63results about "Microphone structural association" patented technology

The application discloses a piezoelectric sensing unit, a piezoelectric microphone and a terminal. The piezoelectric sensing unit comprises a base, an auxiliary layer, a center film, a piezoelectric film and a plurality of cantilevers. The base has a cavity extending along a first direction, and the cavity forms a polygonal opening on a first surface of the base, the polygonal opening having adjacent first and second sides. The auxiliary layer is formed on the first surface of the base, and the auxiliary layer comprises a first auxiliary part located in a region adjacent to the first side of the first surface. The cantilevers are connected to the sides of the polygonal opening one by one, and each cantilever comprises a first end part and a second end part, the first end part is connected to the first auxiliary part, and the connection point of the first end part and the first auxiliary part is located on one side of the first auxiliary part close to the second side. The cantilever extends along the extension direction of the second side. The second end part of each cantilever is connected to the center film. In the scheme, the length of the cantilever is relatively long, which is beneficial to improving the signal-to-noise ratio of the piezoelectric microphone.

A system is described that comprises a housing, a flexible printed board circuit, PCB, and a sensor. The flexible PCB has a first surface that is exposed to an environment and a second surface that is opposite the first surface. The flexible PCB is mounted to the housing by a mounting element. At least a portion of the flexible PCB is configured to vibrate when an acoustic wave reaches the first surface. The sensor is arranged on the second surface of the flexible PCB and is configured to measure vibrations of the flexible PCB and to output a corresponding electrical signal.

Techniques for a wireless remote speaker microphone entering an inactive operational state upon detection of a forced displacement are provided. A wireless remote speaker microphone paired with a portable radio periodically samples input from an inertial measurement unit coupled to the wireless remote speaker microphone, to detect motion of the wireless speaker microphone. It is determined that the motion of the wireless remote speaker microphone is a forced displacement motion. The wireless remote speaker microphone enters an inactive operational state.

A microphone array contains multiple microphone capsules whose outputs are electronically combined for directional recording of sound. The directivity and frequency characteristics of the microphone array depend on the number and position of the microphone capsules. In order to obtain the smallest possible microphone array with only a small number of microphone capsules, with nearly uniform directivity and frequency dependence over the audio frequency range, but which is scalable and robust to small mispositioning of the capsules. Microphone arrays with 15 or 21 microphone capsules (K 15,11 ~K 15,35 ,K 21,11 ~K 21,37 ) are arranged on a carrier (T, T') that are located on three similar branches, each branch being provided with the same number of microphone capsules, which are rotated by 120° with respect to each other. Each of the microphone capsules is located at a triangular corner of the L2 grid in a planar isometric coordinate system (forming an equilateral L2 grid) with three axes (L0, L1, L2) that are rotated by 120° with respect to each other.

The present application provides a method for controlling illumination effect, an electronic device and a storage medium. The method includes: obtaining sound signals, and constructing an impulse response filter according to a sound field type of the sound signals; filtering the sound signals by using the impulse response filter and obtaining analog signals; transforming the analog signals and obtaining a plurality of spectrum signals; calculating a target excitation value for each of the plurality of spectrum signals, and calculating human-perceived loudness of each of the plurality of spectrum signals according to the target excitation value; controlling a lighting effect of at least one lighting device according to the human-perceived loudness of the sound signals. The above method is able to improve an accuracy for controlling illumination effect.

This electronic device may include: a plate including an inner surface exposed to an inner space of the electronic device; a circuit board facing the inner surface of the plate, the circuit board including a first surface and a second surface opposite to the first surface, and the second surface facing the inner surface of the plate; an electronic component arranged on the first surface of the circuit board; a sealing member arranged on the second surface of the circuit board; and a waterproof member arranged on the inner surface of the plate and configured to be assembled with the sealing member. The sealing member assembled with the waterproof member may be in contact with the waterproof member.

A sensor component can include a housing, an electrical interface, and a capacitive transducer, the capacitive transducer including a first electrode and a second electrode. The sensor component can include an electrical circuit including a bias voltage source coupled to the first electrode. The bias voltage source can include a voltage booster circuit coupled to the charge pump and coupled to a reference voltage source. The voltage booster circuit can receive a reference voltage and a clock signal, increase the reference voltage, and increase a voltage of the clock signal provided to a charge pump clock input based on the increased reference voltage. The voltage booster circuit can provide the increased reference voltage to the charge pump input. The voltage booster circuit can also include a switch control circuit that controls at least two transistors of the voltage booster circuit independent of the reference voltage.

Small form-factor MEMS devices and methods of using the devices. An exemplary MEMS device includes an ACM. Certain devices comprise nanometer scale sensing gaps in the out-of-plane direction to increase vibration sensitivity in a vacuum casing. Certain devices described herein provide a differential sensing mechanism. Accelerometer contact microphones having an operational bandwidth ranging from 0 Hz and 10,000 Hz are also disclosed. The vibration acceleration sensitivity of certain devices described herein is better 100 μg√Hz.

The present invention relates to an audio device with a housing, a microphone arm and a detector for determining an orientation of the microphone arm relative to the housing. The invention may advantageously be applied in audio devices having a microphone arm, such as headsets, earphones, hearing protectors and other audio devices used for sound pickup. The audio device (1) comprises a housing (2), a microphone arm (3) that is mechanically and movably connected to the housing (2), a microphone unit (4) arranged at or in the microphone arm (3) and configured to pick up sound (5) from the environment of the audio device (1) and provide a corresponding microphone audio signal (M), a signal processor (5) arranged at or in the housing (2) and configured to provide electric power (P) to the microphone unit (4), and a flexible substrate (6) extending in a length direction (L) between a first end (7) mechanically connected to the housing (2) and a second opposite end (8) mechanically connected to the microphone arm (3). The flexible substrate (6) is configured to bend in dependence on the microphone arm (3) moving relative to the housing (2) and comprises one or more electrical conductors (9) electrically connecting the microphone unit (4) and the signal processor (5) to convey the electric power (P) from the signal processor (5) to the microphone unit (4) and / or the microphone audio signal (M) from the microphone unit (4) to the signal processor (5). The flexible substrate (6) further comprises a bend sensor (10) that is configured to change the value of an electric property in dependence on a bending of a first portion (11) of the flexible substrate (6), and the audio device (1) further comprises a bend detector (12) electrically connected to the bend sensor (10) and configured to estimate an orientation (O) of the microphone arm (3) relative to the housing (2) in dependence on the value of the electric property of the bend sensor (10). Arranging the bend sensor (10) at or in the flexible substrate (6) may provide a both reliable and cost-effective estimation of the orientation (O) of the microphone arm (43).

Aspects of the disclosure relate to microelectromechanical systems (MEMS) devices for pressure measurements. In particular, various examples herein describe techniques for limiting a diaphragm displacement of capacitive MEMS transducers to enable high sound pressure level (SPL) measurements. A reduced diaphragm displacement may be achieved by using a cap over the diaphragm of the MEMS transducer to reduce a volume of a back cavity of a MEMS transducer. A smaller back cavity may acoustically load the diaphragm and reduce the diaphragm displacement. Additionally, or alternatively, a reduced diaphragm displacement may also be achieved by stacking multiple MEMS transducers over each other such that the multiple MEMS transducers are in series acoustically.

Various embodiments of an ear-wearable electronic device are disclosed. The device includes an enclosure having a first housing and a second housing. The device also includes an acoustic path that extends along an axis between a first opening defined by an outer surface of the enclosure and a second opening defined by a surface of a cavity of a microphone coupler disposed within the enclosure. The acoustic path includes a first trap connected to the acoustic path adjacent the first opening of the acoustic path, and a second trap connected to the acoustic path so that the second trap is disposed closer to the second opening than the first trap. Each of the first trap and the second trap is configured to collect debris.

An integrated device package is disclosed. The integrated device package can include a printed circuit board and a microelectronicmechanical systems die that is at least partially disposed within the printed circuit board and electrically coupled to the printed circuit board. The integrated device package can include a filler material that is at least partially disposed between the microelectronicmechanical systems die and the printed circuit board. The integrated device package can include a lid that is coupled to the printed circuit board. The lid and the microelectronicmechanical systems die are spaced by a gap defining a back volume.

An optical microphone module (2) for mounting in a microphone assembly is described. The module (2) is manufactured by assembling a semiconductor chip (4), a spacer (6), and an interferometry assembly (8) into a stack, wherein the spacer (6) is disposed between the semiconductor chip (4) and the interferometry assembly (8). The interferometry assembly (8) includes a diaphragm (12) and a substrate (10) including optical elements (14) spaced apart from the diaphragm (12). The semiconductor chip (4) includes a photoelectric circuit (20) containing at least one photodetector (18) and has a light source (16) mounted thereon or integrated therein. The light source (16) is positioned to provide light to the interferometry arrangement (8) such that two light portions (26, 28) propagate via corresponding optical paths to produce an interference pattern at the photodetector (18) that depends on the position of the diaphragm (12). The stack includes an inner cavity (30) and at least one orifice (40) providing an air passage between the inner cavity (20) and the outer surface (34) of the stack, such that the inner cavity (30) is in fluid communication with the outer surface (34) of the stack. A first side of the diaphragm (12) is in fluid communication with the outer surface (34) of the stack, and a second side of the diaphragm (12) is in fluid communication with the inner cavity (30).

A waterproof vibration transducer module includes a substrate which includes a through hole, a protrusion portion provided on one surface so as to surround the through hole, and a vibration conversion die mounted on the other surface so as to close the through hole; a holder which includes a hole and a rib being on a position surrounding the hole; a barrier diaphragm which is on a position overlapping with the through hole and the hole when viewed in a stacking direction, is clamped by the protrusion portion and the rib, and vibrates in a space formed by the hole and the protrusion portion; a first case in which a sound hole is formed; and a second case which is combined with the first case. The substrate, the holder, and the barrier diaphragm are accommodated in an internal space formed by combining the first case and the second case.

This application relates to the field of audio device technologies, and in particular, to a sound output apparatus. The sound output apparatus includes a housing, a first bracket, a microphone, and a first speaker. The housing is provided with an accommodation space. The first bracket is fastened to the accommodation space of the housing. The first bracket includes a first surface and a second surface that face away from each other. The microphone is fastened to the first surface. The first speaker is fastened to the second surface. The microphone, the first bracket, and the first speaker are stacked in a first direction. The first bracket is used for separate fastening of the microphone and the first speaker, so that the first bracket has little impact on an earphone in the first direction. This helps reduce a size of the earphone in the first direction, to improve compactness of a structure of the earphone, and facilitates assembly, to help improve accuracy and consistency in assembling the earphone.

A waterproof vibration transducer module includes: a substrate including a through-hole, a protrusion portion provided on one face in a manner of surrounding the through-hole, a vibration conversion chip mounted on the other face in a manner of plugging the through-hole; a support including a hole and a rib at a position surrounding the hole; a barrier diaphragm located at a position overlapping the through-hole and the hole when viewed in a stacking direction, clamped by the protrusion portion and the rib, and vibrating within a space formed by the hole and the protrusion portion; a first case formed with a sound hole; a second case combined with the first case, the substrate, the support, and the barrier diaphragm being accommodated in an internal space formed by combining the first case and the second case, the internal space being divided into two spaces by the support and the barrier diaphragm, and the space on the second case side being sealed.

The invention relates to an ear-worn hearing device with an in-ear microphone. A hearing device is disclosed comprising an acoustic tube configured for being worn on an outer ear of a user or at least partially in an ear canal of the user. The hearing device comprises: a speaker having a sound outlet acoustically coupled to an opening of a sound tube through a speaker sound path; and a microphone mounted on the carrier. The microphone includes a manifold forming a microphone sound path acoustically coupling the microphone to the opening of the sound tube, where the manifold isolates the microphone sound path from the speaker sound path along at least a portion of the channel of the sound tube.

A microphone device S100 comprises: a microphone body 10 that has a sound collection section 12; a windscreen 20 that has a windscreen member 21 for covering the sound collection section 12, said windscreen member 21 having an accommodation section 22 that extends toward the inside of the windscreen member 21 from an opening 22a into which the microphone body 10 is inserted, and a through hole 23 that penetrates through the windscreen member 21, in a different location from the opening 22a and in a direction intersecting the extension direction of the accommodation section 22, and leads to the accommodation section 22; and a fixing member 35 that passes through the through hole 23 and is connected to the microphone body 10.

A sensor component is disclosed including a transducer and an electrical circuit disposed in a housing. The electrical circuit includes a bias voltage source coupled to a first electrode of the transducer. A non-inverting amplifier stage is coupled to a second electrode of the transducer. An inverting amplifier stage is coupled to an output of the non-inverting amplifier stage. A negative feedback path is located between an output of the inverting amplifier stage and the first electrode of the transducer. An electrical output signal of the transducer can be attenuated by applying an attenuation signal, based on a filtered electrical signal, to the first electrode via the negative feedback path.

A system includes a microphone having a diaphragm disposed over an electrode on a substrate, coupled to the substrate by a spring, and having a cap layer with a cavity and a vent hole disposed over the diaphragm, wherein the diaphragm moves and changes capacitance with respect to the electrode in response to sound pressure, a speaker having another diaphragm disposed over another electrode on the substrate, coupled to the substrate by another spring, and having another cap layer with another cavity and another vent hole disposed over the other diaphragm, wherein the other diaphragm moves with respect to the other electrode in response to driving signals applied between the other diaphragm and the other electrode, and a CMOS substrate coupled the substrate, to the speaker and microphone, and configured to process the changes in capacitance and configured to provide the driving signals.

The application relates to an audio processing method and device, computer equipment, a computer readable storage medium and a computer program product. The method comprises the following steps: receiving an audio signal to be processed; predicting the audio signal to be processed by using a pre-generated displacement prediction model to obtain a predicted displacement; the predicted displacement comprises a linear predicted displacement and a nonlinear predicted displacement; performing displacement protection and distortion control on the audio signal to be processed according to the linear predicted displacement and the nonlinear predicted displacement to obtain an output audio signal. The method can simultaneously perform displacement protection and distortion control.

A surface vehicle includes a microphone detecting sounds originating outside of the surface vehicle. A heating element is mounted in association with the microphone and provides heat for preventing accumulation of ice near the microphone wherein the ice accumulation would degrade an ability of the microphone to detect sounds originating outside of the surface vehicle.

An electronic device may include a housing forming a side surface surrounding an internal space, and including a front frame which is disposed in the internal space and forms at least a portion of the side surface, and on which a sound hole for transferring a sound from an outside of the electronic device to the internal space, and an acoustic duct communicating with the sound hole are formed, a printed circuit board (PCB) which is supported by the front frame and includes a first board surface, a second board surface, and an opening, a sound module disposed on, directly or indirectly, the first board surface to overlap the opening, and a sealing member that seals a portion between the front frame and the PCB. The front frame includes a support area supporting the sealing member along a circumferential direction of the sealing member.

1. A wireless microphone system comprising: a first wireless microphone having a first microphone element configured to generate a first audio signal, the first microphone configured to generate a first output signal including the first audio signal and information identifying the first wireless microphone; a second wireless microphone having a second microphone element configured to generate a second audio signal, the second microphone configured to generate a second output signal including the second audio signal and information identifying the second wireless microphone; and a monitoring device having a display configured to receive the first and second output signals and to generate, using the display, visualizations of at least one aspect of the first and second audio signals, and to associate each visualization with a representation of information identifying the corresponding first or second wireless microphone.

The game device includes a housing, a microphone located in the housing, and an air vent, a microphone opening, an operation button, and a card-slot opening in a first side surface of the housing. The air vent is located between the microphone opening and an input button and between the card-slot opening and the input button in a longitudinal direction of the first side surface. The card-slot opening is located between the microphone opening and the air vent in the longitudinal direction of the first side surface.

Provided is electronic equipment capable of suppressing a change in sound quality output from a speaker. An operating device (10) (electronic equipment) has a speaker (2) with a terminal section P, a frame (50) (storage member), and an elastic member (3). The frame (50) has a wall section (52) that defines at least part of a storage chamber A that stores the speaker (2). An opening (53) from which the sounds from the speaker (2) are output is formed in the wall section (52). The elastic member (3) supports a lower surface of the speaker (2), is arranged at a position avoiding the terminal section P of the speaker (2), and presses the speaker (2) against an edge (54) of the opening (53).

A sensor component is disclosed comprising a transducer and an electrical circuit arranged in a single package. The electrical circuit includes a bias voltage coupled to a first electrode of the transducer. A non-inverting amplifier stage is coupled to a second electrode of the transducer. An inverting amplifier stage is coupled to an output of the non-inverting amplifier stage. A negative feedback path is located between an output of the inverting amplifier stage and the first electrode of the transducer. An electrical output signal of the transducer can be attenuated by applying an attenuation signal, based on a filtered electrical signal, to the first electrode via the negative feedback path.