485results about "Microphone structural association" patented technology

A digital microphone includes at least one integrator; a state detection and parameter control component directly coupled to an output of the integrator; and a signal processing component coupled to an output of the state detection and parameter control component, wherein a parameter of the signal processing component includes a first value in a first operational mode and a second value in a second operational mode different from the first operational mode.

An integrated audio microphone system simultaneously provides in-room amplification and remote communication during a collaboration session with one or more local participants in a shared space and one or more remote participants. The integrated audio microphone system includes at least one microphone array and speaker system located in the shared space, at least one microphone system for amplification located in the shared space, an audio processor connected to the microphone system and the microphone array and speaker system, and a computer connected to the audio processor. The audio processor is configured to generate a plurality of virtual microphone bubbles and to amplify received audio signals from the microphone system for in-room audio amplification. The amplified audio signals are output to speakers of the microphone array and speaker system. Audio signals from the microphone system and the arrays of microphones are output to the computer to send the audio signals to one or more remote participants.

The invention provides electronic equipment and a pickup device, the electronic equipment is provided with an appearance surface, the appearance surface is provided with a first pickup port and a plurality of second pickup ports distributed at intervals, and each second pickup port and the first pickup port are arranged at intervals; a microphone, a first sound channel and a plurality of second sound channels are arranged in the electronic equipment, the first sound channel is communicated with the first pickup port and a first cavity of the microphone, the second sound channels are communicated with the second pickup ports in a one-to-one correspondence mode, and the second sound channels are communicated with a second cavity of the microphone. And the first cavity of the microphone and the second cavity of the microphone are respectively positioned on two sides of a vibrating diaphragm of the microphone. A plurality of pickup vectors can be formed between the plurality of second pickup ports and the first pickup port. A vector obtained by adding the plurality of pickup vectors is consistent with the sensitivity direction of the microphone. The microphone of the electronic equipment can better receive sound from the sensitivity direction of the microphone, and the microphone can realize directional pickup.

The present application discloses an analog-to-digital conversion circuit, a chip, and a recording device. The analog-to-digital conversion circuit comprises a main path module, a dynamic range enhancement module, and a dynamic digital-to-analog conversion module. The main path module is used for converting an analog signal and an analog feedback signal into a digital signal to be processed for outputting to the dynamic range enhancement module, and obtaining a digital signal on the basis of the digital signal to be processed and a digital gain signal and outputting the digital signal. The dynamic range enhancement module is used for performing dynamic quantization processing on the digital signal to be processed to obtain a control signal, and generating the digital gain signal. The dynamic digital-to-analog conversion module is used for, on the basis of the control signal, dynamically controlling the activation and deactivation of each DAC element in a digital-to-analog conversion array, and generating an analog feedback signal. According to the analog-to-digital conversion circuit of the present application, the need for a front-end fixed-gain OPA is eliminated, reducing power consumption and reducing costs; moreover, dynamically controlling the activation and deactivation of each DAC element in the digital-to-analog conversion array further reduces the power consumption.

An assembly is provided which includes a package and a printed circuit board. The package includes a housing bounding a region and an acoustic sensor within the region. The housing includes a base with a first hole. The sensor is configured to generate signals indicative of sound received by the sensor through the first hole. The printed circuit board is in mechanical communication with the base and includes a second hole aligned with the first hole such that sound received by the second hole propagates through the first hole to the sensor. The printed circuit board further includes an electrically conductive layer, at least a portion of which extends across the second hole and is configured to allow the sound to propagate through the second hole and to at least partially shield the region containing the sensor from electromagnetic interference.

A vibration sensor (200) is provided, comprising: a vibration receiver (210) including a housing (211) and a vibration unit (212), the housing (211) forming an acoustic cavity, the vibration unit (212) being located in the acoustic cavity and separating the acoustic cavity into a first acoustic cavity (213) and a second acoustic cavity (214); and an acoustic transducer (220) acoustically connected to the first acoustic cavity (213). The housing (211) is configured to generate a vibration based on an external vibration signal, the vibration unit (212) changes an acoustic pressure within the first acoustic cavity (213) in response to the vibration of the housing (211), causing the acoustic transducer (220) to generate an electrical signal. The vibration unit (212) includes a quality element (2121) and an elastic element (2122), an area of the quality element (2121) on a side away from the acoustic transducer (220) is smaller than an area of the quality element (2121) on a side close to the acoustic transducer. The elastic element (2122) is connected around a side wall of the quality element (2121).

Aspects of transducers with feedback transduction are described. One aspect is a transducer system comprising an operational amplifier having an inverting input, a non-inverting input, and an output. The transducer system also includes a piezoelectric microelectromechanical system (MEMS) transducer having a first node and a second node, wherein the first node is coupled to the inverting input of the operational amplifier, and wherein the piezoelectric MEMS transducer is configured to generate an electrical signal across the first node and the second node in response to a signal incident upon the piezoelectric MEMS transducer. The transducer system also includes an attenuator having an input and an output, wherein the input of the attenuator is coupled to the output of the operational amplifier, and wherein the output of the attenuator is coupled to the second node of the piezoelectric MEMS transducer.

Provided are a voice call method, an apparatus, a terminal, and a storage medium, relating to the technical field of the terminal. The method includes: obtaining, in response to a voice call instruction, a display screen state of the flexible display screen, the display screen state comprising at least one of a roll-up state and a spread-out state; controlling, in response to the flexible display screen being in the roll-up state, the flexible display screen to spread out, wherein the first housing and the second housing move relative to each other while spreading out the flexible display screen, and wherein a distance between the sound receiving hole and a sound source after the spreading out is smaller than a distance between the sound receiving hole and the sound source before the spreading out; and collecting call voice through the radio microphone.

A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.

A method includes operating, by a device, a microphone incorporated in the device in a half-duplex mode; receiving, by the device, a message to initiate a session with another device, the message including a parameter; parsing, by the device, the message to identify a mode of operation of the microphone based on the parameter; and adjusting, by the device, the microphone to operate in a full-duplex mode based on identification of the mode of operation.

A wearable audio device may comprise a first directional loudspeaker having a first directionality, a second directional loudspeaker having a second directionality different from the first directionality, a communication interface configured to receive a communication audio signal, and a processor configured to operatively control the first directional loudspeaker, the second directional loudspeaker, and the communication interface. The processor may be configured to perform operations comprising detecting a relative mount position of wearable communication device, selecting a proximal loudspeaker to emit the communication audio signal in accordance with the relative mount position, wherein the proximal loudspeaker comprises one of the first directional loudspeaker and the second directional loudspeaker; and transferring the communication audio signal from the communication interface to the proximal loudspeaker in accordance with the selecting.

A microphone includes a shell assembly, a sound pickup assembly, a control assembly and a light-emitting assembly. The shell assembly includes a shell body with a first accommodating chamber. The sound pickup assembly includes a microphone head for sound pickup, wherein the microphone head is arranged on the shell assembly. The control assembly includes a first circuit board. The first circuit board is arranged in the first accommodating chamber, and is electrically connected to the microphone head. The light-emitting assembly includes a light-emitting unit. The light-emitting unit is arranged in the first accommodating chamber and is electrically connected to the first circuit board. The light-emitting unit is configured to allow emitted light to pass through a portion of the shell body.

The present invention provides a waterproof microphone device installed on a vehicle body. The vehicle body includes a frame having a circular opening. The waterproof microphone device includes an outer housing, a circuit board, a microphone, a cover, a first waterproof membrane, and a casing. An inner wall of the frame forming the opening gradually slopes inwardly from an outer surface to an inner surface of the frame. The casing includes a first wall, a second wall, and an outer sidewall. The outer sidewall gradually slopes inwardly from the first wall to the second wall to form an inclined annular sound channel between the inner wall of the frame enclosing the opening and the outer sidewall of the casing. In present invention, the waterproof microphone device can achieve better waterproof effect, and has a more stable structure with a beautiful appearance.

The present disclosure discloses a microphone including a shell, a printed circuit board enclosing a cavity together with the shell, a first chip assembly located in the cavity, and a second chip assembly embedded and accommodated in the printed circuit board. The printed circuit board is a multilayer structure including a chip mounting layer, a first alignment layer, a plurality of shielding layers, a second alignment layer, and an SMT layer arranged in sequence, each of the plurality of shielding layers is connected with a grounding point of the printed circuit board and provided with an avoiding aperture running through it. Compared with the related art, the microphone disclosed by the present disclosure could avoid a heat generated by the operation of the first AISC chip and the second ASIC chip affecting the performance of other devices.

Provided is a structure that makes it possible to easily perform attachment work of a communication device to a helmet and replacement work of the communication device. A helmet 100D is a full-face type helmet, has an opening part 104 on a front surface, and a communication device 10D is arranged on a bottom surface 104a of the opening part 104. The communication device 10D includes a device body 7 and a fixing part 8. The device body 7 includes a first part 1 with a built-in microphone, a second part 2 with a built-in speaker, and a third part 3 with a built-in speaker. The fixing part 8 includes: a fixing part 80 which is inserted into a gap between a liner 102 and a shell 101 in the bottom surface 104a; and a placement part 81 which is continuous with an upper part of the fixing part 80 and on which the device body 7 is placed.

A lavalier microphone has improved dynamic range. The lavalier microphone incorporates a pair of microphone transducer elements into the same housing or attached housings, with one of the microphone transducer elements being more sensitive to acoustic input than the other. The voltage signals from the respective transducer elements are processed and combined, resulting in a digital output audio signal with improved signal to noise both at lower and higher input acoustic levels.

A digital microphone includes a log amplifier having an input for receiving an analog signal; an analog-to-digital converter (ADC) coupled to the log amplifier; a digital low-pass filter coupled to the ADC; a digital decompression component coupled to the digital low-pass filter; and a predictor filter coupled to the digital decompression component, the predictor filter having an output for generating a digital signal. The digital low-pass filter is a positive group delay filter and the predictor filter is a negative group delay filter. The digital microphone has an improved Signal-to-Noise Ratio (SNR) due to filtering, but without increasing overall group delay.

The present application provides a sound capture method applied to a microphone. The microphone comprises a laser self-mixing device and a diaphragm device, the diaphragm device comprises a membrane configured to respond to sound vibration, and the laser self-mixing device and the diaphragm device are separately configured to detect the vibration of the membrane. In the method, a first voltage signal is obtained using the laser self-mixing device, and a second voltage signal is simultaneously obtained using the diaphragm device. If the first voltage signal is equal to or less than a preset threshold, the first voltage signal is converted into an audio signal, or if the first voltage signal is greater than a preset threshold, the second voltage signal is converted into an audio signal. According to the method of the present application, the audio signal may be collected in two different manners, so that the switching between the two signals is realized using a preset threshold, and the more consistent signal is selected and converted into an audio signal. This can ensure the quality of the audio signal. The present application further relates to a microphone and an electronic device.

A wearable electronic device is provided. The wearable electronic device includes a first antenna structure disposed on an antenna carrier, a printed circuit board, a semiconductor packaging substrate packaged with the printed circuit board, a second antenna structure disposed on at least a portion of a surface of the semiconductor packaging substrate, and a contact structure electrically connecting the first antenna structure and the second antenna structure.

A microphone, comprising a housing (1), a circuit board (2) covering and fixed to the housing (1) and defining a first cavity (104) and a second cavity (105) together with the housing (1), a first chip assembly (3) fixed on the side of the circuit board (2) close to the housing (1) and located in the first cavity (104), and a second chip assembly (4) fixed on the side of the circuit board (2) close to the housing (1) and located in the second cavity (105), wherein the first chip assembly (3) comprises a first ASIC chip (301) and a first MEMS chip (302), and the second chip assembly (4) comprises a second ASIC chip (401) and a second MEMS chip (402). The microphone further comprises a first metal layer (5) fixed on the side of the circuit board (2) close to the housing (1) and surrounding both the first chip assembly (3) and the second chip assembly (4). The microphone can prevent the problem that heat generated by operation of the ASIC chips affects performance of other components by means of heat conduction via a substrate of the circuit board (2) or heat dissipation via thermal motion of air.

The application discloses a piezoelectric sensing unit, a piezoelectric microphone and a terminal. The piezoelectric sensing unit comprises a base, an auxiliary layer, a center film, a piezoelectric film and a plurality of cantilevers. The base has a cavity extending along a first direction, and the cavity forms a polygonal opening on a first surface of the base, the polygonal opening having adjacent first and second sides. The auxiliary layer is formed on the first surface of the base, and the auxiliary layer comprises a first auxiliary part located in a region adjacent to the first side of the first surface. The cantilevers are connected to the sides of the polygonal opening one by one, and each cantilever comprises a first end part and a second end part, the first end part is connected to the first auxiliary part, and the connection point of the first end part and the first auxiliary part is located on one side of the first auxiliary part close to the second side. The cantilever extends along the extension direction of the second side. The second end part of each cantilever is connected to the center film. In the scheme, the length of the cantilever is relatively long, which is beneficial to improving the signal-to-noise ratio of the piezoelectric microphone.

A headphone system can include an earbud that includes an earbud speaker, earbud communication circuitry and earbud power circuitry; and a headphone that includes a headphone speaker, an ear cushion, a headband, headphone communication circuitry, headphone power circuitry and an earbud socket that removably receives the earbud.

Certain embodiments of the disclosure relate to microphone-equipped wearable devices, and more particularly, to wearable devices worn on users' ear. According to certain embodiments of the disclosure, a wearable device comprises a speaker, a microphone, and a housing, the housing includes a protrusion configured to be insertable into a user's ear, a first sound path including a first opening formed through an area of a surface of the protrusion, extending from the first opening in a first length, and including a second opening facing the speaker, and a second sound path including a third opening formed through another area of the surface of the protrusion, extending from the third opening in a second length larger than the first length, and including a fourth opening facing the microphone. Other certain embodiments are also possible.

The invention relates to an earphone with an external accessory. The earphone comprises a body connecting part and the external accessory, the body connecting part comprises a first circuit board, at least one first connecting end part and a first fastener. The external accessory can be detachably installed on the body connecting part and comprises a second circuit board, at least one second connecting end part which is used for being electrically connected with the at least one first connecting end part, and a second joint part which is used for being mutually jointed with the first joint part. After the first joint piece and the second joint piece are mutually jointed and the at least one first connecting end part and the at least one second connecting end part are mutually electrically connected, when the external accessory comprising the second circuit board, the at least one second connecting end part and the second joint piece is rotated, the first joint piece rotates, and the second joint piece rotates. And the first circuit board and the at least one first connecting end part also rotate.

Earbud core of a bone conduction loudspeaker, characterized in that the earbud core of a bone conduction loudspeaker comprises: a magnetic circuit arrangement, a vibration arrangement, an external conductor and a support, wherein the vibration arrangement comprises a coil and an internal guide conductor, wherein the external conductor can transmit audio current to the coil for the vibration arrangement, wherein an end of the external conductor is connected to the internal guide conductor of the earphone core, wherein the support has a cable trough, wherein the external conductor and / or the internal conductor are at least partially arranged in the cable trough, wherein the internal guide conductor and the external guide conductor are welded together, and wherein the weld point is located in the cable trough.

Systems and methods for a MEMS microphone package are disclosed. The MEMS microphone package may include a first port to direct sound to a MEMS system, including a die substrate, an acoustic membrane, and one or more plates. The MEMS microphone package may include an ASIC to produce microphone output based on an electrical signal, a PCB, a lid, and a second port. The first port and the second port may define a front volume and a back volume respectively. The second port may increase the back volume to improve sensitivity and reduce the acoustic sensor's noise floor to improve signal-to-noise ratio.

A piezoelectric microelectromechanical systems microphone is provided comprising a substrate including at least one wall defining a cavity, the at least one wall defining an anchor region around a perimeter, a piezoelectric film layer forming a membrane, the piezoelectric film layer being supported at the anchor region by a spring region, and an electrode disposed over the piezoelectric film layer. A method of manufacturing such a MEMS microphone is also provided.

An attenuator circuit includes a microelectromechanical system (MEMS) device having an output for providing an analog output voltage; a switch having a first controlled node coupled to an output of the MEMS device, a second controlled node for receiving a replica analog output voltage, and a control node for receiving a control signal; and a capacitor coupled to the switch.