector into a multi-level diagnostic model for processing, and outputting fault warning information and process compensation parameters; determining the equipment health level based on the fault warning information, and executing a corresponding graded response strategy based on the equipment health level. This method enables predictive maintenance of the reflow oven through multi-physics fusion monitoring, dual-drive diagnosis, and closed-loop linkage.

This invention relates to a vacuum reflow oven feeding device applied in the field of reflow oven technology. It includes a tray conveying mechanism, a product conveying mechanism, a stacking and feeding mechanism, a tray stacking box, a feeding tray, a product stacking box, workpieces to be produced, and a product stacking robot, all fixedly installed on the top of the machine body. The tray conveying mechanism and the product conveying mechanism push the tray stacking box and the product stacking box, where the feeding tray and workpieces to be produced are stacked in an orderly manner, achieving batch feeding and conveying of the feeding tray and workpieces to be produced, effectively reducing the workload of feeding. The product stacking robot then grabs the workpieces to be produced and places them orderly into the feeding tray. Finally, the feeding tray is pushed into the vacuum reflow oven. The feeding process is fully automatic, effectively avoiding safety accidents caused by manual feeding and significantly improving feeding efficiency.

This invention discloses a high-efficiency reflow oven and its process, including a base and a top seat fixedly installed on the base. The top seat is equipped with a hot air mechanism and further includes: a heating mechanism, which is installed on the base and includes a delivery platform, which is rotatably installed inside the base; and a feeding mechanism, which is installed on one side of the base. When the delivery platform approaches the feeding mechanism, the feeding mechanism can passively feed the material on it onto the delivery platform and automatically avoid it. This application places the material on the delivery platform, and driven by a servo motor, the delivery platform first rises to approach the highest temperature position at the top, and then descends, so that the material on it first heats up and then reaches the highest temperature position. After welding, it descends again to cool down. The heating mechanism greatly reduces the footprint of the entire system, thereby improving the utilization rate of space in the factory area.

Provided is a soldering device that enables savings in installation space and energy consumption, and also enables a reduction in costs related to manufacturing and installation. The soldering device comprises a heat pipe type cooler 22 that cools air in a cooling portion 21 of a reflow furnace 20 and that comprises a tubular heat pipe main body 22a accommodating a working fluid, wherein the heat pipe main body 22a comprises: a heat absorbing portion 22a1 which is positioned inside the reflow furnace 20, in the cooling portion 21 of the reflow furnace 20, and which absorbs heat from air in the cooling portion 21; and a heat dissipating portion 22a2 which is positioned outside the reflow furnace 20, in the cooling portion 21 of the reflow furnace 20, and which dissipates the heat absorbed from the air in the cooling portion 21 to the air outside the reflow furnace 20.

The application belongs to the technical field of brazing, and particularly relates to a contact-shaped composite brazing filler metal and a preparation method and application thereof. The preparation method comprises the following steps: obtaining a sheet made of material A; stamping the sheet by using a stamping die to make the surface of the sheet bent to form a plurality of trapezoidal grooves, so that a honeycomb array structure sheet is obtained; spraying solder paste in the trapezoidal grooves of the honeycomb array structure sheet, wherein the solder paste comprises brazing filler metal B and a flux; and placing the honeycomb array structure sheet with the sprayed solder paste into a reflow oven for heating, so that the brazing filler metal B in each trapezoidal groove is melted to form a protruding contact, and a contact-shaped composite brazing filler metal sheet is obtained. In the heating process, the flux is separated out and flows to cover the outer surface of the contact-shaped composite brazing filler metal sheet. The application can realize preparation of a high-strength composite welding point, and has the characteristics of low-temperature welding and high-temperature application.

The utility model provides a fast cooling reflow soldering furnace, which comprises a furnace body, a transmission mesh belt, an upper heating device, a lower heating device and a first cooling device are arranged in the furnace body, a feed port and a discharge port are respectively arranged at two ends of the furnace body, the transmission mesh belt extends from the feed port to the discharge port, the upper heating device is arranged on the upper side of the transmission mesh belt, and the lower heating device is arranged on the lower side of the transmission mesh belt. The lower heating device is arranged on the lower side of the conveying mesh belt. The first cooling device is arranged on the side, close to the discharging port, of the upper heating device and arranged on the upper side of the conveying mesh belt. The first cooling device comprises a cooling box body, a condenser is arranged in the cooling box body, an air outlet hole is formed in the lower side of the cooling box body, and a fan is connected to the top of the cooling box body. According to the utility model, the circuit board is rapidly cooled, welding spots are rapidly solidified, internal stress is reduced, deformation of the circuit board is avoided, production efficiency is improved, and scalding caused by over-high temperature of the circuit board is avoided.

The utility model provides an integral type water -cooling heating platform and vacuum eutectic reflow soldering furnace thereof, include: the furnace body that has installed groove, heating unit, heating unit includes at least one heating pipe, heating pipe is uniformly arranged in the furnace body, heating pipe extends from the furnace body one side to opposite side, and the water -cooling platform that lies in the furnace body processing space, water -cooling platform includes water -cooling base plate and cover, water -cooling base plate surface distribution has the serpentine water -cooling channel, the cover is covered in serpentine water -cooling channel top, water -cooling base plate is connected with water inlet pipe and water outlet pipe, water inlet pipe and water outlet pipe are respectively with serpentine water -cooling channel both ends communication, and water inlet pipe and water outlet pipe are close to water -cooling base plate corner place setting, and water inlet pipe is located water -cooling base plate close to center place. Integral type water -cooling platform realizes the seamless connection of channel and platform through the friction stir welding, eliminates the gap thermal resistance of traditional indirect contact, significantly improves the heat exchange efficiency, satisfies the quick cooling demand.

The present application relates to the field of equipment for manufacturing printed circuit, and particularly relates to an automatic welding device for SMT printed iron shell parts, which comprises an assembling table and a reflow soldering furnace; the reflow soldering furnace comprises a placing table capable of reciprocating along the length direction of the reflow soldering furnace and used for placing a primary assembly or an assembled part; a smearing part capable of smearing solder paste on the primary assembly placed on the placing table is installed on the reflow soldering furnace; a transfer part capable of transferring the primary assembly or the assembled part placed on the assembling table to the placing table and transferring the primary assembly with the smearing solder paste placed on the placing table to the assembling table is arranged beside the assembling table; and a mounting part for mounting the iron shell part on the primary assembly with the smearing solder paste placed on the assembling table is also arranged beside the assembling table. The existing welding method has the problems of low welding precision and low efficiency, and the device provided by the present application has high welding precision and high efficiency.

The utility model relates to the technical field of furnace-passing jigs, and discloses an SMT wave soldering furnace-passing jig which comprises a base and a cover plate. Through grooves are evenly formed in the base, supporting plates are evenly arranged at the bottom of the base and arranged among the through grooves, side folded plates are arranged at the four corners of the base and are of a right-angle structure, fixing studs are arranged at the four corners of the base, the bottoms of the fixing studs are arranged to be stud bottoms, and the stud bottoms penetrate out of the bottom of the base. Mounting columns are arranged at the four corners of the bottom of the cover plate, the mounting columns are arranged in the side folded plates, column holes are formed in the mounting columns, screw grooves are formed in the fixing studs, the screw grooves correspond to the column holes in position, side baffles are arranged on the base, and clamping plates are arranged on the side baffles. According to the SMT wave-soldering furnace-passing jig provided by the utility model, the furnace-passing jig which is convenient to position, install, clamp and fix is realized.

A wave soldering machine includes a housing, a conveyor that is movable with respect to the housing, a preheat module positioned along the conveyor, and a curtain module positioned at an entrance of the housing, the curtain module including at least one curtain and a heating element. A curtain module for a wave soldering machine or a reflow oven includes at least one curtain and a heating element. A method of containing an inert gas around a conveyor in a tunnel of a wave soldering machine or a reflow oven. In some embodiments, the method includes providing a curtain module at an end of the tunnel, the curtain module including at least one curtain and at least one heating element; and controlling a temperature of the heating element.

The invention discloses a vacuum eutectic reflow soldering furnace with a pressure regulating system, which comprises a furnace body with an air inlet and an air outlet; the air inlet is connected with an air inlet pipeline, and an air inlet cooling valve and an air inlet proportion adjusting valve are arranged on the air inlet pipeline to form a pressurization system; the air outlet is connected with an air outlet pipeline, a first baffle valve is arranged on the air outlet pipeline, and a vacuum pump is externally connected to the air outlet pipeline to form a vacuum system; and the pressurizing system and the vacuum system alternately carry out air intake and air exhaust on the furnace body and are used for realizing alternate pressurizing and vacuumizing operation of the furnace body. The pressurization system and the vacuum system are arranged on the furnace body, air intake and air exhaust are alternately carried out on the furnace body, alternate pressurization and vacuum pumping operation of the furnace body is achieved, bubbles in the central area of the chip can move out of the central area of the chip in the expansion and contraction movement process, and therefore the chip is prevented from being damaged. And finally, the voidage of the large-area bonding pad is reduced.

The utility model provides a support and a reflow soldering furnace. The support comprises a base and at least one supporting mechanism. And the supporting mechanism is arranged on the base. The supporting mechanism comprises a supporting assembly, and the supporting assembly comprises a first supporting part and a second supporting part. The first supporting component is connected with the base. The second supporting part can be detachably connected with the first supporting part. And the second supporting component can move relative to the first supporting component, so that the second supporting component is separated from the first supporting component. The support is convenient to disassemble, and the width adjusting assembly is convenient to clean.

The utility model relates to the technical field of reflow furnace, concretely to a reflow furnace ventilation and heat dissipation device, including production workshop, the inside installation of production workshop has control panel, the inside installation of production workshop has motor, the input of motor and the output of control panel electric connection, the inside installation of production workshop has four reflow furnace body, the surface of reflow furnace body is provided with ventilation and heat dissipation mechanism, the inside of ventilation and heat dissipation mechanism includes the manifold, the flow guide pipe, the valve assembly, the exhaust pipe and the exhaust fan. The utility model has realized the balanced heat dissipation function of ventilation and heat dissipation device, has improved the heat dissipation effect when ventilation and heat dissipation device uses.

The multifunctional vacuum reflow soldering furnace comprises a plurality of unit furnaces which are used in a combined mode, a working cavity is arranged in each unit furnace, each working cavity comprises a sealing cover plate, a heating assembly and a cooling assembly, the heating assemblies and the cooling assemblies are arranged in the working cavities, each heating assembly is of a face heating structure, and each cooling assembly is of a refrigerant two-way heat exchange structure. And a grabbing device is arranged at the top of the unit furnace and comprises a traveling crane serving as a motion reference and a clamping jaw driven by the traveling crane, the clamping jaw grabs a tool with a product to be welded to move to a next target position at a time, and the product to be welded is subjected to heating and cooling treatment in a single working cavity. According to the invention, products of multiple specifications can be welded on the same assembly line of the same reflow furnace.

The application provides a carrier system for preventing silicon light sheet pollution in a reflow oven, which is used for carrying integrated chips with through holes in the middle, so that the integrated chips can be reflow soldered in the convection reflow oven. The carrier system comprises a convection carrier and a silicon light sheet protection cover. The convection carrier is provided with a plurality of linearly arranged chip carrying positions, and the positions avoiding the silicon light sheet. The silicon light sheet protection cover is in a U shape, clamps the integrated chip through the through hole to the position on the side of the silicon light sheet, and contains the silicon light sheet. The upper branch of the silicon light sheet protection cover is provided with an inclined upper air guide grille. The lower branch of the silicon light sheet protection cover is provided with a lower air guide grille. The carrier system for preventing silicon light sheet pollution in a reflow oven provided by the application can prevent particles from staying on the surface of the silicon light sheet, and even if there are particles, the particles can be blown away by the inclined air flow. That is, the silicon light sheet protection cover structure provided by the application can make the silicon light sheet cleaner before reflow soldering.

The utility model discloses a kind of support devices for lead-free reflow soldering furnace, it is related to vacuum reflow soldering technical field, including sprocket, chain is installed on the sprocket outside, support plate is installed on the opposite side of chain, support frame is arranged on the lower side of support plate, spring is arranged in the support frame, limit pin is arranged on the upper side of spring. The utility model is provided with support plate, support frame, spring and limit pin, so that when supporting small circuit board, the mounting hole on small circuit board can be inserted into limit pin, ensure the support stability of circuit board, avoid circuit board shaking to affect welding quality.

The invention discloses a chip humidity sensitivity detection device, which relates to the technical field of chip detection, and comprises a drying box, a constant temperature and humidity box, a reflow soldering furnace and an ultrasonic scanning detector, the device further comprises an automatic transfer isolation mechanism. The automatic transferring and isolating mechanism comprises a drying and isolating bin and a conveying mechanism used for conveying chips, and the drying and isolating bin is fixedly arranged between the drying box and the constant-temperature and constant-humidity box. After a to-be-detected chip is subjected to drying pretreatment in the drying box for a set time length, the to-be-detected chip is released into the drying isolation bin through the discharging box door mechanism and is automatically conveyed into the constant-temperature and constant-humidity box through the conveying mechanism, manual transfer is not needed, operation convenience is improved, meanwhile, the external environment is isolated through the drying isolation bin, and the detection efficiency is improved. External moisture is prevented from affecting the initial state of the chip and affecting the accuracy of subsequent detection results.

The application discloses a production line for processing network device built-in mainboards, which comprises a workbench, a conveyor belt arranged on the surface of the workbench, a silk screen printer arranged on the surface of the workbench, a guide rail frame arranged on the surface of the workbench, a patching device arranged on the surface of the guide rail frame, a reflow oven arranged on the surface of the guide rail frame, a dust suction device arranged on the surface of the silk screen printer, wherein the dust suction device comprises a dust collector and a collection box, the dust collector is fixedly connected with the surface of the silk screen printer, the collection box is arranged on one side of the dust collector, a suction head is fixedly connected with the surface of the workbench, the suction head is connected with the dust collector through a pipeline, and a fixing ring is fixedly connected with the surface of the dust collector, so that the dust suction device is arranged, dust suction on the processed mainboard is facilitated, the phenomenon that the mainboard is contaminated by dust and fine particulate matters during transportation and conveying is effectively reduced, the dust and particulate matters are prevented from interfering with the silk screen printing operation of the mainboard, and the overall production effect of the equipment is improved.

The utility model discloses a reflow soldering furnace for reinforcing a mainboard and an electronic component, which comprises a working table, a transmission assembly is arranged above the working table, a soldering chamber is arranged on one side above the transmission assembly, a cooling chamber is arranged on one side of the transmission assembly far away from the soldering chamber, air inlets are arranged in the middle above the soldering chamber and the cooling chamber, and an air outlet is arranged on the other side of the transmission assembly far away from the cooling chamber. The welding chamber and the cooling chamber are both provided with fans below the air inlets, the welding chamber is provided with an electric heating box below the fans, an electric heating pipe is arranged in the middle of the electric heating box, an air outlet groove is formed in the bottom of the electric heating box, and the cooling chamber is provided with a plurality of heat exchange fins arranged at equal intervals below the fans. And cooling pipes are inserted into the heat exchange fins. The reflow soldering furnace is good in welding effect, welding of a mainboard and an electronic element can be rapidly completed, the cooling speed of the mainboard and the electronic element which are welded is high, and the welding quality of the mainboard and the electronic element is effectively guaranteed.

This utility model relates to the field of reflow oven technology and discloses a multivariable coupled reflow oven temperature control and equalization device, including a reflow oven. A control panel is fixedly connected to the outer wall of the reflow oven, and a top cover is rotatably connected to the outer wall of the reflow oven. A pull plate is slidably connected inside the top cover, and a processing box is fixedly connected to the outer wall of the pull plate. A stabilizing component is installed inside the processing box, and an air vent is provided inside the processing box. A filter plate is installed on the outer wall of the air vent, and a disassembly and assembly component is installed inside the filter plate. The stabilizing component includes a clamping plate, and the outer wall of the clamping plate is slidably connected inside the processing box. In this utility model, the pull plate drives the limiting plate and the sliding column, and in conjunction with a spring, the clamping plate slides inside the top cover, thereby conveniently fixing the processing box and maintaining its stability. This solves the problem of not being able to easily maintain the stability of the processing box during placement and improves the stability of the processing box.

This utility model belongs to the field of reflow oven technology and discloses a reflow oven for SMT chip mounting. It includes a conveyor belt, a magnetic block fixedly mounted on the upper surface of the conveyor belt, and a positioning component attached to the outer side of the magnetic block. The positioning component includes a housing, with a groove at the upper interior of the housing. A threaded rod is rotatably mounted inside the groove, and a long rod is attached to the lower end of the threaded rod, slidingly disposed with the groove. A short rod is attached to the other end of the long rod, and a long plate is fixedly mounted on the upper end of the short rod. A magnetic groove is provided at the lower interior of the positioning component. Through the magnetic block and magnetic groove, the SMT board can be firmly fixed on the conveyor belt, preventing displacement of the SMT board due to vibration, high-temperature expansion, or other factors during the soldering process. The positioning component can adapt to SMT boards of different sizes and components of different heights through the threaded rod, long rod, and short rod, reducing equipment adjustment time during changeover production and improving production line flexibility.

The invention relates to the technical field of aluminum substrate surface mounting, in particular to an aluminum substrate low-voidage welding method based on secondary printing and inclined reflow, which comprises the steps of first printing of a bonding pad of an electronic device, first reflow soldering of the electronic device, second printing of the bonding pad of the aluminum substrate, mounting of a soldering lug, mounting of the electronic device and second reflow soldering. After being printed and refluxed, an electronic device is mounted in a 5-25-degree inclined state by means of a soldering lug support on the board inlet side of a bonding pad of the aluminum substrate, the aluminum substrate is horizontally positioned through a reflow carrier, and welding is completed by adopting a conventional nitrogen or air reflow oven. Through the collaborative design of soldering lug supporting inclination, secondary printing and melting point matching, bubbles are efficiently discharged, the problems that in the prior art, vacuum reflow soldering is high in cost, a conventional process is poor in adaptability and high in void rate are solved, the soldering void rate is stably controlled to be at the low level, an existing production line does not need to be transformed, the equipment investment is low, and operation is easy and convenient.

This utility model discloses a reflow oven fixture, including a base plate and a pressure plate. The base plate is a flat plate with two rows of symmetrically distributed PCB mounting areas about the center line, each row having multiple positioning slots. The positioning slots include interconnected interface mounting slots and PCB placement slots, with the interface mounting slots having a greater depth than the PCB placement slots. The PCB placement slots have raised sections, the height of which is equal to half the difference between the thickness of a standard PCB and a thin PCB. When using a standard thickness PCB, the PCB has corresponding clearance holes for the raised sections. The pressure plate and base plate work together to press the PCB together. By providing raised sections, PCBs of different thicknesses can maintain a uniform mounting position in the same reflow oven fixture, effectively solving the height difference problem when thin and standard PCBs are produced together on the same production line. This improves production flexibility and efficiency, and ensures the stability and soldering quality of PCBs of different thicknesses during reflow soldering.

The invention discloses a welding method for metal PINs of a brick type module power supply. The welding method comprises the specific steps that PINs, mechanical blind holes in a PCB and a printing template are prepared; solder paste printing; coating the soldering paste on a surface layer bonding pad of the PCB through the printing template; inserting a PIN needle; pINs are inserted into the mechanical blind holes printed with the solder paste and limited through a tool jig, and the PINs are prevented from inclining; reflow soldering; the PCB subjected to surface mounting and the inserted PINs pass through a reflow oven together, and welding is completed through high-temperature tin melting in the oven; quality inspection; and testing the welded product so as to ensure that the welding strength, the electrical parameters and the reliability of the PIN meet the requirements. According to the PCB, the mechanical blind hole is formed in the PCB, so that the welding requirement of a reflow welding process is met, meanwhile, the space occupied by the welding hole in the PCB is reduced, and the layout design space of the PCB is improved.